Abstract: A mounting device in which a loading distance separating adjacent characteristic components are lined up side by side is shorter than separation distance between suction nozzle and mark camera, processing to image characteristic component by mark camera and recognize the position of characteristic component is performed consecutively or in one batch. With the mounting device, because mounting head is moved a loading distance that is shorter than the separation distance between suction nozzle and mark camera and image processing is performed consecutively or in one batch, the movement distance of mounting head is shorter.

Abstract: A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.

Abstract: An automatic measuring device includes a platform, a pre-positioned suction nozzle, a reverse suction nozzle, a sensor, and a reflection sheet. The sensor is fixed on a side of the reverse suction nozzle, and the reflection sheet is fixed on a side of the pre-positioned suction nozzle and is located below the sensor. The method includes the following steps: controlling, by the automatic measuring device, a light source to emit light to the reflection sheet; detecting, by the sensor, a measurement value of the reflection sheet; determining, by the automatic measuring device, a change curve of a measurement value and a height according to a material of the reflection sheet; finding, by the automatic measuring device from the change curve, a height value corresponding to the measurement value; and determining, by the automatic measuring device according to the height value, whether the transfer and handoff platform can pass examination.

Abstract: A nozzle holder that detachably holds a nozzle in a lower end portion of a main shaft is configured to have a tubular shape having an insertion hole into which an installed portion of the nozzle is inserted, and to include a holder tube portion in which an opening portion leading to the insertion hole is formed on one side surface of the holder tube portion, a clamp lever which has an engaging portion engaged via the opening portion with the installed portion of the nozzle inserted into the insertion hole, and a clamp spring which biases the engaging portion to the installed portion of the nozzle inserted into the insertion hole.

Abstract: After a chuck portion chucks a workpiece holding body which aligns and holds a plurality of workpieces on which components are to be placed, the posture of the workpieces held in the workpiece holding body is adjusted due to rotation mechanism by rotating the chuck portion around an axial line which extends in an aligning direction of the plurality of workpieces held in the workpiece holding body. Then, a placing head places the components on each of the plurality of workpieces which are subjected to posture adjustment.

Abstract: An inspection device (1) includes a light source (10) projecting excitation light to an inner surface of a container (20); an imager (11) capturing a fluorescence image of fluorescence emitted from a foreign substance in response to the excitation light projected; and a detector (13) detecting the foreign substance adhering to the inner surface of the container from the fluorescence image captured by the imager. The foreign substance contains a material emitting fluorescence in response to the excitation light projected to the material. The detector includes a calculator (14) calculating an average brightness value in an inspection target region, and an adjuster (15) adjusting an image-capturing condition where the fluorescence image is captured such that the average brightness value falls within a preset range.

Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.

Abstract: A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.

Abstract: When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.

Abstract: A device for positioning an integrated circuit wafer includes: a base, called upper, and a base, called lower, arranged at a distance from one another in a direction, called vertical, so as to leave a free space between the bases; a support, provided to be mobile between the upper and lower bases, and including a location for receiving the wafer to be inspected; at least one first means apparatus for positioning the support in the vertical direction against, or by cooperation with, the upper base; and at least one second means apparatus for positioning the support in the vertical direction against, or by cooperation with, the lower base. Also provided is an inspection equipment for an integrated circuit wafer implementing such a positioning device.

Abstract: A plurality of workpieces on which components are to be placed are lined up in a row and held by a workpiece holding body, and the workpiece holding body is placed on a carrier and is transported to a working position using a transport conveyor. After the workpiece holding body is chucked by a chuck portion, the workpiece holding body is separated from the carrier by linking an operation of lifting and lowering the chuck portion using a lifting-lowering mechanism and an operation of moving the carrier in a transport direction. The chuck portion which chucks the workpiece holding body is rotated by a rotation mechanism, postures of the plurality of workpieces which are held in the workpiece holding body are adjusted, and then, the components are placed on component placing parts using a placing head.

Abstract: A component mounter including a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units each including a tool rotation device and a component handling tool. The component handling tool includes a base section and a protruding portion extending in a downward direction from the base section, a first end of the protruding portion attached to the base section at a tool attaching position, and a second end of the protruding portion positioned offset with respect to the tool attaching position in a direction perpendicular to the downward direction. The component mounter uses the component handing tools to simultaneously push a component at two push locations so as to insert the component onto the board.

