Abstract: A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can flow. Adjacent ends of the strands are received in an interior cavity of the coupling through an opening in the coupling. A joining material is provided on a first portion of the stator bar within the coupling opening and adjacent the ends of the strands. The first portion is heated to melt the joining material. At essentially the same time, a second portion of the stator bar outside the coupling is also heated. Once the joining material is suitably molten, the first portion is allowed to cool while the second portion remains heated, thereby causing the joining material nearest the ends of the strands to solidify first.

Abstract: A method of terminating at least one conductor of a superconducting cable comprising a plurality of superconducting tapes, comprising the steps of associating an electrically conductive connector radially at the at least one conductor, embedding and end of the superconducting tapes in a thermosetting resin, embedding an end portion of the superconducting tapes in a solder and achieving an electric contact by the solder. Moreover, the invention relates to a terminated conductor of a superconducting cable, a superconducting cable, a joint between conductors of two superconducting cables, a current transmission/distribution network, and a terminator for at least one conductor of a superconducting cable that embody the above method.

Abstract: A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of a winding object by arc welding can be securely carried out. A stripping section strips an insulating coating off from the portions of the wire at the front and rear ends of the coil while the wire is wound around the winding object with the portions of the wire being bound to the terminal. Each portion of the wire, the insulating coating of which is stripped off, bound to the terminal is electrically connected to the terminal by arc welding.

Abstract: A method is provided of connecting wires of a wiring harness to a junction box to form branch circuits. An electrical conductor material is formed in parallel strips in a Y-axis direction on one surface of an insulator board, and wires are arranged in an X-axis direction on the other side of the insulator board. A circuit assembly is formed by connecting the exposed cores of one end of the wires to the conductor material through openings provided in the insulator board. Connector terminals are installed at the other end of the wires that extend outward and away from the insulator board. Groups of wires are gathered and placed in same connectors in which joint terminals are provided. The wires are joined to the connectors to form multiple wire harnesses. The aforesaid circuit assembly is then installed within an upper and lower case assembly provided with lateral openings through which the wire harness can pass.

Abstract: A coaxial cable structure includes an outer cable conductor, and an angle connector, for example a 90° elbow connector, disposed on one cable end. The elbow connector is implemented by encapsulating the one cable end with thermoplastic material and including a metal sleeve which is placed in contact with the outer cable conductor to define an outer conductor of the elbow connector.

Abstract: A green ceramic heater including a green heating resistor formed of an electrically conductive ceramic (e.g., silicide or carbide of a metal element such as W, Ta, or Nb) and an insulative ceramic (e.g., silicon nitride) and power supply leads (e.g., made of W), a first end of each power supply lead being connected to a corresponding end of the green heating resistor, the green heating resistor and the power supply leads buried in a green substrate formed of a material (e.g., silicon nitride) is fired, and subsequently, the resultant ceramic heater is heat-treated at 900 to 1,600° C., to thereby enhance flexural strength of the ceramic heater. The heat treatment is preferably carried out prior to forming a glass layer on an outer circumferential surface of the ceramic heater.

Abstract: A copper plate 2 is mounted on a titanium electrode element 1 by spot welding, and a lead wire 3a is attached to the copper plate 2 by solder 4.

Abstract: A wheel speed sensor has a detection element having at least one lead for detecting a wheel speed, at least one terminal portion connected to the lead of the detection element, a holder portion having a detection element fitting portion fitting the detection element therein and a terminal portion fitting portion fitting the terminal portion therein, and a resin sealed portion sealing the holder portion in a state the detection element and the terminal portion connected with an electric wire are held in the holder portion. The detection element fitting portion and the terminal portion fitting portion are disposed such that the lead of the detection element is brought into abutment with or proximity to a predetermined location of the terminal portion when the detection element and the terminal portion are fitted in the detection element fitting portion and the terminal portion fitting portion, respectively.

Abstract: A method for providing electrical signal transmission and a secure mechanical attachment in a flexible circuit assembly. The inventive mechanism combines the electrical features of discrete wiring with the mechanical features of etched pads connected to plated vias on flex circuits in order to achieve robustness in both the mechanical and electrical properties. A discrete wire is preferably securely bonded to a conductive pad which pad is then securely attached to a plated via. In this manner, the sequence of connections is made mechanically secure by either ultrasonically bonding or welding the discrete wire to the pad and employing the traditionally robust connection between the pad and the via. The arrangement achieves high quality electrical signal transmission by employing discrete wiring for signal transmission along any path of significant length.

Abstract: An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.

Abstract: In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract: A method for conductively connecting first and second electrical conductors is described which consist of different materials. In carrying out the method the ends of the first and second conductors are brought into mechanical contact with each other in an overlapping position. The first and second conductors then are connected to each other by welding without feeding of additional welding material. Finally the overlapping area is formed mechanically to achieve a smooth width transition between the first and second conductors.

