Abstract: A terminal crimping device where an electric wire is moved from a wire stripping section to a terminal crimping section, with both ends of the wire held by two wire holding hands of a wire conveying hand, and is subjected to terminal crimping processing by terminal crimping pressing devices. The terminal crimping device has the second wire conveying hand for conveying the wire at the terminal crimping section. The wire conveying hand conveys the wire without passing it from one side of the wire crimping pressing devices to the other side, so that an occurrence of a holding failure of the wire is suppressed even if the number of the terminal crimping pressing devices is increased or the conveyance speed of the wire is increased.

Abstract: A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion.

Abstract: An screw assembling device includes a supplying mechanism, a securing mechanism, a driving mechanism, and an assembling mechanism. The supplying mechanism supplies a number of screws sequentially. The securing mechanism holds a housing of an electronic device. The assembling mechanism is connected to the supplying mechanism and the driving mechanism. The assembling mechanism is driven by the driving mechanism to predetermined positions of the housing of electronic device and is configured for assembling the plurality of screws transmitted from the supplying mechanism to the predetermined positions of the housing of electronic device.

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract: A lens assembly tool includes a lens receiving frame having a first surface, a positioning plate positioned on the lens receiving frame, and a pressing plate positioned on the positioning plate and having a second surface. The first surface defines a plurality of receiving holes. The positioning plate defines a plurality of through holes aligned with the plurality of receiving holes. The second surface forms a plurality of pressing punches aligned with the plurality of receiving holes.

Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting a pair of movable anvils for engaging two different lengths of connectors. The base further incorporates a fixed anvil for engaging a third length of connector. The movable anvils define an aperture which is shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A connector seating holder is formed in the front of the tool. A slidably mounted plunger cooperates with the anvils to compress a connector. The plunger has a push head and a slide rod. A lock nut is threaded on the push head and is engageable with the slide rod to prevent rotation of the push head.

Abstract: An electrical connector (100) for electrically connecting an IC package with a substrate and includes an insulative housing (1) with a plurality of contacts (10) received therein, a stiffener (3) located outside of the insulative housing (1) and includes a front end (20) and a rear end (21) opposite to the front end (20), a holding member (61) pivotally assembled to the front end (20) of the stiffener (2), a carrier (8) assembled to the holding member (61) for holding the IC package (9), a load plate (3) pivotally assembled to the rear end (21) of the stiffener (2) and includes an opening (310) to permit the exposing of the IC package (9), the load plate (3) presses on the holding member (61).

Abstract: Provided is a U-shaped iron core transfer/assembling method, by which a first leg iron core, a second-leg iron core and a lower-yoke iron core are housed in a first leg iron core tank, a second leg iron core tank and a lower-yoke iron core tank, respectively, and those iron cores are individually transported in sideways attitude. Next, the lower-yoke iron core is transferred into a lower-yoke iron core assembling tank. While the first leg iron core, the second leg iron core and the lower-yoke iron core being kept in the tilted postures, the first leg iron core tank, the second leg iron core tank and the lower-yoke iron core assembling tank are individually opened at their openings and are jointed to each other.

Abstract: An electrical terminal applicator system includes a die connected to a press. A one-piece member includes a stock guide portion homogeneously connected to a tool receiving portion. The one-piece member is releasably secured to the die using only a single fastener. A male member extends from either one of the one-piece member or the die, and a female slot is created in the other one of the one-piece member or the die slidably receiving the male member to permit the one-piece member to be horizontally positioned on the die prior to securing the one-piece member using the single fastener.

Abstract: Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board.

Abstract: A device for aligning a LCD panel having circuit elements with driver circuit card assemblies, consisting of retractable pins located around a central platform. The retractable pins extend in order to receive the LCD panel and circuit element assembly and hold it in place as the circuit elements are aligned with driver circuit card assemblies. Once aligned, the drivers and LCD panel can be bonded together. Once bonded, the pins are retracted and the LCD panel and driver assembly is released. The present invention also relates to a method of aligning LCD panels and drivers using retractable pin tools.

