Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.

Abstract: An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Abstract: Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package substrate has a first area. The first component has a first height and is positioned on the first area. The second package substrate is coupled to the first package substrate. The second package substrate has second and third areas. The second area of the second package substrate vertically overlaps with the first area of the first package substrate The third area of the second package substrate is non-overlapping with the first area of the first package substrate. The second component has a second height and is positioned on the second area. The third component is positioned on the third area. The third component has a third height that is greater than each of the first and second heights.

Abstract: An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.

Abstract: In certain embodiments, a hard disk drive includes at least one disk secured to a motor hub with a disk clamp. The disk clamp is positioned radially off-center with respect to the hub to balance a static drive imbalance. In certain embodiments, a method includes radially offsetting a disk clamp to offset a static drive balance.

Abstract: An align fixture for aligning an electronic component having an elastic unit plate having an elastic unit receiving section, a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, and an elastic unit, the first abutting section being flexibly mounted via the elastic unit, the elastic unit is adapted to exert a force to align the electronic component to the second abutting section, and the elastic unit is a separate elastic member adapted to be mounted at the elastic unit receiving section.

Abstract: In a method for positioning and mounting, on a carrier body (6), an LED assembly (1) preassembled on a circuit board (4), the circuit board (4) having the LED assembly (1) is placed and glued onto the carrier body (6), the LED assembly (1) being brought into the prescribed position relative to the carrier body (6) after being placed on the carrier body (6) by a positioning body (11) having centering elements (17) that contact the LED assembly (1) on one side and the carrier body (6) on the other, wherein the circuit board (4) having the LED assembly (1) is aligned with the carrier body (6). The positioning body (11) has a leg (15, 16) extending from a connecting part (12) and having centering elements (17) for contacting the LED assembly (1) on one side and the carrier body (6) on the other side.

Abstract: A method for placing components on a substrate, the method comprising determining a reference point of a mechanical holding jig based upon a plurality of mechanical features of the mechanical holding jig and placing the substrate into the jig such that mechanical features on the substrate align with the mechanical features on the mechanical holding jig. A location of the substrate is determined with the reference point of the mechanical holding jig. The method continues by installing a plurality of first components onto the substrate aligned to the mechanical holding jig. The substrate is removed from the mechanical holding jig and a second component is placed onto the substrate to cover the plurality of first components. The second component is placed onto the substrate to align a plurality of references points of the second component to the mechanical features on the substrate. The second component is secured to the substrate.

Abstract: A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Abstract: A inverting head 20 that inverts a component 4 picked up by a nozzle 20a upside down includes a flat-plate-like base 31 provided on a vertically-movable transfer base 21d; a nozzle holder support member 33 that is swayable within a horizontal plane the base as a result of arcuate peripheries 41 being supported by a plurality of bearings 32 provided on the base 31; and a nozzle holder 34 that is supported so as to be turnable around a horizontal axis CX by the nozzle holder support member 33 and that holds on its side surface the nozzle 20a.

Abstract: A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion.

Abstract: A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: A method of fabricating chip carriers suitable for use in packaging integrated circuits and other electronic, electro-mechanical and opto-electronic devices is described. In general, a number of wires (or wires and rods) are arranged in parallel in a wiring fixture. After the wires are positioned, they are encapsulated to form an encapsulated wiring block. The wiring block is then sliced to form a number of discrete panels. Preferably, the various wires are geometrically positioned such that each resulting panel has a large number of device areas defined therein. The encapsulant in each panel effectively forms a substrate and the wire segments in each panel form conductive vias that extend through the substrate. The resulting panels/chip carriers can then be used in a wide variety of packaging applications.

Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.

Abstract: A method for controlling a board stopping position includes a calculation step for calculating an extended length of the electronic component mounted on the board and extended from the board end portion in the transfer direction by one of the electronic component mounting machines; and a correcting and stopping step for correcting a stopping timing of the conveyer belt to be stopped in response to the detection signal which is outputted from the board sensor and stopping the board at the mounting position, based on the calculated extended length of the electronic component in a subsequent stage electronic component mounting machine arranged subsequent to the one of the electronic component mounting machines.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.

