Abstract: A flux containing an activator of the nonionic halogen group is used in soldering one end of each of lead terminals 6a and 6b to each of drawing electrodes 5a and 5b of a ceramic element 2. After soldering them, a wax 9 is dripped on the periphery of vibrating electrodes 4a and 4b of the ceramic element 2. Then, an outer resin 10 is applied around the periphery of the ceramic element 2 and so on. By drying the outer resin 10, a solvent contained in the outer resin 10 is dispersed to the outside, and pores are formed in the outer resin 10 on paths through which the solvent has been dispersed. At the same time, a part of a residual flux 11 is absorbed into the pores formed in the outer resin 10. The whole is heated to 150.degree. C. to harden the outer resin 10. When the whole is heated, the wax 9 and the remaining part of the residual flux 11 are absorbed into the pores of the outer resin 10. As a result, a cavity 8 is formed around the periphery of the vibrating electrodes 4a and 4b.

Abstract: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.

Abstract: A method of encapsulating a crystal oscillator (100). First, a dielectric material is assembled or connected to the bottom side of a lead frame (102). Second, oscillator components including a piezoelectric element, capacitors and an integrated circuit are attached on the lead frame (104). Third, an epoxy dam is dispensed around the periphery of the oscillator component locations (106). Fourth, a encapsulant is dispensed within the epoxy dam to encapsulate the oscillator components (108). Fifth, the epoxy dam and encapsulant are cured (110). Thereafter, the oscillator is singulated from the lead frame and the leads are formed for mounting (112).

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: The method is used to assemble an electronic package of the type having a plurality of external conductive output pads for subsequent surface mounting of the electronic package. The method includes forming a nonconductive frame within the opening of a conductive lead frame such that the nonconductive frame is attached to and encapsulates a portion of each of the leads of the conductive lead frame. An electronic package, which includes two printed circuit boards, having components and conductive output areas on respective sides thereof, is positioned within the non-conductive frame from opposite sides and the conductive output areas of the boards attached to respective parts of different ones of the leads of the conductive lead frame. The electronic package is then encapsulated, leaving an air gap between the boards which cushions and isolates the internal solder joints from subsequent stress by allowing the boards to flex. The leads of the conductive lead frame are then separated from the frame.

Abstract: The present invention provides a method and apparatus for fabricating thermally and electrically improved electronic integrated circuits by laminating one or more lead frames to a standard integrated circuit package such as, for example, thin small outline package (TSOP). The lead frame laminated to the package enhances thermal conduction of heat from the integrated circuit package. A heat spreader may also be utilized to improve heat transfer and can be further used as a ground plane to improve signal quality by reducing electrical circuit noise. Achieving improved thermal transfer characteristics from an integrated circuit package results in better dissipation of heat from the integrated circuit package and results in more reliable operation thereby. Using standard commercially available integrated circuit packages such as TSOP allows economical and rapid fabrication of thermally and electrically superior electronic circuits for applications that demand high reliability and performance.

Abstract: The present invention relates generally to a new apparatus and method for a chip carrier. More particularly, the invention encompasses an apparatus and a method that uses a chip carrier having a single encapsulant to provide both flip chip fatigue life enhancement and environmental protection. A double-sided, pressure-sensitive, thermally-conductive adhesive tape could also be used with the encapsulated chip to directly attach the chip to a heat sink. Similarly, also disclosed is a method and apparatus for directly joining a heat sink to the chip carrier.

Abstract: An automatic waterproofing apparatus for automatically waterproofing a joint of electric wires, comprising: a plurality of pallet jigs each of which is formed with a recess for receiving the joint, a pair of slots for receiving the electric wires and an air vent hole communicating with the recess; a transport device for continuously transporting the pallet jigs; a sheet feeding device for feeding onto an upper face of each pallet jig a flexible band-like sheet; a slit forming device for forming at opposite sides of the sheet a pair of slits corresponding to the slots, respectively; a suction device for sucking air in the recess of each Dallet jig from the air vent hole so as to bring the sheet into close contact with the recess; a joint placing device for placing the joint in the recess and inserting into the slots through the slits the electric wires disposed at opposite sides of the joint; a filler injecting device for injecting a predetermined quantity of filler into the recess; and an adhesive tape bondin

Abstract: A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are nonfunctional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: A catheter has a tubular plastics body and an insulated metal wire extending along the bore of the catheter through an aperture close to its patient end. The exposed end of the wire is covered by and connects with an electrically-conductive plastics material injection molded about the tubular body to form an electrode with a convex surface projecting from the surface of the catheter.