Abstract: A crimping tool for crimping a stented heart valve comprises a housing having a front wall and a back wall, a compression assembly disposed between the front wall and the back wall and including a stent receiving chamber therewithin for receiving a stented heart valve, and a delivery device holder slidably coupled to the front wall of the housing. The compression assembly is movable between an uncrimped position and a crimped position to reduce the diameter of the stented heart valve.

Abstract: A lift frame for engaging and transporting a slatted vehicle grill. Two U-bolts extend from a rectangular frame with a crane lift point and a securing fastener. The U-bolts slideably slot between a pair vehicle grill slats while a fastener bolt clamps the U-bolts and slats together. Two locking clamps attach the lower frame rail to a second set of slats, securing the entire assembly against the vehicle grill for removal and transport. The frame provides a tool that improves safety and reduces effort required to lift a large vehicle radiator grill when access to the internal engine compartment is necessary for maintenance and repairs.

Abstract: A device and method for minimizing the forces that may compromise a lead frame mount to a support structure in an integrated circuit die package during various packaging method steps. When a window clamp is used to provide pressure during a lead frame bonding step or during a wire bonding step during packaging, the vertical force applied by the window clamp may be transferred in lateral direction by the physical contour of the top plate of the support structure. By changing the physical contour of the top plate of the support structure, such as by disposing a specific kind of contoured protrusion, one may minimize or eliminate the lateral forces that act against achieving a solid bond of the lead frame to the support structure. Further, during wire bonding, the same minimization or elimination of lateral forces lead to improved wire bonding.

Abstract: Method and Apparatus are provided for automatically disposing plural wires along predetermined trajectories, wherein the plural wires extend from coils wound in slots of dynamoelectric machine cores. Plural wires forming leads (16?, 17?) are located in predetermined positions and caused to extend along predetermined directions (33,34) by means of manipulating equipment and tooling (3) which operates automatically. In addition, the equipment and tooling (3) cause the plural wires to become twisted and cut to form portions (16?, 17?) for connection to terminals. The tooling (3) is provided with reference surfaces (21,23) and seats (26,27) which are used to bend the plural wires along the predetermined trajectories and to provide a position constraint for the portions becoming twisted.

Abstract: A substrate conveyor track is provided with first to fourth conveyors. Two conveyors situated on both sides of the substrate conveyor track, and the other two conveyors situated at the center of the same. There is enabled selection of any one from a small substrate mounting mode for giving a single substrate conveyance width to the four conveyors and mounting electronic components on four small substrates having the single width; a large substrate mounting mode for actuating all movable conveyors to the center of the substrate conveyor track and mounting electronic components on two large substrates by the two conveyors; and a large-small-substrates mounting mode for bringing the two conveyors on one side of the substrate conveyor track, among the four conveyors, into the small substrate mounting mode and bringing one of the conveyors on the other side of the track into the large substrate mounting mode.

Abstract: The invention relates to a method for manufacturing a concentrated-photovoltaic panel (1), said panel (1) including: a back surface (11) designed to hold a series of photovoltaic modules (20) in position; a front surface (12); a lower part (13a, 13?a) of a mounting (13, 13?) attached to the front surface, said mounting (13, 13?) being designed to hold a series of light-energy concentration systems (30) in position, such that each concentration system (30) is aligned with at least one associated photovoltaic module (20); and lateral walls (16) connecting the back surface (11) and the front surface (12) so as to define a closed box (10); the method being characterized in that the respective position of the photovoltaic modules (20) is fixed in space with respect to the lower part (13a) of the mounting (13, 13?), when the front surface (12), the lateral walls (16) and the back surface (12) of the box (10) are assembled with the photovoltaic modules (20) and the lower part (13a, 13?a) of the mounting (13, 13?).

Abstract: A structure and method operable to create a reusable template for detachable thin semiconductor substrates is provided. The template has a shape such that the 3-D shape is substantially retained after each substrate release. Prior art reusable templates may have a tendency to change shape after each subsequent reuse; the present disclosure aims to address this and other deficiencies from the prior art, therefore increasing the reuse life of the template.

Abstract: A trimming apparatus and method that can create plural trim shapes using one press die. The trimming apparatus includes a conveying device for conveying a pallet having a workpiece disposed thereon, a trimming device having a press die for trimming the workpiece in a trimming process area, a positioning device for determining the relative position of the press die with respect to the pallet and a position switching device provided in the positioning device to change operable to change the position of the press die with respect to the pallet in the trimming process area.

