Means To Fasten Electrical Component To Wiring Board, Base, Or Substrate Patents (Class 29/739)
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Publication number: 20140353362Abstract: A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.Type: ApplicationFiled: May 29, 2013Publication date: December 4, 2014Applicant: IPG Photonics CorporationInventors: Alexander Ovtchinnikov, Igor Berishev, Alexey Komissarov, Svletan Todorov, Pavel Trubenko
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Patent number: 8898893Abstract: Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.Type: GrantFiled: December 15, 2010Date of Patent: December 2, 2014Assignee: Universal Instruments CorporationInventor: Koenraad Gieskes
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Publication number: 20140345120Abstract: A printed board working apparatus includes a transport device which transports a printed board in a horizontal direction, and a moving member which moves in a horizontal direction above the transport device. The printed board working apparatus includes a plurality of component attaching portions which are aligned in the installation direction and move together with the moving member. The printed board working apparatus also includes at least one working head which performs work on the printed board held by the transport device. The working head is attached to at least one component attaching portion out of the plurality of component attaching portions, and can change a position relative to the moving member in the installation direction. A region where the working head cannot perform work as the number of working heads increases is reduced.Type: ApplicationFiled: May 8, 2014Publication date: November 27, 2014Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Takeshi OGISO
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Publication number: 20140345123Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path.Type: ApplicationFiled: May 20, 2014Publication date: November 27, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas-Michael Winkel
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Patent number: 8893369Abstract: A packaging structure for assembling to a printed circuit board (PCB) comprises a captive screw having a screw head, a threaded shank and a sleeve; and a fixture pressing against the screw head for a part of the threaded shank to expose from a distal end of the sleeve, and clamping the fixture on the sleeve.Type: GrantFiled: May 30, 2012Date of Patent: November 25, 2014Inventor: Ting-Jui Wang
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Publication number: 20140334120Abstract: An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.Type: ApplicationFiled: July 24, 2014Publication date: November 13, 2014Inventors: Michael Dakhiya, Eran Shaked
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Patent number: 8881380Abstract: There is provided a component mounting apparatus, which includes: a nozzle which sucks a component; a nozzle supporting member, on which the nozzle is installed, which moves in a vertical direction with respect to an upper surface of a substrate on which the component sucked at the nozzle is mounted; an optical system which captures an image of a leading edge portion of the nozzle where the component is sucked in a component mounting operation, from a side direction, such that an optical axis of the optical system is inclined at a predetermined angle with respect to a sucking surface of the nozzle; and an analyzer which analyzes the image of the leading edge portion to determine whether a sucking state of the component sucked by the nozzle is normal or abnormal.Type: GrantFiled: May 30, 2012Date of Patent: November 11, 2014Assignee: Samsung Techwin Co., Ltd.Inventor: Hatase Takayuki
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Patent number: 8875385Abstract: An apparatus for retaining a package of laminations of an electromagnetic core in a device (3) for the production thereof that is mounted into a panel (1) arranged at a distance from a yoke (2) of said device (3) for the production of individual laminations (4) and mutual joining of same into a package (5), wherein it comprises peripheral units like an aggregate for pressurized hydraulic oil, sensors, control unit and ejector.Type: GrantFiled: October 28, 2009Date of Patent: November 4, 2014Assignee: Univerza V LjubljaniInventors: Marko Hladnik, Niko Herakovic
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Publication number: 20140317909Abstract: A method for producing a radio frequency identification transponder includes forming a first groove in a conductive sheet such that a portion of said conductive sheet surrounds the first groove, attaching an RFID chip to the conductive sheet after the first groove has been formed such that the first groove is located between a first connecting element of the chip and a second connecting element of the chip, and forming a second groove in the conductive sheet after the chip has been attached so as to form an antenna element of said transponder.Type: ApplicationFiled: November 29, 2012Publication date: October 30, 2014Inventor: Juhani Virtanen
