Abstract: A method of manufacture and a piezoelectric transducer are provided having a housing whose interior contains a piezoelectric element having radially spaced surfaces which undergo relative shear and produce an electrical signal in response thereto, an outer radial surface of the piezoelectric element being soldered to the interior of the housing, and an inner radial surface of the piezoelectric element is soldered to the outer surface of a stress/strain transmitting element. The solder alloy used shrinks less than →2.5% solidification. The subassembly made up of the piezoelectric element and the stress/strain transmitting element is provided with a passage to permit escape of gas from a chamber above the piezoelectric member which may be present from vapors attendant soldering.

Abstract: A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generated when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and including a lamination body as a component of the multilayer body.

Abstract: Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first apertures, and a second aperture. Each circuit trace overlies a first aperture, and an end of the circuit trace is near the second aperture. Solder balls are placed in each first aperture and fused to the overlying circuit trace. A die is placed in the second aperture. Each circuit trace may include a third aperture over the first aperture. Solder from the solder ball within the first aperture fills the overlying third aperture. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.

Abstract: So as to obtain a pin-form wire having a stable high-quality shape without being affected by the back tension in a bonding wire, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is move along a curved path has a shape of a bent wire to be formed after forming the pin-form wire by a wire bonding apparatus.

Abstract: A process for manufacturing electronic device packages includes a step of forming a metal sheet into a runner part and a plurality of spaced apart terminal parts. The runner part extends in a longitudinal direction. The terminal parts are connected to the runner part and are aligned in the longitudinal direction. Each of the terminal parts includes a pair of spaced apart connecting legs that have lower inserting sections connected to the runner part, and upper soldering sections which extend from the lower inserting sections and which are offset from each other in a transverse direction relative to the longitudinal direction so as to define an inserting gap therebetween. The process further includes the steps of positioning an electronic element in the gap in each terminal part, and respectively connecting the upper soldering sections to two opposite side faces of the electronic element.

Abstract: To stabilize the form of a letter S of an inner lead after bonding in a method of manufacturing &mgr;BGA·IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead, when the inner lead is bonded to the electrode pad, first, the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the tape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. Afterward, the center line of the inner lead is recognized, the inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Abstract: A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.

Abstract: Apparatus and systems for cooling heat sinks, integrated circuit boards, and electronic components by providing internal passageways in the heat sinks, circuit boards, and electronic components that connect to a fluid manifold. The internal passageways connect to the surface of the heat sinks, circuit boards and electronic components. A cooling fluid capable of phase change is supplied to the internal passageways to conductively cool the interior of the heat sink, circuit board, and component and to cool the surface of the heat sink, circuit board, and/or component at least partially by evaporative cooling. A plurality of circuit boards, components, and/or heat sinks may be placed back to back with the fluid manifold therebetween. The heat sinks, circuit boards, and/or components are in an enclosed space so that cooling fluid can be contained, condensed and recycled to the fluid manifold.

Abstract: A method for removing a braiding layer of a coaxial cable which includes a core conductor; a layer of insulator coated over the core conductor; a layer of braiding layer encapsulated the insulator; and 4) an outer insulator, comprises the steps of a) removing a section of the outer insulator to expose a section of the braiding layer; b) dipping the section of the braiding layer into a solder bath such that the braiding layer is coated with a layer of solder to form a consolidated section; c) scoring a cut along traverse section of the consolidated section and dividing the consolidated section into first and second portions; d) bending the consolidated section along the cut to break the first and second portions; and e) removing the first portion and exposing the inner insulator.

Abstract: The present invention provides a method of forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. Generally and according to one embodiment, the method includes providing the contact along with a solder-holding clip having a body with an opening. The body has a solder-holding conformation adjacent the opening and a solder mass is held by the conformation. The contact is then positioned proximate to the body opening and heat is applied to the solder mass causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball being formed on the portion of the contact. Subsequent to forming the solder ball, the solder-holding clip is separated from the contact leaving a contact with a solder ball affixed thereto.

Abstract: The present invention provides a safety guard for a type-N coaxial connector that prevents casual human contact with a conductive center pin of the coaxial cable. The safety guard is preferably made of a dielectric material and is generally tubular in shape. The safety guard is adapted to be installed on existing connectors in the field, or to be part of a connector assembly that is to be installed on a coaxial cable. Among the advantages of the present invention are substantial reduction in complexity over prior art interlock connector designs. The safety guard of the present invention is provided for a male connector only, thereby alleviating the need for modification of the mating female connector.

