Abstract: Embodiments may be directed to marine geophysical surveying and associated methods. At least one embodiment may be directed to incorporation of a lock mechanism in a sensor streamer that interlocks the outer jacket with one or more of the spacers to prevent relative rotation between the outer jacket. An embodiment may provide a sensor streamer that includes an outer jacket, a plurality of spacers, and a locking mechanism. The outer jacket may be elongated in an axial direction and comprise an outer jacket surface and an inner jacket surface. The plurality of spacers may be positioned in the outer jacket at spaced apart locations in the axial direction, wherein each of the plurality of spacers comprises a spacer body having an outer spacer surface. The locking mechanism may interlock the outer jacket with at least one of the plurality of spacers.

Abstract: A cable preparation machine includes a frame forming a cable cutting zone and having a cable opening along a cable axis at the cable cutting zone receiving an end of a cable. The cable preparation machine includes a pulley assembly rotatably coupled to the frame about the cable axis, a drive assembly operably coupled to the pulley assembly to rotate the pulley assembly about the cable axis, and a blade assembly operably coupled to the pulley assembly and rotated with the pulley assembly about the cable axis. The blade assembly is configured for cutting an insulator from the end of the cable in a first cutting configuration when the cable is positioned in the cable opening and the blade assembly is configured for cutting a cable braid from the end of the cable in a second cutting configuration when the cable is positioned in the cable opening.

Abstract: A cable processing device includes a cable conveying device running along a machine longitudinal axis transporting a cable, and a cable changer selectively supplying cables for processing. The cable changer has two guide units for guiding and holding one cable each and being movable between inoperative and active positions. In the inoperative position, the guide unit is positioned outside the cable conveying device spaced from the machine axis. In the active position, the guide unit is positioned coaxially with the machine axis producing an operative connection to the cable conveying device. The guide units are movable independently of each other. When one of the guide units is moved from the inoperative position into the active position, the other guide unit remains positionally fixed in the inoperative position. When the guide units are both in their inoperative positions, they are positioned lying next to each other on a common horizontal plane.

Abstract: A method produces activated carbon, suitable in particular for use in double-layer condensers. The method includes a) producing a mixture of a preferably pulverulent carbon material, a base and a hydrophilic polymer chemically inert to the base, b) pressing the mixture produced in step a) to form a pressing and c) activating the pressed body produced in step b).

Abstract: A cable (100) is proposed, comprising a protective sheath (130) wherein at least one conductor is housed. The protective sheath has a given thickness and an external diameter within a range of values defined by a predetermined standard. The cable also comprises at least one removable indicator strip (150): that extends longitudinally over at least one arc portion of the external circumferential surface of the protective sheath; that is made of a material enabling said at least one removable indicator strip to adhere to the protective sheath, while being capable of being detached from the protective sheath without altering it, by applying an extraction force per unit of width of said at least one removable indicator strip greater than a predetermined threshold; that has a thickness so that the external diameter of the protective sheath increased by the thickness of said at least one removable indicator strip is within said range of values.

Abstract: A circuit board assembly includes a printed circuit board, at least one wire, at least one wire fixing device, and a plurality of electronic components. A wire fixing method includes following steps. Firstly, the wire fixing device is inserted into a conductive hole of the printed circuit board. Then, the wire fixing device is fixed on the printed circuit board via a soldering material. Then, a conducting terminal of the wire is introduced into an accommodation space of the wire fixing device through the first opening of the wire fixing device. Then, at least one concave structure is formed in an external surface of a first conducting part of the wire fixing device by a jig. Consequently, the conducting terminal of the wire is fixed on the wire fixing device, and the wire is electrically connected with the printed circuit board through the wire fixing device.

