Abstract: A coaxial cable device and method involve weld connectivity. The device, in one embodiment, includes an outer conductor engager and an inner conductor engager. At least one of such conductor engagers includes a weld interface for weld connection with part of a coaxial cable.

Abstract: An implantable medical electrical lead includes a plurality of conductors that extend continuously, without any intermediary junctions, between a plurality of electrodes and a corresponding plurality of contact members of an in-line connector terminal. A junction between each conductor and the corresponding contact member is preferably formed by first fitting a conductive sleeve, which is coupled to a proximal portion of the conductor, into an eyelet feature of the contact member, which is mounted on a strut member, and then welding the sleeve to the contact member at a pre-formed slot of the contact member, which extends along an external recessed surface thereof. The assembly of the connector terminal preferably completes the construction of the lead, wherein the proximal portion of each conductor is positioned in a helical path, which extends between an elongate body of the lead and the connector terminal, and along which a grip zone is formed.

Abstract: An electrical contact assembly has a plurality of formed elongate closed seam tubular elements attached to a carrier with each of the elongate tubular elements attached to the carrier via a tab. Scored creases are formed in the tabs for separating the elongate tubular elements from the assembly and scored creases are formed in the carrier for defining carrier strips. The carrier strip had a plurality of grouped elongate tubular elements. The electrical contact assembly is placed in a crimping die where at least one or more wires are inserting into selected elongate tubular elements. Pressure is applied to least one or more of the selected elongate tubular elements to produce bulk material deformation along a substantial portion of the elongate tubular elements to crimp the elongate tubular elements to the wires as electrical contacts.

Abstract: There is provided a polymer PTC device including a polymer PTC element having a lower resistance. The production process of a PTC device which includes a PTC element (102) having a polymer PTC component (110) and metal electrodes (104) placed on both sides thereto; and a lead (106) connected electrically to at least one of the metal electrodes, is characterized in that the polymer PTC component is formed of an electrically conductive polymer composition which comprises a polymer material and conductive fillers dispersed therein, and the connection of the lead to the metal electrode is performed at a temperature which is lower than the melting point of the polymer material.

Abstract: An implantable medical electrical lead includes a plurality of conductors that extend continuously, without any intermediary junctions, between a plurality of electrodes and a corresponding plurality of contact members of an in-line connector terminal. A junction between each conductor and the corresponding contact member is preferably formed by first fitting a conductive sleeve, which is coupled to a proximal portion of the conductor, into an eyelet feature of the contact member, which is mounted on a strut member, and then welding the sleeve to the contact member at a pre-formed slot of the contact member, which extends along an external recessed surface thereof. The assembly of the connector terminal preferably completes the construction of the lead, wherein the proximal portion of each conductor is positioned in a helical path, which extends between an elongate body of the lead and the connector terminal, and along which a grip zone is formed.

Abstract: A method for terminating a fiber optic cable includes removing an end portion of an outer jacket of a fiber optic cable to expose a strength member and at least one optical fiber. A binder material of the strength member of the fiber optic cable is heated using a heat source to expose strength elements of the strength member. The strength elements are secured to a fiber optic connector assembly using an adhesive.

Abstract: An implantable cardiac electrotherapy lead is manufactured by providing an electrode on a tubular body of the lead, forming a crimp connector from a tubing, forming at least one splice opening at the tubing, receiving and end of a cable conductor in a cavity of the crimp connector, and welding an outer surface of the crimp connector to an edge of the electrode. In a post-crimp position, proximal and distal ends of an inner surface of the tubing contact an insulation jacket of the cable conductor and a sharp edge of the at least one splice opening penetrates the insulation jacket and contacts a conductive core of the cable conductor to provide electrical communication between the crimp connector and the cable connector.

Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.

Abstract: An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.