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Patent number: 8869386Abstract: A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum.Type: GrantFiled: June 28, 2013Date of Patent: October 28, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chih-Chen Lai
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Publication number: 20140304984Abstract: A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.Type: ApplicationFiled: June 25, 2014Publication date: October 16, 2014Applicant: VALEO ETUDES ELECTRONIQUESInventors: Laurent VIVET, Jean-Michel MORELLE, Sandra DIMELLI, Laurent DENEU-FONTAINE, Romaric LENOIR
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Patent number: 8857047Abstract: An apparatus for incorporating a metallic foil into a semiconductor package includes a carrier embossed with a multiplicity of cavities. Each of the cavities define a pedestal recessed with the cavities which penetrate only partially through the thickness of the carrier. A metallic foil overlying a pattern with the pedestals in direct contact and help support the metallic foil with the metallic foil pressed into at least some of the cavities. In other embodiments, a gap is between the metallic foil and bottoms of the cavities in a substrate. Integrated circuit dice are attached to the foil. Each die is attached to the foil in a region of the foil overlying a portion of the at least one device area pattern. Bonding wires electrically connect the integrated circuit dice to the foil.Type: GrantFiled: September 18, 2012Date of Patent: October 14, 2014Assignee: Texas Instruments IncorporatedInventors: Jaime A. Bayan, Nghia Thuc Tu, Will Kiang Wong, David Chin
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Publication number: 20140298649Abstract: There is provided a component mounting method for fitting a component including downwardly-extending insertion pins on a substrate by sucking the component by a suction nozzle and moving the suction nozzle such that the insertion pins of the sucked component are inserted into pin insertion holes formed in a substrate. The component mounting method includes: positioning the insertion pins and the pin insertion holes, and then pushing the component against the substrate by the suction nozzle, thereby fitting the component on the substrate such that the insertion pins are inserted into the pin insertion holes; and pushing again the component against the substrate after the component is fitted on the substrate, so as to push the insertion pins into the pin insertion holes.Type: ApplicationFiled: September 11, 2012Publication date: October 9, 2014Applicant: Panasonic CorporationInventor: Yasuyuki Ishitani
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Patent number: 8850694Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.Type: GrantFiled: April 5, 2010Date of Patent: October 7, 2014Assignee: Palo Alto Research Center IncorporatedInventors: Eugene M. Chow, Jeng Ping Lu, Meng H. Lean, David K Biegelsen
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Patent number: 8850695Abstract: Printed circuit board (PCB) assembly tooling and methods are provided. Particular tooling includes a first tooling fixture having a first core component receiver to receive a first portion of a magnetic core to be coupled to a first side of a PCB. The tooling also has a second tooling fixture including a second core component receiver to receive a second portion of the magnetic core to be coupled on a second side of the PCB to the first portion of the magnetic core. The tooling also has an alignment component disposed on at least one of the first tooling fixture and the second tooling fixture. The alignment component enables alignment of the first tooling fixture and the second tooling fixture. When the first tooling fixture and the second tooling fixture are aligned, the first portion of the magnetic core and the second portion of the magnetic core are aligned.Type: GrantFiled: January 5, 2010Date of Patent: October 7, 2014Assignee: The Boeing CompanyInventors: Norman L. Call, Jose M. Chavez, Rodolfo Chavez
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Publication number: 20140290056Abstract: An apparatus that facilitates the accurate and uncomplicated placement of an adhesive circuit structure onto an integrated circuit card is described. The apparatus is configured to hold the adhesive circuit structure and an integrated circuit card such that the two components can be aligned for proper placement.Type: ApplicationFiled: July 20, 2012Publication date: October 2, 2014Inventor: Horatio Nelson Huxham
