With Work-holder For Assembly Patents (Class 29/760)
  • Patent number: 7165317
    Abstract: The present invention is an object to provide an apparatus or a method making it possible to easily effect connection between additional electrodes, etc. and lead electrodes when performing a processing for achieving a predetermined throat height value or crown processing or the like and making it possible to measure the requisite lapping amount. For achieving the object, a flexible electrode extension sheet is used which consists of a portion for retaining a ceramic bar in which element portions are formed and a portion where there are formed wirings respectively in correspondence with the elements and adapted to be connected to these elements, in which these wirings, which can be easily connected to an external measurement system, are electrically connected to the elements, whereby the lapping amount is easily obtained from the characteristic amount of the elements in the lapping process.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: January 23, 2007
    Assignee: TDK Corporation
    Inventors: Hiroshi Shindo, Akio Ogawa, Kazushige Tohta
  • Patent number: 7152311
    Abstract: A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: December 26, 2006
    Assignee: Tessera, Inc.
    Inventors: Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, David Light, John W. Smith
  • Patent number: 7140083
    Abstract: A nozzle sheet has arrays of nozzles, and additionally has two first positioning holes on opposite sides of the arrays of nozzles, respectively, that are opposite to each other in a lengthwise direction of the nozzle sheet, and two second positioning holes in respective vicinities of the two first positioning holes. When the nozzle sheet is adhered to a lower surface of a channel unit consisting of a plurality of sheet members and having a plurality of ink channels, first, two first positioning pins of a first jig are fitted in the two first positioning holes of the nozzle sheet so as to position the nozzle sheet relative to the first jig and, subsequently, the channel unit is adhered to the nozzle sheet so as to provide a cavity unit.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: November 28, 2006
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Atsushi Ito
  • Patent number: 7134191
    Abstract: A press-fitting device in which a terminal of a connector having a staggered arrangement section of the terminal of the connector is press-fitted into an insertion hole is provided. In the press-fitting device, a first terminal restricting member on which a guide section for restricting a vertical displacement of the terminals between the terminals along the lateral direction of the connector housing and a second terminal restricting member on which a guide section for restricting the lateral displacement of the terminals between the terminals along the vertical direction of the connector housing in an upper or lower part of the first terminal restricting member are provided. A guide groove to which terminals on an interior side of the connector housing are introduced is provided at a tip end portion of the guide portion positioned at the staggered arrangement section of the terminals.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: November 14, 2006
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries
    Inventor: Ryousuke Shioda
  • Patent number: 7131182
    Abstract: An assembly method and fixture for assembling a supporting disk of a motor rotor according to the invention is based on an “adjusting, and fixing” concept. A functional axis fixture and an adjusting axis fixture, which can match with each other for holding the supporting disk and the rotor, are first prepared. The functional axis of the supporting disk is aligned with the geometric axis of the functional axis fixture, and the geometric axis of the rotor is aligned with the geometric axis of the adjusting axis fixture. By engaging the functional axis fixture and the adjusting axis fixture, the functional axis of the supporting disk is aligned with the geometric axis of the rotor. Therefore, the bias and concentricity can be precisely controlled and improved.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: November 7, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Dung-Chang Yeh, Yung-Ping Lin
  • Patent number: 7124499
    Abstract: The apparatus is used for installing a wire in a crimp, in particular a wire being provided on a wire spool mounted on a spool holder. The wire outputs the apparatus at a wire output guide. The apparatus comprises a crimp punch tool located in front of the wire output guide. A first actuator allows operating the crimp punch tool. The wire is cut using a wire cutter adjacent to the crimp punch tool. The cutter tool is operated by a second actuator. In use, the wire is installed by feeding the wire from the wire spool through the wire output guide and then into the crimp. The crimp is closed by punching it using the crimp punch tool. The wire is cut after the last crimp using the wire cutter tool. The apparatus and method can be used for installing very fragile and small wires.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: October 24, 2006
    Assignee: Simpler Networks Inc.
