Abstract: A nozzle managing system in which suction nozzles can be suitably transferred is provided. A nozzle managing machine includes a tray holding section that holds a tray, a palette accommodation device as a nozzle stocker, and a nozzle transfer device that transfers the suction nozzles between the tray and the palette accommodation device. In addition, the nozzle managing machine acquires tray information that is information indicating the tray T held in the tray holding section, acquires nozzle information corresponding to the tray T on the basis of the tray information and JOB information stored in a memory section of a host PC, and controls the nozzle transfer device on the basis of the nozzle information.

Abstract: Automated dynamic manufacturing systems may provide for alignment of multiple components with respect to one another, such as an apparatus, a robot, and a supply of parts. The alignment may initially be performed roughly, using a global metrology device configured to track the apparatus, robot, and supply of parts, each of which may be movable with respect to the others, such as by being positioned on a respective automated guided vehicle. Alignment may then be performed to closer tolerances using a local metrology device coupled to the robot and configured to accurately position an end effector, such that the end effector may perform a manufacturing task on the apparatus, such as a pick-and-place process involving transporting an individual part from the supply of parts, transferring it to the apparatus, and coupling it thereto. Such systems and methods may be used to perform manufacturing processes on large apparatus, such as aircraft.

Abstract: When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

Abstract: An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Abstract: A production management system is configured so as to make it possible to produce component mounting boards to the same specifications in two lanes of a component mounting machine using one set of NC data by arranging feeders of two feeder set bases in the same manner and setting the mounting order of the components to the circuit boards in the two lanes to be the same in a same-direction production mode in which circuit boards are conveyed in the same front/back direction in the two lanes. In addition, the arrangement of the feeders and the mounting order of the components are optimized so that the difference in production times in the two lanes in the same-direction production mode is minimized.

Abstract: Contactor arrangement of an IC test handler, comprising: a contactor unit which has test contacts for contacting an IC in test and for temporarily pressing the IC against the test contacts, a plunger head, which has a recessed central region corresponding to the geometrical configuration of the IC, such that those surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, and a contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit.

Abstract: A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.

Abstract: A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.

Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).

Abstract: A second tape feeding mechanism 20B can deal with a plurality of types of carrier tapes and has a biasing mechanism 25 that brings a biasing member 30 in which a recess portion 30b is provided in an abutment surface 30a into abutment with a carrier tape so as to bring the carrier tape into engagement with an outer circumferential surface of a sprocket 21B, and with a preceding tape kept in engagement with the sprocket 21B, a leading end portion of a following tape is inserted between the sprocket 21B and the preceding tape.

Abstract: In an apparatus adapted to scan a lower side of an electronic component being suction-held by a suction-holding nozzle, to perform image recognition of suction-held conditions of the electronic component, this invention is intended to perform a transfer operation under a condition that the suction-holding nozzle is arranged closer to an upper surface of a base, wherein the optical path directed downwardly from the suction-holding nozzle is bended in a lateral direction by a first optical path changing member and then further bended in another direction by a second optical path changing member to allow image-sensing means to capture an image of a lower surface of the suction-holding nozzle, and the electronic component being suction-held by the suction-holding nozzle is illuminated along the lateral optical path changed by the first optical path changing member.

Abstract: An embodiment of this invention provides a separation apparatus for separating a stacked article, such as a semiconductor chip package with sensing functions, comprising a substrate and a cap layer formed on the substrate. The separation apparatus comprises a vacuum nozzle head including a suction pad having a top surface and a bottom surface, a through hole penetrating the top surface and the bottom surface of the suction pad, and a hollow vacuum pipe connecting the through hole to a vacuum pump; a stage positing under the vacuum nozzle head and substantially aligning with the suction pad; a control means coupling to the vacuum nozzle head to lift upward or lower down the vacuum nozzle head; and a first cutter comprising a first cutting body and a first knife connecting to the first cutting body.

Abstract: A component mounting system makes a mounting head to which a component holder is attached perform component mounting operation including upward and downward movement operation with respect to a board and mounts a component on the board. A mounting apparatus repeats reciprocating mounting operations in which the component holder is moved in a mounting order relative to a reference line extending in a first direction being the board conveyance direction such that that the component holder is advanced over the board in a second direction orthogonal to the first direction and then a held high-height component is mounted and thereafter the component holder is retracted from the board in the second direction. The mounting order is set in order in which a mounting coordinate of the high-height component is larger in the second direction relative to the reference line.