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Publication number: 20140259633Abstract: A method, system and apparatus, the method including positioning a microelectronic device on a carrier substrate; coupling the microelectronic device to a roller assembly; and rotating the roller assembly to transport the microelectronic device from the carrier substrate to a receiving substrate. The system including a carrier substrate configured to support a microelectronic device; a roller assembly configured to receive and transport the microelectronic device; and a receiving substrate dimensioned to receive the microelectronic device from the roller assembly. An apparatus for parallel assembly of microelectronic devices on a module including a laterally translatable carrier substrate configured to move a plurality of microelectronic devices in a first direction; a rotatable cylindrical body having a plurality of device openings dimensioned to receive the microelectronic devices; and a laterally translatable receiving substrate configured to move in a second direction.Type: ApplicationFiled: November 25, 2013Publication date: September 18, 2014Applicant: Sandia CorporationInventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Judith Maria Lavin, Paul J. Resnick
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Publication number: 20140261616Abstract: An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.Type: ApplicationFiled: March 12, 2014Publication date: September 18, 2014Applicant: SANDIA CORPORATIONInventors: Jeffrey P. Koplow, Vipin P. Gupta, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Jeffrey S. Nelson
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Patent number: 8833634Abstract: An object of the invention is to provide an electronic component mounting system which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.Type: GrantFiled: September 29, 2009Date of Patent: September 16, 2014Assignee: Panasonic CorporationInventor: Kazuhide Nagao
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Patent number: 8826522Abstract: A method for the insertion of ferrite members onto pins acting as the contacts of an electrical filter connector. The ferrite members are oriented to a desired orientation by a known method. The ferrite members are preferably oriented in the vertical position for storage and are conveyed to a dynamic storage lock chamber equipped with a ferrite member stopping mechanism. A ferrite member distribution system incorporating a horizontally moving distribution plate individually releases the ferrite members from the lock chamber into the distribution system and inserts ferrite members onto the contacts according to a rate controlled by the operator.Type: GrantFiled: May 25, 2012Date of Patent: September 9, 2014Assignee: Souriau SASInventor: Robert Roblot
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Patent number: 8824164Abstract: The present invention provides a laminate printed board having a novel structure that is able to ensure alignment accuracy of the interboard terminals soldered to one printed board and that is also able to achieve a simplification of the process of soldering the interboard terminals. Through-hole lines in which a plurality of through-holes extend in lines are formed on a first printed board. Additionally, a press-fitting fastener hole is formed within the through-hole lines and a first end of an interboard terminal is press-fitted and fastened to the press-fitting fastener hole. Additionally, first ends of others of the interboard terminals are inserted through and flow soldered to through-holes on the first printed board.Type: GrantFiled: July 17, 2012Date of Patent: September 2, 2014Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Tsuyoshi Sakita
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Patent number: 8813350Abstract: A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.Type: GrantFiled: June 3, 2011Date of Patent: August 26, 2014Assignee: Seagate Technology LLCInventors: Niandong Liu, William A. Nelson, James O. Anderson
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Publication number: 20140230241Abstract: After a reel of an MSD which is a moisture management target component is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, exposure time for which the MSD is in an atmospheric exposure state is timed in a reel unit, and the exposure time is compared with exposure limit time set for the MSD and stored in a storage part, and an electronic component mounting apparatus equipped with the reel of the MSD whose exposure time exceeds the exposure limit time is specified and work by the apparatus is stopped.Type: ApplicationFiled: March 7, 2013Publication date: August 21, 2014Inventors: Norihisa Yamasaki, Yasuhiro Maenishi, Yuji Nakamura
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Patent number: 8800139Abstract: A method of chip mounting uses a manipulator to mount an electronic component in a vertically upward direction onto a downwardly-facing mounting surface of a printed circuit board held by a holding bed. The holding bed is located above the manipulator or sidewise relative to the manipulator for mounting by the manipulator onto the downwardly-facing mounting surface of the printed circuit board.Type: GrantFiled: December 21, 2011Date of Patent: August 12, 2014Assignee: Trinc.OrgInventor: Makoto Takayanagi