    Inventors: Jean-Claude Villeneuve, Michel Décarie, Normand Lassonde, Pierre Kakos, Paul-André Messier
  • Patent number: 7120996
    Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: October 17, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Patent number: 7117582
    Abstract: A method of enabling a reliable, motor-to-base merge process is designed for motors that are attached to a base with screws that mount from outside of the base. An assembly fixture receives the motor, which has a tooling hole for circumferentially locating the motor relative to the base. The assembly fixture closely receives the motor and has a tooling pin that engages the tooling hole to prevent rotation of the motor relative to the assembly fixture. During the motor-to-base merge process, the motor is inverted with the tooling pin in the tooling hole. The assembly fixture aligns the threaded screw holes in the motor with the mounting holes on the base.
    Type: Grant
    Filed: September 23, 2003
    Date of Patent: October 10, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Ta-Chang Fu, Ungtae Kim, Robert A. Lenicheck, Sattar Malek, Stanley Yen Wong
  • Patent number: 7107672
    Abstract: A plurality of flexible printed circuit boards are held on a transfer carrier, which is formed by a base plate and a resin layer formed on an upper surface of the base plate. Reference pins are positioned at reference pin openings of the carrier base plate and reference holes of the flexible printed circuit boards are positioned at the reference pins in order to adhere the board to the carrier resin layer. Electronic parts are mounted on the flexible printed circuit board by bonding the electronic parts to bonding portions of the flexible printed circuit board.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: September 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuto Onitsuka, Teruaki Nishinaka
  • Patent number: 7080450
    Abstract: A machine for terminating wire assemblies comprising: a means for holding a wire assembly; a linear movement means for moving said means for holding between a first area and a second area; an insertion head; and, a means for dislodging; wherein, after a wire assembly is loaded into the means for holding a wire assembly, the means for holding a wire assembly is moved by the linear moving means from the first area to the second area for assembly termination by the insertion head; and, following termination, the assembly is at least partially unseated from the means for holding a wire assembly by the means for dislodging.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: July 25, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Neil Edward Deming, Larry Eugene Cox, Jr.
  • Patent number: 7059045
    Abstract: In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: June 13, 2006
    Assignee: Intel Corporation
    Inventors: Daoqiang Lu, Christopher L. Rumer
  • Patent number: 7032293
    Abstract: A process for producing bundles of laminated sheet metal for magnet cores, wherein laminations are punched free along two longitudinal edges of a sheet metal strip, at least two sheet metal laminations of a magnet core are of a different width extending from one longitudinal edge to the other, and several laminations, which rest against each other, are connected with each other to form the bundle. To simplify the tool control, the two longitudinal edges of a lamination are punched in edge cutting stations, which are separate from each other and are arranged offset in the feed direction of the sheet metal strip. The edge cutting stations for cutting the longitudinal edges have a cutting die and an associated bottom die. The cutting die, together with the bottom die, is displaced for creating different laminate widths.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: April 25, 2006
    Assignee: Dr. Karl Bausch GmbH & Co. KG
    Inventor: Günther Bausch
  • Patent number: 7032297
    Abstract: An apparatus for safe and easy installation of wall-mounted electrical switches utilizing a multi-function tool. The tool is provided, in the form of an insulated handle that is detachably engaged with a wall switch. The wall switch device is temporarily attached to a switch fixture using one or more magnets. The tool further includes built-in electrical wire measuring, stripping and bending structures.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: April 25, 2006
    Inventors: Bryan Cahill, Deborah Unser
  • Patent number: 7024752