Abstract: The present disclosure relates to an electrical connector and an assembling method thereof. The electrical connector includes a first insulating housing, a step-shaped second insulating housing, a plurality of first contacts, a plurality of second contacts, and a plurality of third contacts. The first and third contacts are exposed over the second insulating housing and face the same direction. The second contacts are exposed over the second insulating housing and face an opposite direction. The exposed first, second, and third contacts are capable of being soldered to a transmission cable.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by friction welding is provided with a monolithic connector body with a bore dimensioned for an interference fit with an outer diameter of the outer conductor. A friction groove may be formed around the leading end of the outer conductor by application of a friction weld support against the inner diameter and leading end of the outer conductor. The friction groove may include a material chamber formed between a radial friction protrusion of the bore and a bottom of the friction groove. The friction weld support may be provided with ceramic surfaces contacting the outer conductor, a stop shoulder dimensioned to abut a cable end of the bore and/or an elastic insert seated within an inner conductor bore.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

Abstract: A method for fabricating a piezoelectric vibrator includes inserting a filling member formed with a through hole inside of a ring having a substantially cylindrical shape, and inserting one piece of a lead to the through hole of the filling member to project from both sides of the ring. The method further includes sintering the filling member along with the ring and the lead to integrate in an airtight manner, subjecting an exciting electrode of the piezoelectric vibrating piece to a bump connection with an inner lead portion of the lead projected from the ring, subjecting another exciting electrode on a side of the piezoelectric vibrating piece opposed to the other exciting electrode to wire bonding with the ring, and press-fitting the ring to an opening portion of a case and sealing the piezoelectric vibrating piece connected with the inner lead portion inside of the case in an airtight manner.

Abstract: A wire crimping section (11) of a terminal (10) comprises a base section (13) upon which a conductor (1) of a wire (W) is arranged; and a pair of caulking sections (14) that is formed in extension from the base section (13), and that is caulked so as to crimp the conductor (1). A friction-agitation connection section (20), which is formed by making the conductor (1), the base section (13), and the pair of caulking sections (14) into a state of integrated plastic flow, is provided on the wire crimping section (11).

Abstract: A terminal connector with an electric wire includes a bottom portion, a wall, a plurality of connection pieces, and an auxiliary wall. An end portion of the electric wire is placed on and connected to the bottom portion. The electric wire includes a core wire exposed at the end portion. The wall is provided continuously from the bottom portion and integrally rises from one side of the bottom portion extending to another side. One of the connection pieces extends from one end of the bottom portion and another one of the connection pieces extends from one end of the wall and the connection pieces are contacted and connected to an opposing terminal connector. The auxiliary wall is provided continuously from another end of the wall that is opposite from the one end from which the connection piece extends. The auxiliary wall extends downwardly to the bottom portion.

Abstract: A hair dressing device that utilizes low voltage from a pair of batteries to generate temperature needed for curling and straightening the hair comprises an upper body and a lower body, each having an outer side and an inner side. A heating plate is mounted on the inner side of the lower body facing the upper body. At least one heating element is mounted on the heating plate to generate heat utilizing high precision printing at high temperature. An insulating member is interposed between the at least one heating element and the heating plate to eliminate short circuit. The lower body is coupled to the upper body around a hinge section. A thermal sensor and a controller are incorporated in the hair dressing device to monitor and control the temperature of the heating plate. The hair dressing device can be connected and disconnected from power using an ON/OFF switch.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: An cable assembly includes an external cover; two printed circuit boards accommodated in the external cover; a cable including a plurality of wires, a metallic braiding enclosing the wires and an insulative jacket enclosing the metallic braiding, an axial slit defined in the metallic braiding and the insulative jacket of a front segment of the cable for exposing the corresponding wires outside, the corresponding wires separated into two groups of wires respectively soldered to the two printed circuit boards; an outer shielding layer enclosing the axial slit; and a shrinkable tube mounted to the outer shielding layer.

Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.

Abstract: A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.

Abstract: A method for bonding two electronic components includes inserting hollow and open inserts into full convex elements of a lower hardness than that of the inserts, where, when an insert is inserted into a full element at least one surface of the open end of the insert is left free from the full element so as to create an outlet passage for gases contained in the insert.

