Abstract: Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

Abstract: An electrode lead for a cochlear implant, the electrode lead having a lateral side and a medial side supporting an electrode array, wherein a height of a cross section of the electrode lead is greater in the lateral side than a height of the cross section in the medial side.

Abstract: Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.

Abstract: A plurality of application specific integrated circuit (ASIC) chips with different functions is provided. Each of the ASICs performs one or more functions along an ultrasound data path. The chips include communications protocols or processes for allowing scaling. For example, ASICs for backend processing include data exchange ports for communicating between other ASICs of the same type. As another example, receive beamformer ASICs cascade for beamformation. By providing ASICs implementing many or most of the ultrasound data path functions, with scalability, the same ASICs may be used for different system designs. A family of systems from high end to low-end using the same types of ASICs, but in different configurations, is provided.

Abstract: An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.

Abstract: A method for making a high current low profile inductor includes forming an inductor element comprising a coil having an open center and an outside surface, the coil also having first and second coil ends, making a dry mixture comprising a dry resin and an insulated dry powdered magnetic powder, and compressing the dry mixture around the outside surface of the coil and within the open center of the coil to create an inductor body without liquefying the dry mixture, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface.

Abstract: A method of preparing a polymer actuator includes providing an ionic conductive polymer membrane; forming first and second metal electrodes respectively over first and second surfaces of the ionic conductive polymer membrane; substituting water used in the formation of the first and second metal electrodes with an ionic liquid stable to an electrolysis; and coating the first and second surfaces of the metal electrodes with a coating material.

Abstract: A focused ultrasound transducer includes a first ultrasonic emitter and at least one metallic ultrasonic lens acoustically coupled thereto. The emitter generates ultrasonic energy that propagates along a beam path projecting therefrom. The at least one metallic ultrasonic lens is positioned at least partially in the beam path so that it can direct (e.g., focus, defocus, and/or collimate) in at least one direction (or along at least one plane) at least some of the ultrasonic energy propagating from the emitter. The metallic lens may be formed by extrusion, by molding (e.g., diecast molding or thermoforming), or by sintering (e.g., powder metallurgy). The metallic lens also advantageously functions as a heat sink, improving thermal performance of the ultrasound transducer.

Abstract: A method of manufacturing a solenoidal magnet structure, includes the step of providing a collapsible accurate mold in which to wind the coils winding wire into defined positions in the mold, placing a mechanical support structure over the coils so wound, impregnating the coils and the mechanical support structure with a thermosetting resin, allowing the thermosetting resin to harden, and collapsing the mold and removing the resultant solenoidal magnet structure formed by the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.

Abstract: The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer.

Abstract: The manufacturing method for an electronic parts module includes forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first and the second land parts, positioning a terminal of the active element on the second land part, sticking the active element to the base wiring layer through the adhesive layer by heating and pressing the active element onto the base wiring layer with a thermally pressing tool, and releasing the heating and pressing with the thermally pressing tool while the adhesive layer is semi-solidified, thereafter positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer, and solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface to form the resin sealing layer.

Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: The present invention relates to a connector of an electromagnetic clutch for a compressor and a manufacturing method thereof. The method includes the steps of arranging a leading end of a lead wire 62 or 72 of at least one discharge device 60 or remaining magnetic field removing device 70, which configures a surge absorbing circuit, to a terminal 50 installed in a connector 30 configuring a field coil assembly and having a coupling slot 56 formed in one side thereof; plastically deforming at least one slot bridge 57 to fix the lead wire 62 or 72 to the coupling slot 56; and making the connector 30 in a state where the terminal 50 is fixed to an assembly of at least the discharge device 60 or remaining magnetic field removing device 70 by injection molding.

Abstract: Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.

Abstract: A tamper-proof cap adapted to be mounted on a large assembly for shielding a selected area of the large assembly is disclosed. The tamper-proof cap comprises a laminate stack-up structure wherein at least one open chamber is formed. The stack-up structure comprises at least two layers wherein tamper-proof layers are formed on top of the open chamber. A plurality of vias are disposed around the open chamber, forming with said tamper proof layers a tamper-proof structure around said open chamber. The vias are adapted for connecting the tamper-proof layers to the large assembly when the tamper-proof cap is mounted. In a preferred embodiment, the tamper-proof cap further comprises a shielding layer on top of the tamper-proof layer that are preferably done using conductive ink.

Abstract: This invention relates to ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin intentionally suctioned through the through hole air vent on the underside of the laminate is attracted to re-usable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.

Abstract: Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.

Abstract: A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.

Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.