    Abstract: A crimping press has a tool receptacle arranged at a lower end of a pressing slider provided with a force-sensing device. The forces arising during the crimping operation are transmitted from the supporting surfaces of an upper tool to several points on the force-sensing device. Provided on each side of an upper fork and held by screws are two collars to which are transmitted, the crimping forces on either side of the supporting surface. With their heads, the screws hold the collars, while with their other ends the screws are engaged with the pressing slider. The collars transmit the crimping forces to the sensor elements of the force-sensing device.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: April 11, 2006
    Assignee: Komax Holding AG
    Inventors: Peter Imgrüt, Claudio Meisser
  • Patent number: 7020954
    Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: April 4, 2006
    Assignee: ESEC Trading SA
    Inventors: Dominik Hartmann, Ruedi Grueter
  • Patent number: 7017258
    Abstract: A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: March 28, 2006
    Assignee: Intel Corporation
    Inventors: Michael Z. Eckblad, Mark W. Anderson
  • Patent number: 7015066
    Abstract: A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: March 21, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Pei-Haw Tsao, Chender Huang, Jones Wang, Ken Chen
  • Patent number: 7002813
    Abstract: An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: February 21, 2006
    Assignees: Leopold Kostal GmbH & Co. KG, Solarworld AG
    Inventors: Eduard Bergmann, Herwig Rilling, Peter Westermayr, Clemens Hofbauer, Boris Klebensberger, Karsten Wambach
  • Patent number: 6996898
    Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: February 14, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Mark V Peckham, Tony Teitenberg
  • Patent number: 6990730
    Abstract: A process and system for mounting terminals with electric wires in cavities of connector housings. Press-connecting terminals are initially loaded in cavities arranged in an upper surface of a connector jig and electric wires are press-connected on the terminals in the jigs. Then, the terminals with electric wires are transferred from the connector jig to cavities arranged in a lower surface of a inserting jig by pins arranged to contact and push the terminals from below in the transfer direction. Then, the terminals are loaded from the inserting jig to cavities of connector housings from the back by blades arranged to contact and push the terminals from one end in the inserting directing.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: January 31, 2006
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Koji Fujita, Yoshinobu Ota, Junichi Shirakawa, Kenji Hashimoto
  • Patent number: 6976303
    Abstract: A system is provided for mounting a connecting device to a substrate. A connector housing is located at one side of the substrate, and a threaded fastening nut is engaged on the housing. A threaded fastener is engaged with the opposite side of the substrate and extends therethrough for tightening the nut toward the substrate in response to rotating the fastener. An assembly tool holds the fastening nut against rotation as the fastener is rotated. The tool includes a first portion for engaging at least a part of the housing to properly position the tool. A second portion of the tool engages the fastening nut to prevent rotation thereof. The second portion of the tool is aligned with the fastening nut automatically in response to engaging the first portion with the housing.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: December 20, 2005
    Assignee: Molex Incorporated
    Inventors: Wenzong Chen, Thomas R. Marrapode, Igor Grois, Jeffrey P. Myczek
  • Patent number: 6971159
    Abstract: A tool for inserting electrical wires into an electrical connector for mating with a plurality of electrical contact members fixedly mounted within the electrical connector comprises a base fixture upon which the electrical connector is to be installed, an insertion die holder upon which a set of insertion dies is mounted for encountering and forcing the plurality of electrical wires into the electrical connector, a driving assembly for moving the insertion die holder toward the base fixture so as to cause the set of insertion dies to force the plurality of electrical wires into the electrical connector and mate with the electrical contact members of the electrical connector, and structure fixedly mounted upon the base fixture for engaging the electrical connector so as to precisely locate and laterally immobilize the electrical connector upon the base fixture such that the set of insertion dies can accurately insert the electrical wires into said electrical connector.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: December 6, 2005
    Assignee: Illinois Tool Works Inc
    Inventors: Anatoly Gosis, James A. Turek
  • Patent number: 6952868