Abstract: A method for forming a head gimbal assembly in which the head gimbal assembly and a frame are formed from a continuous piece of laminated material comprised of a first layer, a second layer and a third layer. A plurality of electrical lines are formed in the third layer of the head gimbal assembly and a plurality of electrical line extensions are formed in the third layer of the frame. The slider is positioned at an angle to the frame and a plurality of termination pads on the slider are bonded to the electrical lines. The frame is partially separated from the head gimbal assembly and the relative position of the slider to the head gimbal assembly is changed by an amount sufficient to separate the plurality of electrical lines from the plurality of electrical line extensions.

Abstract: A tool for removing ball grid array (BGA) packaged integrated circuit or multi-chip modules from printed circuit boards is comprised of a two-tined fork with a heated wire stretched between the tips of the tines and a thin sheet of material filling the area between the tines.

Abstract: A conductive ball mounting equipment for mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate, including a suction tool having a suction face to cover each one of divided blocks on the substrate, a suction part which is formed on the suction face of the suction tool, corresponding to the arrangement pitches of the electronic components and sucks the conductive balls to the positions corresponding to the electrodes, and a suction limiter for sucking the conductive balls only to the specified suction part corresponding to the electronic components in the divided blocks. According to this construction, the conductive balls can be efficiently and stably mounted on the electrodes of the electronic components of the substrate.

Abstract: A solder bonding method comprises the step of solder bonding a first electrode 30 to a second electrode 16 having a solder bump 18 of mainly Sn formed on the upper surface thereof. The first electrode 30 and/or the second electrode 16 includes metal layers 14, 26 formed of an alloy layer containing Ni and P, an alloy layer containing Ni and B, or an alloy layer containing N, W and P. The metal layer of the alloy layer containing impurities, such as P, etc. can prevent the Ni of the metal layer from combining with the Sn in the solder bump. Accordingly, good bonded states can be obtained.

Abstract: In a method of repairing a solar panel having a defective solar cell array, a solar cell replacement array is glued onto a defective solar cell array of the solar panel and is electrically integrated in the solar panel.

Abstract: A method is provided for establishing an electrical connection between at least one connecting piece of a workpiece and at least one wire. Firstly the end of the at least one wire is prepared. Then the prepared end of the at least one wire is positioned on the terminal or connecting piece of the workpiece. Thereafter the at least one connecting piece and the prepared end of the at least one wire are welded together by laser radiation.

Abstract: A method is provided for establishing an electrical connection between at least one connecting piece of a workpiece and at least one wire. Firstly the end of the at least one wire is prepared. Then the prepared end of the at least one wire is positioned on the terminal or connecting piece of the workpiece. Thereafter the at least one connecting piece and the prepared end of the at least one wire are welded together by laser radiation.

Abstract: A method is provided for establishing an electrical connection between at least one connecting piece of a workpiece and at least one wire. Firstly the end of the at least one wire is prepared. Then the prepared end of the at least one wire is positioned on the terminal or connecting piece of the workpiece. Thereafter the at least one connecting piece and the prepared end of the at least one wire are welded together by laser radiation.

Abstract: A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact surface and subsequently leading it to the second contact surface, bonding it to the latter, and subsequently separating it using the wire-bonding tool.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Abstract: An implantable medical electrical lead is made by forming a generally radially directed bore extending between each lumen of an elongated lead body having a plurality of internal longitudinally extending, circumferentially spaced lumina, the bores being located at longitudinally and circumferentially spaced locations, then drawing an elongated conductor cable into and through each lumen of the lead body such that a terminal end thereof projects through and beyond an associated one of the bores. A metallic tube is slidably attached onto each conductor cable adjacent the cable's terminal end, then is firmly joined to its associated conductor cable. Thereupon, each metallic tube is affixed, as by welding, preferably, by laser welding, to an associated one of a plurality of tubular electrodes coaxial with, and overlying, the lead body at longitudinally spaced locations. In one instance, the tubular electrode may be a ring electrode with the lead body connected to a pacemaker.

Abstract: The invention relates to a device for metal welding, comprising a shielding element (1) which allows visual monitoring of the working process but protects the eyes from light radiation. The device comprises a video camera (5) which is directable towards the welding zone for recording the welding process in the form of video signals transmitted, via an image processing unit, to a video display unit (7), which the user is able to view and which is placed in or on the inside of the shielding element (1). The image processing unit reads process data from the video signals and presents the same via the video display unit.