Abstract: A process of an embedded chip package structure includes following steps. Firstly, a metal core layer having a first surface, a second surface opposite to the first surface, an opening, and a number of through holes are provided. The opening and the through holes connect the first surface and the second surface. A chip is then disposed in the opening. Next, a dielectric layer is formed in the opening and the through holes to fix the chip in the opening. Thereafter, a number of conductive vias are respectively formed in the through holes and insulated from the metal core layer by a portion of the dielectric layer located in the through holes. A circuit structure is then formed on the first surface of the metal core layer by performing a build-up process, and the circuit structure electrically connects the chip and the conductive vias.

Abstract: A coaxial cable connector formed via multi-shot injection molding has a body formed by multiple injection molding layers of different injection moldable materials about a central inner contact to form an integral connector body. The connector body is provided with a coaxial dielectric spacer of dielectric polymer surrounding the inner contact; a coaxial inner body of injectable molded metal composition surrounding an outer diameter of the dielectric spacer; and an outer body of polymer surrounding the inner body. A range of different coupling bodies compatible with the connector body may also be formed via injection molding to provide connectors compatible with a range of different coaxial cable configurations.

Abstract: A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts is disclosed. The method includes the steps of a) forming the conductive member by integrally forming the first and second conductive parts and a joining part that joins portions of the first and second conductive parts, b) mounting the piezoelectric element and the conductive member in the case so that the first conductive part is connected to the first electrode and the second conductive part is connected to the second electrode, and the joining part and the portions of the first and second conductive parts joined by the joining part are positioned outside of the case, c) supplying a filling material into the case, and d) removing the joining part after step c).

Abstract: A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.

Abstract: There are provided a magnetic element capable of enhancing magnetic permeability of a magnetic member, improving a direct current superposition characteristic, and improving production efficiency and a method of manufacturing the magnetic element. The magnetic element includes a coil (30) formed of a conductor having an insulating film, a first core member (20) constituted of insulative soft magnetic ferrite and covering the coil (30), and a second core member (50) having soft magnetic metal powder as material and surrounded by the first core member (20). Furthermore, the magnetic element includes a third core member (40) which has soft magnetic metal powder as material and a higher filling ratio of the soft magnetic metal powder than the second core member 50 and is surrounded by the first core member (20).

Abstract: There is provided a capacitor-embedded printed wiring board incorporating therein a capacitor having stabilized electrical characteristics. The capacitor-embedded printed wiring board includes: a capacitor having a first electrode 5, a high dielectric constant layer 7 and a second electrode 9 which are sequentially laminated on an insulating substrate 1, the second electrode being electrically connected to a land 6 for electrode contact formed in a wiring layer in which the first electrode is formed; a member 12 having at least one insulating layer and laminated over the capacitor and the wiring layer; and a via 18 having an opening extending through the member and the second electrode to reach the land, the via electrically interconnecting the second electrode and the land in the opening. A method of manufacturing the same is also provided.

Abstract: An improved feed-through RF connector uses structural materials with coefficients of thermal expansion selected to enhance the reliability of a hermetic seal. The design of the connector and the selection of materials facilitate easy installation and help avoid cyclic fatigue and cracks that could result in a loss of hermetic seal.

Abstract: A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the molding compound cap structure. The molding compound cap includes a configuration that exposes a portion of a microelectronic device.

Abstract: A method for producing an ink jet head including, on a substrate, a piezoelectric element for discharging an ink from a discharge port, and an ink flow path communicating with the discharge port so as to correspond to the piezoelectric element, the method comprising in this order a step of providing, on the substrate, a mold material corresponding to the ink flow path, a step of providing a wall material of the ink flow path so as to cover the mold material, a step of eliminating a portion of the substrate corresponding to the piezoelectric element thereby forming a space in the substrate, and a step of eliminating the mold material thereby forming the ink flow path.

Abstract: There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole.

Abstract: An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

Abstract: The present invention fixes a nozzle sheet on a substrate with a predetermined material (5,6), which has an excellent chemical resistance and sufficient adhesiveness, or more specifically, fixes the nozzle sheet on the substrate with cyclized rubber or with patternable, adhesive elastic material. Moreover, the present invention forms walls for liquid chambers and liquid channels with polyimide.

Abstract: Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

Abstract: A method of producing a surface acoustic wave device includes a sacrificial-layer forming step of forming a sacrificial layer on a piezoelectric substrate so as to cover comb electrodes and reflectors, a space-forming-member forming step of forming a space-forming member while openings are formed near the reflectors along a surface of the sacrificial layer, a sacrificial-layer removing step of removing the sacrificial layer from the openings of the space-forming member, and a resin sealing step of sealing a surface acoustic wave element with sealing resin, the surface acoustic wave element having an excitation protection space formed between the reflectors and the comb electrodes by the space-forming member.

