Abstract: The present invention provides an assembly apparatus employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: Substrates are supported by height-adjustable supporting pins in automated equipping units. The supporting pins are composed of a tip and a foot part that is spring-borne relative to the tip. When the supporting pins are placed against an underside of the substrate, the supporting pins individually adapt to the contour of the underside of the substrate. The height position of the supporting pins is subsequently fixed. As a result, substrates having position and surface variations can be protected against sagging upon placement of components on the substrates during an automated equipping process.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted ante substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed an the substrate. The stiffener member has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.

Abstract: A printed circuit board support comprising a support base, a base extension and a magnetic source. The support base defines a support surface and a lower surface. The base extension is secured to the support base and arranged to define at least a portion of a height dimension of the printed circuit board support. The magnetic source is secured to the base extension and positioned such that the lower surface of the support base is arranged to secure the printed circuit board support to an object under magnetic force. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72 (b).

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: The present invention relates to a transfer type circuit board fabricating system including a conveyor device for transferring circuit boards in a predetermined transfer direction through a component placing device for placing electronic components on the circuit boards. The conveyor device includes a pair of conveying surfaces for conveying the circuit boards and a pair of board supports for supporting one of the circuit boards. Each board support extends between and is supported by the pair of conveying surfaces. A table having a surface is situated below both the pair of conveying surfaces and the pair of board supports. A pair of deflection shields extend from and at an acute angle with respect to the surface of the table to terminate at an edge. Each edge is flush with and adjacent to one of the conveying surfaces and is also beneath the pair of board supports.

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: A retainer element for at least one electrical component for assembly on circuit supports, such as, e.g., on printed circuit boards. The retainer element is comprised of at least one body, which has at least one uptake for the component. The component can be inserted in the uptake, and the body has at least one fastening element, by means of which it can be fastened to the circuit support. For example, the fastening elements are configured as catch hooks.

Abstract: A process and apparatus is disclosed capable of removably adhering a semiconductor substrate to a substrate support in a sub-atmospheric environment using a plurality of individual fibers, each mounted at one end adjacent the substrate support, and each having a loose end. When the portions of the fiber adjacent the loose fiber ends are each brought into contact with the under surface of the substrate, Van der Waals forces are exerted between the substrate and the fibers to urge the substrate toward the underlying substrate support. In a preferred embodiment, the substrate and portions of the fiber adjacent the loose fiber ends are first vertically brought into physical contact with one another, and then a horizontal force is applied to horizontally move, with respect to one another, the substrate and the portions of the fibers adjacent the loose fiber ends.

Abstract: A technique for separating the stator leads of an electric motor during the manufacturing process. The technique comprises a system having a lead gathering assembly, a lead separator, and a drive mechanism. The lead gathering assembly is adapted to gather together a plurality of stator windings extending from a stator. The lead separator having a plurality of teeth adapted to separate a stator winding from the plurality of stator windings gathered together by the lead gathering assembly. The drive mechanism is adapted to drive the lead separator into the plurality of stator windings. The lead separator has teeth to separate each of the stator windings gathered together by the lead gathering assembly.

Abstract: An apparatus and a method for calibrating the position of a wafer platform in an ion implanter, and particularly in a medium current ion implanter. The apparatus is constructed by a curvilinear piece formed in a half-circular shape, a pair of linear rods for supporting the curvilinear piece, and at least one cross-bracing rod connected in-between the pair of linear rods for providing rigidity of the apparatus. When the inside peripheral surface of the curvilinear piece intimately engages an outside peripheral surface of the wafer platform of the ion implanter, or when the first and second linear rods fit snugly on the implanter indicative that the wafer platform is properly calibrated at a zero-angle position. When such fitting is not possible, the wafer platform is then adjusted until a snug fitting is made possible.

Abstract: Apparatuses and methods for automating the assembly of a fiber optic module. The fiber optic module typically includes a housing, a clip, and a ferrule that is attached to the end of a fiber optic cable. The housing, clip, ferrule and fiber optic cable are supported by a pallet assembly. The pallet assembly can be loaded into a docking station of a laser weld machine that welds the ferrule to the clip. The pallet assembly includes a cartridge that is attached to a pallet and supports the housing. The pallet is constructed to receive different cartridges. Each cartridge has support features that correspond to a specific type of module housing. A different type of module housing may be loaded onto the pallet assembly by merely replacing the cartridge. The same pallet can therefore be used for the assembly of different fiber modules.

Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member. The support is readily compressed to allow placement into or onto a space defined by surfaces of a positioning device, and the support expands upon its release to fill the space. When the support is left in the positioning device during a change over to a different circuit board, the support will automatically adjust to any width-wise adjustment in the space between the surfaces of the positioning device.

Abstract: The present invention discloses a back-up plate up/down apparatus in which a back-up plate is ascended or descended without rocking, maintaining a parallel state. The back-up plate up/down apparatus includes a base plate; guide blocks installed with a constant distance to the base plate; a first driving cylinder installed between the guide blocks; fixed blocks installed with a constant distance to both ends of the base plate and having rotating shafts inserted to both ends thereof; rotating links, in which the rotating shaft is inserted to an end thereof and a connecting member is connected to the other end thereof; a second driving cylinder connected to the connecting members by means of a rod; holders fixed at rods of other connecting members slidably and for fixing the back-up plate; and sensors installed to the holders with a constant distance.

Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.

Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.

Abstract: An apparatus for automatically resetting a printed-wiring-board supporting device including a supporting table and a plurality of supporting members which are set on a surface of the supporting table to support a back surface of a printed wiring board, the apparatus including a supporting-member storing device in which the supporting members are stored, a holding head which can hold each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the surface of the supporting table, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.

Abstract: An improved structure of terminal connector pliers is disclosed.

Abstract: A fixing device for a printed circuit board (PCB) is comprised of an axis, a spring chip and a fixing pillar for fixing the PCB on a shell. This device has the functions of fixing, vibration buffer, and preventing electromagnetic interference (EMI). According to the invention, the axis penetrates through the PCB and the spring chip and connects to the fixing pillar on a shell, thereby fixing the PCB onto the shell. The spring chip is elastic such that it can absorb external vibrations and reduce damages to the PCB. By putting the spring chip into contact with the PCB, the electromagnetic wave is guided to the shell, thus avoiding the EMI.

Abstract: An apparatus is provided to assist a user in aligning and sizing a plurality of spaced-apart channels to be formed in a cleat connected to a power generator housing so as to secure a plurality of leads extending from a power generator through the housing. The apparatus includes a main member to which secondary members removably and movingly connect to align with the leads. Channel sizers connect to the secondary members to register the diameter of each lead. The apparatus first aligns with and registers the diameter of each lead and is then positioned adjacent the housing to assist the user in correctly spacing and forming holes in a support structure such as a cleat. Related methods are also provided for aligning and sizing channels to be formed in a cleat or other support structure to secure the leads extending from the power generator through the housing.

Abstract: An apparatus for processing flexible tape for microelectronic assemblies includes a base having a top surface, a bottom surface and an aperture extending between the top and bottom surfaces, and a platform having a top surface for engaging a flexible tape used for making microelectronic assemblies, such as semiconductor chip packages. The platform is sized to fit within the aperture extending between the top and bottom surfaces of the base. The base is pivotally secured at one end of the platform so that when the base pivots with respect to the platform, the flexible tape engaged by the platform remains on the platform. The assembly also includes a carrier frame having a slot and a clamp sized to pass through the slot and the carrier frame and the aperture in the base for securing the flexible tape to the top surface of the platform as the base pivots with respect to the platform.

Abstract: A holding connector system is provided for connecting a microdevice feeder to an assembly line table having a plurality of latch stop pins and a plurality of alignment slots. A connector body having a guide rail, which is pivotally mounted to the first structure, engages one of the plurality of alignment slots for connecting the microdevice feeder and the assembly line table. A holding mechanism having a latch, which is pivotally mounted to the microdevice feeder engages one of the plurality of latch stop pins for holding the microdevice feeder to the assembly line table. The holding connector system allows for simple, easy installation and removal of the microdevice feeder without the possibility of front to back tipping.