    Abstract: An assembly apparatus for a magnet assembly is disclosed. The assembly apparatus includes first and second assembly nests and an assembly slide operable between an advanced position relative to the assembly nests and a retracted position for assembly. As disclosed the assembly apparatus is used to assemble spacer posts between opposed magnet/backiron assemblies. The assembly apparatus includes spacer nests proximate to the assembly nests for assembly of spacers between the opposed magnet/backiron assemblies.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: October 11, 2005
    Assignee: Seagate Technology LLC
    Inventors: Terry R. Fahley, Paul L. Johnson, David L. Duvick
  • Patent number: 6948235
    Abstract: In one embodiment, an apparatus for facilitating installation of a shroud on a pin grid comprises a first alignment structure including a first plurality of longitudinal elements adapted to be inserted within each gap of the pin grid along a first direction and a first handle extending in a perpendicular manner to the plurality of longitudinal elements, and a second alignment structure including a second plurality of longitudinal elements adapted to be inserted within each gap of the pin grid along a second direction and a second handle extending in a perpendicular manner to the second plurality of longitudinal elements, wherein when the first alignment structure and the second alignment structures are inserted within the pin grid, the first and second handles form at least a partial frame structure to receive the shroud in a position to receive pins of the pin grid.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: September 27, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon A. Rubenstein, Bradley E. Clements
  • Patent number: 6950310
    Abstract: A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: September 27, 2005
    Assignee: Texas Instruments Incorporated
    Inventor: Darvin R. Edwards
  • Patent number: 6944943
    Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: September 20, 2005
    Assignee: Samsung Techwin Co., Ltd
    Inventors: Tae-yeon Cho, Seong-i Lee
  • Patent number: 6941647
    Abstract: The present invention discloses a transfer for a tray feeder comprising: a base frame; a support frame installed at both sides of the base frame; first and second linear motion guiders installed oppositely and longitudinally to the inside of the support frame and having a plurality of first and second linear motion guide rails; first and second plates installed to an upper portion of the first and second linear guides and having a cylinder block capable of supporting a side of the tray received an electronic parts and the like; and a driving unit installed to a side portion of the support frame and for making the movement of the first and second plates; wherein the first and second plates can move along the first and second guide rails, crossing with each other.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: September 13, 2005
    Assignee: Mirae Corporation
    Inventors: Jae Hyuk Cho, Sang Won Lee, Dong Suh Lee
  • Patent number: 6922886
    Abstract: An apparatus designed for installing anode bracelets upon pipes used in cathodic protection systems. The apparatus includes a pair of grasp booms which hold the anode bracelet during installation of the bracelet around the pipe to be cathodically protected. The grasp booms can be rotated for the installation of the anode bracelet and can be opened to receive each half of the bracelet and closed to mount the bracelet around the pipe.
    Type: Grant
    Filed: July 6, 2002
    Date of Patent: August 2, 2005
    Inventor: John L. Costley, Jr.
  • Patent number: 6922888
    Abstract: An attachment for a tool used to attach and remove load break elbows and protective caps from bushings disposed on a transformer is provided. The tool attachment includes an elbow engaging member that is positionable around a load break elbow or cap fixed to a bushing. The engagement member is fixedly secured to a horizontal bar that includes a number of aligned openings extending through the bar. These openings are selectively alignable with a pair of openings disposed on a vertical bar to pivotally attach the vertical and horizontal bars to one another. The vertical bar also includes an opening through which a pulling eye on the elbow or cap can extend when the tool attachment is positioned on the elbow or cap.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: August 2, 2005
    Assignee: Speed Systems Inc.
    Inventors: William E. Barry, Todd K. Knapp
  • Patent number: 6892444
    Abstract: An optical component manipulation system has two opposed jaws, which can each be independently positioned relative to each other in a coordinate plane to thereby effect the desired positioning of optical components within the larger system. Z-axis rigidity is provided by air-bearings. Laser heating of the jaws is used for solder, or similar heat driven bonding, processes.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: May 17, 2005
    Assignee: Axsun Technologies, Inc.
