Chip Component Patents (Class 29/740)
  • Patent number: 11129320
    Abstract: A trace memory that stores trace logs of multiple feeders set on a feeder setting table of a component mounter is provided in the feeder setting table, and while the component mounter is operating, trace logs of each feeder are output from the control sections of the multiple feeders on the feeder setting table to the feeder setting table, and are stored by a communication control section of the feeder setting table in the trace memory linked to identification information of each feeder. By this, it is possible to save trace logs from multiple feeders on the feeder setting table all together in a shared trace memory, such that it is not necessary to load trace memory on each feeder, thereby meeting requirements of compact feeders and lower costs.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: September 21, 2021
    Assignee: FUJI CORPORATION
    Inventors: Satoshi Osaki, Yoshiyuki Fukaya, Hideaki Oki
  • Patent number: 11122719
    Abstract: A component mounter provided with a first raising and lowering device to raise and lower a raising and lowering member, and a second raising and lowering device to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device. Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: September 14, 2021
    Assignee: FUJI CORPORATION
    Inventor: Kohei Sugihara
  • Patent number: 11106068
    Abstract: A method of manufacturing a display device includes fixing a display panel to a stage, attaching a printed circuit board to a first side surface of the fixed display panel, and irradiating the first side surface of the display panel with light from a first lighting and irradiating a second side surface of the display panel opposite the first side surface of the display panel with light from a second lighting to check alignment of the printed circuit board.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Si Joon Song, Eui Jeong Kang, Byoung Yong Kim, Dae Hyuk Im, Young Min Park
  • Patent number: 11076518
    Abstract: A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that exposes the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component exposing unit includes an insertion member that is inserted between a cover tape and a carrier tape and includes a base part and a tip part continuous with an upstream end in a tape feeding direction of the base part. The tip part is inclined toward the cover tape away from the carrier tape with respect to the base part in a state where the insertion member is inserted between the cover tape and the carrier tape.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: July 27, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Oyama, Ryouta Masuda, Koji Yamazumi, Haruyasu Fujita
  • Patent number: 11064640
    Abstract: The present disclosure relates to a feeder arm for a surface mount technology (SMT) machine. In an embodiment, the feeder arm includes a support body that is fastened to an SMT machine. The feeder arm includes a reel loading body that supports a reel of electrical components to allow the reel to be prepared for installation on the SMT machine. The feeder arm includes preparation circuitry configured to electrically connect the reel to allow the reel to be prepared. The feeder arm includes an articulating joint between the reel loading body and the support body. The articulating joint may articulate the second body between a first position and a second position.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: July 13, 2021
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventor: John Christian O'Bryan
  • Patent number: 11051440
    Abstract: A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that exposes the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component exposing unit includes a cover tape raising unit that performs a raising process for a cover tape. In the travel path formed from the tape travel path forming unit, a first path part on which the cover tape raising unit is disposed is inclined to one direction side in a Z-axis direction from an upstream side toward a downstream side in a tape feeding direction.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: June 29, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Oyama, Ryouta Masuda, Koji Yamazumi, Haruyasu Fujita
  • Patent number: 11032959
    Abstract: A component mounting machine includes a mounting head configured to select and execute an individual mode in which lifting and lowering is performed for each of multiple holding tools, each of which holds a component and a collective mode in which the holding tools are lifted and lowered collectively; a memory section configured to store multiple collective lifting and lowering scheduled groups in each of which the components of which the number is the same as the number of holding tools are grouped; and a control section configured to subsequently execute holding of the component by the holding tool, dipping of the component into a coating agent, and mounting of the component on a board.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: June 8, 2021
    Assignee: FUJI CORPORATION
    Inventors: Nobuaki Minoshima, Mitsuhiko Shibata
  • Patent number: 11006674
    Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by coupling a base of the cartridge to a carriage that is transported via a track. The track transports the carriages between various substations at which one or more parts are added to the base. The carriage may be lifted from the track by a lifter mechanism at each substation in order to perform assembly operations on the base. An inspection system may inspect the cartridges at various stages of completion at or between the various substations.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: May 18, 2021
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Quentin Paul Guenther, Jr., Johnny Keith Cagigas, William Robert Collett, Lawrence P. Balash, Scott Lee Brady, Ronnie Dean Dover, John Scott Gerow, Don Edward Green, John Matthew Odel, Christopher M. Spencer, Vernon L. Steiner, David James Thierauf, Louis Wade Wacker, Byron Joseph Williams
  • Patent number: 10939598
    Abstract: To provide a control device and a control method of a component mounting machine which is capable of improving the accuracy of mounting control. In a case where the holding member is moved from a current position to a predetermined processing position within the component mounting machine, the control device of the component mounting machine moves a holding member to a preparation position which is set to a defined propelling direction and distance with respect to the processing position, and then moves the holding member from the preparation position to a mounting position.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: March 2, 2021