Abstract: A piezoelectric component-mounting foil and foil making method are disclosed, whereby a first portion of the foil in a first plane substantially parallel to a second portion of the foil in a second plane are connected by a central portion not in the first or second plane, the central portion having at least one width dimension of the central portion less than at least one length dimension of the central portion. A conductive foil material, appropriate thickness, overall geometry, and, if desired, appropriate notch configuration are selected for a desired implementation of the foil for conductively attaching and at least partially supporting at least one piezoelectric component such as a quartz crystal.

Abstract: A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms part of a resin package.

Abstract: After a semiconductor die is placed onto a leadframe and electrically connected to the die, the die and the ends of the leads adjacent to the die are encased in a packaged body. The exposed ends of the leads are trimmed so that the leads are of desired lengths for leadforming, or for connection to substrates or sockets. The ends of the leads are enclosed in a protective body, so that when the package is tested and handled, the protective body reduces undesirable bending of the leads. By trimming the leads before forming the protective body, the leadframe used need not be larger than those normally used.

Abstract: A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends toward the bottom of the housing where a metallic slug is positioned. The cavity also includes one or more bond shelves descending from the top of the housing toward the bottom of the housing. The bond shelves support conducting bond pads which are coupled to connecting pins which extend from the housing. An integrated circuit with a number of integrated circuit bond pads is attached by an epoxy to the bottom of the cavity. Bond wires couple the integrated circuit bond pads and the bond shelf pads. A liquid is dispensed in the cavity such that the liquid extends from the bottom of the cavity to a position above the bond wires. A properly selected liquid provides protection for the integrated circuit and its electrical connections.

Abstract: After a semiconductor die is placed onto a leadframe and electrically connected to the die, the die and the ends of the leads adjacent to the die are encased in a packaged body. The exposed ends of the leads are trimmed so that the leads are of desired lengths for leadforming, or for connection to substrates or sockets. The ends of the leads are enclosed in a protective body, so that when the package is tested and handled, the protective body reduces undesirable bending of the leads. By trimming the leads before forming the protective body, the leadframe used need, not be larger than those normally used.

Abstract: A tapered carbon microelectrode is produced by extruding an organic material or a composition composed of crystalline carbon fine powder and an organic binder into a thin rod form, carbonizing said rod by calcining to produce a pure carbon thin rod, soaking the resulting thin rod as an anode in an electrolytic solution, gradually pulling up the thin rod while electrochemically oxidizing the tip portion of the thin rod. Then a lead wire is connected with the thick portion of the thin rod followed by coating all the surface except the conically sharp tip portion.The tapered carbon electrode can be used for various electrochemical measurements and scanning tunneling microscope.

Abstract: This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits are stacked in multilayers and are connected to respective lead fingers and respective die circuits by standard, known methods such as TAB or wire bond and encapsulated in a known way. The ground plane and power plane being adjacent to the signal plane reduces the power-ground loop inductance and thus reduces the package noise. By reducing the inductance, the circuit can have a shorter switching time. Also, by adding the ground plane, the power-ground capacitance is increased, which serves to reduce the effect of power supply fluctuations in the system.

Abstract: A miniature, electrically-insulated multi-conductor electrical cable suitable for implantation in living bodies and readily connected to sensors or electrodes with terminal pads or to conductors such as printed flex circuit traces of electrical circuits, and a method for preparing such cables. Individual electrical conductors are coated with at least one layer of insulating material. The insulated individual conductors are stranded together, or optionally bound together by an additional layer of insulating material which is compatible with implantation in living bodies. The individual conductors are separated from one another in terminal portions of the cable and are encapsulated in a ribbonizing resin which is trimmed to expose portions of the individual conductors, held by the ribbonization resin at a predetermined pitch to facilitate connection of each of the conductors to a respective conductor trace of a printed circuit or flex circuit.