Abstract: A connector for an implantable medical lead that is electrically and mechanically connectable to an implantable medical device, has a connector pin made of a first conducting material. A tubular insulator made of an insulating material concentrically surrounds at least a portion of the pin. A connector ring made of a second conducting material is concentrically positioned around at least a portion of the insulator. The insulator is connected to the connector ring by spark plasma sintering in the case of an active fixation lead, and is connected to the ring and the pin by spark plasma sintering in the case of a passive fixation lead.

Abstract: A medical electrical lead that includes a lead body and at least one tubular electrode sub-assembly positioned over and attached to the external surface of the lead body. The lead body includes at least one elongated conductive element, such as a cable, that is electrically connected to a coiled electrode of the tubular electrode sub-assembly. The tubular electrode sub-assembly includes a tubular liner and an electrode embedded in the outer surface of the liner. In some embodiments, only a portion of the inner surface of the tubular liner is attached to the lead body which may potentially improve flexibility of the medical electrode lead in the area occupied by the tubular electrode sub-assembly.

Abstract: A method for using a cable assembly apparatus for coupling a connector to a cable having a base supporting an interface pedestal dimensioned to receive the connector; an inductor coil coupled to an inductor coil actuator operable to move the inductor coil between a load position and an operation position proximate the interface pedestal; a grip clamp operable by a clamp actuator to move between an open position and a closed position above the interface pedestal; and a temperature sensor configured to read a temperature proximate the interface pedestal. The method includes using the apparatus for retaining the pre-assembled connector and cable in an aligned orientation for controlled heating by the induction heater to heat a solder perform to solder the connector to an outer conductor of the cable.

Abstract: After melted enamel coating is discharged, a fusion process of electrical wire-to-wire connection is carried out inside a crimping connector. In the conductor connection method based on the fusion process, a plurality of enamel-coated conductor wires are inserted in the crimping connector prior to the start of the fusion process. Further, a temporary crimping process that provides the crimping connector a temporary crimping by mechanical pressurizing means is also performed. Addition of force at both end parts or either end part of the cross-section orthogonal to the axis of the above crimping connector may cause expansion, which needs to be suppressed with external force. At the same time, the cross-sectional areas corresponding to both end parts or either end part should preferably be as small as possible. The temporary crimping is applied to the crimping connector for this purpose.

Abstract: A method of manufacturing a surface acoustic wave device including a surface acoustic wave element and an electronic component on a package, the method including a component mounting step including mounting the electronic component on the package; an element mounting step including mounting the surface acoustic wave element on the package; an annealing step; a wire bonding step including wire bonding at least one of the electronic component and surface wave element to the package, the wire bonding step being performed after the annealing step.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector, the annular flare seat open to the connector end of the connector. An inner conductor cap is provided for interconnection with an inner conductor of the coaxial cable by ultrasonic welding. The ultrasonic welding of each of the inner and outer conductor interconnections may be performed via inner conductor and outer conductor sonotrodes which are coaxial with one another, without requiring the cable and or connector to be removed from their fixture.

Abstract: A coaxial connector in combination with a coaxial cable is provided with an inner conductor supported coaxial within an outer conductor, a polymer jacket surrounding the outer conductor. A unitary connector body with a bore is provided with an overbody surrounding an outer diameter of the connector body. The outer conductor is inserted within the bore. A molecular bond is formed between the outer conductor and the connector body and between the jacket and the overbody. An inner conductor end cap may also be provided coupled to the end of the inner conductor via a molecular bond.