Abstract: The invention is related to a kind of a PCB unloading mechanism, consisting of a floating plate and a moving mechanism attached between a fixing plate and a bed. On both sides of the floating plate insets a bushing, allowing the floating plate to move on a guiding shaft fixed between the fixing plate and the bed. The floating plate moves up and down through the control of the moving mechanism fixed on top of the fixing plate. Moreover, a plurality of ejecting pins are embedded on the surface of the floating plate. The ejecting pins can pass through the corresponding holes on the bed and the template for displacement, allowing the PCB to be released from the fixedness and complete the unloading operation smoothly so as to ensure the accuracy of the positioning for the next processed PCB.

Abstract: A device for inserting wires and/or pipes in a tubular, flexible sheath includes a sleeve (11), with a split (111) made therealong. The sleeve (11) is encircled by a cylindrical tubular body (21) also having made therealong a relative split (211). The sleeve (11) can turn inside this cylindrical tubular body (21), so as to define two working positions, first (H1) and second (H2). In the first working position (H1), the split (111) of the sleeve (11) corresponds to the split (211) of the tubular body (21), so that the wires can be inserted into the device. In the second working position (H2), the split (211) of the tubular body (21) is closed by the sleeve (11), so as to block the wires inside the device. A rounded, wedge-shaped member (23) rising over the cylindrical tubular body (21) is to be slidably fitted in the flexible sheath (F). The profile of the member (23) allows to open the edges of the elements (3) of the sheath, so as to insert the wires thereinside.

Abstract: The device for assembling a push V-belt for a continuously variable automatic transmission wherein the push V-belt consists of a plurality of push elements (1) movably interconnected that form an endless belt and of two ring sets (2, 2′) has a centering ring (3) for lodging the first ring set (2) and fixing the individual push elements (1) and a circular ring (4) upon the lodged push V-belt and externally partly surrounding it, the ring having an inner outline adapted to the appertaining outer outline of the push V-belt so that a radial force acts upon each individual push element (1) in direction to the axle that traverses perpendicularly to the radial plane the central point of the circle formed by the push V-belt.

Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.

Abstract: An apparatus for moving an operative suction nozzle which holds an electric component. The apparatus mounts the electric component held by the operative suction nozzle on a circuit board. The apparatus includes a device which supplies the electric component to the operative suction nozzle; a device which supports the circuit substrate; a nozzle storing device which stores normal suction nozzles; and a nozzle moving device. A nozzle-defect detecting device which detects a defeat of the operative suction nozzle is provided. Also provided is a nozzle exchanging device which automatically operates the nozzle moving device to move the defective suction nozzle having the detected defect, to the nozzle storing device so that the defective suction nozzle is exchanged with the normal suction nozzle stored by the nozzle storing device.

Abstract: A calibration tool for centering an inner tube with respect to an outer tube of a vertical furnace for semiconductor manufacturing including a first alignment member having a plurality of engagement surfaces simultaneously movable radially outward an equal radial distance for engagement with a base structure of a vertical furnace to center the calibration tool with respect to the base structure and the outer tube; a second alignment member having a plurality of engagement surfaces simultaneously movable radially outward an equal radial distance to engage the inner tube and to move the inner tube to a position centered with respect to the outer tube of the vertical furnace.

Abstract: A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and removes the battery contact part from the board part while the solder is melted. An assembling unit mounts an unused battery contact part on the board part. The unused battery contact part has an unused form of the first battery contact part. A soldering unit connects the unused battery contact part to the board part by use of solder.

Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An apparatus and method are provided that increases the efficiency of material handling apparatus, such as those used to trim and form electrical leads on solid state electrical devices. The apparatus includes a plurality of rotatable pulleys, an endless belt capable of retaining devices to be processed that is disposed around the pulleys such that rotation of the pulleys will cause said belt to travel around said pulleys, and a plurality of paired tooling members, each of said, paired tooling members having first and second tooling members disposed on opposing sides of the belt and directly opposing so as to cooperate and perform a tooling operation on the leads when reciprocated toward each other along a common axis. In a preferred embodiment, two horizontally aligned pulleys with vertical axes of rotation are used to rotate the belt in a horizontal plane.