    Inventors: Robert K. Jenner, Dale C. Flanders, Peter S. Whitney, Jonathan R. Coppeta
  • Patent number: 6886244
    Abstract: An apparatus for performing treatments to the surface of disk-shaped workpieces/substrates, as in the manufacture of multi-layer, thin-film recording media. The apparatus includes treatment stations for performing treatments to a surface of each of the disk-shaped workpieces/substrates; a pallet adapted for mounting the disk-shaped workpieces/substrates, a plurality of bias potential sources; and a transporting source to transport the pallet past the treatment stations. The pallet includes electrically conductive segments and each segment is electrically insulated from other segments; is adapted to mount and expose at lest one surface of a disk-shaped workpiece; and includes an electrical contact for providing electrical contact with the bias potential source of the apparatus.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: May 3, 2005
    Assignee: Seagate Technology LLC
    Inventors: Paul Stephen McLeod, Taesun Ernest Kim
  • Patent number: 6877219
    Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: April 12, 2005
    Assignees: Air Liquide America, L.P., American Air Liquide, Inc.
    Inventors: Martin Theriault, Stephane Rabia, Jason Uner
  • Patent number: 6877215
    Abstract: A compliance mechanism for manipulating a control object by an end effector supported by a robotic arm. The robotic arm is supported by a combination of linear slides for two-axis freedom of movement. A locking arm is attached to the robotic arm and the locking arm is moveable between a locked and an unlocked position. The locking arm is biased in the locked position to restrict movement of the robotic arm along the two axes. A plunger extends adjacent the end effector. Upon engagement with an alignment feature associated with the control object, the plunger moves the locking arm from the locked to the unlocked position, thereby introducing compliance along the two axes manipulation of the control object.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: April 12, 2005
    Assignee: Seagate Technology LLC
    Inventor: Michael W. Pfeiffer
  • Patent number: 6874219
    Abstract: A disk clamp for securing disks to the hub of a spindle motor in a disk drive has symmetrically spaced apart countersunk apertures in the top surface of the disk clamp. The apertures enable the disk clamp to maintain a proper orientation before the fasteners are attached. This design overcomes issues related to rotation and displacement of the clamp while it is being fastened to the hub, and reduces the complexity of the tooling and fixtures required to complete the assembly. Less tooling complexity also allows multi-fastener driver systems to be employed so that all of the fasteners required to complete the assembly may be simultaneously attached arid driven into the disk clamp. The countersunk apertures on the disk clamp are designed to couple with tapered sleeves on the installation tool to quickly and precisely center the fasteners in the disk clamp while providing anti-rotation torque for the disk clamp.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: April 5, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Steven Alf Hanssen, Jr-Yi Shen, Emmanuel N. Tatarakis, Stanley Yen Wong
  • Patent number: 6868601
    Abstract: A calibration tool for centering an inner tube with respect to an outer tube of a vertical furnace for semiconductor manufacturing including a first alignment member having a plurality of engagement surfaces simultaneously movable radially outward an equal radial distance for engagement with a base structure of a vertical furnace to center the calibration tool with respect to the base structure and the outer tube; a second alignment member having a plurality of engagement surfaces simultaneously movable radially outward an equal radial distance to engage the inner tube and to move the inner tube to a position centered with respect to the outer tube of the vertical furnace.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: March 22, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventor: Yung-Pin Lin
  • Patent number: 6863169
    Abstract: A printed circuit board support comprising a support base and a base extension assembly. The support base defines a support surface. The base extension assembly is secured to the support base and is arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of the printed circuit board support, wherein variation of the variable extension assembly height dimension results in variation of the height dimension of the printed circuit board support. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72(b).
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: March 8, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Brian F. Gordon, Tony M. Teitenberg, John S. Godfrey
  • Patent number: 6864431
    Abstract: A method of supporting a fragile board by a plurality of supporting members formed of respective elastic materials. The method includes steps of: (a) preparing a plurality of first and second supporting members as the supporting members such that the second supporting members have higher compression modulus than the first supporting members; (b) arranging the first and second supporting members on a plane such that each of the first supporting members is adjacent to a corresponding one of the second supporting members and such that each of the first supporting members has a larger height from the plane than each of the second supporting members; and (c) positioning the first and second supporting members under the board, whereby the board is supported at a lower surface thereof by the supporting members.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: March 8, 2005
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventor: Shinsuke Suhara
  • Patent number: 6859995
    Abstract: A new fixture which is capable of holding an HSA throughout all processes is invented so that Quasi-Static Test can be done before swaging. Handling operations are reduced and rework is made much easier. The invention further provides a process for testing the HSA by means of the fixture.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: March 1, 2005
    Assignee: Sae Magnetics (H.K.) Ltd.