Abstract: A method of assembling an electromagnetic interference filter comprises the step of disposing electrical components on a base. The components are connected to form an electromagnetic interference filter. The filter is enclosed in a metal case, which is formed by folding a metal sheet around said filter and joining the ends of the sheet together. The metal sheet has an insulating coating disposed on one side to prevent contact between the filter components and the case. The outer surface of the case is sealed with seal tape.

Abstract: A cable coupling, particularly for data buses, includes a transformer and resistors to which the cables are directly wired. The components and all electrical connections are enclosed in a heat shrinkable tubing or sleeve filled with liquid encapsulant. Upon application of heat, the tubing shrinks causing the encapsulant to fill all voids between components. The encapsulant is then cured to provide an uncased coupling assembly which protects the components and electrical connections from breakage, while eliminating the need for a separate rigid housing. An overbraided shield and environmental seal may subsequently be added to provide further protection for the coupling.

Abstract: An apparatus and process for splicing electrical wires that are to be exposed to an adverse environment. The apparatus includes a connector, an insulating sleeve adapted to retain the connector, and an encapsulant. The encapsulant, which is disposed within the insulating sleeve, has a cone penetration value of 100 to 350 (10.sup.-1 mm) and an ultimate elongation of at least 200%.

Abstract: A circuit panel subassembly suitable for use in an eletromechanical apparatus includes a plurality of wires formed within an electrically conductive grid imbedded within a reaction injection molded panel which forms a part of the housing of the electromechanical apparatus. Wires are deployed in a pattern by using a wire organizing frame and the electrically conductive grid and the frame are subsequently imbedded in a reaction injection molded panel. Terminals attached to the ends of the wires remain exposed at spaced apart locations where components are to be mounted. Separate connector housings can be attached to the panel over the exposed terminals and other components or matable connectors can be attached thereto. The entire apparatus can be constructed robotically.

Abstract: An electrical connector (1) comprising, an insulative housing block (16), conductive electrical contacts (9) in the housing block (16) connected to corresponding signal wires (2), a conductive ground bus (10) connected to corresponding ground wires (5), plastics material (28) at a rear of the housing block (16) imbedding the ground bus (10) and a portion of the cable (1), and a conductive shell (29) enclosing the plastics material (28).

Abstract: A catheter sensor assembly and support has a member with a distal end and a proximal extension joined by an intermediate part. An open passage extends along the proximal extension and across the intermediate part to carry a sensor overlaying the passage. Conductors attach to the sensor bottom for transmitting signals from the sensor through a catheter lumen. An adhesive sealant secures the sensor to the intermediate part near the distal end so that the passage remains open between the lumen and the bottom. A method for assembling and supporting a sensor at a distal end of a catheter tube includes steps of attaching a sensor with an area toward an end connected to electrical conductors, placing a tube in the passage to provide a passageway between the lumen and the sensor, mounting the sensor to the member overlying the passage, inserting the proximal extension into the lumen with the electrical conductors passing through the lumen and sealing the sensor to the passage.

Abstract: An electronic device having a plurality of leads comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity therein and a plurality of lead slots extending from the cavity to a base of the holder, an electronic element mounted in the cavity and having a plurality of leads extending therefrom, a plurality of the leads extending within the slots from the element to the base, and a plurality of lead terminals mounted on the holder and each having one end extending into one of the slots into conducting engagement with a lead and a free end extending outward therefrom.

Abstract: A terminal block (20) includes a plurality of wells each having a protector 32) disposed therein and each having a bore which communicates with a U-shaped terminal (60) so that a portion of the protector extends through the bore into engagement with a bade (66) of the terminal. Tangs (68--68) of each terminal depend downwardly. Also, the terminal block includes a plurality of terminal posts (62--62) each having a spade (69) depending therefrom. A first plastic material (70) encapsulates the base and innermost portions of each U-shaped terminal and post. Individual conductors of a pair in a cable (50) extend to a depending tang of a terminal and to a tang of an associated terminal. A strap wire interconnects the other depending tang of each U-shaped terminal to a spade of an associated terminal post. A second plastic material encapsulates the wiring and the outermost portions of the U-shaped terminals and of the spades of the terminal posts.