Abstract: A mounting device is provided with a first raising and lowering drive section that raises and lowers a syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section that raises and lowers the suction nozzle with respect to the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component or information of the stage height of a transfer stage.

Abstract: A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.

Abstract: A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.

Abstract: A pick and place nozzle performance analytics system streams production data from pick and place machines used in electronic assembly to a cloud platform as torrential data streams, and performs analytics on the production data to track, visualize, and predict performance of individual nozzles in terms of rejects or miss-picks. The analytics system generates a performance vector for each nozzle based on the collected production data, the performance vector tracking both the accumulated rejects and the percentage of rejects as respective dimensions of an x-y plane. The system monitors and analyzes the trajectory of this vector in the x-y plane to predict when performance degradation of the nozzle will reach a critical threshold. In response to predicting that nozzle performance degradation will exceed a threshold at a future time, the system can generate and deliver notifications to appropriate client devices.

Abstract: A mounting target working device includes a mounting target holding unit that holds a mounting target. The mounting target holding unit includes a lift mechanism that moves the mounting target in an upward-downward direction, a tilt mechanism attached to the lift mechanism and that tilts the mounting target, and a rotation mechanism attached to the tilt mechanism and that rotates the mounting target. The rotation mechanism is supported in a cantilever manner by the tilt mechanism.

Abstract: Provided is a production facility (1), including: a plurality of production units (10A to 10E) coupled to each other in a separable manner; a guide rail (2) extending in a unit coupling direction; and transfer means (3) capable of sequentially transferring, by moving along the guide rail (2), a workpiece from the production unit (10A) toward the production unit (10E). Each of the plurality of production units (10A to 10E) includes: a processing section (13) configured to execute predetermined processing; a control section (14) configured to electrically control an operation of the processing section (13); a rail member (20) constructing the guide rail (2); and a slide member (30) constructing the transfer means (3). Each of the plurality of production units (10A to 10E) further includes: a connector (15, 15) configured to electrically connect the control section (14) thereof and the control section (14) of the adjacent production unit (10).

Abstract: A light-emitting diode transfer includes: a stage; a moving portion disposed on the stage and which performs a linear motion on the stage; a linear driving portion disposed on the moving portion and which performs a linear motion on the moving portion; and a head portion rotatably disposed on the linear driving portion and which picks up a light-emitting diode.

Abstract: A component mounter including a control device configured to perform communication control with component supply device, a control device including guidance control section configured to issue guidance of a mounting position of component supply device to which carrier tape should be inserted based on information of the component stored in the carrier tape, a check control section configured to determine whether the carrier tape has been correctly inserted to the mounting position as guided by guidance control section, based on a recognition signal of tape insertion recognition section configured to recognize insertion of the carrier tape into tape insertion opening, and a supply command sending section configured to send a component supply command to the feeder at the mounting position in a case in which it is determined that the carrier tape has been inserted to the mounting position as guided by guidance control section.

Abstract: In a rotary head type component mounter, before using two suction nozzles of rotary head to pick up the leading components in component supply tape set in two tape feeders, rotary head is moved in the XY directions by head moving mechanism and rotated by head rotating mechanism such that the pickup points of the two suction nozzles are positioned on two straight lines and extending in the tape feeding direction of each tape feeder passing through the ideal pickup points of the leading components of the two tape feeders, and the leading components are fed to component pickup positions and that are the pickup points of the suction nozzles on the two straight lines. Then, the two suction nozzles of rotary head are lowered simultaneously to pick up the two component simultaneously using the two suction nozzles.

Abstract: A robot system including a conveying apparatus that conveys an object; a robot that performs a process on the object being conveyed; a visual sensor that acquires visual information about the object; a high-frequency processing unit that detects at least one of a conveying velocity at which the object is being conveyed by the conveying apparatus and a position of the object by processing, at a first frequency, the visual information; a low-frequency processing unit that detects a position of the object by processing, at a second frequency that is lower than the first frequency, the visual information; and a control unit that controls the robot.