Abstract: A circuit chip mounting system incorporates a carrier having a socket for receiving a circuit chip. The socket includes a plurality of contacts for contacting pads on the chip and includes pins extending therefrom for insertion into terminals in a PCB. Secondary spacers each having a configuration corresponding to a portion of the shape of the carrier are provided with holes arranged to receive the pins and permit the pins to pass therethrough for insertion in PCB terminals. The secondary spacers are soluble to be removed in a washing procedure during processing.

Abstract: A pressing apparatus is adapted for pressing a plurality of heat sinks on a circuit board, and includes a frame body and a plurality of pressing tools. The frame body includes a platform configured for placement of the circuit board thereon, and a mounting frame disposed above and spaced apart from the platform. The pressing tools are disposed at respective positions on the mounting frame. Each of the pressing tools includes an axle component, a universal joint unit disposed at a bottom end of the axle component, and a pressing head connected to the universal joint unit. The axle component extends downwardly between the platform and the mounting frame, and is configured to be resiliently and vertically movable. The pressing head is adapted for contacting one of the heat sinks, and is rotatable about the axle component by virtue of the universal joint unit.

Abstract: A lead wire implanting apparatus is provided that can fabricate high-quality brushes that are without variations in implanting height and implanting strength and free from cracks and that can make the reproducibility of set values better and improve the workability in setup changing. The lead wire implanting apparatus has a tamping member and a storing cup for storing conductive metal powder, for implanting and fixing a lead wire to a brush main body by performing a tamping action of the tamping member a predetermined number of times. The apparatus has a linear-type servo motor serving as a drive source for driving the tamping member in vertical directions, a first position detector for detecting a shift position of the tamping member, and a controller device for controlling the linear-type servo motor based on detected information by the first position detector to cause the tamping member to perform a predetermined tamping action.

Abstract: An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.

Abstract: A smart card processing system for processing a plurality of smart card portions on a smart card panel substantially simultaneously. The system may include a transfer member for moving card panels. Smart card panels may be loaded into an input magazine capable of elevating the panels with respect to a processing station. A transfer member may transport smart card panels from the input magazine to the processing station wherein one or more pre-personalization operations may be conducted. The transfer member may also be operative to move the smart card panels from the processing station to a marking station such that defective smart portions may be marked. The transfer may also move panels from the marking station to an output magazine. The output magazine may lower the smart card panels with respect to the marking station to accommodate more initiated smart card panels.

Abstract: A display alignment system aligns an internal display device with an outer cover glass such that planes defined by both are substantially parallel. A subject electronic device includes an outer housing having a back portion and multiple mounting bosses, a transparent display cover coupled to the outer housing, a display device disposed between the back portion and the display cover, and mounting brackets coupling the display device to the mounting bosses. The exact positions of the mounting brackets are adjusted to compensate for the specific dimensions of the mounting bosses, outer housing and/or display device, which is done using a separate assembly fixture having spring-loaded and locking pins to record individual mounting boss heights. Recorded boss heights are used to position the mounting brackets on sides of the display device so that the combination thereof is customized for the recorded outer housing and mounting bosses.

Abstract: A method of assembling a matrix of photovoltaic cells includes positioning photovoltaic cells in a desired orientation, aligning the row of photovoltaic cells relative to each other, and enabling a homogeneous downward pressure on the row of photovoltaic cells to facilitate electrical and mechanical connectivity between the photovoltaic cells.

Abstract: A component assembly (10) used for picking and placing the component assembly includes a component (14-30) having a geometry incapable of being picked and placed or having a geometry that is unstable when placed through a reflow oven. The assembly includes a support member such as a detachable clip (11) having a pick and placeable surface such as a top flat surface (12). The clip attaches to the component to modify a center of gravity to form a stable component assembly once attached to the support member. The component assembly can further include conductive elements (such as a center conductor (17) of a coaxial cable (16) and at least one ground conductor (15)) used for registration with apertures or other surface locations on a substrate (19).