    Assignee: FUJI CORPORATION
    Inventors: Hidenori Goto, Yusuke Yamakage, Masataka Iwasaki
  • Patent number: 10921790
    Abstract: A manufacturing-job apparatus includes a control module, a holding module, and a job module. The holding module is configured to hold a job object. The job module is configured to execute a job for the job object. The control module includes a communication unit and a common interface. The communication unit is configured to communicate with each of the holding module and the job module. The common interface is configured to supply motive power to both of the holding module and the job module.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: February 16, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Okamura, Kazuki Takatori, Shimpei Sugino, Hiroki Yukawa, Mami Kikuchi
  • Patent number: 10919711
    Abstract: A component mounting device including a component mounting head that mounts a component on a board by using a first raising and lowering device and a second raising and lowering device. The second raising and lowering device causes an engaging member to engage with an engaged member of a suction nozzle, and by further advancing the engaging member causes the suction nozzle to advance against a biasing force of biasing member. Further, a control device is configured to cause the engaging member to move in the advancing direction by using the actuator of the second raising and lowering device and detect an engaging position in a vertical direction at which engaging member engages with engaged member.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: February 16, 2021
    Assignee: FUJI CORPORATION
    Inventors: Kenji Hara, Mitsuru Sanji
  • Patent number: 10925200
    Abstract: A component mounting system starts mounting processing in a state in which a portion of the initial set target feeders of the multiple feeders required for mounting processing are set in supply area of component mounter, and in which remaining feeders are not set in supply area of component mounter. Mounting processing is performed while switching feeders that have finished supplying components with remaining feeders using exchange robot during mounting processing of a single board. By this, because it is possible to perform mounting processing while exchanging required feeders within the range of the upper limit loading quantity of component mounter, it is possible to improve the efficiency of mounting processing.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: February 16, 2021
    Assignee: FUJI CORPORATION
    Inventors: Jun Iisaka, Shigeto Oyama
  • Patent number: 10925198
    Abstract: A shaft device includes a nut support including a shaft hole, a spline shaft extending through the shaft hole of the nut support, a spline nut having a tubular shape, a bearing of thrust type rotatably supporting the spline nut relative to the nut support, and a biasing member configured to bias the bearing in an axial direction of the spline shaft. The spline nut is disposed coaxially with a portion of the spline shaft protruding upward from the shaft hole and connected to the spline shaft through a spline mechanism.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: February 16, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Tomoyoshi Utsumi
  • Patent number: 10912203
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: February 2, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Inoue, Naoki Azuma
  • Patent number: 10906084
    Abstract: A workpiece conveyance device is used for a pressing device. The workpiece conveyance device includes a support member supporting a holding component usable to detachable hold a workpiece, a lever unit including a first lever portion and a second lever portion, a lever unit support body supporting the lever unit, a first lever support portion provided to the lever unit support body, and a second lever support portion provided to the lever unit support body. The second lever portion is provided between the first lever portion and the support member. The second lever portion is rotatably linked to the first lever portion. The lever unit pivotably supports the support member. The first lever support portion pivotably supports the first lever portion. The second lever support portion slidably and pivotably supports the second lever portion.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: February 2, 2021
    Assignee: KOMATSU INDUSTRIES CORPORATION
    Inventors: Hiromoto Shimada, Hidetoshi Akashi
  • Patent number: 10874040
    Abstract: A rotary head of a surface mounter includes a rotating body, an N-shaft servo motor configured to rotate and drive the rotating body, and a plurality of suction nozzles attached to the rotating body in such a manner as to be movable in a direction of a rotation axis. The plurality of suction nozzles are arranged on the circumference of a circle with the rotation axis as the center, and the plurality of suction nozzles are configured to hold and release a component. The rotary head of a surface mounter further includes at least a pair of Z-axis drive devices spaced apart from each other in a rotation direction of the rotating body and configured to move, in the direction of the rotation axis, the suction nozzle that has moved to a predetermined drive position on the circumference of the circle.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: December 22, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kenji Tsuri, Tomoyoshi Utsumi
  • Patent number: 10856570
    Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by transporting carriages between various substations at which parts are added to a base. In another assembly method, the base may be moved between a plurality of robots which direct the base downwardly into contact with components to couple the components therewith. An inspection system may inspect the cartridges at various stages of completion.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: December 8, 2020
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Frederic Philippe Ampolini, Timothy Brian Nestor, Jack Gray Flinchum, Jr., Wayne Douglas Brown, Nicholas Harrison Watson, Charles Jacob Novak, III, Paul Andrew Brinkley, James Robert Covino, John DePiano, Edward Louis Dickinson, Eugene R. Harris, Kevin Edward Keough, David Jay Smith, John Hook, Michael LaCourse, Robert Metcalf, Steven Hart, David Pelletier, Marc Bourque, Nathaniel Cambray, John William Wolber, James William McClellan, Steven R. Mongillo, Frank S. Silveira, Michael Laine, Quentin Paul Guenther, Jr.
