Abstract: A substrate processing apparatus includes a chuck configured to attract and hold a substrate; an observer configured to observe multiple positions within a second surface of the substrate attracted to and held by the chuck, the second surface being opposite to a first surface thereof which is in contact with the chuck; and an analyzer configured to analyze observation results of the multiple positions. When a singularity regarding a height from a surface of the chuck attracting and holding the substrate exists on the second surface, the analyzer specifies a position of the singularity on the chuck.

Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.

Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

Abstract: An automatic exchanging device is provided which moves alongside the front face of a component mounting line. When an automatic exchange request for a feeder is generated in any of multiple component mounting machines constituting the component mounting line, the automatic exchanging device moves to the front of the component mounting machine in which the automatic exchange request was generated to automatically exchange the feeder. When a new automatic exchange request is generated in any one of the component mounting machines, a pull-out operation of a predetermined number of component mounting machines is prohibited, from the component mounting machine facing the automatic exchanging device toward the position of the component mounting machine in which the new automatic exchange request was generated.

Abstract: A wire wound-type coil component with an integrated structure does not have a bonding portion where there is concern about reliability with respect to a spiral conductive wire, a terminal electrode, and an annular core. A coil component includes a core with an integrated structure, at least part of which is a winding core portion, which has an annular shape having a through-hole, and which is made of a non-conductive material; and a coil conductor with an integrated structure, which has a spiral conductive wire arranged to spirally extend around the winding core portion and first and second terminal electrodes formed at both end portions of the spiral conductive wire, respectively. The coil component is manufactured through three-dimensionally shaping the core, the coil conductor, and a shape holding member for holding a shape of a wall surface of the core defining the through-hole, by using a 3D printer.

Abstract: A component supply device including a main body provided with an introducing region into which a component supply tape holding components is introduced and configured to supply the components by sending the component supply tape introduced into the main body via the introducing region in a longitudinal direction of the component supply tape. The device comprises a tape supporter insertable into the introducing region while supporting the component supply tape, and a clamping mechanism configured to sandwich and hold at least a part of a supported part of the component supply tape supported by the tape supporter with respect to the tape supporter. The component supply tape is introduced into the main body by inserting the tape supporter into the introducing region with the component supply tape held by the clamping mechanism.

Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

Abstract: A dismantling system includes a dismantling machine including a tip attachment for dismantling an object to be dismantled, an imaging device that provides a field of view from a second viewpoint position for visually recognizing an object to be dismantled, which is different from a first viewpoint position of an operator, and a dismantling operation device that receives operation by an operator of the tip attachment for dismantling an object to be dismantled with respect to the field of view provided by the imaging device.

Abstract: A method of assembly comprising a pick-and-place spindle module having a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.

Abstract: A component-mounting device includes a base, a board positioner which positions a board, a feeder carriage which is attachable to and detachable from the base, a part feeder which supplies a component, a mounting head which mounts the component on the board positioned by the board positioner, a nozzle replacement table which holds a replacement nozzle attached to or detached from the mounting head, a replacement table holder which holds the nozzle replacement table at a predetermined holding position within a movable range of the mounting head, and a placing table on which the nozzle replacement table is placed before the replacement table holder holds the nozzle replacement table. The component-mounting device delivers the nozzle replacement table between the replacement table holder and the placing table in a state where the feeder carriage is connected to the base.

Abstract: An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.

Abstract: A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

Abstract: A component mounting device includes multiple selector valves corresponding individually to multiple holders disposed on a rotary head and switching between making and breaking communication between a corresponding holder flow path and a negative pressure source, and valve driving devices driving selector valves corresponding to holders, among the multiple holders, located in predetermined revolving positions. The component mounting device executes a negative pressure recovery operation when a suction error has occurred in which the component is not held by suction to the nozzle after suction operation. When a suction error occurs at the nozzle held by the holder, the component mounting device performs the negative pressure recovery operation by waiting for the holder to be rotated to a predetermined revolving position and drives the selector valve corresponding to the holder using the valve driving device to cut off communication between the holder flow path and the negative pressure source.

Abstract: A dispensing head comprises: a body structure including a first z-axis motor attachment location, a second z-axis motor attachment location, a first linear track and a second linear track; a first z-axis motor attached to the body structure at the first z-axis motor attachment location; a second z-axis motor attached to the body structure at the second z-axis motor attachment location; a first body attached to the first linear track and operably connected to the first z-axis motor such that the first body moves along the first linear track when the first z-axis motor is actuated; a second body attached to the second linear track and operably connected to the second z-axis motor such that the second body moves along the second linear track; a first theta motor operably connected to the first body; and a second theta motor operably connected to the second body.