Abstract: A tool for catching an IC package comprises a main body, a plurality of operation arms and a plurality of clamping arms. The main body has a base and a plurality of lateral portions rotating relative to the base. The operation arms each extends upwardly from a top portion of a corresponding lateral portion. The clamping arms each extends downwardly from a lateral portion and is formed with a clasping portion at a free end thereof, the clasping portion has a latching slot. The operation arms bring the lateral portions to rotate inwardly and open the clamping arms.

Abstract: A control device includes a reception unit that receives first operation information and second operation information different from the first operation information; and a process unit that instructs a robot to execute operations based on the first operation information and the second operation information using a plurality of captured images of an imaged target object, the images being captured multiple times while the robot moves from a first posture to a second posture different from the first posture.

Abstract: A system for automatically identifying a blade that is connected to a hand piece based on data transmitted from the blade to the hand piece. The blade is provided with a first electronic coupler that communicates with a second electronic coupled positioned in the hand piece such that data related to the blade is transmitted to the hand piece and controllers/computers and in the case of reusable blades, updated data is transmitted to the blade to be saved in a memory coupled to the first electronic coupler. The coupling system can be either a hard wired or wireless coupling between the blade and the hand piece.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.

Abstract: An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. This apparatus includes a first substrate moving unit which moves the printed circuit board, loaded by the loading unit, in the Y-direction. This apparatus includes a substrate holding unit which temporarily holds the printed circuit board moved by the first substrate moving unit. This apparatus includes a component mounting unit which mounts an electronic component on the printed circuit board. This apparatus includes a second substrate moving unit which moves the printed circuit board with the electronic component mounted thereon in the Y-direction. This apparatus includes an unloading unit which moves the printed circuit board, moved by the second substrate moving unit, in the X-direction to unload it. This invention can provide an electronic component mounting apparatus which is compact in its conveyance direction for conveying a printed circuit board.

Abstract: An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. This apparatus includes a first substrate moving unit which moves the printed circuit board, loaded by the loading unit, in the Y-direction. This apparatus includes a substrate holding unit which temporarily holds the printed circuit board moved by the first substrate moving unit. This apparatus includes a component mounting unit which mounts an electronic component on the printed circuit board. This apparatus includes a second substrate moving unit which moves the printed circuit board with the electronic component mounted thereon in the Y-direction. This apparatus includes an unloading unit which moves the printed circuit board, moved by the second substrate moving unit, in the X-direction to unload it. This invention can provide an electronic component mounting apparatus which is compact in its conveyance direction for conveying a printed circuit board.

Abstract: A component imaging unit of an electronic component mounting apparatus has three area cameras, and each of visual fields are common to each other regardless of the area cameras. When the imaging form of the component imaging unit is set to a first mode, a component recognition unit recognizes the electronic components held by the holding unit, based on an image imaged by one area camera. Meanwhile, when the imaging form is set to a second mode, in the component imaging unit, the component recognition unit recognizes the electronic component held by the holding unit, based on each of images, each of which is imaged by three area cameras.

Abstract: A substrate-treating apparatus includes a process chamber including a space therein, a lower electrode which is in the space of the process chamber and supports the substrate, an upper electrode which faces the lower electrode in the process chamber, a high frequency supply line which includes a feed point which applies a high frequency power to the lower electrode, and a modulator which asymmetrically supplies a dielectric substance to a lower portion of the lower electrode with reference to a center portion of the lower electrode.

Abstract: An automatic installation device for automatic procuring and fixing an object to a product is mounted on a base. The automatic installation device comprises an elevating mechanism, a loading mechanism for procuring the object, and a flexing mechanism connected between the elevating mechanism and the loading mechanism. The flexing mechanism is capable of driving the loading mechanism moving between the object and the product for aligning the object with the product in a first orientation. The elevating mechanism is capable of driving the loading mechanism to move in a second orientation perpendicular to the first orientation to drive the loading mechanism moving adjacent to the product and fixing the object to the product.

Abstract: A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.

Abstract: In the machine tool (10) pertaining to the present invention, the contour lines (51) of a tool (20) are displayed on a display screen (S). When an operator measuring the dimensions traces a contour line (51) on the display screen (S) of a touch panel (45) with a finger, it is possible to automatically identify, on the display screen (S), the site to be measured (i.e., the contour line (51)) on the tool (20). In this way, an operator can measure the dimensions of the tool (20) in an extremely simple manner. Additionally, it is possible to automatically measure the tool diameter or the blade position of the tool (20) as the operator designates a specific position on the contour line (51) of the tool (20). Thus, with such a method for measuring the dimensions of the tool (20), it is possible to easily identify an unexpected site to be measured on a tool having complex contour lines, such as a multi-stage tool.

