Abstract: Provided is a method for manufacturing a thermally-assisted magnetic recording head in which a light source unit including a light source and a slider including an optical system are joined. The method comprises steps of: adhering by suction the light source unit with a back holding jig; bringing the light source unit into contact with a slider back surface of the slider; applying a load to a load application surface of the light source unit by a loading means to bring a joining surface of the light source unit into conformity with the slider back surface; positioning the light source unit apart from the slider, and then aligning the light source with the optical system; bringing again the light source unit into contact with the slider; and applying a load again to the load application surface to bring the joining surface into conformity with the slider back surface.

Abstract: The present invention discloses a feed apparatus, a feed channel and a setting device, that is used in connection with these specific apparatuses. The feed apparatus uses either a strip magazine or a rotary magazine. The feeding of the fastening elements proceeds stepwise using a movable slide, where with use of the rotary magazine a simultaneous loading and unloading of the rotary magazine at different positions is guaranteed.

Abstract: An assembly fixture for fixing a part/component to a printed circuit board includes a platform, an elevating unit, and a carrying body. The platform has a receiving area and a plurality of positioning pillars. The elevating unit is disposed on the platform. The carrying body is coupled with the elevating unit, configured to correspond in position to the receiving area, configured to carry the printed circuit board, and provided therein with a plurality of through holes corresponding in position to the positioning pillars, respectively. The elevating unit is capable of descending to enable the positioning pillars to protrude from the printed circuit board and the through holes, respectively, for positioning the part/component on the printed circuit board. The assembly fixture is effective in positioning the part/component on the printed circuit board to render an assembly process of the printed circuit board easy, quick, safe, and precise.

Abstract: A device for installing aerial electrical power conductors on utility poles. The device includes a frame having a plurality of anchors. The anchors are arranged to provide a place for securing a plurality of pull ropes during installation of the conductors. The device includes a post sized to be received in a hitch on a vehicle. In one embodiment, the device is sized to fit into an aerial platform, such as that used on utility bucket trucks. The device may be lifted to the point of connection on the utility pole.

Abstract: A weaving machine for an rotary electric machine coil assembly is disclosed including a rotating and driving section having timing belts causing rotary pulleys to rotate about their axes under the same attitudes while causing the rotary pulleys to rotate about an axis of a stationary pulley, movable members placed on the rotary pulleys to be movable in X- and Y-directions, coil feed magazines inclined such that coil wire segments have one ends slidably supported on the movable members and axes of the coil wire segments cross on a rotating axis of the rotary table, an orbit specifying member for specifying an orbit, in which the coil feed magazines are caused to rotate, in a rectangular shape, a rotating and driving member for permitting the coil feed magazines to perform synchronized rotating movements, and a coil transfer device operative to grip the coil wire segment for transfer.

Abstract: In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.

Abstract: An assembly auxiliary jig facilitates assembly of an electronic device having a casing, a first fitting, a second fitting, and a wire. The assembly auxiliary jig includes: a base having therein a receiving space for positioning and receiving the casing and an accessing recess configured to communicate with the receiving space and facilitate access to the casing; a first platform disposed at the base and having a positioning groove in communication with the receiving space to thereby receive the first fitting; a first lid hinged to the first platform and configured to close the positioning groove; a second platform disposed at the base and defined with a positioning recess in communication with the receiving space to receive the second fitting; and a second lid hinged to the second platform and configured to close the positioning recess.

Abstract: To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes 40 and forming outer shapes of a plurality of piezoelectric plates 10 simultaneously with the through holes by constituting reference points G by centers of the through holes by etching the wafer by a photolithography technology, a step of preparing a jig for a wafer having inserting pins formed to project by a number the same as a number of the through holes from above a flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pin into the through hole, a step of forming an electrode on outer surfaces of the plurality of piezoelectric plates, and a step of cutting to separate the plurality of piezoelectric plates from the wafer to fragment, and

Abstract: An automatic assembly jig adapted for assembling an electronic component and a case is provided. The jig includes a working platform, a carrier, a pressure exerting device and at least a gear. The working platform has a guiding rail. The carrier is disposed on the working platform and is slidably mounted on the guiding rail. The pressure exerting device is disposed above the working platform. The gear is disposed on the working platform and connected with the carrier, so as to drive the carrier moving along the guiding rail to the position under the pressure exerting device.