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Publication number: 20140215812Abstract: A mounting head 16 includes shaft members 23 respectively provided with suction nozzles 22, rotation driving motors 24 for individually conducting rotary movements of the shaft members 23, and vertical movement driving motors 25 which are arranged in a staggered arrangement in an opposite direction to a staggered arrangement of the shaft members 23, and adapted to individually conduct vertical movements of the shaft members 23. The rotation driving motors 24 directly drive the shaft members 23, and the vertical movement driving motors 25 move the shaft members 23 up and down, together with the rotation driving motors 24.Type: ApplicationFiled: September 11, 2012Publication date: August 7, 2014Applicant: PANASONIC CORPORATIONInventors: Shinji Yamamoto, Yutaka Kinoshita, Nobuhiro Nakai, Hiroyuki Fujiwara
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Publication number: 20140215813Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.Type: ApplicationFiled: February 5, 2014Publication date: August 7, 2014Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Youhei KISHIMOTO
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Patent number: 8793867Abstract: A head nozzle unit includes a pair of motion guides located parallel to each other, a pair of movable blocks disposed on the pair of motion guides and movable independently of each other, a guide member transversely connected to the pair of motion guides via the pair of movable blocks, a pair of head nozzle parts disposed on opposite lateral surfaces of the guide member, the pair of head nozzle parts movable independently of each other and operable to pick up and mount electronic parts, and a driver that moves the pair of movable blocks in cooperation with one another and that moves the pair of head nozzle parts in predetermined directions. Further, an apparatus and method for mounting electronic parts includes the head nozzle unit. The pair of head nozzle parts alternately and sequentially performs a series of mounting processes of picking up the electronic parts and mounting the picked up electronic parts.Type: GrantFiled: January 21, 2011Date of Patent: August 5, 2014Assignee: Samsung Techwin Co., Ltd.Inventors: Tae-Young Lee, Boo-Goan Choi
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Publication number: 20140208587Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant.Type: ApplicationFiled: October 19, 2012Publication date: July 31, 2014Applicant: PANASONIC CORPORATIONInventors: Tadashi Maeda, Hiroki Maruo, Tsubasa Saeki
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Patent number: 8789266Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.Type: GrantFiled: July 22, 2010Date of Patent: July 29, 2014Assignee: Samsung Techwin Co., Ltd.Inventor: Seong-Ku Kim
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Patent number: 8782879Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.Type: GrantFiled: August 29, 2012Date of Patent: July 22, 2014Assignee: TDK CorporationInventors: Toru Mizuno, Osamu Shindo, Hitoshi Nakayama
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Patent number: 8782875Abstract: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D).Type: GrantFiled: November 29, 2010Date of Patent: July 22, 2014Assignee: Panasonic CorporationInventors: Takeyuki Kawase, Yoshiyuki Kitagawa, Shuzo Yagi
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Patent number: 8776361Abstract: A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label. The system includes a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules. The stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch is disposed above the stamping opening A support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate. A suction device is provided for holding the RFID chip module on the stamping punch. A heating device for melting solder is present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.Type: GrantFiled: November 30, 2010Date of Patent: July 15, 2014Assignee: Textilma AGInventor: Stefan Buhler
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Publication number: 20140190000Abstract: An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.Type: ApplicationFiled: January 17, 2014Publication date: July 10, 2014Applicant: HzO, Inc.Inventors: Blake Stevens, Max Sorenson, Scott B. Gordon
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Patent number: 8763238Abstract: A hearing aid (8) comprises an inlet port (6), a sound tube (12) for conveying sound to the ear piece (13). The invention further provides a component for a hearing aid comprising a slab (26) having an exterior surface, which is super-hydrophobic. The component may be any one of a housing, a casing, a shell, a faceplate, a grid, a hook, a lid, a battery drawer, a button, or a manipulator. The invention also provides a method of manufacturing a component for a hearing aid.Type: GrantFiled: July 1, 2009Date of Patent: July 1, 2014Assignee: Widex A/SInventors: Jorn Eiler Vestergaard, Jorgen Mejner Olsen, Leif Hojslet Christensen, Kenneth Brian Haugshoj, Martin Frohling Jensen, Kasper Vestentoft