Abstract: A first and second guide block pieces retain a plurality of electronic components in an electronic component retention space formed and fixed on a shuttle plate by using a position determination hole formed in advance in accordance with a distance between a pair of opposing corners of a bottom surface of an electronic component, and by emitting light ranging from one end portion to the other end portion of the shuttle plate along an upper surface of a plurality of electronic components interposed and retained between the electronic component interposing-and-retaining portions along longitudinal directions of the first and second guide block pieces, an optical sensor detects that the emitted light is blocked by an irregularly inclined electronic component.

Abstract: An electronic component mounting method includes a removing step, a first mounting step, a first attaching step and a second mounting step. In the removing step, a first feeder holding first electronic components is removed from an attaching portion of a component feeding device when there is a reason for removing the first feeder from the attaching portion. In the first mounting step, electronic components other than the first electronic component, out of electronic components to be mounted on a board, are mounted on the board when the first feeder is removed from the attaching portion. In the first attaching step, the first feeder is attached to another attaching portion, to which no feeder is attached, after the removing step. In the second mounting step, the first electronic component is mounted on the board from the first feeder attached to the other attaching portion after the first attaching step.

Abstract: A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

Abstract: It is an objective to provide an electronic parts mounting apparatus and an electronic parts mounting method for making it possible to mount various types of electronic parts having equivalent electric characteristics on a single substrate. Before a mount head 15 starts mounting LED parts 4 on substrates 3 positioned by substrate conveyance paths 12, the number of LED parts 4 still remaining on a plurality of tape feeders 13 is compared, according to the type of the LED part 4, with target number of LED parts 4 to be mounted on the substrates 3. When the number of remaining LED parts 4 of at least one type becomes smaller than the target number of LED parts 4 to be mounted, the mount head 15 is deactivated.

Abstract: An abnormality detection device including an air flow path that is opened and closed by a vertical movement of a nozzle piston in a nozzle holder of a suction nozzle, an air supply path that supplies air to the air flow path, and a flow sensor that detects an amount of air flow in the air supply path. The amount of air flow in the air flow path of the nozzle holder is monitored and based on an output signal from the flow sensor a defect the vertical movement of the nozzle piston is detected.

Abstract: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.

Abstract: A method includes: detecting a splice by splicing in a tape feed process of supplying a component by pitch-feeding the carrier tape; and performing data processing of writing splice component information over in-use component information when the splice is detected, and rewriting only a number of remaining component of the in-use component information by means of the number of remaining component of the splice component information without issuing a component depletion alarm when the splice is not detected and when the number of remaining component in the in-use component information has decreased to a predetermined value.

Abstract: A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.

Abstract: Provided is an apparatus for manufacturing a double-sided mounting substrate, the apparatus including: a backup table provided under the printed circuit board at the mounting position which supports the lower surface of the printed circuit board; and a servo motor which elevates and lowers the backup table, wherein the servo motor elevates the backup table to mount the new electronic components and lowers the backup table to carry-in and to carry-away the printed circuit board based on a lower limit position of the backup table, and wherein the lower limit position of the backup table is a position separated downwardly from a reference surface at the mounting position by a distance obtained by adding a preset clearance to a sum of a maximum height of the mounted electronic components mounted on the lower surface of the printed circuit board and a thickness of the printed circuit board.

Abstract: Thin substrates and mold compound handling is described using an electrostatic-chucking carrier. In one example, a first part of a plurality of silicon chip packages is formed on a front side of a silicon substrate wafer at a first processing station. An a carrier wafer of an electrostatic chuck is attached over the front side of the silicon wafer. The substrate wafer is moved to a second processing station. A second part of the plurality of silicon chip packages are formed on a back side of the silicon wafer at a second processing station. The electrostatic chuck is then released.

Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

Abstract: The invention provides a component supply device which is small and can supply electronic components efficiently. The component supply device 1 mounts a component supply tape T and exposes the electronic components out of the component supply tape T to provide to a component installation device 7 which mounts the electronic components on a circuit board. The component supply device 1 has a replenishment device 2 which replenishes a new component supply tape (Tb) when a preceding component supply tape Ta runs out, and a sensor S which detects the run-out of the preceding component supply tape Ta. The replenishment device 2 has a reel holding section 21 on which reels 20 wound with the component supply tape T are inserted, and a standby section 5 of the component supply tape T. When the sensor S detects that the preceding component supply tape Ta runs out and issues a detection signal, the component supply tape T is moved from the standby section to be replenished.