Abstract: A method for producing an operative connection between a coaxial cable (1) and a coaxial connector (16). A cable jacket (5), if present, is removed by means of a first tool (6) to a predefined first length L1. In a second step, an outer conductor (3) is removed by means of a second tool (7) to a predefined second length L2. In a third step, a dielectric (4) is removed by means of a third tool (8) to a third length L3, such that one end (15) of the inner conductor (2) is exposed. Then the end (15) of the inner cable conductor (2) is formed by means of a rotary swaging device (9), which comprises a plurality of deflectable jaws (10) rotatable circumferentially about an axis of rotation (11) and each hammering in the radial direction with at least one operative surface (14).

Abstract: A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected portions of the first granular conductive material layer forming first layer conductive elements. An additional granular conductive material layer is introduced into the mold over the fused selected portions of the first layer and unfused portions of the first layer. The fusion process element is then traversed across the mold to fuse selected portions of the additional granular conductive material layer forming an additional layer of conductive elements. Unfused granular conductive material is then purged from the fused first conductive elements and additional conductive layer elements.

Abstract: The invention relates to a method for producing a stranded inner conductor (1), and to a coaxial cable (9). In a first step, a stranded inner conductor (2) is provided, which consists of several wires (3) twisted together. Then the stranded inner conductor (1) is rotary swaged by means of a rotary swaging device (10). In a further step, the rotary swaged stranded inner conductor (3) is enclosed with a dielectric (4). In a further step, the dielectric (4) is enclosed with an outer conductor (5) and a cable sheath (6).

Abstract: A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location. The device can have an extended central collar extending axially from the through-hole in the center of the device, which will allow it to be installed in holes, or on a stud without the use of adhesives or other retaining methods.

Abstract: Provided are an insertion method and an insertion apparatus for efficiently and reliably inserting a plurality of coil elements aligned in a ring shape into respective slots of a stator core. In an insertion method of inserting, the insertion method includes a coil element alignment process S3 of forming an assembly body 50 by assembling the plurality of coil elements 40 in a ring shape in the state where the turn portions 42 alternately overlap each other, a supporting process S42 of supporting the assembly body 50 by using the turn portions 42, and an insertion process S45 of allowing the assembly body 50 and the stator core 60 to be close to each other and inserting the leg portions 41 of the coil elements 40 of the assembly body 50 into the slots 61.

Abstract: An attachment device includes an exhaust, a connecting pipe, and an adhering head. The adhering head includes an adhering surface, and the adhering surface defines a number of evenly spaced adhering holes for adhering a conductive adhesive film. The connecting pipe air-tightly connects the exhaust to the adhering head.

Abstract: The invention relates to a method of manufacturing a personalized RF coil array for MR imaging guided interventions. The method comprises the steps of: —acquiring diagnostic image data reflecting the anatomy of a portion of a patient's body (10); —planning an intervention on the basis of the diagnostic image data, wherein a field of the intervention within the patient's body (10) portion is determined; —arranging one or more RF antennae (11, 12, 13) on a substrate (19), which is adapted to the patient's anatomy, in such a manner that the signal-to-noise ratio of MR signal acquisition via the one or more RF antennae (11, 12, 13) from the field of the intervention is optimized. Moreover, the invention relates to a computer program and to a computer workstation.

Abstract: The invention relates to a method for producing substantially two-dimensional flat coils (28), wherein at least two cover plates (2, 3) that each have a cover surface (20) and a former (4) having a former surface (21) that is smaller than the cover surfaces are provided, wherein the former is releasably clamped between the two cover plates, such that at least some sections of lateral support surfaces (10) are formed by projecting sections (9) of the cover plates, wherein a coil conductor (25) for the geometry of the flat coil (28) is wound along the circumference of the former between the cover plates, and wherein the wound coil conductors (25) are fixed locally relative to one another through cut-outs (16) in at least one of the cover plates. The invention further relates to a corresponding winding device (1, 11, 22).