Abstract: A positioning device to position one or more plates of electronic circuits with respect to an operating unit. The device comprises a rotary member which rotates selectively between a first operating position and a second operating position, and a positioning member mounted on the rotary member. The positioning member comprises a frame, which is mounted removably on the rotary member, and a strip of transpirant material on which each plate is rested. The strip is wound between a pair of winding/unwinding rollers, pivoted on the frame. The positioning member also comprises heating means able to heat the wafer to take it to a determinate operating temperature.

Abstract: A conveyor system is provided. The conveyor system includes a threshold assembly. The threshold assembly has a base plate that is secured to a floor, and the threshold assembly has a channel that is formed between two support beams that are secured to a base plate. A plurality of threshold center plates are provided, which span and enclose the channel formed by the support beams, such that each threshold assembly includes a modular printed circuit board that fits within the channel and is enclosed within the channel by threshold center plates. And, multiple conveyor segments are mountable to the threshold assembly. Other systems components and methods for making and operating the same are provided.

Abstract: An apparatus for fuel cell stacking includes an assembly jig having a base; an alignment assembly configured to be engaged with the base; and a compression assembly configured to be engaged with the alignment assembly.

Abstract: An assembling device for assembling an electronic device which includes a front shell, a rear shell, a lens cover mounted on one of the front and rear shells includes a supporting member and a pressing member. The supporting member includes a base and a positioning block according to the lens cover to be assembled. The base defines a well for receiving the electronic device to be assembled. The positioning block is positioned in the well and has an adjustable height relative to the bottom surface of the well. The pressing member includes a pressing portion which is configured for pressing one of the front and rear shells of the electronic device. Thereby when assembling the electronic device, the height of the positioning block can be adjusted to press or not press the lens cover depending on which of the front and rear shells is assembled.

Abstract: A non-contact power reception apparatus is provided, in which a power reception coil for a charging system and a loop antenna for an electronic settlement system are mounted on a battery pack and a cover case of a portable terminal such that the power reception coil is arranged in the center thereof and the loop antenna is disposed outside the power reception coil, so that a mode of receiving a wireless power signal and a mode of transmitting and receiving data are selectively performed, thereby preventing interference from harmonic components and enabling non-contact charging and electronic settlement using a single portable terminal. A jig for fabricating a core to be mounted to the non-contact power reception apparatus is provided.

Abstract: An installation device for a gradient coil module in a magnetic resonance tomography apparatus has a loading cart that moves the gradient coil module away from and to the magnetic resonance tomography apparatus. A bearing girder having a track is fastened to the loading cart. Track rollers can be installed on the gradient coil module such that the gradient coil module can be moved relative to the loading cart by means of the track rollers resting on the track.

Abstract: An apparatus (1) for fixing a planar object, in particular a substrate (2), on a working area (4) by means of vacuum is provided with an at least partly transparent bearing plate (5), one side of which forms the working area and which has a rear side arranged at a distance from the working area with a radiation-reflecting structure (7). The bearing plate additionally has vacuum channels which can be connected to a vacuum line and which open into the working area. In order to illuminate the substrate as homogeneously as possible by means of transmitted light, at least one light source (10) is provided, the radiation of which can be fed into the bearing plate. In addition, the working area is preferably operatively connected to a heating apparatus (11), so that the substrate (2) can be heated.

Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.

Abstract: A machine is provided for making a fluid level sender assembly having a first mounting member with a flange and a fluid level sender including a second mounting member that telescopically connects with the first mounting member. The machine has a base, a holding member to support the first mounting member, a head member having an outer ring configured to rotate the flange, the head member moving between a first and second position to allow placing the first mounting member on the holding member and a second position to allow the outer ring to rotate the flange and a sensor receiving member to engage the fluid level sender. The sensor receiving member may move with respect to the holding member to telescopically position the fluid level sender and the plurality of different longitudinal positions such that a plurality of differently sized fluid level sender assemblies can be constructed.