    Inventors: Takehiro Kamigama, Huegung Wang, Yiusing Ho, Chunkau Leung, Waikong Cheung, Shinji Misawa, Jinsuo Sun, Wenxin Chang
  • Patent number: 6859984
    Abstract: A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M×N matrix configuration, is provided and an interconnect interface device is joined to the rear face of the piezoelectric member. A plurality of printed circuits are then attached to the interconnect device so as to enable the resultant transducer array to be electrically connected to an external cable. The interconnect device is formed by an insulator member having dimensions in accordance with those of the piezoelectric member. A drilling operation is performed on the insulator member to form a corresponding array of through holes. The insulator member is then metallized and a resin used to provide filling of the through holes. Grooves are formed in at least one face of the insulator for receiving the printed circuits.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: March 1, 2005
    Assignee: Vermon
    Inventors: Dominique Dinet, Leong Ratsimandresy, Rémi Dufait, An Nguyen-Dinh, Aimé Flesch
  • Patent number: 6839956
    Abstract: An object of the invention is to provide a method of assembling a disc which can reduce an unbalance of a rotating portion.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: January 11, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Keiko Watanabe, Tetsuya Hamaguchi, Takashi Matsuki, Shizuo Yamazaki
  • Patent number: 6836959
    Abstract: A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: January 4, 2005
    Assignee: NEC Corporation
    Inventors: Shinji Watanabe, Masashi Tsunabuchi
  • Publication number: 20040255455
    Abstract: An apparatus and method for allocating and positioning back-up pins for supporting a substrate are provided. The apparatus includes a substrate guide rail for guiding a circuit board to a predetermined position; a plurality of magnetic back-up pins for supporting the circuit board; a back-up pin plate for placing the back-up pins thereon; a back-up pin stand disposed near the back-up pin plate and for holding the back-up pins; a camera for photographing an image of a surface of the circuit board; a display means for displaying a virtual or composed image of the entire circuit board scanned by the camera and a real-time image of a portion of the circuit board for aiding a user to allocate the adequate support locations of the circuit board; and a transfer means for transferring the back-up pins onto the allocated locations on the back-up pin plate.
    Type: Application
    Filed: February 17, 2004
    Publication date: December 23, 2004
    Inventors: Won-keun Yu, Yun-hyuk Son, Jae-jin Lee
  • Patent number: 6829818
    Abstract: A magnetic head slider with at least one thin-film magnetic head element on a suspension is mounted. This mounting includes electrically connecting the magnetic head slider with the suspension with ball bonding connections. Electrical property of the thin-film magnetic head element is inspected, and then the ball bonding connections are separated when it is judged that the thin-film magnetic head element has defective electrical property. Then, the magnetic head slider is detached from the suspension, and thereafter a new magnetic head slider with at least one thin-film magnetic head element is mounted on the suspension from which the magnetic head slider was detached.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: December 14, 2004
    Assignee: TDK Corporation
    Inventors: Takehiro Kamigama, Masashi Shiraishi
  • Publication number: 20040244189
    Abstract: A bolster plate is attached to a printed circuit board and acts as a stiffener that reduces bending in the overall assembly during the attachment of an integrated circuit chip to the printed circuit board under a heavy applied load. The bolster plate is provided with a shim that compensates for bending of the bolster plate under load, thereby preventing damage to the integrated circuit chip. The dimensions of the shim may be selected according to computer model results representing bow deformation in the bolster plate without the shim.