Abstract: After measuring electrical characteristics, a component favorably drops from a measuring element. An inspection device includes a pair of measuring elements configured to measure electrical characteristics of a component by gripping the components due to being capable of approaching and separating from each other; and air supply device configured to supply air to at least one of a pair of opposing surfaces that oppose each of the pair of measuring elements, and by supplying air to at least one of the opposing surfaces from air supply device, a component s adhered to the at least one opposing surface can be caused to drop favorably.

Abstract: A system for mounting electronic components on a substrate includes component holders each configured to hold an electronic components to be mounted on the substrate. A revolving device is configured to revolve the component holders along a pre-determined path so that each one of the component holders is moveable into a component receiving location for receiving a respective electronic component and/or a component mounting location for mounting the respective electronic component on the substrate. An actuator is configured to actuate a respective component holder in the component receiving location and/or the component mounting location. A safety device is configured to determine whether the respective component holder to be actuated by the actuator is properly placed in an operative position on the revolving device. The safety device is arranged separately from the actuator and is spaced apart from the actuator along the pre-determined path.

Abstract: A setting value of a component parameter that includes at least one of component information relating to an electronic component and tape information relating to a carrier tape that is supplied by a tape feeder is input, a rule table in which a component parameter and a setting value of an operational parameter relating to an operation by at least one of component mounting apparatuses are associated with each other is stored, and the setting value of the operational parameter that corresponds to a setting value of the component parameter which is input is set based on a rule table.

Abstract: A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporting path transporting one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a component information storage being capable of storing component information of stick cases. A plurality of electronic components of same lot are accommodated in the plurality of stick cases, and the component information storage stores component information of a stick case read from one of the plurality of stick cases, as the component information of each of the plurality of stick cases.

Abstract: Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.

Abstract: A component mounting head for mounting a component includes a head main body; a nozzle holding tool held on the head main body capable of lifting and lowering; a suction nozzle fitted into a lower end portion of the nozzle holding tool and movable in an up-down direction, and picks up and holds the component on the lower end portion of the suction nozzle, a first lifting and lowering device lifting and lowering the nozzle holding tool, a second lifting and lowering device lifting and lowering the suction nozzle, an acting force detector detecting an acting force acting on the suction nozzle in the up-down direction, and a control device controlling the second lifting and lowering device based on the acting force detected by the acting force detector, when the component is mounted, in which a bearing is interposed between the suction nozzle and the nozzle holding tool.

Abstract: A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state; a component transporting path transporting one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; a component detector being disposed on the component transporting path, the component detector detecting one or more electronic components on the component transporting path; a component number measurer measuring a first number of electronic components based on the detection result of the component detector; and a determiner determining a change of stick case which supplies one or more electronic components to the component supply position based on the first number of electronic components measured by the component number measurer and a second number of electronic components unloaded from the component supply position.

Abstract: A part feeding device of the present disclosure includes a main body; a conveyor; and a part detector. At a position further upstream than the part detector, the transporting passage includes a guide surface for guiding the lower surface of the part feeding tape, and a ceiling surface which faces the guide surface and is positioned at a position upwardly apart from the guide surface by the dimension larger than the thickness of the part feeding tape having the maximum thickness to be used in the part feeding device. The transporting passage includes a partial guide surface which supports the lower surface of the part feeding tape, and the partial guide surface includes an approaching portion approaching a ceiling surface in a downstream direction.

Abstract: A tape feeder (a component supplying device) which transports a carrier tape covered with a cover tape and storing components to a component pick-up position, peels off the cover tape before the component pick-up position, and supplies the stored components to a component mounter, the tape feeder including photo-switch (a detector) which detects presence or absence of tension acting on the cover tape, the cover tape is peeled off from the carrier tape, a feeder storage unit (a storage unit) which stores the presence or absence of tension which is detected by the photo-switch, and an operation determination unit (a determination unit) which determines a processing operation performed when power which is supplied to the tape feeder is reintroduced based on the presence or absence of tension which is detected.

Abstract: A nozzle station installation device capable of installing multiple nozzle stations, which hold multiple suction nozzles that are used in an electronic component mounting machine, in a nozzle cleaning device or the like, is provided. The nozzle station installation device is provided with multiple reference bases, and intermediate bases that are provided to be attachable and detachable on each of the multiple reference bases and on which multiple nozzle stations are capable of being placed, positioning sections which position intermediate bases are provided at a common position on the multiple reference bases, a positioning and fixing device that positions and fixes each of the multiple nozzle stations to be attachable and detachable is provided on each of the multiple intermediate bases, and 2D codes are disposed in a fixed positional relationship with the positioning sections in each of the multiple nozzle stations.