  • Patent number: 10856459
    Abstract: A component supplying device supplying a component while using a component supply tape having components thereon includes a reel support portion rotatably supporting a reel around which the component supply tape is wound, a feeder transferring the component supply tape drawn out from the reel toward a component pick-up position and transferring the component supply tape from which the component is picked up at the component pick-up position S1 toward a tape discharge path, and a correction member arranged on a transfer path of the component supply tape between the reel support portion and the tape discharge path. The correction member is configured to correct curl of the component supply tape.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: December 1, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Yuzuru Taniguchi, Yasuyoshi Hongashi
  • Patent number: 10842024
    Abstract: Provided is a method for populating printed circuit boards, which includes the steps of registering jobs in each case relating to the population of a number of printed circuit boards of a printed circuit board type with components of predetermined component types, assigning printed circuit board types of the registered jobs to a predetermined number of fixed set-up families, optimizing the assignment in such a way that a characteristic number relating to all the pick-and-place lines of the pick-and-place system is optimized as far as possible, and populating the printed circuit boards on one of the pick-and-place lines by using one of the fixed set-ups.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: November 17, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Alexander Pfaffinger, Christian Royer
  • Patent number: 10842026
    Abstract: An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: November 17, 2020
    Assignee: Xerox Corporation
    Inventors: Chad S. Smithson, Ethan Shen, Johann Junginger, Tianxiao Xu
  • Patent number: 10834860
    Abstract: A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ryan N. Elsasser, Brian E. Hanrahan, Steven J. James, Oswald J. Mantilla, Enrico A. Romano, Yuet-Ying Yu
  • Patent number: 10834859
    Abstract: Provided is a component mounting device including: an XY robot, a Z-axis slider attached to an X-axis slider of the XY robot so as to be movable in the Z-axis direction, a head loaded on the Z-axis slider, and a nozzle attached to head 30 so as to be movable in the Z-axis direction. With the component mounting device, a component supplied from a component supply unit is picked up by the nozzle, transported to a specified position on a board, and mounted. A flexible section with an external appearance with a U shape that is expandable and contractible in the X-axis direction and the Z-axis direction is arranged to the rear of a Y-axis slider. A portion of an X-axis wiring tube and a portion of a Z-axis wiring tube are bundled together in the flexible section.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: November 10, 2020
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Ito, Mizuho Yamamoto
  • Patent number: 10804123
    Abstract: A component-handling device for removing components from a structured component supply and for depositing the removed components at a receiving device. A first turning device having a plurality of receiving units receives a component from the structured component supply at a dispensing point, to turn the received component by a first predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a transfer point. A second turning device having a plurality of receiving units receives the component at the transfer point from a receiving unit of the first turning device, to turn the received component by a second predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a depositing point. Position sensors detect position data of the turning devices, and position data of the components located on the receiving units.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: October 13, 2020
    Assignee: MUEHLBAUER GMBH & CO. KG
    Inventors: Henri Junker, Markus Ferstl
  • Patent number: 10784129