Abstract: Disclosed is a device for assembling a device including a base and a main board assembly in a hard disk drive including an actuator having a magnetic head; a base having a spindle motor mounted thereon, the spindle motor rotating at high speed a disk on which the magnetic head is suspended to conduct data writing and reading; and a main board assembly assembled to a lower surface of the base. The device comprises a guide section for establishing a vertical assembling position of the base and the main board assembly and for allowing the main board assembly to be capable of a sliding movement to a predetermined location on the base; a stopper section for stopping the sliding movement of the main board assembly on the base; and a locker for locking the main board assembly stopped by the stopper section to the base in a vertical direction.

Abstract: In order to waterproof a plurality of wires which constitute a wire harness passed through a through hole formed in a grommet, a lower mold is provided with a first recessed portion, and an upper mold is provided with a second recessed portion. The first recessed portion and the second recessed portion define a cavity when the upper mold and the lower mold are integrated, such that a cross section of the cavity is substantially identical with a cross section of the through hole formed in the grommet. The wires are placed on the first recessed portion of the lower mold. Then, the wires are coated with a water stop agent. Further, the wires are applied with vibration so as to permeate the water stop agent into a gap between the wires. The upper mold and the lower mold are integrated such that a cross section of the wire harness is matched with a cross section of the cavity. The water stop agent permeated into the wires is solidified.

Abstract: A process and system for mounting terminals with electric wires in cavities of connector housings. Press-connecting terminals are initially loaded in cavities arranged in an upper surface of a connector jig and electric wires are press-connected on the terminals in the jigs. Then, the terminals with electric wires are transferred from the connector jig to cavities arranged in a lower surface of a inserting jig by pins arranged to contact and push the terminals from below in the transfer direction. Then, the terminals are loaded from the inserting jig to cavities of connector housings from the back by blades arranged to contact and push the terminals from one end in the inserting directing.

Abstract: A media rework tool for discs and/or a spindle motor carrying a disc pack is disclosed that has a slider plate mounted on a base for lateral movement between a retracted position and an extended position. The slider plate holds a spindle motor with a disc pack mounted on it, and moves between the two positions. The tool includes a gripper assembly having a plurality of opposing arms for grasping predetermined discs within a disc pack on the spindle motor when the slider plate is in the retracted position. The gripper assembly raises the predetermined discs and any intermediate spacer rings upward for temporary storage on a media guide to allow the remainder of the disc pack to be reworked, such as for replacement of a defective disc or spindle motor when the slider plate is laterally moved to the extended position. Following reworking of the remainder of the disc pack, the spindle motor is returned to its centered position relative to the media guide and the gripper assembly.

Abstract: A method is provided for making an ultrasonic transducer particularly useful in medical imaging. The transducer includes a transducer body having a major front surface for radiating ultrasonic energy to a propagation medium and is formed by a piezoelectric member having a curved shape including a curved front surface. The curved shape is produced by deforming a planar piezoelectric composite member to produce the desired curvature and retaining the curvature using suction forces. A graded frequency region is created by grinding the curved front surface of the piezoelectric element along a grinding plane. This region is defined by the area of intersection of the grinding plane and the front surface of the curved piezoelectric member and in different implementations of the method, covers all or less than all of the total front surface.

Abstract: Two or more parts feeding sections are provided, and in each of the parts feeding sections, identical combinations of parts cassettes aligned in the same arrangement are prepared. If one or more type of components that are to be picked up at one time by a plurality of suction nozzles is exhausted, the mounting head moves to the other parts feeding section, which provides the same combination of components for all the suction nozzles to pick up the components at one time, so that the mounting operation can be continued without stopping the apparatus for replenishment of components.

Abstract: An apparatus and associated method for attaching a disc drive cover member to a disc drive base member. A fixture comprises a base and a stop guard, cradle and guide rails supported by the base. The disc drive base member is operatively receivingly engaged in the cradle adjacent the guide rails. The disc drive cover member is operatively abuttingly engaged at one end against the stop guard and pivoted toward the disc drive base member. Any substantial misalignment of the disc drive cover member with the disc drive base member causes the disc drive cover member to engage at least one of the guide rails and therefore be urged into proper alignment, preventing adverse contact between the disc drive cover member and the disc drive base member.