Abstract: To provide a component mounting order optimizing method and a component mounting order optimizing apparatus by which it is easy to change a preparatory plan and it is possible to shorten time necessary for a change of substrates to be produced. An optimization program storage section 16 has a placement list preparing section 17 which obtains component placement data to be obtainable by a component information reading device 5 reading identification information of a component cassette, and prepares a component placement list in which identification information of component cassettes and positions which are loaded in a component supply section were associated, and a mounting order deciding section 18 which decides mounting order of components in such a state that an array of the component cassettes is fixed, on the basis of the component placement list.

Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting a pair of movable anvils for engaging two different lengths of connectors. The base further incorporates a fixed anvil for engaging a third length of connector. The movable anvils define an aperture which is shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A connector seating holder is formed in the front of the tool. A slidably mounted plunger cooperates with the anvils to compress a connector. The plunger has a push head and a slide rod. A lock nut is threaded on the push head and is engageable with the slide rod to prevent rotation of the push head.

Abstract: A frame and an ink-jet head including a nozzle plate and a fixed plate are placed on a first jig having a first face and a second face parallel to the first face and located outside the first face when seen in a direction perpendicular to the first face while being at a predetermined distance from the first face with respect to the direction perpendicular to the first face, in such a manner that a portion of the frame other than a portion formed with an adhesive layer is in contact with the second face, that an ink ejection face of the nozzle plate is opposed to the first face, and that both ends of the fixed plate are in contact with the adhesive layer. Thereafter, the adhesive layer is cured under a state where the ink ejection face is in contact with the first face, so that a head unit is manufactured.

Abstract: A compression tool for connecting end connectors to coaxial cable ends includes a die for supporting a cable thereon, a slider axially spaced from the die for compressing against an end connector, which is fitted around but not yet crimped onto the cable end, and a handle connected to the slider via an inner link. A push button on the handle can be selectively inserted in a front or a rear locating hole provided on the inner link. When the handle is pivotally turned downward, the push button forces the inner link forward while the inner link is pivotally turned about the push button, so that the slider connected to the inner link is pushed forward toward the die. By inserting the push button in the front or the rear locating hole, the slider can be pushed forward by a shorter or a longer length, respectively.

Abstract: Component placement apparatus (1, 21) comprising a storage device (2) for storing components, means (5, 25, 71, 81, 91) for transporting a component from the storage device (2) to a transfer device (6, 26) comprising at least one component pickup position (11), and a component pick and place device (7) for picking up a component from the pickup position and placing the component on a desired location on a substrate (8) positioned on a substrate support. The transfer device (6, 26) is movable between a position relatively close to the stationary storage device (2) and a variable desired position above the substrate support relatively close to the movable pick and place device whilst the means (5, 25, 71, 81, 91) for transporting a component from the storing device to the transfer device (6, 26) comprise guiding means for guiding a tape (4) comprising components from reel (3) located in the storage device (2) into the component pickup position (11) on the transfer device (6, 26).

Abstract: A system for fabricating a transducer for an ink jet imaging device comprises a transducer assembly including a transducer overlying at least a portion of a flexible carrier. The transducer has a top surface extending a first distance from the carrier. A spacer overlies a portion of the carrier not covered by the transducer. The spacer has a top surface extending a second distance form the carrier. The second distance is less than the first distance and corresponds to a target thickness for the transducer. A lapping tool is configured to lap the top surface of the transducer. The system includes a detector for detecting when the lapping tool contacts the lapping spacer.

Abstract: A robotic tool for assembling a portion of a disk drive includes a movable end effector that includes a first portion and a second portion that is movable relative to the first portion. The first portion may be configured to engage the actuator assembly and the second portion may be configured to engage the flex circuit connector. A controller may be provided to control the movable end effector, causing the end effector to pick up the head stack assembly in a first configuration, move the second portion of the end effector relative to the first portion thereof so as to articulate the head stack assembly into a second configuration that is different than the first configuration, and place the head stack assembly into the base.

Abstract: A hard-disk drive insertion mechanism includes carrier mechanism that moves longitudinally with the hard-disk drive as it is being inserted toward said electrical connector. The carrier mechanism includes engagement features for engaging the hard-disk drive as it is being inserted. The insertion mechanism also includes a clamping mechanism that gradually clamps the hard-disk drive with elastomeric material before it engages an electrical connector.

Abstract: A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other.

Abstract: A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.