    Abstract: A mounting device in which a loading distance separating adjacent characteristic components are lined up side by side is shorter than separation distance between suction nozzle and mark camera, processing to image characteristic component by mark camera and recognize the position of characteristic component is performed consecutively or in one batch. With the mounting device, because mounting head is moved a loading distance that is shorter than the separation distance between suction nozzle and mark camera and image processing is performed consecutively or in one batch, the movement distance of mounting head is shorter.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 22, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kohei Sugihara, Hidenori Goto
  • Patent number: 10784130
    Abstract: A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: September 22, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joong-Ha Lee, Sang-Yoon Kim, YoungBum Kim, Hui-Jae Kim, SeungDae Seok, Jaebong Shin, Byungjoon Lee, Yongin Lee, Jaeyeon Pyo
  • Patent number: 10775156
    Abstract: An automatic measuring device includes a platform, a pre-positioned suction nozzle, a reverse suction nozzle, a sensor, and a reflection sheet. The sensor is fixed on a side of the reverse suction nozzle, and the reflection sheet is fixed on a side of the pre-positioned suction nozzle and is located below the sensor. The method includes the following steps: controlling, by the automatic measuring device, a light source to emit light to the reflection sheet; detecting, by the sensor, a measurement value of the reflection sheet; determining, by the automatic measuring device, a change curve of a measurement value and a height according to a material of the reflection sheet; finding, by the automatic measuring device from the change curve, a height value corresponding to the measurement value; and determining, by the automatic measuring device according to the height value, whether the transfer and handoff platform can pass examination.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: September 15, 2020
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Guanghui Zhang
  • Patent number: 10766073
    Abstract: After a chuck portion chucks a workpiece holding body which aligns and holds a plurality of workpieces on which components are to be placed, the posture of the workpieces held in the workpiece holding body is adjusted due to rotation mechanism by rotating the chuck portion around an axial line which extends in an aligning direction of the plurality of workpieces held in the workpiece holding body. Then, a placing head places the components on each of the plurality of workpieces which are subjected to posture adjustment.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 8, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Yoichi Makino
  • Patent number: 10772248
    Abstract: A nozzle holder that detachably holds a nozzle in a lower end portion of a main shaft is configured to have a tubular shape having an insertion hole into which an installed portion of the nozzle is inserted, and to include a holder tube portion in which an opening portion leading to the insertion hole is formed on one side surface of the holder tube portion, a clamp lever which has an engaging portion engaged via the opening portion with the installed portion of the nozzle inserted into the insertion hole, and a clamp spring which biases the engaging portion to the installed portion of the nozzle inserted into the insertion hole.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: September 8, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Osamu Okuda, Kazunobu Sakai, Eyri Watari
  • Patent number: 10766654
    Abstract: An inspection device (1) includes a light source (10) projecting excitation light to an inner surface of a container (20); an imager (11) capturing a fluorescence image of fluorescence emitted from a foreign substance in response to the excitation light projected; and a detector (13) detecting the foreign substance adhering to the inner surface of the container from the fluorescence image captured by the imager. The foreign substance contains a material emitting fluorescence in response to the excitation light projected to the material. The detector includes a calculator (14) calculating an average brightness value in an inspection target region, and an adjuster (15) adjusting an image-capturing condition where the fluorescence image is captured such that the average brightness value falls within a preset range.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: September 8, 2020
    Assignees: KYODO YUSHI CO., LTD., TORAY ENGINEERING CO., LTD.