Abstract: An electric device with an operation indicating light has a base and a case transversely divisible in a main frame and a case cover. The main frame is fitted to the base at one open end of the frame. A resin material is injected into the space provided by the base and the main frame. The case cover is fitted to the other open end of the main frame so that an operating indicating lamp can be seen through an indicating hole in the case cover. Thus, the device can be easily assembled, and the resin material does not leak from the gap between the operation indicating lamp and the indicating hole. Cracks are prevented from developing in the solder connecting the lamp to the circuit board. In addition, the lamp can be positioned at a high precision because no packing is required to prevent resin leakage.

Abstract: A liquid jet recording head comprises a recording head unit for discharging liquid from an orifice by applying an energy to the liquid from an energy generator mounted on a substrate in order to form flying droplets, and a substrate member having an external wiring unit for supplying an electrical signal to said energy generator; wherein the electrical connection area for electrically connecting said energy generator and said external wiring unit is integrally molded by an insulative sealing material.This is a division of application Ser. No. 077,090, filed July 23, 1987, which is a continuation of application Ser. No. 740,494, filed June 3, 1985, now abandoned.

Abstract: A method of sealing electric and electonic parts, comprising employing two different ultraviolet-curing resins for upper and lower layer portions, respectively, the resin employed for the upper layer portion having a smaller specific gravity than that of the resin for the lower layer portion before the resins are cured, and simultaneously curing the resins by irradiation with an ultraviolet ray. The ultraviolet-curing resin employed for the upper layer portion is an epoxy acrylate or epoxy resin, while an urethane acrylate ultraviolet-curing resin is employed for the lower layer portion, and the thickness of the ultraviolet-curing resin employed for the upper layer portion is set at from 0.5 mm to 3 mm.

Abstract: A transcutaneous nerve and/or muscle stimulation electrode manufacturing method provided which enables rapid assembly of an electrode. Stretchability is provised by a conductive fabric which includes an array of conductive fibers with interstitial areas therebetween. A conductive adhesive fills interstitial areas of the conductive fabric and provides for adhering the electrode to the patient's skin.

Abstract: A method for the manufacture of an inductive chip of the type with a wire coiled around a core comprises the following steps:(a) Fixing the core to a connecting strip made of a metallic material, the strip being provided with slots by which electrical connections can be obtained on either side of the component,(b) Winding a wire around the fixed core,(c) Soldering each end of the wire to each part of the strip designed to form the electrical connections,(d) Coating the wound core, with the connecting strip acting as a mould joint for the moulding process,(e) Cutting out the connecting strip to set off the limits of each component and the parts intended to form the external electrical connections,(f) Folding and fixing the parts delimited in the previous step of the component.

Abstract: A leadless chip inductor having metallic terminal plates and a coil element fixed to the metallic terminal plates, the metallic terminal plates being partially enclosed, together with the coil element, by a resin molded cover, the portions of the metallic terminal plates exposed to the outside of the molded outer cover being bent along the edge of the molded cover so as to form terminals for connection to an external circuit. The mechanical and electrical connection between the metallic terminal plates and the lead lines led from the coil is achieved by brazing or welding the lead lines to the undersides of a narrow strip-shaped tabs which is projected from each metallic terminal plate. With this arrangement, the coil lead lines are securely connected to the metallic terminal plates.

Abstract: A minaturized magnetically-shielded potted electronic component such as a reed relay, is manufactured by first producing a casing by etching a u-metal sheet to produce a casing blank together with fold lines thereon, the blank then being folded to produce a casing part 10 completed by insulating plastics material end walls 21 located between turned-over end wall sections 16,17 integral with the casing side walls 12,13. The reed relay insert 24 and operating coil 25 are mounted on a lead frame 23 including pins 27,28 and then the components are positioned within the casing 10 the lead frame 23 engaging grooves 22 in the end walls 21. The space within the casing surrounding reed relay is then filled with a potting compound and the relay completed by removing the salvage bar 31 from the lead frame 23.