Abstract: An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; step (64), forming holes in the protective film according to an intended pattern of the blind holes in the metal cover, thus exposing the metal surface through the holes; step (66), etching the metal substrate in the exposed areas to form the blind holes; and step (68), removing a remainder of the protective film from the metal substrate, thereby obtaining the finished metal cover. The method involving etching is relatively low-cost. Additionally, because electrophoretic deposition is used to cover the metal substrate with the protective film, the protective film can be formed on all surfaces of the metal substrate. Thus the method is especially advantageous for manufacturing a metal cover having a three-dimensional shape.

Abstract: A reusable coil assembly (36) for use within a contaminated environment includes a seamless outer envelope (38). An RF coil element (70) and an electronic circuit (88) are encased within the seamless outer envelope (38). The RF coil element (70) is connected to the electronic circuit (88). The outer envelope (38) is integrally constructed from a thermoplastic material using Fused Deposition Modeling process.

Abstract: A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the electro-conductive film. A resilient material is positioned in contact with the conductor so that at least a portion of the conductor is located between the resilient material and the electro-conductive film. A retainer is positioned in contact with the resilient material so that at least a portion of the resilient material and at least a portion of the conductor are located between the retainer and the electro-conductive film. The retainer applies a compressive pressure to the resilient material which transfers at least a portion of the compressive pressure to the conductor to hold the conductor in contact with the electro-conductive film.

Abstract: A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Abstract: An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis direction, and tracking servo coils for moving the moveable unit containing the objective lens in the horizontal directions, and a liquid crystal element disposed for correcting the refractive index. Springs simultaneously provide support for the moveable unit and feed power to the liquid crystal element, the focus servo coil, and the tracking servo coils. A method for making said optical pickup apparatus is described. Two sheets, each having four springs extending across an opening formed by punching, are disposed parallel to each other at a predetermined distance. On these sheets, a fixed unit and a movable unit are formed by insert-molding. Excess portions of the metal sheets are removed, and a through-hole is formed so that connected portions of the wirings, lying side by side, are disconnected.

Abstract: Methods for forming data storage media and the media formed thereby are disclosed herein. In one embodiment, the method for forming a data storage media, comprises: injection molding a substrate comprising surface features, wherein said surface features have greater than about 90% of a surface feature replication of an original master; and disposing a data layer over at least one surface of said substrate; wherein said data storage media has an axial displacement peak of less than about 500? under shock or vibration excitation.

Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.

Abstract: A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the molding compound cap structure. The molding compound cap includes a configuration that exposes a portion of a microelectronic device.

Abstract: A waterproof structure for switch pins includes a pin exposed outside a switch to be connected to an electric wire. The pin and the electric wire are covered by a waterproof insulation material through an injection forming process to become an integrated manner. The pin and electric wire are fully waterproof. The electric wire also can be fastened firmly to the pin to prevent separation of the two.

Abstract: Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of electrical connection pads is located within the recess. A semiconductor die can be flip chip attached to the interposer by at least partial insertion of the semiconductor die within the recess with discrete conductive elements between bond pads of the semiconductor die and electrical connection pads of the interposer. The electrical connection pads communicate with a number of other electrical contact pads accessible elsewhere on the interposer, preferably on a lower surface thereof. A low viscosity underfill encapsulant is disposed between the semiconductor die and the interposer and around the discrete conductive elements by permitting the same to flow into the space between the die and the perimeter wall.

Abstract: Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided.

Abstract: Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in an aperture disposed from the first surface to the second surface. To contact the electrical devices, the contact includes a center portion from which extends two diverging, cantilevered spring arms that project beyond either surface of the electrical connector. To shorten the path that current must travel through the contact, one spring arm terminates in a bellows leg that extends proximate to the second spring arm. When placed between the electrical devices, the spring arms are deflected together causing the bellows leg to press against the second spring arm. For retaining the contact within the aperture, the contact also includes retention members extending from the center portion that engage the insulative housing.

Abstract: The present invention provides an improved voltage variable material (“VVM”). More specifically, the present invention provides an improved printed circuit board substrate, an improved device having circuit protection an improved data communications cable having circuit protection and a method for mass producing devices employing the VVM substrate of the present invention. The VVM substrate eliminates the need for an intermediate daughter or carrier board by impregnating conductive particles and possibly semiconductive and/or insulative particles associated with known volatage variable materials into the varnish or epoxy resin associated with known printed circuit board substrates.

Abstract: A sensor assembly for a magnetic flowmeter is provided that is cost-effective to manufacture, while incorporating an effective seal against leakage and enabling precise positioning of electrodes. The sensor assembly includes an electrode assembly and a plastic housing molded about the electrode assembly. The electrode assembly includes an electrode and a plastic base disposed about the lower end of electrode. The housing includes a wall in direct contact with the plastic base such that the tip of the electrode projects from the wall, facilitating a secure seal about the electrode. The sensor assembly further includes a magnetic assembly configured to provide a magnetic field extending beyond the wall of the housing.