Abstract: Methods for ultrasonically joining portions of a medical lead are provided. One method includes providing a conductor, a fitting and a coil electrode. The conductor has a distal portion that includes an inner conductive portion and an outer insulative portion. The fitting has a first cavity and a second cavity, the first cavity being sized and configured to receive the distal portion of the conductor and the second cavity being sized and configured to receive a portion of the coil electrode. The conductor is ultrasonically welded within the first opening, providing a mechanical and electrical attachment. The coil electrode is also electrically coupled to the fitting, providing an electrical pathway from the conductor to the coil electrode. Also provided are medical leads including ultrasonic bonds and other methods of ultrasonically joining portions of a medical lead.

Abstract: An electrical contact assembly has a plurality of formed elongate closed seam tubular elements attached to a carrier with each of the elongate tubular elements attached to the carrier via a tab. Scored creases are formed in the tabs for separating the elongate tubular elements from the assembly and scored creases are formed in the carrier for defining carrier strips. The carrier strip had a plurality of grouped elongate tubular elements. The electrical contact assembly is placed in a crimping die where at least one or more wires are inserting into selected elongate tubular elements. Pressure is applied to least one or more of the selected elongate tubular elements to produce bulk material deformation along a substantial portion of the elongate tubular elements to crimp the elongate tubular elements to the wires as electrical contacts.

Abstract: A method of manufacturing a temperature sensor unit comprising the steps of: providing the conductors in the sheath such that in a first zone a space is defined between the sheath and the conductors; providing the second insulating material in liquid form in the space; positioning the sensors in the space such that the conductors are provided closer to the centre of the sheath than the sensors; and soldering and/or welding the set of conductors to the set of terminals. A temperature sensor in which sets of conductors and one or more temperature sensors are arranged inside a sheath and with respect to each other such that the conductors are provided closer to the centre of the sheath than the temperature sensors.

Abstract: A monolithic, multi-layer heating element forms the high temperature tip of a glow plug assembly. The heating element includes a conductive core which is surrounded by an insulator layer, which in turn supports a resistive layer. An optional conductive jacket can surround the resistive layer. These layered components are pre-formed in prior operations and then assembled one into the other to form a precursor structure. The precursor structure is transferred to a die, where it is compressed to form a so-called green part having dimensional attributes proportional to the finished heating element. The individual layers remain substantially intact, with some boundary layer mixing possible to enhance material-to-material bonding. The green part is sintered to bond to various materials together into an essentially solid mass. Various finishing operations may be required, following which the heating element is assembled to form a glow plug.

Abstract: A method for manufacturing a single-wire anemometric probe, or an n-wire (n>1) probe, for making measurements near a surface, comprising, for at least one of the wires: a) positioning and holding of a straight portion of the wire, comprising a metal core surrounded by a protective sheath, on two surfaces; b) elimination of a part of the sheath, to expose an active wire measurement zone; and c) the wire is soldered on two pins of the probe body.

Abstract: A method for forming an electronic circuit disposes a plurality of magnets onto a flux plate to form a magnetic platen. A substrate package is formed using the magnetic platen and, stacked against the magnetic platen, a non-magnetic carrier and a substrate layer, with a bonding material sandwiched between the carrier and the substrate layer, and with the carrier layer disposed nearest the magnetic platen. A fused wafer stack is formed by heating the substrate package to adhere the substrate layer to the carrier. The fused wafer stack is removed from the magnetic platen and the circuit fabricated on the substrate layer.

Abstract: A method of fusing cables and a dead end assembly and a cable are provided. A joint assembly for fusing cables and a dead end fusing assembly for fusing a cable and a forge assembly are provided. The method includes cutting back strands of a cable, exposing the core; inserting the core of cables into a core grip; positioning the joint assembly over the core grip within certain marked sections of the cables; wrapping the joint assembly with one wrap of detonation cord; securing a detonator to the detonation cord explosive charge and detonating the detonator, such that the core grip fuses the cables together.

Abstract: A system for heating a subsurface formation is described. The system includes a plurality of elongated heaters located in a plurality of openings in the formation. At least two of the heaters are substantially parallel to each other for at least a portion of the lengths of the heaters. At least two of the heaters have first end portions in a first region of the formation and second end portions in a second region of the formation. A source of time-varying current is configured to apply time-varying current to at least two of the heaters. The first end portions of at least two heaters are configured to have substantially the same voltage applied to them. The second portions of at least two heaters are configured to have substantially the same voltage applied to them.