Abstract: A control unit of an electronic component mounting apparatus controls a component imaging unit so as to image an electronic component that is held by the holding unit when the holding unit is subjected to an acceleration movement or a deceleration movement by a movement mechanism unit.

Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

Abstract: A manufacturing apparatus for an electronic component includes a plurality of press members provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, the plurality of press members contacting a housing of a connector and pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit coupled with the pair of arm sections and adapted to measure a stress generated at the pair of arm sections when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

Abstract: A component mounting apparatus that compresses a component to a transparent substrate on which the component is placed with a photocurable resin interposed therebetween. The component mounting apparatus includes: a receiving unit that includes a base member and a transparent member provided on an upper surface of the base member and receives a surface of the substrate, which is positioned below the component, on an upper surface of the transparent member; a pressing unit that presses the component against the substrate received by the receiving unit; and a light irradiation unit that irradiates the photocurable resin with light through the transparent member.

Abstract: A parts mounting system includes: a parts checking section that detects parts information which is identification information applied to the electronic parts and includes a parts code for specifying parts of the electronic parts and a parts maker code for specifying the parts maker and checks the detected parts information with parts information previously registered in a storing part; and a parts data generation section that, when the detected parts information is unregistered parts information in which the parts code is stored in the storing part and the parts maker code of the parts code is not stored in the storing part, generates parts data of the electronic parts relating to the unregistered parts information based on previously registered parts data having the same parts code.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: A reel for a component mounting apparatus that pulls a carrier tape out of the reel and pitch-feeds and supplies the carrier tape by a tape feeder in a component supply part and picks up a supplied component and mounts the component in a substrate by a mounting head. The reel includes: a reel core part; and the carrier tape being wound and stored around the reel core part, wherein the carrier tape includes a distal end fixed to the reel core part, and a brittle part that is positioned in the vicinity of the distal end and is broken by action of longitudinal tension in excess of a prescribed strength on the carrier tape, and the pitch-feed separates the carrier tape from the reel core part at the brittle part.

Abstract: A component mounting method includes: detecting feeder ID information of a parts feeder, which individually specifies a parts feeder, after a second parts feeder is attached to an attaching position of the feeder base having a feeder address, and confirming whether the second parts feeder is the same as a first parts feeder which was attached to and then detached from the attaching position; and calculating an attaching/detaching time from detachment of the first parts feeder to attachment of the second parts feeder if it is confirmed that the second parts feeder is the same as the first parts feeder. If the calculated attaching/detaching time is a given time or shorter, the mounting work is performed without performing a component checking operation which determines whether a kind of an electronic component accommodated in the second parts feeder is proper.

Abstract: A component mounting apparatus includes: an operational sequence supervision unit which is created in compiler language determining an operational sequence specifying a series of sequence operations of suctioning, recognizing and mounting a component; and a second memory unit which stores a custom program, created in interpreter language and specifying an operation different from the series of sequence operations, and custom program designation information that designates execution of the custom program. The operational sequence supervision unit controls a switching process for switching from the series of sequence operations to an interpreter language processing execution routine for executing the custom program, during, or before or after, the series of sequence operations in accordance with the custom program designation information.

Abstract: An electronic component manufacturing apparatus includes a first plate and a second plate such that a first surface of an electronic component chip is in contact with a first elastic layer of the first plate and a second surface of the electronic component chip is in contact with a second elastic layer of the second plate. The electronic component manufacturing apparatus further includes a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof and a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, the first and second plates in accordance with a turning path of the electronic component chip.

Abstract: The present disclosure relates to a device for attaching a chip on film onto a panel and the method of use the device. The device comprises a platform for conveying the panel, a pressure head for carrying the chip on film, and a panel supporting mechanism in cooperation with the pressure head during use. The device further comprises a distance-adjusting mechanism for measuring a distance between the panel and the supporting mechanism after the panel is placed between the pressure head and the supporting mechanism, and reducing the distance. According to the device of the present disclosure, the distance between the panel and the supporting mechanism can be reduced, so that the deflection occurred during attachment of the chip on film can be avoided. Therefore, the quality of the final product obtained can be improved.

Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.