    Type: Application
    Filed: July 1, 2004
    Publication date: December 9, 2004
    Inventor: Joseph M. White
  • Patent number: 6792675
    Abstract: The present invention relates to an apparatus that proactively ensures alignment (parallelism) of the connectors on the circuit board during the solder assembly of the connectors to the circuit board. The apparatus includes an alignment fixture that has been specifically designed to ensure parallelism of straddle-mounted connectors during the solder reflow assembly process. The fixture has connector slots and a circuit board slot. The slots help to detect whether the connectors meet the X- and Y-axis alignment requirements after the insertion process (after the connectors have been placed onto the circuit board). That is, if the X- and Y-axis alignment specifications are met, the circuit board with its attached connectors can be completely fitted into the slots of the alignment fixture.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: September 21, 2004
    Assignee: Sun Microsystems, Inc.
    Inventor: Camnhung T. Tran
  • Publication number: 20040177497
    Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member.
    Type: Application
    Filed: March 31, 2004
    Publication date: September 16, 2004
    Inventors: Mark V. Peckham, Tony Teitenberg
  • Patent number: 6789312
    Abstract: A bolster plate is attached to a printed circuit board and acts as a stiffener that reduces bending in the overall assembly during the attachment of an integrated circuit chip to the printed circuit board under a heavy applied load. The bolster plate is provided with a shim that compensates for bending of the bolster plate under load, thereby preventing damage to the integrated circuit chip. The dimensions of the shim may be selected according to computer model results representing bow deformation in the bolster plate without the shim.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: September 14, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Joseph M White
  • Publication number: 20040172822
    Abstract: Apparatuses and methods for automating the assembly of a fiber optic module. The fiber optic module typically includes a housing, a clip, and a ferrule that is attached to the end of a fiber optic cable. The housing, clip, ferrule and fiber optic cable are supported by a pallet assembly. The pallet assembly can be loaded into a docking station of a laser weld machine that welds the ferrule to the clip. The pallet assembly includes a cartridge that is attached to a pallet and supports the housing. The pallet is constructed to receive different cartridges. Each cartridge has support features that correspond to a specific type of module housing. A different type of module housing may be loaded onto the pallet assembly by merely replacing the cartridge. The same pallet can therefore be used for the assembly of different fiber modules. This minimizes the tooling cost and change-over time associated with manufacturing different types of modules.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 9, 2004
    Inventors: Keith Douglas Koster, Robert Glenn Heitel, Jiansheng Zhou
  • Patent number: 6785958
    Abstract: A jig for loosening electric wires of a wire harness passed through a grommet is disclosed. The jig includes a fixing-side clamping portion for clamping the one end of a wire harness, a guide rail extending in a longitudinal direction of the wire harness, a bearing slidably engaged with the guide rail; a lock portion for locking said bearing to the guide rail, a circular rotating member, supported by said bearing, for rotating the wire harness in a circumferential direction of the wire harness; and a movable-side clamping portion, integrally attached to the rotating member, for clamping the other end of the wire harness. The rotating member may have a spiral cam groove, and the bearing may have an engagement protrusion to be engaged with the cam groove so that when the one clamping portion is inverted, the rotating member can move in its longitudinal direction. The one clamping portion may include a rachet mechanism.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: September 7, 2004
    Assignee: Yazaki Corp.
    Inventors: Takahiro Saito, Norihiro Yoneyama, Kenji Usui, Masaya Uchida
  • Patent number: 6779259
    Abstract: Two or more parts feeding sections are provided, and in each of the parts feeding sections, identical combinations of parts cassettes aligned in the same arrangement are prepared. If one or more type of components that are to be picked up at one time by a plurality of suction nozzles is exhausted, the mounting head moves to the other parts feeding section, which provides the same combination of components for all the suction nozzles to pick up the components at one time, so that the mounting operation can be continued without stopping the apparatus for replenishment of components.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: August 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoto Mimura, Hirofumi Obara, Hiroshi Ogata, Chikashi Konishi