Abstract: In the case of a small-sized motor of the present invention, a printed board to which an electric circuit including an electric element is attached is mounted on a case cover. The printed board has a soldering part to be connected to a member attached to an interior of the case cover for being connected to an electric power source supplied from an outside and a soldering part to be connected to a projection in a notch provided on an opening part side of the metal case to body-earth the electric circuit. In the soldering part for the body-earthing, at the time of assembling the motor, after fitting the case cover to the metal case opening part, a pair of electrodes are brought into contact from an outside of the metal case near the soldering part, to weld the soldering part by a principle of the electric resistance welding.

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Abstract: A method for assembling an electrical bobbin requires a spool of wire extending between first and second leads, a housing having first and second opening, and first and second terminal posts, each having a predetermined width. The method includes the step of placing the spool of wire into the housing. The first lead is then extended through the first opening. Like the first lead, the second lead is then extended through the second opening. The first terminal post is extended into the first opening and the second terminal post is extended into the second opening. The first lead is wrapped around the first terminal post to create a first wire wrap. The second lead is wrapped around the second terminal post to create a second wire wrap. The first wire wrap is soldered to the first terminal post. The second wire wrap is soldered to the second terminal post.

Abstract: A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A coated lead wire can be solidly connected to a terminal of a coil bobbin by placing the terminal entwined with the coated lead wire into between electrodes having heating portions, and supplying electric current to the electrodes to heat the terminal entwined with the coated lead wire along with solder to melt the solder and burn off a coating layer of the coated lead wire while exerting pressure against to the terminal entwined with the coated lead wire, and directing a blow of inert gas toward the terminal entwined with the coated lead wire between the electrodes. The coating layer carbonized as the result of being burned out by heating up the electrodes can be blown out without being mixed into the molten solder, consequently to add strength to the connection between the lead wire and the terminal, to thereby form a reliable and firm connection between the lead wire and the terminal with ease.

Abstract: A method of making an implantable electrode array, adapted for insertion into a cochlea, includes the steps of: (a) forming electrode contact pieces made from a precious, biocompatible material into a desired shape; (b) attaching the electrode contact pieces to a foil sheet made from a non-toxic but chemically-active metal; (c) connecting a wiring system to the metal contact pieces; (d) molding a flexible polymer carrier around the electrode contact pieces and wiring system while such are held in place by the foil sheet; and (e) etching away the foil sheet, leaving the electrode contact pieces exposed at a surface of the molded polymer carrier. The exposed electrode contacts are made so as to have a shape, geometry, or makeup that aids in controlling the current flow and current density associated with the electrode contact as a function of position on the electrode contact.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads.

Abstract: The method makes it possible to form a stator of an electric motor by means of a multiple-slide press (21, 22, 23). The starting point is a bundle consisting of rectilinear segments of sheets obtained by stamping and welded. The stator is formed by means of four successive operations carried out by four groups of slides of a multiple-slide press and corresponding dies. The cylinder formed is subsequently welded along its joining generatrix and is calibrated in a hydraulic press.

Abstract: A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads.

Abstract: A power adapter is shown for use on injection molding runner nozzles. The power adapter provides for quick and easy installation (and removal) of thick film resistance heaters on the runner nozzles, without the need for rewiring. The power adapter comprises a series of rings that allow insertion of the terminal end of the heater, which is then rotated into a locked position. One of the rings contains contacts which are at least semi-permanently wired to a power source. To facilitate the power adapter, a novel method terminating the heating element is used. A noble-metal-based bonding agent (such a silver-base ink) is applied to the heating element and/or terminal plate. The terminal plate is then affixed to the heating element and the bonding agent is fired.

Abstract: A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can flow. Adjacent ends of the strands are received in an interior cavity of the coupling through an opening in the coupling. A joining material is provided on a first portion of the stator bar within the coupling opening and adjacent the ends of the strands. The first portion is heated to melt the joining material. At essentially the same time, a second portion of the stator bar outside the coupling is also heated. Once the joining material is suitably molten, the first portion is allowed to cool while the second portion remains heated, thereby causing the joining material nearest the ends of the strands to solidify first.

Abstract: A method of manufacturing an electronic component unit comprises the steps of forming a conductive pattern on a surface of a substrate, roughening a surface of a connecting area of said conductive pattern, printing an adhesive on the connecting area, connecting an electrode of an electronic component to the electroconductive adhesive on the connecting area, and drawing the adhesive at a temperature of 50-120° C.

Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Abstract: A method for assembling an electrical bobbin requires a spool of wire extending between first and second leads, a housing having first and second opening, and first and second terminal posts, each having a predetermined width. The method includes the step of placing the spool of wire into the housing. The first lead is then extended through the first opening. Like the first lead, the second lead is then extended through the second opening. The first terminal post is extended into the first opening and the second terminal post is extended into the second opening. The first lead is wrapped around the first terminal post to create a first wire wrap. The second lead is wrapped around the second terminal post to create a second wire wrap. The first wire wrap is soldered to the first terminal post. The second wire wrap is soldered to the second terminal post.