Abstract: A finishing apparatus for performing an automated finishing operation on a surface of a workpiece is disclosed. The finishing apparatus may include a platen fabricated from a magnetic material and having a platen surface, and a finishing module disposed on the platen surface and having a finishing operation end effector. The finishing module may generate a magnetic field that biases the finishing module toward the platen, and may be operable to generate a magnetic flux to control movement of the finishing module over the platen surface to perform the automated finishing operation on the surface of the workpiece.

Abstract: A chuck device is provided with multiple types of chuck claws clamping a component, a chuck claw switching mechanism switching the chuck claw in use among the multiple chuck claws based on the type of component to be clamped, and a driving mechanism causing the chuck claw subjected to the switching by a chuck claw switching mechanism perform a clamping operation. The chuck claw switching mechanism causes the respective chuck claws to move vertically independently of each other and performs switching of the chuck claw in use by a rotating cylindrical cam in a state where rotation of a tubular guide member placed on an outer peripheral side of a cylindrical cam is locked. A rotation locking member locking the rotation of the tubular guide member during switching of the chuck claw in use and a cam follower moving the rotation locking member are disposed in a mounting head.

Abstract: A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft.

Abstract: A component mounting machine including: a nozzle that picks up a component; sliders and a ball screw that move the nozzle in horizontal and vertical directions; a reel unit that supplies components; a board conveyance device that holds and conveys a board on which components are mounted; a parts camera that irradiates a component held by the nozzle with light to image the component from below; and a controller that performs various control functions, is provided. The controller obtains a clearance height at which an obstacle between the parts camera and a predetermined mounting position on a board can be avoided, extracts from an HDD an imageable range of the component, and sets a target height of a lower surface of the component held by the nozzle when the nozzle passes above the parts camera, such that the target height is closest to the clearance height within the imageable range.

Abstract: A component mounting system that efficiently determines a component as a bulk component to be mounted on a bulk feeder through a simulation, and a bulk component determining method. The component mounting system includes a printed-circuit-board conveyance section that includes conveyance lanes and which convey a plurality of different types of printed circuit boards, a component supply section, a mounting head, a bulk feeder, and a bulk component determining section that performs a simulation in which operation times when the components supplied from the component supply section are moved on the printed circuit boards on the conveyance lanes are calculated for all the components and determines the bulk component to be mounted on the bulk feeder based on the calculated operation times.

Abstract: An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.

Abstract: A component mounter includes a component transfer device, a tool station, and a control device. The component transfer device is provided with a head main body, and a tool holding device configured to hold a nozzle tool and provided to be raisable and lowerable with respect to the head main body and rotatable around a rotation axis line. The tool station is configured to be able to store an exchange-use nozzle tool at multiple different storage angles. The control device of the component mounter includes an angle acquiring section that acquires the storage angle of the exchange-use nozzle tool in the tool station, and an exchange control section that, during the nozzle tool exchange processing, rotates the tool holding device based on the storage angle of the nozzle tool, and performs angle alignment of the nozzle tool with respect to the head main body.

Abstract: The invention provides a component supply device which is small and can supply electronic components efficiently. The component supply device 1 mounts a component supply tape T and exposes the electronic components out of the component supply tape T to provide to a component installation device 7 which mounts the electronic components on a circuit board. The component supply device 1 has a replenishment device 2 which replenishes a new component supply tape (Tb) when a preceding component supply tape Ta runs out, and a sensor S which detects the run-out of the preceding component supply tape Ta. The replenishment device 2 has a reel holding section 21 on which reels 20 wound with the component supply tape T are inserted, and a standby section 5 of the component supply tape T. When the sensor S detects that the preceding component supply tape Ta runs out and issues a detection signal, the component supply tape T is moved from the standby section to be replenished.