Abstract: A system for heating a subsurface formation is described. The system includes an elongated heater in an opening in the formation. The elongated heater includes two or more portions along the length of the heater that have different power outputs. At least one portion of the elongated heater includes at least one temperature limited portion with at least one selected temperature at which the portion provides a reduced heat output. The heater is configured to provide heat to the formation with the different power outputs. The heater is configured so that the heater heats one or more portions of the formation at one or more selected heating rates.

Abstract: A body housing supports a plurality of terminals, and an end of a flat cable that includes a conductor-exposed portion is disposed in the body housing. The cover housing is attached to the body housing, and holds the plurality of terminals and a plurality of conductors so as to be sandwiched between the body housing and the cover housing. The terminals are provided with a raised portion that is formed such that a portion of the terminals protrudes, and the plurality of terminals and the plurality of conductors in the conductor-exposed portion are respectively welded together by performing resistance welding with the terminals and the conductors abutting against each other via the raised portion. This enables welding to be performed with a small current with regard to resistance welding of the plurality of terminals of the flat cable connector and the plurality of conductors of the flat cable, thus reducing power consumption during welding, and can also achieve stable welding quality.

Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.

Abstract: A method for using a cable assembly apparatus for coupling a connector to a cable having a base supporting an interface pedestal dimensioned to receive the connector; an inductor coil coupled to an inductor coil actuator operable to move the inductor coil between a load position and an operation position proximate the interface pedestal; a grip clamp operable by a clamp actuator to move between an open position and a closed position above the interface pedestal; and a temperature sensor configured to read a temperature proximate the interface pedestal. The method includes using the apparatus for retaining the pre-assembled connector and cable in an aligned orientation for controlled heating by the induction heater to heat a solder preform to solder the connector to an outer conductor of the cable.

Abstract: According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

Abstract: A system for heating a subsurface formation is described. The system includes a first elongated heater in a first opening in the formation. The first elongated heater includes an exposed metal section in a portion of the first opening. The portion is below a layer of the formation to be heated. The exposed metal section is exposed to the formation. A second elongated heater is in a second opening in the formation. The second opening connects to the first opening at or near the portion of the first opening below the layer to be heated. At least a portion of an exposed metal section of the second elongated heater is electrically coupled to at least a portion of the exposed metal section of the first elongated heater in the portion of the first opening below the layer to be heated.

Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.

Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.

Abstract: Connecting elements and methods for the electrical connection between a light-weight metal conductor and an electrical contact, in particular for use in motor vehicles are disclosed. A metal sleeve is cold welded to the conductor. A contact element is connected to the metal sleeve in an electrically conductive manner and can be connected to the contact. A hardenable liquid seals, in a gas-tight manner, a contact element-side opening in the metal sleeve cold welded to the light-weight metal conductor.

Abstract: A method of making an electronic label including a chip (1) provided with two contact strips (2, 3) onto which a conducting wire (4) is welded in a single operation. The segment of conducting wire (4) forming the antenna is then cut between the two contact strips (2, 3) of chip (1). The group of chip and antenna thus realized may then be encapsulated between two sheets of a fibrous or plastic material.

Abstract: There is provided a method for manufacturing a recording apparatus which includes an actuator, a flexible flat cable connected to the actuator, and a circuit element mounted on the flexible flat cable, the method including: applying a conductive material for connection to the actuator and the circuit element, on terminal electrodes formed on one surface of the flexible flat cable; and forming bumps for joining the actuator to the terminal electrodes while joining the circuit element to the terminal electrodes. This makes it possible to mount the circuit element for preventing a malfunction of the recording apparatus, without any great increase in the number of manufacturing processes of the recording apparatus.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.