Abstract: A semiconductor apparatus includes a semiconductor chip through-line for transmitting signals commonly to a plurality of stacked semiconductor chips. The apparatus includes a first test pulse signal transmission unit configured to transmit a first test pulse signal to a first end of the semiconductor chip through-line when a power-up operation is performed; a second test pulse signal transmission unit configured to transmit a second test pulse signal to a second end of the semiconductor chip through-line after the first test pulse signal is transmitted; a first signal reception unit coupled to the first end of the semiconductor chip through-line, and configured to receive signals transmitted from the first and second test pulse signal transmission units; and a second signal reception unit coupled to the second end of the semiconductor chip through-line, and configured to receive the signals transmitted by the first and second test pulse signal transmission units.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: A jig securing alignment and positional accuracy in all directions (x, y, z) for an electrical component to be soldered to a PCB is provided. The jig positions the IC in the x and y directions, and keeps the IC from rotating. The jig also holds the IC down during the soldering process to make sure that the IC remains parallel to the PCB before, during and after soldering. The jig attaches to mounting holes on the PCB and its placement can be automated or performed manually.

Abstract: A method for producing a gradient coil assembly for a magnetic resonance imaging system includes applying a number of primary gradient coils and a number of secondary gradient coils to a winding mandrel to form the gradient coil assembly. A control coil arrangement is associated with the winding mandrel. During an intermediate check before completion of the gradient coil assembly, at least one coupling inductance value between the control coil arrangement and at least one of the primary gradient coils and/or at least one of the secondary gradient coils is determined. An arrangement of the relevant gradient coils on the winding mandrel is corrected as a function of the at least one coupling inductance value.

Abstract: An assembly tool is provided. The assembly tool comprises a body, a first vacuum channel defined within the body, and a first locating pin attached to the body. The first locating pin has a shaft portion arranged within a surrounding portion of the body. The first locating pin is configured to engage a first alignment feature of a hard drive component at a first contact area to align the hard drive component with the assembly tool. The body is configured to couple the first vacuum channel to a vacuum source and to facilitate particle evacuation from the first contact area via the first vacuum channel when a vacuum is applied by the vacuum source.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D).

Abstract: Provided is a coaxial cable connector compression tool comprising a resilient coaxial cable retaining mechanism, having a tool mounting portion, affixed to said compression tool and a compliant cable receiving portion configured to releasably retain a coaxial cable, wherein the cable retaining mechanism, which may be comprised or one or multiple pieces, bears minimal compression forces while positioned on said compression tool to hold said coaxial cable in proper alignment when said compression tool is operated. Moreover, a method is provided for retaining a coaxial cable in proper alignment during compression of a coaxial cable connector onto said coaxial cable.

Abstract: The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.

Abstract: An apparatus for decoating a solar module includes a rotatable scraper, which is connected to a drive-shaft for driving in rotation and pressing with a pressure-force the scraper onto a surface of the solar module, wherein the rotatable scraper has prongs or teeth with side-faces and end-faces, and wherein the end-faces are embodied as polishing surfaces.

Abstract: A apparatus for mounting an interposer PCA into a chassis is disclosed. The apparatus comprises a bracket attached to the PCA. A geared handle is rotatably attached to one end of the bracket. The geared handle is configured to rotate between an open position and a closed position. Two geared segments are rotatably attached to the opposite end of the bracket and are meshed with the geared handle. A slot is formed in each geared segment and two slots are formed in the geared handle. The slots engage with insertion/ejection flanges on the chassis. The engaged slots force the PCA down into mating connectors in the chassis when the handle is rotated from the open position to the closed position.

Abstract: Manufacture of electronic devices is usually accomplished through automated assembly lines using automated conveyors. These automated conveyors, typically comprising metallic components, cannot convey electronic devices into an RF chamber for testing (e.g., RF) during manufacture without compromising the efficacy of the shielding provided by the RF chamber. Thus, although electronic devices are assembled on automated assembly lines, a device is typically removed from the automated assembly line for testing, transported manually into an RF chamber, powered on, and then tested. After testing, the electronic device is powered down, manually removed from the RF chamber, and returned to the assembly line. Described herein are embodiments of a system and method to automatically transport electronic devices under power through an RF isolated chamber for testing (e.g., RF) as part of an automated assembly line process resulting in a dramatic increase in the number of electronic devices that can be tested.