Abstract: Method and Apparatus are provided for automatically disposing plural wires along predetermined trajectories, wherein the plural wires extend from coils wound in slots of dynamoelectric machine cores. Plural wires forming leads are located in predetermined positions and caused to extend along predetermined directions by means of manipulating equipment and tooling which operates automatically. In addition, the equipment and tooling cause the plural wires to become twisted and cut to form portions for connection to terminals. The tooling is provided with reference surfaces and seats which are used to bend the plural wires along the predetermined trajectories and to provide a position constraint for the portions becoming twisted. Apparatus can be provided for positioning portions of a plurality of restraining members in the spacing existing between the bridges of the coils and the end faces of a dynamo electric machine core.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by friction welding is provided with a monolithic connector body with a bore dimensioned for an interference fit with an outer diameter of the outer conductor. A friction groove may be formed around the leading end of the outer conductor by application of a friction weld support against the inner diameter and leading end of the outer conductor. The friction groove may include a material chamber formed between a radial friction protrusion of the bore and a bottom of the friction groove. The friction weld support may be provided with ceramic surfaces contacting the outer conductor, a stop shoulder dimensioned to abut a cable end of the bore and/or an elastic insert seated within an inner conductor bore.

Abstract: A coupling for a powered search light includes a body that has a power device that provides electrical power or access to electrical power and a head coupled to the body including an lighting device which provides light when electrically powered. An end is coupled to or included as part of the body. A receiving coupling is coupled to or included as part of the head. A plurality of tabs are defined on the end and extending radially therefrom. A corresponding plurality of flanges are defined in the receiving coupling and extending radially inward therefrom. The end is arranged and configured to engage the receiving coupling by capture of the plurality of tabs by the corresponding plurality of flanges. A lock locks the plurality of tabs with respect to the plurality of flanges.

Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.

Abstract: An application and development apparatus has a plurality of vertically stacked blocks directed to coating film formation on a substrate. This plurality of blocks includes first processing units, a first substrate transportation region, and a first transportation unit for transporting substrates between the first processing units within the first transportation region. A development process block also is vertically stacked with the blocks directed to coating film formation to constitute a layered block as the process block. The development process block also includes second processing units and a second transportation unit for transporting substrates between the second processing units within the second transportation region. The application and development apparatus further has a shelf-type delivery stage group, a vertical transportation unit and a substrate inspection unit such that a substrate input into the inspection unit passes through the delivery stage group from the vertical transportation unit.

Abstract: An apparatus for incorporating a metallic foil into a semiconductor package includes a carrier embossed with a multiplicity of cavities. Each of the cavities define a pedestal recessed with the cavities which penetrate only partially through the thickness of the carrier. A metallic foil overlying a pattern with the pedestals in direct contact and help support the metallic foil with the metallic foil pressed into at least some of the cavities. In other embodiments, a gap is between the metallic foil and bottoms of the cavities in a substrate. Integrated circuit dice are attached to the foil. Each die is attached to the foil in a region of the foil overlying a portion of the at least one device area pattern. Bonding wires electrically connect the integrated circuit dice to the foil.

Abstract: A method for forming a lead or lead extension includes forming an arrangement of elongated conductors. Each of the conductors extends from a proximal end of the arrangement to a distal end of the arrangement. Each of the conductors includes a layer of insulation disposed over a conductive core. A conductor-separating element is disposed over either the proximal end or the distal end of the arrangement. The conductor-separating element includes a plurality of ablation windows defined in a body. An end of at least one of the elongated conductors is radially extended over a portion of the conductor-separating element such that a portion of the at least one elongated conductor extends across at least one of the ablation windows. Insulation from the portion of the at least one conductor extending across the ablation window is ablated to expose a portion of the conductive core of the elongated conductor.

Abstract: The embodiments disclose a method including fabricating custom cables using a custom cable technology, wherein the custom cables include a universal flat cable including a plurality of flexible conduits including a plurality of cable pods, an ultra-flat cable and a flat series cable, and wherein the custom cables include reinforced cable jackets, and wherein the custom cables include reduced weight cable jackets including a microcell jacket.