Abstract: Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with the same column and row spacing as the original probes and using the same height as the original probes.

Abstract: An improved Hall position sensor comprises a Hall effect sensing device having its leads soldered directly to an exposed electro-conductive portion of a flexible multiconductor circuit. The Hall position sensor further comprises a Hall magnet disposed proximate to the soldered Hall effect sensing device/flexible circuit unit.

Abstract: A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

Abstract: A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

Abstract: A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract: An apparatus and method for laser stripping coated cables for endocardial defibrillation leads comprising a jig for holding at least one insulated wire, the jig having a base plate, a linear stripping area on the plate, a first clasp mounted on the plate for holding a first end of the wire, at least two primary pins mounted on the plate on a first side of the linear stripping area, at least one secondary pin mounted on the plate on a second side of the linear stripping area, and a second clasp mounted on the plate for holding a second end of the wire; and a laser effective to remove insulation from the insulated wire, the laser being mounted to effectively remove insulation in the linear stripping area.

Abstract: A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape.

Abstract: A connecting structure of covered wires is provided. A ground wire 2 is overlaid by a shield wire 1 such that the wires cross each other. Respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1,2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper resin tip 13 isS provided, on a periphery of the butt face, with a projection 13b. One the other hand, the lower resin tip 14 has a recess 14b formed on a periphery of the butt face, for engagement with the projection 13b. Owing to the provision of the projection 13b and the recess 14b, it is possible to exclude a possibility that the upper resin tip 13 deviates from the lower resin tip 14 during the ultrasonic oscillation.

Abstract: A method of making an electrical connector includes the steps of: a. stamping and forming a contact strip (10) and a number of contacts (12) on the contact strip; b. defining a recess (16) in a tail (14) of each contact; c. applying a first finish of nickel material on portions of the contact having the recesses followed by a second finish of tin-lead alloy material; d. injection molding an insulative housing (20) to the contacts; e. bending the tails outwardly; f. severing the contact strip from the contacts at the recesses.

Abstract: The generator comprises a polyphase stator coil 5 having a lead conductor 19 wound and inserted into a stator core 4, a rotor 6 having rotor cores 8 and 9 for forming magnetic poles, a front bracket 1 and a rear bracket 2 for holding a stator 3 and rotatably supporting the rotor 6, and a commutator 17 which is mounted in this rear bracket 2 and to which a metal terminal 20 bonded to the lead conductor 19 of the stator coil 5 is connected, and it is configured so that bonding between the lead conductor 19 and the metal terminal 20 is fixed by caulking with bonding pieces 20a and 20b provided in the metal terminal 20 embracing the end of the lead conductor 19 from both sides and spacing between the bonding pieces 20a and 20b embracing from both of these sides is bonded and fixed by arc welding.

Abstract: Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of the through-hole upper lands; solder and solder paste are then melted by heating, causing them to flow into the through-holes and to wet and spread out upon the through-hole bottom face lands, thereby effecting a soldered joint with the BGA-side pads and through-hole upper lands securely attached, and forming solder fillets. In this way, the quality of the solder joints can be ascertained by an ordinary external inspection method.

Abstract: Process for producing a middle electrode with precious metal reinforcement, a middle electrode being used with an ignition tipwhich is tapered relative to the middle electrode body, such that a precious metal wire with a cross section which corresponds to the tapered ignition tip is welded flat onto the tapered ignition tipand such that this precious metal wire is cut off at the desired height, with a sharp edge.

Abstract: A method for manufacturing a connecting structure for covered wires is provided at first, a shield wire (1) and a ground wire (2) are prepared. After overlapping the ground wire (2) on the shield wire 1 across each other, respective overlapping portions of the wires (1, 2) are interposed between an upper resin tip (13) and a lower resin tip (14). Next, the upper and lower resin tips (13, 14) are oscillated with ultrasonic waves while compressing the upper and lower resin tips (13, 14) from the outside. Consequently, respective outside rinds (1d, 2b) of the wires (1, 2) are molten for removal, so that a braided wire (1c) comes into electrical contact with a core line (2a) the upper resin tip (13) is provided, on its butt face, with a stopper (13b) for defining the position of a leading end of the ground wire (2), while the lower resin tip (14) is provided, on its butt face, with a recess (14b) for receiving the stopper (13b).

Abstract: A linkage terminal for a joint connector is provided by stacking two terminal elements, welding their carriers intermittently, and cutting the carriers corresponding to the number of unit accommodation grooves of a corresponding housing.