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Patent number: 8756799Abstract: A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the substrate accommodating trays are to be mounted on an upper surface; and substrate removal tool insertion openings for inserting the substrate removal tools are positioned so as to oppose openings of the mounted substrate accommodating trays.Type: GrantFiled: June 25, 2009Date of Patent: June 24, 2014Assignees: Sharp Kabushiki Kaisha, Sydek CorporationInventors: Takenori Yoshizawa, Hideo Taniguchi, Hiroto Shibata
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Patent number: 8752283Abstract: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.Type: GrantFiled: June 1, 2012Date of Patent: June 17, 2014Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Bing Dang
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Publication number: 20140157591Abstract: A substrate standby unit that is capable of keeping only one substrate 4 on standby in a substrate sorting mechanism 40 that moves the substrate 4 from the print inspection device M2 to the component installation device M4, a memory device 60 that stores a substrate ID on the substrate 4 that is on standby in the substrate standby unit, and a substrate ID management unit 46 that updates the substrate ID that is stored in the memory device 60 accompanying the transfer of the substrate 4 from the print inspection device M2 to the substrate standby unit are included. The substrate ID stored in the memory device 60 and the inspection result data associated with this substrate ID and stored in an inspection result data memory unit 45 are transmitted to the component installation device M4.Type: ApplicationFiled: August 31, 2012Publication date: June 12, 2014Applicant: PANASONIC CORPORATIONInventor: Daisuke Nagai
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Publication number: 20140154894Abstract: A method for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner is provided. An end piece of a metal foil strip is fed in a feeding step, in which the contact sensor plate is positioned on the electric or electronic module in a positioning step, and in which the contact sensor plate is fastened on the electric or electronic module in a fastening step. The method is characterized in that the contact sensor plate is produced by being severed from the foil strip in a severing step that follows the feeding step and precedes the positioning step.Type: ApplicationFiled: March 23, 2012Publication date: June 5, 2014Inventor: Andreas Heise
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Publication number: 20140150254Abstract: An electronic component mounting method includes a removing step, a first mounting step, a first attaching step and a second mounting step. In the removing step, a first feeder holding first electronic components is removed from an attaching portion of a component feeding device when there is a reason for removing the first feeder from the attaching portion. In the first mounting step, electronic components other than the first electronic component, out of electronic components to be mounted on a board, are mounted on the board when the first feeder is removed from the attaching portion. In the first attaching step, the first feeder is attached to another attaching portion, to which no feeder is attached, after the removing step. In the second mounting step, the first electronic component is mounted on the board from the first feeder attached to the other attaching portion after the first attaching step.Type: ApplicationFiled: July 25, 2013Publication date: June 5, 2014Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Daisuke KASUGA
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Publication number: 20140150256Abstract: A size S1 of each of projections 32b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20, and a size S2 of each of the projections 32b in a direction perpendicular to the proceeding direction of the tape member 20 at a height where each of the projections 32b is engaged with each of the feed holes 22 of the tape member 20 is smaller than the diameter D of each of the feed holes 22 of the tape member 20.Type: ApplicationFiled: August 16, 2012Publication date: June 5, 2014Applicant: PANASONIC CORPORATIONInventors: Kazunori Kanai, Masanori Hiyoshi, Shigekazu Yoneyama, Satoshi Kawaguchi
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Patent number: 8739393Abstract: It is an object to provide an electronic component mounting method that makes it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape 15 already loaded on a tape feeder to a newly loaded carrier tape 15A, when an optical sensor 30 has detected a joint J between the already-loaded carrier tape 15 and the newly-loaded carrier tape 15A, a height measurement device 12 performs measurement of a component pickup height targeted for components P housed in the carrier tape 15A in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzles 10a are to be lowered are updated on the basis of the measurement result.Type: GrantFiled: May 11, 2011Date of Patent: June 3, 2014Assignee: Panasonic CorporationInventors: Shinji Yamamoto, Yasuyuki Ishitani