Abstract: A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure. A vacuum chamber is evacuated to vacuum, and the lower plate member and an intermediate member are relatively moved in an approaching direction, so that an outer peripheral portion of the pressurizing release film is gas-tightly held between the upper face of the substrate-placing table of the lower plate member and a lower face of an inner frame body.

Abstract: A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.

Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.

Abstract: A method includes: with a setting frequency set as an operating frequency of an LSI, selecting a capacitor having a lowest resonant impedance and a resonant frequency close to the setting frequency with reference to a capacitor characteristic database and installing one or more capacitors, each being the selected capacitor, as high frequency decoupling capacitors, the number thereof corresponding to a value obtained by dividing the upper limit of the power feeding line impedance by a resonant impedance of the capacitor.

Abstract: A lamp socket assembly tool includes an engaging end configured to engage a lamp socket inserted in an opening of a lamp housing, which may be a vehicle lamp housing. The tool includes a driving end operatively connected to the engaging end and configured to receive and transmit an axial and rotating force to the engaging end to assemble or disassembly a socket engaged by the tool relative to the housing. The tool includes a passage for receiving a connector portion of the socket such that the tool is not in contact with a connector interface. The passage may define an aperture through which a connector wire attached to the socket may exit or move freely during rotation of the socket by the tool. The engaging interface may substantially conform to a socket interface defined by a standardized filament lamp, such as an ECE H9 or H11 socket.

Abstract: An installation tool to install a cruise control stop switch onto a brake pedal of an automotive vehicle includes a cylindrical shaped main body, a cylindrical shaped top portion attached to an open end of the main body, a power supply enclosed within the main body and the top portion, multiple indicators attached to an outer surface of the main body, and a removable coupler located in a recess in the top portion. The coupler, which is electrically connected to the power source and the multiple indicators, is configured to receive the cruise control stop switch.

Abstract: There is provided a working machine including a guide beam having a power transmitter; at least one working head comprising a power receiver and configured to move along the guide beam, wherein the power receiver receives power from the power transmitter in a non-contact manner in which the power receiver and the power transmitter are not physically connected, and wherein the working head operates by the received power in the non-contact manner.

Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.

Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.

Abstract: A method is provided for determining a sequence of mounting a plurality of components on a board by using variable pitch heads having a plurality of pitches. The method includes: partitioning the board into a plurality of sectors, each of the sectors including a plurality of mounting points arranged in parallel with a direction in which the heads are arranged; dividing the board into a plurality of sub-boards including first sub-boards based on the sectors, each of the first sub-boards including as many mounting points as the heads; and determining a combination of a sequence of mounting the components on the board and at least one pitch among the pitches required to mount the components on the board in a shortest time, compared to another sequence or other sequences of mounting the components on the board and another pitch or other pitches among the pitches, based on the first sub-boards.

Abstract: In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: A handing apparatus includes a handle, a tray configured to be secured to a motherboard, and a connecting rod. The connecting rod includes a clamping portion engaged with the tray. A first end of the connecting rod is rotatably secured to the handle by a first shaft, and a second end of the connecting rod is rotatably secured to the tray by a second shaft. The handle is rotatable about the first shaft relative to the connecting rod to disengage the clamping portion from the tray, so that the connecting rod is rotatable about the second shaft relative to the tray.

Abstract: In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: A rotation angle detection device of the present invention includes: a support body; a rotating body that can rotate with respect to the support body about a rotation axis and move in a rotation axis direction; a rotation angle detection unit that has a magnet attached to either of the support body and the rotating body, and a magnetic sensor attached to the other of the support body and the rotating body and facing the magnet in the rotation axis direction, and that detects a rotation angle of the rotating body on the basis of an output signal of the magnetic sensor; and a position detection unit that detects that the rotating body is positioned at a detection position in which a distance between the magnet and the magnetic sensor in the rotation axis direction becomes a predetermined detection distance.

Abstract: A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.

Abstract: A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support a board includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the board to support the board. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.

Abstract: An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

Abstract: A storage device assembling module for assembling a storage device in an electronic apparatus includes a main frame, an adapter, and at least one handgrip. The main frame includes a chute forming a receiving space for receiving the storage device and positioning. The adapter is combined with the main frame and includes a first connecting port connected electrically to the storage device and a second connecting port connected electrically to a circuit board. The location of the first connecting port is closed to the chute, and the connecting direction of the first connecting port is substantially perpendicular to the connecting direction of the second connecting port. Each handgrip is connected pivotally to at least one side of the main frame which is away from the circuit board. The storage device assembling module can substantially be perpendicularly detached from the circuit board by pulling the at least one handgrip.