Abstract: The present document describes a method for building a part for use with a test equipment in the performance of a test of electrical equipment. The part comprises at least one of a connector, an interface cable, and a test program. The method comprises accessing a database comprising data about the part, building the part based on the data, and providing the part with a unique identifier. The data is sufficient for at least one of determining an availability of the part and allowing building the part.

Abstract: The invention relates to a device for industrially producing photovoltaic concentrator modules which consist of a module frame, a lens pane comprising a plurality of Fresnel lenses, a sensor-carrier pane, and an electric line guide, said device comprising the following features: a) a carriage (30) for retaining a module frame (1) in a tension-free manner by means of clamping elements (31) on the two longitudinal sides and stop elements (37) on the two transverse sides, these clamping elements (31) being adjusted by displacing and rotating a shift rod (32), b) a device (47) for punctually applying acrylic and linearly applying silicone (48) onto the support surfaces of the module frame (1), c) one device for laying the sensor-carrier pane (3) and one for laying the lens pane (2), these panes being conveyed in a tension-free manner using special suction devices (39) and being set down with a centrally-positioned, predetermined contact pressure, d) a device for measuring the position of each pane and for positio

Abstract: An out of the box signage kit facilitates in field conversion of a static billboard having an anchored planar mounting structure into a large format billboard type electronic sign that includes a plurality of interchangeable weatherized display modules; a plurality of hand mountable interchangeable structural frames for supporting the plurality of weatherized display modules, each structural frame having a back portion for mounting to a frontside of the anchored planar mounting structure and a front portion defining a plurality of bay members for receiving corresponding ones of said plurality of weatherized display modules; and a plurality of interchangeable wire harnesses, each individual wire harness including a first end for coupling to a power source mounted on a backside of the anchored planar mounting structure, each individual wire harness having a plurality of power extensions for coupling the power source to at least one of the display modules.

Abstract: A method for the insertion of ferrite members onto pins acting as the contacts of an electrical filter connector. The ferrite members are oriented to a desired orientation by a known method. The ferrite members are preferably oriented in the vertical position for storage and are conveyed to a dynamic storage lock chamber equipped with a ferrite member stopping mechanism. A ferrite member distribution system incorporating a horizontally moving distribution plate individually releases the ferrite members from the lock chamber into the distribution system and inserts ferrite members onto the contacts according to a rate controlled by the operator.

Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.

Abstract: A method for installing an elastomeric cover sleeve on an electrical connection including a connector and a cable having a cable axis includes: providing an installation tool including a slide portion; premounting the installation tool on the cable such that the slide portion extends along the cable axis and covers a portion of the cable; thereafter, sliding the cover sleeve onto the cable and onto the slide portion of the premounted installation tool to a parked position wherein the slide portion is interposed between the cover sleeve and the cable; installing the connector onto the cable; and thereafter, sliding the cover sleeve along the cable axis and the slide portion onto the connector.

Abstract: In a method for correcting a coil wound in two layers, the coil is corrected as follows: a conductor is wound from an outside layer toward an inside layer to form a first row; the conductor is wound from the inside layer toward the outside layer to form a second row; the conductor is wound from the outside layer toward the inside layer to form a third row; a crossover portion is formed by connecting adjacent rows of the conductor; and a load is applied to the crossover portion from a coil correcting die through a crossover-portion correcting die so as to push first and second ends of the crossover portion along adjacent rows and move an intermediate portion of the crossover portion to an adjacent row.

Abstract: A system and method for forming a conductive pattern. In the illustrative embodiment, the system includes an applicator for applying a conductive substance onto a surface of a structure and a mechanism for precisely moving the applicator such that the conductive substance is applied in a desired pattern. In an illustrative embodiment, the mechanism includes a robotic arm driven by commands from a computer, and the conductive pattern is designed to manipulate the electromagnetic properties of the structure. The system can be used to apply a conductive pattern directly onto an electromagnetic component, such as a radome, IR dome, multi-mode dome, or flat plate EM window, or to apply a conductive pattern onto a component mold during the component fabrication process. In the latter case, the conductive pattern is an integrated part of the component.