Abstract: A jig for clutching a plurality of probe assemblies each of which has a connecting portion and a soldering portion has a base body and a covering body. The base body has a plurality of first receiving grooves each penetrating a front end and a rear end thereof. The covering body is formed with a plurality of second receiving grooves corresponding to the first receiving grooves. The covering body is openably fixed on the base body, the first receiving grooves and the second receiving grooves are matched to form a plurality of passageways. A front end of each of the passageways has a portion protruded inwards to form a resisting rib. The connecting portions of the probe assemblies are received in the passageways and abut against the resisting ribs, with tip ends of the soldering potions exposing outside the passageways from rear ends of the passageways.

Abstract: Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board.

Abstract: A method and apparatus is described for aligning a first article relative to a second article, for example for aligning a nanoimprint template with a semiconductor wafer. The method comprises the steps of: providing said second article with at least one flexible structure fixed relative thereto at least one point, providing a first article having at least one surface relief marking thereon, providing a detector for measuring an interaction of the flexible structure with the surface relief marking and generating detector signals relating to said interaction, identifying with the help of the detector signals the position of the flexible structure and thus of the second article with respect to the surface relief marking and generating relative movement between the first and second articles to achieve a desired alignment between the first and second articles defined by the surface relief marking. In this method and apparatus the flexible structure is brought into contact with the surface relief marking.

Abstract: A holding mechanism has a holding component including a base and a covering plate. The covering plate has two supporting pegs at two ends of a bottom thereof fixed on a top surface of the base, for forming a receiving chamber where a plurality of electrical connectors, with PCBs inserted therein, is arranged side by side. A stopping plate is capable of being driven to insert into and withdraw from the receiving chamber from a frontward direction, for resting front ends of the electrical connectors. A locking component is capable of moving frontward and rearward, and has a main body disposed rearward of the base. The main body has an upper portion protruded frontward to form a locking portion, for resting rear ends of the PCBs, and a plurality of pressing elements extending frontward above and beyond the locking portion, for pressing exposed top surfaces of the inserted PCBs.

Abstract: Disclosed is a compact shot-treatment machine that enables the quality of a shot treatment for a workpiece to be enhanced, having a tubular portion, without generating dents on the workpiece. The shot-treatment machine comprises a jig 1 having a plurality of axial members 22, each axial member to be passed completely through each tubular portion of one or more workpieces W for holding them, and is detachably mounted on the jig; an enclosure 2 for defining a projection chamber therein; a supporting means 3 for rotatably holding the jig 1 in the projection chamber; a projection device 7 for projecting shots to the workpieces W in the projection chamber; and a circulating mechanism 8 for collecting the shots projected from the projection device 7 and supplying them to the projection device 7.

Abstract: A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.

Abstract: A cable assembly apparatus for coupling a connector to a cable having a base supporting an interface pedestal dimensioned to receive the connector; an inductor coil coupled to an inductor coil actuator operable to move the inductor coil between a load position and an operation position proximate the interface pedestal; a grip clamp operable by a clamp actuator to move between an open position and a closed position above the interface pedestal; and a temperature sensor configured to read a temperature proximate the interface pedestal. A method for using the apparatus retains the pre-assembled connector and cable in an aligned orientation for controlled heating by the induction heater to heat a solder preform to solder the connector to an outer conductor of the cable.

Abstract: Staking apparatus (22) and a method for staking one or more fasteners (44) of a part assembly (18) are provided by a conveyor (14), a lower lift and lock assembly (24) including a lower lifter (28) and a lower lock (30), and an upper press (26). Lower and upper staking punches (40, 60) of the lower lifter (28) and the upper press (26), respectively, provide the staking while at least one and preferably a plurality of springs (36) resiliently support a pallet assembly (16) on which the part assembly (18) is positioned.

Abstract: An assembling apparatus is disclosed. The assembling apparatus includes a base, an assembling platform, and a driving part. The assembling platform and the driving part are fixed on the base. The assembling platform defines a receiving space for receiving a semiconductor chip module, a lever chamber for receiving clips of the semiconductor chip module, and a driving groove for connecting the receiving space and the lever chamber. The assembling platform further includes a lever bar removably placed in the lever chamber for expanding the clips. The driving part includes driving shafts. An end of each of the driving shafts is in the driving groove and is movable to pass through the lever chamber and reaches the receiving space. The assembling apparatus is used to assemble a semiconductor chip module conveniently and safely.