    Inventors: Yoichi Suzuki, Toshikazu Kawado, Chisa Inaka, Tatsuya Okada
  • Patent number: 10741519
    Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: August 11, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel
  • Patent number: 10701850
    Abstract: When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: June 30, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Hiroyuki Aou, Takeshi Shibabuki
  • Patent number: 10701849
    Abstract: A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: June 30, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinji Yamamoto, Koji Sakurai, Hiroyuki Fujiwara
  • Patent number: 10684233
    Abstract: A device for positioning an integrated circuit wafer includes: a base, called upper, and a base, called lower, arranged at a distance from one another in a direction, called vertical, so as to leave a free space between the bases; a support, provided to be mobile between the upper and lower bases, and including a location for receiving the wafer to be inspected; at least one first means apparatus for positioning the support in the vertical direction against, or by cooperation with, the upper base; and at least one second means apparatus for positioning the support in the vertical direction against, or by cooperation with, the lower base. Also provided is an inspection equipment for an integrated circuit wafer implementing such a positioning device.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: June 16, 2020
    Assignee: UNITY SEMICONDUCTOR
    Inventor: Sylvain Petitgrand
  • Patent number: 10668584
    Abstract: A plurality of workpieces on which components are to be placed are lined up in a row and held by a workpiece holding body, and the workpiece holding body is placed on a carrier and is transported to a working position using a transport conveyor. After the workpiece holding body is chucked by a chuck portion, the workpiece holding body is separated from the carrier by linking an operation of lifting and lowering the chuck portion using a lifting-lowering mechanism and an operation of moving the carrier in a transport direction. The chuck portion which chucks the workpiece holding body is rotated by a rotation mechanism, postures of the plurality of workpieces which are held in the workpiece holding body are adjusted, and then, the components are placed on component placing parts using a placing head.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: June 2, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Yoichi Makino
  • Patent number: 10667451
    Abstract: A component mounter including a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units each including a tool rotation device and a component handling tool. The component handling tool includes a base section and a protruding portion extending in a downward direction from the base section, a first end of the protruding portion attached to the base section at a tool attaching position, and a second end of the protruding portion positioned offset with respect to the tool attaching position in a direction perpendicular to the downward direction. The component mounter uses the component handing tools to simultaneously push a component at two push locations so as to insert the component onto the board.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Tatsue Kondo, Hiromi Suzuki
  • Patent number: 10660250
    Abstract: A mounting device is provided with a first raising and lowering drive section that raises and lowers a syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section that raises and lowers the suction nozzle with respect to the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component or information of the stage height of a transfer stage.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: May 19, 2020
    Assignee: FUJI CORPORATION
    Inventor: Koji Kawaguchi
  • Patent number: 10638651
    Abstract: A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: April 28, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Osamu Okuda, Kazunobu Sakai, Eyri Watari
  • Patent number: 10634325
    Abstract: A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: April 28, 2020
    Assignee: FUJI CORPORATION
    Inventor: Kohei Sugihara
  • Patent number: 10624251
    Abstract: A pick and place nozzle performance analytics system streams production data from pick and place machines used in electronic assembly to a cloud platform as torrential data streams, and performs analytics on the production data to track, visualize, and predict performance of individual nozzles in terms of rejects or miss-picks. The analytics system generates a performance vector for each nozzle based on the collected production data, the performance vector tracking both the accumulated rejects and the percentage of rejects as respective dimensions of an x-y plane. The system monitors and analyzes the trajectory of this vector in the x-y plane to predict when performance degradation of the nozzle will reach a critical threshold. In response to predicting that nozzle performance degradation will exceed a threshold at a future time, the system can generate and deliver notifications to appropriate client devices.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: April 14, 2020
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Mikica Cvijetinovic, Gregory J. Vance, Francisco P. Maturana
  • Patent number: 10588251
    Abstract: A mounting target working device includes a mounting target holding unit that holds a mounting target. The mounting target holding unit includes a lift mechanism that moves the mounting target in an upward-downward direction, a tilt mechanism attached to the lift mechanism and that tilts the mounting target, and a rotation mechanism attached to the tilt mechanism and that rotates the mounting target. The rotation mechanism is supported in a cantilever manner by the tilt mechanism.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: March 10, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Shinichi Okazaki, Naoki Suzuki
  • Patent number: 10569374
    Abstract: Provided is a production facility (1), including: a plurality of production units (10A to 10E) coupled to each other in a separable manner; a guide rail (2) extending in a unit coupling direction; and transfer means (3) capable of sequentially transferring, by moving along the guide rail (2), a workpiece from the production unit (10A) toward the production unit (10E). Each of the plurality of production units (10A to 10E) includes: a processing section (13) configured to execute predetermined processing; a control section (14) configured to electrically control an operation of the processing section (13); a rail member (20) constructing the guide rail (2); and a slide member (30) constructing the transfer means (3). Each of the plurality of production units (10A to 10E) further includes: a connector (15, 15) configured to electrically connect the control section (14) thereof and the control section (14) of the adjacent production unit (10).