Abstract: A coaxial line as a rigid probe interposer is particularly useful for connecting an electrical tester to a high speed integrated circuit utilizes two coaxial dielectrics for spacing a center conductor from an outer conductor in the form of a holed metallic body. The line center conductor is initially coated with a first dielectric. The dielectric coated center conductor is thereafter positioned in an oversized hole within the conductive body. The annular free space existing between the inside wall of the hole and the outer circumference of the first dielectric is filled as by capillary action, with a second, liquid dielectric which flows into the fissures and cracks within the first dielectric prior to curing.

Abstract: An electric component such as a rectifier is shown in which the electric leads are formed from composite wire material. The wire material has a copper core surrounded by and metallurgically bonded to a layer of ferrous material such as steel having optimal concentricity which layer is in turn surrounded by and metallurgically bonded to a layer of copper.

Abstract: A system for coupling or connecting magnet wires to lead wires comprises terminals each having a portion upturned with an insulation displacement connector and each also having a portion with crimp connectors. The system also comprises a terminal holder with front and rear plates each having slots for supporting said connectors in a position to hold wires in an out-of-alignment orientation.

Abstract: A serving dish having a heater, and a method for assembling the dish. An electric heater including a resistance element enclosed in a heat conducting and electrical insulating material is adhesively bonded against the bottom of a serving dish of ceramic or the like. Holes through the material covering the resistance element provide for electrical contact with the resistance element, and these holes are filled with solder. A bottom plate of stainless steel or other electrically conductive sheet is adhesively bonded over the heater, and the bottom plate is heated to melt the solder and cause the solder to fuse to the bottom plate. The entire bottom plate has its edges sealed by a silicone rubber sealant or the like to encapsulate the heater. The resulting dish has a bottom plate to give a neat appearance, the bottom acting as electrical contacts to energize the heater and heat the contents of the serving dish.

Abstract: A method of making a transducer which has a head mass, a tail mass and a plurality of piezoelectric rings arranged in a stack with alternate electrodes, which are to be glued to the piezoelectric rings. The electrodes are of the type which have a surface on either side defining passageways when abutting an adjacent component. The components are assembled without the use of adhesive and then placed into a vacuum chamber where the pressure is reduced. The pressure is then brought back to normal atmospheric pressure in the presence of an adhesive surrounding the stack, with the adhesive being drawn into the passageways and toward the interior of the stack as a result of the pressure differential created. The adhesive joins the components together and also coats the outside of the stack so that after curing it functions as an anti-arcing coating.

Abstract: A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.

Abstract: To manufacture a vibration-resistant, shock-resistant electrical connection on a ceramic substrate (11) having an electrically conductive layer (12) applied to a surface (13, 19) thereof, a groove or channel-like depression (16, 20) is formed in the surface, preferably also including a through-bore (18), into which a conductor (17) is placed. The space between the conductor and the groove, the through-bore, if provided, and an extending groove at the other surface (19) of the substrate is filled with a sinterable mass (21), preferably a cermet, containing a metal which is compatible with the metal of the conductor wire (17), both for example containing platinum. As a starting material, the plate with the grooves therein is extrusion-pressed, pre-sintered at a low temperature to give it form stability, then the electrode (12) is applied, then the electrical conductor (17) and the cermet is applied and then the entire sub-assembly is fired to sintering temperature, e.g. about 1500.degree. C.

Abstract: A high voltage electrical component can be insulated by placing such component into a first sleeve of preformed insulative material dimensioned to receive and telescope over the component. An internal abutment in the first sleeve positions the component for reception of both the first sleeve and component by a second sleeve of preformed insulative material dimensioned to receive and telescope over the first sleeve and component within. An internal abutment in the second sleeve further secures and centers the component and the first sleeve for subsequent encapsulation by insulative materials used with injection molding to form an outer insulative jacket. Once encapsulated within the insulative jacket the telescoping sleeves form a convoluted path outwardly from the component to the exterior of the jacket thereby minimizing high volt leakage.