Abstract: A device for extracting a tool holder from a base block mounting has a front plate and a pair of rearwardly extending arms contacting the base block mounting. An extraction nut has at least two parallel threaded holes therein. A threaded stud is threaded into one of the threaded holes and the length extends through a hole in the front plate and through the tool holder and is retained by a nut. An extraction bolt is threaded through the second threaded hole of the extraction nut with the distal end engaging the front plate.

Abstract: An apparatus for assembling an electronic device is disclosed, which includes one or more grid holders for maintaining one or more grids in association with a plurality of conducting components positioned perpendicular to the grid(s). One or more insulating components are also provided for mounting and supporting the conducting components. The grid holder(s) can be pushed onto the conducting components in order to eliminate the need for applying spot weld currents to the conducting components and thereby provide a weldless assembly apparatus for the precise construction of an electronic device.

Abstract: A structure and method operable to create a reusable template for detachable thin semiconductor substrates is provided. The template has a shape such that the 3-D shape is substantially retained after each substrate release. Prior art reusable templates may have a tendency to change shape after each subsequent reuse; the present disclosure aims to address this and other deficiencies from the prior art, therefore increasing the reuse life of the template.

Abstract: Embodiments in accordance with the present invention relate to the design and manufacturing of inexpensive photovoltaic or thermal receivers for cost-effective solar energy conversion of concentrated light. Particular embodiments in accordance with the present invention disclose the design of a photovoltaic receiver and a low-pressure, low-flow-rate liquid cooler. Embodiment of the present invention also disclose a preferred low-cost and scalable manufacturing approach.

Abstract: An alignment jig including: a base jig which is used when aligning and bonding a nozzle plate which is provided with nozzle orifices ejecting liquid of a liquid-jet head with/to a fixing member holding a nozzle plate side of the plurality of liquid-jet heads, and which is provided with an optical system on a bottom plane thereof; a mask having transparency, one plane of which is bonded to a plane of the base jig opposite to the optical system, and the other plane of which is provided with a reference mark for being aligned with an alignment mark provided for the nozzle plate; and a spacer jig which is bonded to a plane of the mask where the reference mark of the mask is provided, and which holds the fixing member.

Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.

Abstract: A paste supply unit that is located in a side opposed to an electronic parts supply table 6 with a mounting table 8 sandwiched between them to supply a paste to a board 24 includes a transfer head 5 that transfers the paste to the board 24 and an dispense head 4 that draws an image by discharging the paste to the board 24, and either the transfer head 5 or the dispense head 4 is selected to supply the paste depending on the kind of an electronic parts.

Abstract: An electronic component mounting apparatus and a nozzle placement history data management method for making it possible to correctly manage nozzle placement history data and ensure data reliability are provided. In an electronic component mounting apparatus for mounting an electronic component on a board with an adsorption nozzle detachably placed on a mount head, a determination section 27 detects the presence or absence of the adsorption nozzle in the mount head based on the flow rate measurement result of a flow rate sensor 24, and an again-placing detection section 38 detects that the adsorption nozzle is once removed and then is again placed by a machine operator based on the nozzle presence/absence detection result.

Abstract: A holding tool for fixing an electronic component (2) during a manufacturing process, the electronic component (2) comprising a winding assembly (20) and an electronic circuit (24), wherein the holding tool (1) includes a holding tool body (10), first and second jaws (12, 14) disposed at the holding tool body (10) relatively movable to each other in a first direction (A), and first and second wire guide means (3, 4) characterized in that the first and second wire guide means (3, 4) are disposed at the holding tool body (10) remote from the jaws (12, 14).

Abstract: A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.

Abstract: A device for installing aerial electrical power conductors on utility poles and a method of operation is provided. The device includes a frame having a plurality of anchors. The anchors are arranged to provide a place for securing a plurality of pull ropes during installation of the conductors. The device includes a post sized to be received in a hitch on a vehicle. In one embodiment, the device is sized to fit into an aerial platform, such as that used on utility bucket trucks. The device may be lifted to the point of connection on the utility pole.