Abstract: A pick-and-place dispensing head comprises: a body structure having a z-axis motor attachment location and a linear track; a z-axis motor attached to the body structure at the axis motor attachment location, the z-axis motor configured to exact movement in a z-axis; a body attached to the linear track and operably connected to the z-axis motor such that the body moves along the linear track when the z-axis motor is actuated; a theta motor operably connected to the first body; a receiving location operably connected to the body; and an optical detector extending from the first body configured to detect upward z-axis movement of a received pick-and-place spindle relative to the body.

Abstract: An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from

Abstract: In a forward movement, an article is conveyed to a printing device via a transfer position while being kept mounted in a first holder for printing by the printing device. The article is returned to the transfer position together with the first holder after printing. An article to be printed after the above article is mounted into a second holder in parallel with at least a part of the forward movement, the printing and a return movement. This is capable of printing on the articles in a short throughput time also when the articles are those having a three-dimensional shape such as bottles and in-vehicle components.

Abstract: A management device for managing a component mounter that mounts components onto a substrate using some of constituent elements each selected from one of constituent element groups each including the constituent elements. One group is a nozzle group including nozzles. The device includes: a true displacement amount calculator that calculates, for each target component which is the component, a true amount of displacement which is a sum of (i) an amount of pickup displacement being an amount of displacement between the target component and a target nozzle being one of the nozzles and picks up the target component and (ii) an amount of correction being an amount of offset of a position of the target nozzle when picking up the target component; and a statistical processor that performs parameter estimation for a predetermined statistical model using the true amount to calculate a degree of malfunction of each constituent element.

Abstract: In a component mounter provided with a holding tool configured to hold leaded component, a moving device configured to move the holding tool, and an imaging device configured to image a leaded component held by the holding tool, the lengths of the pair of leads of leaded component are different. With respect to this, operation of the moving devices is controlled based on imaging data of the leaded component captured by the imaging device, and the tip section of long lead of the pair of leads of the leaded component held by the holding tool is inserted in a through-hole. Next, leaded component is moved such that short lead is positioned above a through-hole, and the short lead is inserted into the through-hole. That is, the pair of leads are inserted into the through-holes in order of proximity of the tips to circuit board, closer leads being inserted earlier.

Abstract: A method for transporting and installing an electronic device having at least one first electrical contact element includes fixing the electronic device in a recess or interior of a reusable transport and assembly module such that access to the at least one first contact element is blocked by a protective element, transporting the transport and assembly module and the electronic device into a connection region of an electrical apparatus, removing the protective element so that the at least one first contact element is accessible, actuating an actuation apparatus provided on the transport and assembly module to move the electronic device in a direction out of the recess or interior into a contact position in which the at least one first contact element is brought into electrical contact with at least one second contact element provided on the electrical apparatus, and removing the transport and assembly module.

Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

Abstract: An apparatus for taking out a workpiece includes: a nozzle head that has a plurality of suction nozzles, each of which has a suction unit configured to suction a workpiece, a frame that is attached to a transport apparatus, and a support unit that supports the plurality of suction nozzles and is supported by the frame in a movable manner, wherein the support unit is caused to move relative to the frame, thereby selectively arranging one of the plurality of suction nozzles at a predetermined use position; and a drive unit that causes one suction nozzle arranged at the predetermined use position to move relative to the frame and causes the one suction nozzle to move to a predetermined suction position at which the workpiece is suctioned by the suction unit.

Abstract: A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.

Abstract: A component mounting machine includes a tool station and a determination section. The tool station detachably accommodates a holding member including a main body section which can hold a component to be mounted on a board and multiple identification sections which can identify multiple accommodation angles. The determination section determines an angle difference in which the accommodation angle of the holding member differs from a predetermined accommodation angle. At least one identification section of the multiple identification sections is defined as a first identification section, the at least one identification section being exposed when the accommodation angle of the holding member is the predetermined accommodation angle in a close state in which the multiple identification sections are partially covered by a shielding member.

Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A component supply system comprising: a supply device including a storage section configured to store a component and a storage body mounting section where a storage body including at least the storage section is detachably mounted and configured to supply a component from the storage section of the storage body mounted on the storage body mounting section in a supply position; a first loading stand on which the storage body can be placed; and a second loading stand disposed at a different location from a location where the first loading stand is disposed and on which the storage body can be placed, wherein the storage body is transferred between either of the first loading stand and the second loading stand and the storage body mounting section.

Abstract: A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.

Abstract: A trace memory that stores trace logs of multiple feeders set on a feeder setting table of a component mounter is provided in the feeder setting table, and while the component mounter is operating, trace logs of each feeder are output from the control sections of the multiple feeders on the feeder setting table to the feeder setting table, and are stored by a communication control section of the feeder setting table in the trace memory linked to identification information of each feeder. By this, it is possible to save trace logs from multiple feeders on the feeder setting table all together in a shared trace memory, such that it is not necessary to load trace memory on each feeder, thereby meeting requirements of compact feeders and lower costs.

Abstract: A component mounter provided with a first raising and lowering device to raise and lower a raising and lowering member, and a second raising and lowering device to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device. Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device.

Abstract: A method of manufacturing a display device includes fixing a display panel to a stage, attaching a printed circuit board to a first side surface of the fixed display panel, and irradiating the first side surface of the display panel with light from a first lighting and irradiating a second side surface of the display panel opposite the first side surface of the display panel with light from a second lighting to check alignment of the printed circuit board.

Abstract: A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that exposes the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component exposing unit includes an insertion member that is inserted between a cover tape and a carrier tape and includes a base part and a tip part continuous with an upstream end in a tape feeding direction of the base part. The tip part is inclined toward the cover tape away from the carrier tape with respect to the base part in a state where the insertion member is inserted between the cover tape and the carrier tape.

Abstract: The present disclosure relates to a feeder arm for a surface mount technology (SMT) machine. In an embodiment, the feeder arm includes a support body that is fastened to an SMT machine. The feeder arm includes a reel loading body that supports a reel of electrical components to allow the reel to be prepared for installation on the SMT machine. The feeder arm includes preparation circuitry configured to electrically connect the reel to allow the reel to be prepared. The feeder arm includes an articulating joint between the reel loading body and the support body. The articulating joint may articulate the second body between a first position and a second position.

Abstract: A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that exposes the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component exposing unit includes a cover tape raising unit that performs a raising process for a cover tape. In the travel path formed from the tape travel path forming unit, a first path part on which the cover tape raising unit is disposed is inclined to one direction side in a Z-axis direction from an upstream side toward a downstream side in a tape feeding direction.

Abstract: A component mounting machine includes a mounting head configured to select and execute an individual mode in which lifting and lowering is performed for each of multiple holding tools, each of which holds a component and a collective mode in which the holding tools are lifted and lowered collectively; a memory section configured to store multiple collective lifting and lowering scheduled groups in each of which the components of which the number is the same as the number of holding tools are grouped; and a control section configured to subsequently execute holding of the component by the holding tool, dipping of the component into a coating agent, and mounting of the component on a board.

Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by coupling a base of the cartridge to a carriage that is transported via a track. The track transports the carriages between various substations at which one or more parts are added to the base. The carriage may be lifted from the track by a lifter mechanism at each substation in order to perform assembly operations on the base. An inspection system may inspect the cartridges at various stages of completion at or between the various substations.

Abstract: To provide a control device and a control method of a component mounting machine which is capable of improving the accuracy of mounting control. In a case where the holding member is moved from a current position to a predetermined processing position within the component mounting machine, the control device of the component mounting machine moves a holding member to a preparation position which is set to a defined propelling direction and distance with respect to the processing position, and then moves the holding member from the preparation position to a mounting position.

Abstract: A shaft device includes a nut support including a shaft hole, a spline shaft extending through the shaft hole of the nut support, a spline nut having a tubular shape, a bearing of thrust type rotatably supporting the spline nut relative to the nut support, and a biasing member configured to bias the bearing in an axial direction of the spline shaft. The spline nut is disposed coaxially with a portion of the spline shaft protruding upward from the shaft hole and connected to the spline shaft through a spline mechanism.

Abstract: A component mounting device including a component mounting head that mounts a component on a board by using a first raising and lowering device and a second raising and lowering device. The second raising and lowering device causes an engaging member to engage with an engaged member of a suction nozzle, and by further advancing the engaging member causes the suction nozzle to advance against a biasing force of biasing member. Further, a control device is configured to cause the engaging member to move in the advancing direction by using the actuator of the second raising and lowering device and detect an engaging position in a vertical direction at which engaging member engages with engaged member.