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract: A repairing method, repairing device and repairing structure for repairing a signal line of an array substrate having the disconnected defect , including: setting a repairing route according to a position of the disconnected defect and determining a position at which a filling portion is required to be formed according to the repairing route; forming the filling portion at the position at which the filling portion is required to be formed; and forming a repairing line along the repairing route. By detecting the repairing route before repairing the disconnected defect by forming the filling portion according to the repairing route, the present disclosure can avoid the disconnection of the repairing line caused by great height differences of the surface under the repairing line and improve the repairing success rate of the disconnected defect.

Abstract: A method for manufacturing a semiconductor device includes: forming a structure including a substrate, a device layer formed on the substrate, a pair of through-hole electrodes penetrating through the substrate in the thickness direction of the substrate, a pair of vertical electrodes extending in the thickness direction of the substrate and reaching to one surface of the substrate, and a shared wiring connecting the pair of vertical electrodes in the device layer; forming a connection wiring connecting one of the through-hole electrodes and one of the vertical electrodes; and stacking the structure and a second substrate such that an electrode of the second substrate is connected to a through-hole electrode which is not connected to the connection wiring among the pair of through-hole electrodes.

Abstract: A driving board folding machine comprises a machine housing, a movable table and one or more pre-folding stations for holding an unfolded flexible circuit and a circuit housing. When the driving board folding machine is activated, the one or more pre-folding stations are moved to a folding station located within the machine housing and the flexible circuit is folded and inserted within the circuit housing. The driving board folding station is able to comprise multiple pre-folding stations on one or more sides of the movable table. A holding pin holds the flexible circuit in place while a forming press moves in order to preform the flexible circuit, fold the flexible circuit and move the circuit housing to insert the flexible circuit into the housing.

Abstract: A method for stringing a first elongate element through a second elongate element is provided by placing the first elongate element in a channel and injecting compressed gas into the channel to propel the first elongate element therethrough. The channel has a first open end, and the second elongate element is sealed around the first open end. Compressed gas is injected into the channel towards the second elongate element, propelling the first elongate element through the second elongate element. Also disclosed is a system for performing such a method, including a source of compressed gas and a housing having a channel with a first end and a second open end. The first end is in fluid communication with the source of compressed gas. The channel has a tapered portion adjacent the open end of the channel, and the channel defines a straight longitudinal axis between the first end and the second open end.

Abstract: Disclosed is a system and method of encasing the drive components of an electric powered bicycle in a unified storage device compressed and structurally integrated into the triangle space between the top tube, down tube and seat tube of a typical bicycle frame. This invention details a unique component case that provides the storage and security of electric bicycle drive components including the electric power source (the battery cell pack), and electric motor controller including circuit board and housing, along with associated wires, fuses, switches, instruments and plugs. This invention also details a unique braking system and details a method of mounting stationary foot pegs in the bottom bracket of a typical frame and replacing the standard pedals and crank set.

Abstract: A gradient coil mounting unit for mounting a gradient coil module in a chamber of a magnetic resonance imaging (MRI) apparatus includes: vibration-proof pads provided on first and second edges of an inner surface of the chamber; and fixing taps provided on first and second edges of an outer surface of the gradient coil module. At least one vibration-proof pad has a shape that is complementary to a shape of a corresponding fixing tap.

Abstract: Systems and methods for processing potentially defective individual packaged modules are presented. A Printed Circuit Board (PCB) that includes a set of individual module substrates can be received and an image of a first side of the PCB can be captured by an image capture module which can include one or more cameras. Based on the captured image, it can be determined whether the set of individual module substrates includes previously identified (e.g., inked) individual module substrates that correspond to potentially defective individual module substrates. In response to determining that the set of individual module substrates includes inked individual module substrates, a map of the inked individual module substrates can be created. Based on the map, locations corresponding to the inked individual module substrates can be marked with a laser on a second side of the PCB.

Abstract: Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation.