Abstract: Some embodiments include a connection device for electrically coupling an electrical device to a test system. The connection device can include at least one suction cup configured to be coupled to the electrical device, spring loaded connector pins configured to electrically couple the electrical device to the test system, and a support frame coupled to the at least one suction cup and the spring loaded connector pins. The at least one suction cup can include three suction cups including a first suction cup, a second suction cup, and a third suction cup, and the support frame can include a first end coupled to the first suction cup, a second end opposite the first end and coupled to the second suction cup, and a third end between the first and second ends and coupled to the third suction cup. Other embodiments of related devices and methods are also described herein.

Abstract: A nozzle holder 34 includes a nozzle base 51 whose both ends are supported, the nozzle base 51 inside which a vacuum path is formed, extending in a horizontal direction, a nozzle locking member 53 for communicating a nozzle 20a to the vacuum path (vacuum path 72 of the inside of the nozzle base) of the inside of the nozzle base 51, and a pair of fixing members 54 for fixing the nozzle locking member 53 to the nozzle base 51.

Abstract: A method of installing a pressing block suit of a solar panel to a mounting body, in the method, a pressing block suit of the solar panel is adhered to the mounting body with an adhesive or directly without adhesive. The processes of the method is easy and convenient, the cost of installing is reduced.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. In the embodiments, the connector tools can be made by wire electrode discharge machining (VVEDM) process. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: The apparatus of the present application reduces poor soldering having gas loft there at when soldering. In a reflow soldering apparatus for soldering electronic components mounted on a board by heated atmospheric gas while transferring the printed circuit board with the electronic components within preheating chambers and reflow chambers. Reflow chamber in order within a furnace, a pressure reducing chamber capable of reducing a pressure of the atmospheric gas is installed in the reflow chamber where the heated atmospheric gas circulates in the chamber, and gas involved in a heated and melted soldering part on the printed circuit board is removed at the pressure reducing chamber.

Abstract: A challenge to be met by the present invention is to provide a component mounting device, a component mounting system, and a component mounting method that make it possible to correctly position a substrate at a working location and mount components on the substrate even when components mounted on the substrate project outside from an end of the substrate in a direction parallel to a substrate conveyance path. When a front end portion (PbT) of a substrate (Pb) conveyed by a substrate conveyance path (13) is detected to have reached inspection light (L), operation of the substrate conveyance path (13) is immediately halted.

Abstract: A component fixing device includes a holding portion for holding a component with a hollow portion while restricting a movement of the component; and a fixed portion elastically connected to the holding portion and to be fixed to an object. The holding portion is inserted into the hollow portion of the component for holding the component. The holding portion may have a center holding portion abutting against an outer surface of the component and a pair of arm portions disposed at both sides of the center holding portion and capable of bending relative to the center holding portion, so that the center holding portion and the arm portions sandwich the component.

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract: An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the electronic component mounting apparatus (M5*) equipped with a tray feeder (30) is brought into the second operation mode.

Abstract: An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.

Abstract: An electronic component mounting system configured by linking together a plurality of inspecting-coating machines (M1) and a plurality of electronic component mounting apparatuses (M2) to (M4), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out processing pertinent to any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the inspecting-coating machine (M1) equipped with an inspection head (15) and a coating head (16) is brought into the second operation mode.

Abstract: An auxiliary tool, for assembling a number of voice coil motors, includes a number of trays, a rod member, and two limiting members. Each of the trays includes a main portion and a plurality of support arms extending away from the main portion. The main portion includes a top surface and a bottom surface. The support arms and the main portion cooperatively define two receiving spaces respectively on the top surface and the bottom surface. Each voice coil motor is received in two receiving spaces of two neighboring trays and clamped by the two neighboring trays. The rod member passes through trays and the voice coil motors. The two limiting members are sleeved over the rod member at two ends of the rod member. The trays and the voice coil motors are limited between the two limiting members.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.