Abstract: A component mounting system starts mounting processing in a state in which a portion of the initial set target feeders of the multiple feeders required for mounting processing are set in supply area of component mounter, and in which remaining feeders are not set in supply area of component mounter. Mounting processing is performed while switching feeders that have finished supplying components with remaining feeders using exchange robot during mounting processing of a single board. By this, because it is possible to perform mounting processing while exchanging required feeders within the range of the upper limit loading quantity of component mounter, it is possible to improve the efficiency of mounting processing.

Abstract: A manufacturing-job apparatus includes a control module, a holding module, and a job module. The holding module is configured to hold a job object. The job module is configured to execute a job for the job object. The control module includes a communication unit and a common interface. The communication unit is configured to communicate with each of the holding module and the job module. The common interface is configured to supply motive power to both of the holding module and the job module.

Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.

Abstract: A workpiece conveyance device is used for a pressing device. The workpiece conveyance device includes a support member supporting a holding component usable to detachable hold a workpiece, a lever unit including a first lever portion and a second lever portion, a lever unit support body supporting the lever unit, a first lever support portion provided to the lever unit support body, and a second lever support portion provided to the lever unit support body. The second lever portion is provided between the first lever portion and the support member. The second lever portion is rotatably linked to the first lever portion. The lever unit pivotably supports the support member. The first lever support portion pivotably supports the first lever portion. The second lever support portion slidably and pivotably supports the second lever portion.

Abstract: A rotary head of a surface mounter includes a rotating body, an N-shaft servo motor configured to rotate and drive the rotating body, and a plurality of suction nozzles attached to the rotating body in such a manner as to be movable in a direction of a rotation axis. The plurality of suction nozzles are arranged on the circumference of a circle with the rotation axis as the center, and the plurality of suction nozzles are configured to hold and release a component. The rotary head of a surface mounter further includes at least a pair of Z-axis drive devices spaced apart from each other in a rotation direction of the rotating body and configured to move, in the direction of the rotation axis, the suction nozzle that has moved to a predetermined drive position on the circumference of the circle.

Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by transporting carriages between various substations at which parts are added to a base. In another assembly method, the base may be moved between a plurality of robots which direct the base downwardly into contact with components to couple the components therewith. An inspection system may inspect the cartridges at various stages of completion.

Abstract: A component supplying device supplying a component while using a component supply tape having components thereon includes a reel support portion rotatably supporting a reel around which the component supply tape is wound, a feeder transferring the component supply tape drawn out from the reel toward a component pick-up position and transferring the component supply tape from which the component is picked up at the component pick-up position S1 toward a tape discharge path, and a correction member arranged on a transfer path of the component supply tape between the reel support portion and the tape discharge path. The correction member is configured to correct curl of the component supply tape.

Abstract: An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

Abstract: Provided is a method for populating printed circuit boards, which includes the steps of registering jobs in each case relating to the population of a number of printed circuit boards of a printed circuit board type with components of predetermined component types, assigning printed circuit board types of the registered jobs to a predetermined number of fixed set-up families, optimizing the assignment in such a way that a characteristic number relating to all the pick-and-place lines of the pick-and-place system is optimized as far as possible, and populating the printed circuit boards on one of the pick-and-place lines by using one of the fixed set-ups.

Abstract: Provided is a component mounting device including: an XY robot, a Z-axis slider attached to an X-axis slider of the XY robot so as to be movable in the Z-axis direction, a head loaded on the Z-axis slider, and a nozzle attached to head 30 so as to be movable in the Z-axis direction. With the component mounting device, a component supplied from a component supply unit is picked up by the nozzle, transported to a specified position on a board, and mounted. A flexible section with an external appearance with a U shape that is expandable and contractible in the X-axis direction and the Z-axis direction is arranged to the rear of a Y-axis slider. A portion of an X-axis wiring tube and a portion of a Z-axis wiring tube are bundled together in the flexible section.

Abstract: A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

Abstract: A component-handling device for removing components from a structured component supply and for depositing the removed components at a receiving device. A first turning device having a plurality of receiving units receives a component from the structured component supply at a dispensing point, to turn the received component by a first predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a transfer point. A second turning device having a plurality of receiving units receives the component at the transfer point from a receiving unit of the first turning device, to turn the received component by a second predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a depositing point. Position sensors detect position data of the turning devices, and position data of the components located on the receiving units.