Abstract: A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

Abstract: Component mounter includes a transfer inspection device that inspects the transfer state of solder by imaging the bottom surface of a component, and a transfer inspection data creation device that creates transfer inspection data. The transfer inspection data creation device performs imaging of the bottom surface of a pre-transfer component with a camera at multiple shutter speeds, acquires the multiple pre-transfer images of different shutter speeds, obtains pre-transfer bump portion pixel values, performs imaging of the bottom surface of a post-transfer component with the camera at the same multiple shutter speeds, acquires the multiple post-transfer images of different shutter speeds, obtains post-transfer bump portion pixel values, and determines the shutter speed to be used when performing transfer inspection based on the post-transfer bump portion pixel values.

Abstract: A fixing tool includes a pair of arms, a holding portion, and a claw portion. The arms are capable of being inserted into and pulled out from through holes formed respectively in a sheet support plate, which supports a sheet stored in a sheet feeder of an image forming apparatus such that the sheet can be lifted and lowered, and in a bottom portion of the sheet feeder. The holding portion is provided so as to project from a predetermined position on each of the arms and capable of holding the sheet support plate and the bottom portion. The claw portion is provided so as to project inward from a distal end of each of the arms and capable of being inserted between an integrated circuit mounted in the image forming apparatus and a mounting target portion which the integrated circuit is mountable to and detachable from.

Abstract: A rotary head is configured of at least two types of rotary heads, such as a first rotary head in which four suction nozzles are respectively held to be rotatable on the circumference, and a second rotary head in which the suction nozzles of which the number is more than four are respectively held to be rotatable on a pitch circle diameter which is the same as that of the suction nozzle of the first rotary head, the first rotary head is attached to the drive unit, and a control device which controls an angular position of the first rotary head and an angular position of the components suctioned to the suction nozzles, to be respectively controlled to be changed by 45 degrees when the components held by the suction nozzles are imaged by a component camera is provided.

Abstract: Systems and methods for transferring solar cells while maintaining a controlled micro-environment are provided. In particular, such systems provide automated loading and unloading of solar cells by use of a conveyor and elevator within a tank receptacle sealingly connected with a solar cell carrying pods and a flow tube of solar cell components in a solar cell fabrication process. The tank receptacle can include one or more ports for sealingly and operably coupling with a cover of a solar cell carrying pod, each port having an elevator for withdrawing a removable base of the pod along with a solar cell carrying cassette into the tank and a conveyor to facilitate loading and/or unloading of solar cells with the cassette by coordinated movement of the elevator and conveyor. Such systems can further include a robotic arm having a gripper and nozzle to maintain a micro-environment within the pod during transport.

Abstract: A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two transport lanes. The board distributing apparatus distributes the board to any one of the two transport lanes based on a presence or absence of boards in the carry-in area and the mounting area.

Abstract: A printed board working apparatus includes a transport device which transports a printed board in a horizontal direction, and a moving member which moves in a horizontal direction above the transport device. The printed board working apparatus includes a plurality of component attaching portions which are aligned in the installation direction and move together with the moving member. The printed board working apparatus also includes at least one working head which performs work on the printed board held by the transport device. The working head is attached to at least one component attaching portion out of the plurality of component attaching portions, and can change a position relative to the moving member in the installation direction. A region where the working head cannot perform work as the number of working heads increases is reduced.

Abstract: A gripper is described as including two lateral flanks that are directly or indirectly connected to each other at one end, generating a space between them containing an actuator whose lateral boundaries have at least one opening accessible from the outside. At least one reinforcement rib is allocated to at least one of the lateral flanks. A method for manufacturing the gripper is also described.

Abstract: A substrate working machine that performs mounting work on a circuit substrate is provided. The machine includes a receiving section that receives a first mounting work-correspondence device and a mounting stand on which a second mounting work-correspondence device is detachably mounted. The mounting work-correspondence device includes at least one of a device supplying an item necessary for the mounting work, a device discharging an item unnecessary in the mounting work, and a device performing processing required for the mounting work. The receiving section and the mounting stand are disposed at a predetermined edge portion of a base.

Abstract: Disclosed herein is a dispensing head that includes a motor, an air pump operably connected to and powered by the motor, and a first spindle connected to the air pump. The air pump is configured to create airflow in the first spindle. Further disclosed is a method of creating airflow in a dispensing head, and an assembly machine system having a dispensing head.