Abstract: A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set.

Abstract: There is disclosed a device for a production of cable harnesses, said device having a stand, a rotor, at least two rotor arms and at least two mounting boards, said rotor rotatably mounted on said stand and said rotor having said at least two rotor arms on which said at least two mounting boards are mounted, wherein each mounting board of said at least two mounting boards is configured to allow producing at least one cable harness. In a preferred embodiment each mounting board of said at least two mounting boards is mounted on two rotor arms of said at least two rotor arms in a vertically adjustable manner, and said rotor has a rotor post which extends upward from said stand and to which said at least two rotor arms are mounted.

Abstract: An apparatus for removal of a disk in a disk stack. The apparatus includes a shaft. The shaft has an end portion insertable into a disk remover tool. The shaft has a positioning portion at an end of the shaft opposite the insertable end portion. The positioning portion includes a surface de-tensionizer. The surface de-tensionizer provides disengagement of surface tension between the disk and a disk spacer during a disk removal process performed thereon.

Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting a pair of movable anvils for engaging two different lengths of connectors. A slidably mounted plunger cooperates with the anvils to compress a connector. The plunger has a push head, an adjustment knob and a slide rod. The push head and adjustment knob are movable relative to one another and have first and second end faces with different outside diameters. An end face with the appropriate diameter for a particular connector can be placed in an operative position where it will engage a connector.

Abstract: A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.

Abstract: A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine.

Abstract: A jig for probe connector adapted for clutching a plurality of probe assemblies each of which has a connecting portion, a probing pin and a soldering portion disposed at two ends of the connecting portion respectively. The jig for probe connector has a base body. The base body has a plurality of passageways each penetrating a front end thereof. The passageway includes a first receiving recess and a second receiving recess disposed at a front of the first receiving recess. A cross section of the second receiving recess is larger than that of the first receiving recess, with a drop defined as a preventing portion formed therebetween. A side of the second receiving recess has a portion protruded inward to form a buckling lump, which is spaced from the preventing portion with a predetermined distance.

Abstract: Staking apparatus (22) disclosed performs a method for staking one or more fasteners (44) of a part assembly (18) are provided by a conveyor (14), a lower lift and lock assembly (24) including a lower lifter (28) and a lower lock (30), and an upper press (26). Lower and upper staking punches (40, 60) of the lower lifter (28) and the upper press (26), respectively, provide the staking while at least one and preferably a plurality of springs (36) resiliently support a pallet assembly (16) on which the part assembly (18) is positioned.

Abstract: A terminal reel cart that supports a reel of terminals and a terminal applicator such that the terminal applicator can be loaded with the strip of terminals and moved into position relative to a wire processing system. The terminal reel cart supports the reel of terminals and a terminal applicator. The reel cart includes a plurality of wheels that allow the cart to be easily moved throughout a processing facility. The reel cart includes a paper take up reel that is driven by a motor and collects the paper backing from the strip of terminals. The paper take up reel is driven by a drive motor on the wire processing system.

Abstract: Multiple connector clips are bondable onto an electronic device simultaneously with a rotary clip bonder, wherein a pick head comprising a plurality of collets is positioned at a clip supply channel. A plurality of connector clips are picked up from the clip supply channel in a fixed orientation with the pick head and are conveyed to a clip bonding area where the electronic device is located. The pick head is rotated with a rotary motor about a rotational axis passing through a shaft connecting the rotary motor to the pick head in order to change the orientation of the plurality of connector clips, before the connector clips are bonded at the clip bonding area.

Abstract: Disclosed are a holding tray, a substrate alignment system using the same and a method thereof. More specifically, the present invention relates to a holding tray for substrate capable of accomplishing high-precision alignment and conducting a stable deposition. A holding means is included in at least one side of the substrate to hold and support the substrate in a manner that the substrate is vertically held and supported on a flat surface of the holding tray during a vacuum process. The holding tray according to the present invention, the substrate alignment system using the same, and the method thereof include a substrate on which a deposition is made, a frame formed to receive the substrate, a tray formed to receive the frame, and at least one holding means formed to hold the substrate on the frame.