Abstract: Terminals of a plurality of types of components to be mounted on a circuit board are provided beforehand with a joining material corresponding to the type of component. A basic joining material is applied to the circuit board all at one time. The basic joining material is commonly usable for joining all of the types of components to the circuit board. An individual joining material is applied to certain locations on the circuit board, to which locations components of a particular type are to be mounted. The individual joining material matches properties of the joining material provided beforehand to the components of the particular type. The second step may be performed before the first step to yield the same results.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.

Abstract: So as to obtain a stable high-quality shape without being affected by the back tension in a bonding wire, after forming a pin-form wire by a wire bonding apparatus, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is moved along a curved path that has a shape of a bent wire to be formed.

Abstract: Crimp pieces (21) of a metal terminal and a conductor wire placed on an inner side of the crimp pieces are positioned between a crimp indenter (11) and a crimp anvil (18). Then, at least one of the crimp indenter (11) and the crimp anvil (18) is moved toward another one thereof along a direction of a longitudinal center axis (12) to crimp the crimp pieces (21). At least two arch-shaped portions (13) are disposed on an inner surface of the crimp indenter (11), and are adjacent to each other and symmetric with respect to a plane including the longitudinal center axis (12). A sharply pointed portion (14) is defined by curves of the at least two arch-shaped portions (13) intersecting on the longitudinal center axis (12). Curvature of each of the curves is set to be greater toward the sharply pointed portion (14).

Abstract: An arcing fault detection circuit breaker (10) with strain relieved electrical tap comprises an electronic trip unit (68) to detect arcing from line (30) to neutral (80). Arcing is detected by measuring the voltage drop across a bimetal (32). Voltage drop across the bimetal (32) is sensed by a twisted pair conductor (62), which is electrically connected across the bimetal (32). The bimetal (32) has a fixed end (34) and an opposing free end (54), which is free to move. A strain relief element in the form of stepped eyelet (92) is used to affix one conductor (64) of the twisted pair conductor (62) to the bimetal (32) so that the conductor (64) remains affixed to the free end (54) of the bimetal (32) during movement of the bimetal (32).

Abstract: A method of producing an electrically conductive connection by laser radiation includes providing a connecting wire of a material with a higher melting temperature providing a connecting carrier of a material with a lower melting temperature, joining the connecting wire with the connecting carrier without an additional material, melting the connecting carrier with a lower melting temperature, and melting the connecting wire with a higher melting temperature on an outer surface.

Abstract: The invention relates to a method for the manufacture of a prefabricated motor vehicle door module and is directed to improving the manufacturing efficiency of complex technical systems with extensive cabling. The method for manufacturing the prefabricated motor vehicle door module with an electronics unit and several electrical components, such as a window regulator motor, central locking, mirror adjustment and heating, switches, lights, speakers, and a side bag, comprises fitting out of a support plate with the electrical components provided for a specific vehicle door and the cabling of the door by means of electrical leads; wherein the fitting out step is carried out in a main assembly line; wherein at least a part of the electrical leads is prefabricated as individual lead connections in a secondary cable production line in accurate sequence for the door module production in a production device and are mounted independently of each other directly on the door module in a main assembly line.

Abstract: A flexible electric heater comprises a heat resistant support (4) of sheet or tape form having at least one electrical resistance heating element (1) secured thereto. The at least one heating element comprises a ribbon (2) of electrical resistance material provided with a plurality of integral tabs (3). The tabs have been pressed through the support to secure the heating element to the support. The support (4) is flexible and comprises a woven fabric material, such as woven glass fabric or woven ceramic fabric, or a non-fibrous material, such as flexible mica.

Abstract: A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

Abstract: A wire connecting structure of a connector comprises a connector housing, a terminal holding portion protruding from an end of the connector housing, terminal incorporating holes which are provided in the terminal holding portion and communicate with the connector housing, terminals disposed within the terminal incorporating holes, covered wires placed on the terminals, and upper hole wall portions which are provided in the terminal holding portion to define upper portions of the terminal incorporating holes and when pressed, subside into the terminal incorporating holes so as to contact the covered wires, core elements of the covered wire and the terminal being subjected to ultrasonic vibration through the upper hole wall portion which is pressed so as to contact the covered wire, so that the core elements and the terminal are conductively contacted with each other, the upper hole wall portion being settled by fusion in each of the terminal incorporating holes by the ultrasonic vibration.