Abstract: An apparatus is provided for installing sleeves onto elongated substrates such as electrical wiring or cable, where the sleeves are slideably arranged on fingers extending from a carrier belt. The apparatus includes a base having a belt path for receiving the carrier belt and a finger guideway for receiving a finger of the carrier belt. Stripping means are slideably mounted on the base for forcing a sleeve from a finger onto a substrate. An indexing element is provided for moving the carrier belt to a position so that a finger having a sleeve arranged thereon is in the finger guideway each time after a sleeve is stripped from a finger. In use of the device, the sleeve can be stripped from a finger into the die in two stages, where an elongate substrate is inserted into the removed portion of the sleeve between the two stages. For installing non-cylindrical sleeves on cylindrical substrates, a die is mounted to the base at a position to receive the sleeve as it is stripped from a finger.

Abstract: A pallet (10) for receiving a plurality of electrical components used in fabricating crystal resonators (28, 40, 42, 46), has a number of spaced bosses (12) adapted to receive terminals (30, 32) of the components. The terminals (30, 32) extend through a longitudinal groove (20) so that the components can be readily tested at various phases of assembly. The pallet (10) includes a number of spaced teeth (22) whereby the pallet (10), together with the components, can be advanced through a plurality of testing-and-fabricating stations. The pallet (10) is guided in its longitudinal intermittent movement by means of a keyway (26) constructed integrally in a face of the pallet opposite the side having the teeth (22). The pallet (10), together with the components mounted thereon, can be transferred from one fabricating station to the other through a rack (56) which is adapted to receive a number of pallets (10).

Abstract: A resilient boot 10 used to cover the axial juncture between a cable 40 and an anode 30 is supported in a rolled and stretched condition on a hollow support member 20 which has a flange 28 to removably retain the tubular section 16 of the boot 10 in roll form 18 and a flange 23 to removably retain the sleeve section 12 of the boot 10 in roll form 14. The support member 20 is assembled over the juncture and roll 18 is unrolled so that tubular section 16 conforms snugly to the cable 40 and roll 14 is unrolled so that sleeve section 12 conforms snugly to the anode 30. The tubular section 27 of the support member 20 removed stresses at the juncture which results from lateral movement of the cable.

Abstract: There is provided a flexible electric heater element and a process for making such a heater element.The flattened ends of two lead wires are disposed on a first layer of material which includes a vulcanizable elastomer. The ends of a resistance wire are placed in electrical contact with the flattened ends of the two lead wires. A second layer of material, which includes a vulcanizable elastomer, is placed over the first layer sandwiching between the layers the resistance wire in electrical contact with the flattened ends of the two lead wires. The other ends of the two lead wires extend externally to the first and second layers of material.The elastomer is vulcanized and the flattened ends of the lead wires are held in permanent electrical contact with the ends of the resistance wire by forces exerted by the vulcanized elastomer.

Abstract: Method for encapsulating components in cases, which includes connecting a gold wire to an aluminum surface, subsequently closing the case by welding in a vacuum, and tempering the case in a hydrogen-containing atmosphere and an encapsulation produced by the method.

Abstract: A tantalum capacitor comprising a cylindrical body and an axial tantalum anode wire. This wire is first folded and then soldered to an anode connection wire roughly parallel to a cathode connection wire which is itself soldered to the body of this capacitor. The connection wires include preferably a double right-angled section so that the distance between the outward portions of this wire correspond to predetermined standards.

Abstract: An electric resistance heating element of the hairpin type is provided by a molybdenum disilicide resistance wire loop transversely connected to molybdenum disilicide terminals. The resistance wire is sandwiched between the ends of two pieces of terminal wire and the ends of these pieces are butt welded together on the resistance wire, to form each terminal.

Abstract: An assembly for fixing an undersea telecommunications cable with a central strength member (1) but no metal armouring to the housing of a repeater (2). It includes a funnel-shaped conical part (3) with a flared mouth piece, a neck 3A whose inside diameter is equal to the diameter of the cable. Said conical part is fixed to the housing of the repeater. An elongate elastomer sleeve surrounds the end of the cable up to the inner zone of the neck of said conical part and has an outside diameter which tapers gradually towards its end distant from said mouth piece. An elongate shell (8) is made of stratified glass and resin material, said material surrounding the flared end of the mouth piece of the conical part and said sleeve. An outer sleeve (9) made of braid of high tensile strength extends around the periphery of said shell, and an elevator cover (10) surrounds the aforementioned parts. Application to cables which are to be submerged to great depths.