Abstract: Apparatuses and methods for automating the assembly of a fiber optic module. The fiber optic module typically includes a housing, a clip, and a ferrule that is attached to the end of a fiber optic cable. The housing, clip, ferrule and fiber optic cable are supported by a pallet assembly. The pallet assembly can be loaded into a docking station of a laser weld machine that welds the ferrule to the clip. The pallet assembly includes a cartridge that is attached to a pallet and supports the housing. The pallet is constructed to receive different cartridges. Each cartridge has support features that correspond to a specific type of module housing. A different type of module housing may be loaded onto the pallet assembly by merely replacing the cartridge. The same pallet can therefore be used for the assembly of different fiber modules.

Abstract: A workpiece table assembly is configured to hold a plurality of workpieces (e.g. conductive strands) so that the workpieces can be modified (e.g. bent). In one embodiment, the workpiece table assembly advantageously comprises a table, a saddle, a lift mechanism, and a die. The saddle is advantageously recessed below the table and raised or lowered by the lift mechanism. The table advantageously has a top surface with holes adapted to accept quick-release pins from a step-off board. The step-off board also has notches to accept and position the strands for die pressing. In one exemplary operation, the step-off board is used to stagger the strands over the down-positioned saddle. The saddle is then raised by the lift mechanism and the die placed within the saddle on top of the strands. A force is applied to the die to bend the strands.

Abstract: The invention relates to a device for supporting flat products, especially printed circuit boards. The device comprises a supporting member (4) and supporting pins (1) which can be placed on and removed from the supporting member. Recesses (5) and protrusions (3) fitting in said recesses are provided for positioning of the supporting pins in relation to the supporting member. Said recesses (5) and protrusions (3) have a non-circular cross-section. A combination of a protrusion (3) and a recess (5) positioning a supporting pin (1) in a particular position on the supporting member (4) is located eccentrically in relation to the centreline of said supporting pin (1).

Abstract: A chamber for a module IC handler is disclosed which consists of a pre-heater for suitably heating a carrier containing a plurality of module IC at a preset temperature (which may be generated at the driving of the module IC) before the tests for the module IC are performed, and a test site for performing the tests with a external tester while pushing the carrier by using the pusher.

Abstract: In a method of producing a microgripper including a grip finger 100 which has a coupling portion 100g that commonly owns one ends of three V-shaped edges 100v on an open end side, other ends of the V-shaped edges 100v being connected to a case 14, and in which the coupling portion 100g is connected to a moving portion of a translational driving section 12, and the coupling portion 100g is pulled on the basis of translational movement, whereby displacement amounts of the tip ends of the V-shaped edges 100v are inwardly magnified more than an amount of the translational movement, the method comprises the steps of: in a state where the grip finger 100 has three edge portions 101a in which the V-shaped edges 100v having the coupling portion 100g are developed in a substantially flat plane, outwardly bending the edge portions 101a at a substantially center; and inwardly bending the edge portions 101a at a vicinity of the coupling portion 100g.

Abstract: A bolster plate is attached to a printed circuit board and acts as a stiffener that reduces bending in the overall assembly during the attachment of an integrated circuit chip to the printed circuit board under a heavy applied load. The bolster plate is provided with a shim that compensates for bending of the bolster plate under load, thereby preventing damage to the integrated circuit chip. The dimensions of the shim may be selected according to computer model results representing bow deformation in the bolster plate without the shim.

Abstract: A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: The present invention discloses a transfer for a tray feeder comprising: a base frame; a support frame installed at both sides of the base frame; first and second linear motion guiders installed oppositely and longitudinally to the inside of the support frame and having a plurality of first and second linear motion guide rails; first and second plates installed to an upper portion of the first and second linear guides and having a cylinder block capable of supporting a side of the tray received an electronic parts and the like; and a driving unit installed to a side portion of the support frame and for making the movement of the first and second plates; wherein the first and second plates can move along the first and second guide rails, crossing with each other.

Abstract: Described herein is an improved mounting arrangement for mounting an electrical device (13) on a circuit board (9). The mounting arrangement comprises a substrate (12) which is spaced from the circuit board (9) by a support (14) which incorporates a heat sink (16). A clamp (17) forces one end of the substrate (12) against the support (14) to provide a mechanically stable arrangement which has improved thermal contact with the heat sink (16).