Abstract: A method of forming an elastomeric sheet adhesive bond between mating surfaces of an electrode and a backing member to accommodate stresses generated during temperature cycling due to mismatch in coefficients of thermal expansion. The elastomeric sheet comprises a thermally conductive silicone adhesive able to withstand a high shear strain of ?300% in a temperature range of room temperature to 300° C. such as heat curable high molecular weight dimethyl silicone with fillers. Installation can be manually, manually with installation tooling, or with automated machinery.

Abstract: In one embodiment, a system for wrapping biomedical conductor wires about core material, comprises: a payout assembly and a take-up assembly for controllably paying out the core material and taking up the core material with the wrapped conductor wires; a turntable; a plurality of carriers, disposed on the turntable, for letting out the conductor wires; and a die for applying force to the conductor wires as the wires are wrapped about the core material, the die adapted to rotate according to group rotation of the plurality of carriers by the turntable during operation of the system, wherein the die comprises one or more features asymmetrically arranged about a circumference of the die, the one or more features adapted to direct the conductor wires from the plurality of carriers onto the core material in an axially repeating pattern of groups of closely spaced wires with each group separated by a distance larger than the spacing between adjacent wires within each group.

Abstract: An apparatus for patterning a ribbon includes a holding device, a heating device, and an embossing device. The holding device is utilized for positioning the ribbon on a surface of a solar cell. The first solder layer contacts the solar cell. The heating device is utilized for melting the ribbon for string tabbing on the solar cell. The embossing device is utilized for contacting the melted ribbon to form a pattern on the ribbon. A surface energy between the ribbon and the solar cell is greater than a surface energy between the ribbon and the embossing device.

Abstract: Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

Abstract: An adjustably mountable electrical device with one or more yokes coupled to the electrical device, at least one electrically conductive strap, and an electrical device face, wherein a distance between the electrical device face and at least one of the yoke, the strap and an electrical box mounting screw aperture is adjustable after the electrical device is mounted to the electrical box. The system may comprise mounting flanges that may have threaded hubs or the system may further comprise an electric device having front and back shells moveable on a track in response to depression of a button allowing for movement of the back shell so that the electric device may be mounted having its face coplanar with a front wall surface.

Abstract: Methods and systems for altering the electrical resistance of a wiring path. The electrical resistance of the wiring path is compared with a target electrical resistance value. If the electrical resistance of the wiring path exceeds the target electrical resistance value, an electrical current is selectively applied to the wiring path to physically alter a portion of the wiring path. The current may be selected to alter the wiring path such that the electrical resistance drops to a value less than or equal to the target electrical resistance value.

Abstract: A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

Abstract: An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted; two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion; two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.

Abstract: An apparatus for applying an elastic tubular sleeve onto a splicing region between at least one pair of cables, wherein the tubular sleeve is supported in a radially expanded condition on at least one supporting element, may include axial-movement devices configured to axially move the at least one supporting element relative to the tubular sleeve at an adjustable speed, so as to cause a radial elastic shrinkage of the tubular sleeve capable of inducing an axial ejection thrust on the at least one supporting element, and counter devices configured to counteract the axial ejection thrust induced by the elastic shrinkage of the tubular sleeve.

Abstract: A hatchplate, formed of copper material, has first and second perpendicular surfaces with punched holes formed therein to provide for connecting the hatchplate to building ground, for mounting the hatchplate to a wall of the telecommunications facility and for mounting one or more surge suppressors to the hatchplate, thereby providing for a suitable ground connection for the surge suppressors.

Abstract: A component fixing device includes a holding portion for holding a component with a hollow portion while restricting a movement of the component; and a fixed portion elastically connected to the holding portion and to be fixed to an object. The holding portion is inserted into the hollow portion of the component for holding the component. The holding portion may have a center holding portion abutting against an outer surface of the component and a pair of arm portions disposed at both sides of the center holding portion and capable of bending relative to the center holding portion, so that the center holding portion and the arm portions sandwich the component.