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Patent number: 8739392Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.Type: GrantFiled: June 30, 2009Date of Patent: June 3, 2014Assignee: Intel CorporationInventors: Tod Byquist, Daniel P. Carter
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Patent number: 8735218Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.Type: GrantFiled: December 1, 2009Date of Patent: May 27, 2014Assignee: Muehlbauer AGInventors: Michael Max Mueller, Helfried Zabel, Hans-Peter Monser
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Patent number: 8732941Abstract: In order to simplify the assembly of printed board connectors, there is provided an assembly aid that features one or more recesses in accordance with the dimensions of the printed board connectors, wherein one or more printed board connectors to be assembled on a printed board can be inserted into said recesses. The contact spacing on the printed board corresponds with the arrangement of the printed board connectors in the assembly aid such that an exact alignment of the printed board connectors is realized. The assembly aid remains on the printed board until the soldering process is completed, wherein this prevents, for example, flotation of SMD components.Type: GrantFiled: March 3, 2010Date of Patent: May 27, 2014Assignee: Harting Electronics GmbHInventors: Christian Schuetz, Guenter Pape
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Publication number: 20140130348Abstract: A component mounter includes: a nozzle having a nozzle main body and a reflecting part provided behind the main nozzle body and reflecting light from front, the nozzle main body including a greatest outer periphery section provided to a front section of the main nozzle body, and the greatest outer periphery section of an outer periphery of the nozzle main body provided in front on the reflecting part; a first illuminating unit provided in front of the reflecting part and illuminating the reflecting part from front with light; and an imaging unit provided in front of the nozzle and capturing the greatest outer periphery section positioned in front of the nozzle main body, using the light from the first illuminating light and reflected off the reflecting part.Type: ApplicationFiled: May 11, 2012Publication date: May 15, 2014Inventors: Osamu Okuda, Hiroharu Tokunaga, Hideaki Katou, Tomio Tanaka
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Publication number: 20140130341Abstract: A method and system for pins detection and insertion of an electronic component are provided. The method includes picking an electronic component having a plurality of pins by a pick and place device, acquiring a plurality of serial images with respect to the plurality of pins at different height along an image acquiring direction by an image acquiring device, separately detecting image positions corresponding to the plurality of pins in the plurality of serial images, determining whether the electronic component is qualified according to a distance between the image positions of two adjacent pins, and if the electronic component is qualified, inserting the electronic component to a circuit board according to a position relationship between the image positions of the pins and a geometric center position of the pick and place device.Type: ApplicationFiled: November 8, 2013Publication date: May 15, 2014Applicant: Industrial Technology Research InstituteInventors: KUO-FENG HUNG, YUNG-JUNG CHANG, YEN-CHIA PENG
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Patent number: 8720045Abstract: A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set.Type: GrantFiled: March 12, 2012Date of Patent: May 13, 2014Assignee: Sony CorporationInventor: Takeshi Nakamura
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Publication number: 20140123454Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.Type: ApplicationFiled: November 5, 2012Publication date: May 8, 2014Applicant: Infineon Technologies AGInventors: Abdul Rahman Mohamed, Subaramaniym Senivasan, Zakaria Abdullah, Ralf Otremba
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Publication number: 20140115886Abstract: A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine.Type: ApplicationFiled: October 26, 2012Publication date: May 1, 2014Applicants: VOLEX PLC, APPLIED MICRO CIRCUITS CORPORATIONInventor: Benoit SEVIGNY
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Patent number: 8707550Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.Type: GrantFiled: July 24, 2009Date of Patent: April 29, 2014Assignee: ASM Technology Singapore Pte LtdInventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He