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: February 25, 2020
    Assignee: NTN CORPORATION
    Inventor: Nao Ishiyama
  • Patent number: 10568247
    Abstract: A light-emitting diode transfer includes: a stage; a moving portion disposed on the stage and which performs a linear motion on the stage; a linear driving portion disposed on the moving portion and which performs a linear motion on the moving portion; and a head portion rotatably disposed on the linear driving portion and which picks up a light-emitting diode.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: February 18, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Minsoo Kim
  • Patent number: 10548251
    Abstract: A component mounter including a control device configured to perform communication control with component supply device, a control device including guidance control section configured to issue guidance of a mounting position of component supply device to which carrier tape should be inserted based on information of the component stored in the carrier tape, a check control section configured to determine whether the carrier tape has been correctly inserted to the mounting position as guided by guidance control section, based on a recognition signal of tape insertion recognition section configured to recognize insertion of the carrier tape into tape insertion opening, and a supply command sending section configured to send a component supply command to the feeder at the mounting position in a case in which it is determined that the carrier tape has been inserted to the mounting position as guided by guidance control section.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: January 28, 2020
    Assignee: FUJI CORPORATION
    Inventor: Koichiro Sugimoto
  • Patent number: 10531601
    Abstract: In a rotary head type component mounter, before using two suction nozzles of rotary head to pick up the leading components in component supply tape set in two tape feeders, rotary head is moved in the XY directions by head moving mechanism and rotated by head rotating mechanism such that the pickup points of the two suction nozzles are positioned on two straight lines and extending in the tape feeding direction of each tape feeder passing through the ideal pickup points of the leading components of the two tape feeders, and the leading components are fed to component pickup positions and that are the pickup points of the suction nozzles on the two straight lines. Then, the two suction nozzles of rotary head are lowered simultaneously to pick up the two component simultaneously using the two suction nozzles.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: January 7, 2020
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Ito, Jun Iisaka
  • Patent number: 10521871
    Abstract: A robot system including a conveying apparatus that conveys an object; a robot that performs a process on the object being conveyed; a visual sensor that acquires visual information about the object; a high-frequency processing unit that detects at least one of a conveying velocity at which the object is being conveyed by the conveying apparatus and a position of the object by processing, at a first frequency, the visual information; a low-frequency processing unit that detects a position of the object by processing, at a second frequency that is lower than the first frequency, the visual information; and a control unit that controls the robot.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 31, 2019
    Assignee: FANUC CORPORATION
    Inventor: Masafumi Ooba
  • Patent number: 10509069
    Abstract: After measuring electrical characteristics, a component favorably drops from a measuring element. An inspection device includes a pair of measuring elements configured to measure electrical characteristics of a component by gripping the components due to being capable of approaching and separating from each other; and air supply device configured to supply air to at least one of a pair of opposing surfaces that oppose each of the pair of measuring elements, and by supplying air to at least one of the opposing surfaces from air supply device, a component s adhered to the at least one opposing surface can be caused to drop favorably.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: December 17, 2019
    Assignee: FUJI CORPORATION
    Inventors: Toshiyuki Sawada, Satoshi Iwashima
  • Patent number: 10506749
    Abstract: A system for mounting electronic components on a substrate includes component holders each configured to hold an electronic components to be mounted on the substrate. A revolving device is configured to revolve the component holders along a pre-determined path so that each one of the component holders is moveable into a component receiving location for receiving a respective electronic component and/or a component mounting location for mounting the respective electronic component on the substrate. An actuator is configured to actuate a respective component holder in the component receiving location and/or the component mounting location. A safety device is configured to determine whether the respective component holder to be actuated by the actuator is properly placed in an operative position on the revolving device. The safety device is arranged separately from the actuator and is spaced apart from the actuator along the pre-determined path.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: December 10, 2019
    Assignees: ETEL S.A., FUJI CORPORATION
    Inventors: Koji Kawaguchi, Fredrik Arnell, Marc Kunze, Bruno Chichiricco
  • Patent number: 10466683
    Abstract: A setting value of a component parameter that includes at least one of component information relating to an electronic component and tape information relating to a carrier tape that is supplied by a tape feeder is input, a rule table in which a component parameter and a setting value of an operational parameter relating to an operation by at least one of component mounting apparatuses are associated with each other is stored, and the setting value of the operational parameter that corresponds to a setting value of the component parameter which is input is set based on a rule table.
    Type: Grant
    Filed: March 19, 2016
    Date of Patent: November 5, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Kenichiro Ishimoto
  • Patent number: 10470347
    Abstract: A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporting path transporting one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a component information storage being capable of storing component information of stick cases. A plurality of electronic components of same lot are accommodated in the plurality of stick cases, and the component information storage stores component information of a stick case read from one of the plurality of stick cases, as the component information of each of the plurality of stick cases.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: November 5, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryouji Eguchi, Takashi Uchino, Takashi Tamura, Shuuichi Kubota
  • Patent number: 10462947
    Abstract: Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: October 29, 2019
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Ito, Yoshihiro Yasui