Abstract: A connector device is shaped or formed to include bendable flaps for securing one or more conductors when the flaps are crimped. Typically, the connector device includes a base having an external surface that is eventually affixed to a complementary shaped surface. Accordingly, a conductor can be attached to the complementary shaped surface. For example, one or more conductors can be crimped via the connector device, which is thereafter attached to a complementary surface.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations, wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: An electrical connector (1) having a cover (5) mounted thereon is disclosed in accordance with the present invention. The connector includes a connector body (2) defining a passageway (20) in a mounting surface (202) with a contact (3) received therein. The contact has a tail portion (304) adapted to be electrically connected to a circuit substrate (6). The cover has a pair of legs (52) extending into the passageway and forming an opening (524) adjacent to the mounting surface of the connector body. The tail portion of the contact terminates in the opening. A fusible element (4) has a portion disposed in the opening and fused to the tail portion of the contact.

Abstract: A wheel speed sensor has a detection element having at least one lead for detecting a wheel speed, at least one terminal portion connected to the lead of the detection element, a holder portion having a detection element fitting portion fitting the detection element therein and a terminal portion fitting portion fitting the terminal portion therein, and a resin sealed portion sealing the holder portion in a state the detection element and the terminal portion connected with an electric wire are held in the holder portion. The detection element fitting portion and the terminal portion fitting portion are disposed such that the lead of the detection element is brought into abutment with or proximity to a predetermined location of the terminal portion when the detection element and the terminal portion are fitted in the detection element fitting portion and the terminal portion fitting portion, respectively.

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: Coupling sleeve with a generally cylindrical shape designed for connection between a mineral-insulated coaxial cable and a matching device which is itself coaxial. The sleeve protects a first contact and directly provides a second contact between two ends respectively of the cable and of the matching device. The sleeve is preferably designed with an aperture to enable filling after final assembly. The filling is done with insulating materials. After filling, the aperture is plugged. Preferably, the sleeve is soldered respectively to the second contact of the cable and to the second contact of the matching device.

Abstract: System for providing an open-cavity semiconductor package. The system includes a method for wire bonding a finger sensor die to an external circuit. The finger sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire, forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height, and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.

Abstract: The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.

Abstract: A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member against the upper surface of the land portion by a first electrode tool, heating the first electrode tool to expose a part of the lead wire, and applying an electric current between the first electrode and a second electrode tool so that resistance welding is effected between the cover member and the lead wire and between the lead wire and the land portion.

Abstract: A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: The method makes it possible to form a stator of an electric motor by means of a multiple-slide press (21, 22, 23). The starting point is a bundle consisting of rectilinear segments of sheets obtained by stamping and welded. The stator is formed by means of four successive operations carried out by four groups of slides of a multiple-slide press and corresponding dies. The cylinder formed is subsequently welded along its joining generatrix and is calibrated in a hydraulic press.

Abstract: A method of constructing a mapping catheter is described where the catheter has numerous electrodes each associated with a single connection in a plug. The method consists of first arranging a plurality of wires in the desired relationship, with each of the wires running to a connection in a plug. Next, a single electrode is formed on each wire. Because it is often difficult to associate a particular connection with a particular plug, an electrical signal is then applied to a single one of the wires. The electrical signal can be applied to the connection or to the electrode. The electrical signal is then found among by examining either the electrodes or the connections, depending on which where the electrical signal was applied. Once the electrical signal is discovered, a map can be made between the connections and the electrodes.

Abstract: A method of manufacturing an electrode array has an elongate flexible carrier that is much more flexible in a first direction than in a second direction orthogonal thereto. The elongate flexible carrier is formed with a bias force that causes the array to flex in the first direction so as to assume the general spiral or circular shape of the scala tympani duct within the cochlea. The less-flexible direction is the direction that makes it difficult for the array to twist as it is inserted within the scala tympani duct. The bias force is sufficiently strong to cause the array to assume its preformed spiral shape even after being straightened during initial insertion into the cochlea. Electrode contacts, embedded into the carrier so as to be exposed along an inner or concave surface of the spiral, thus wrap snugly around the modiolus, thereby positioning the electrode contacts against the modiolar wall in an optimum position for stimulation.

Abstract: A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of a winding object by arc welding can be securely carried out. A stripping section strips an insulating coating off from the portions of the wire at the front and rear ends of the coil while the wire is wound around the winding object with the portions of the wire being bound to the terminal. Each portion of the wire, the insulating coating of which is stripped off, bound to the terminal is electrically connected to the terminal by arc welding.

Abstract: Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.

Abstract: An electric motor having an integrally formed bonding apparatus that allows an installer to quickly and efficiently bond the electric motor to a bonding grid of a bonding area. A fastener having a head is inserted into an aperture of the housing of the electric motor such that a bonding conductor is captured between the housing and the head. The bonding conductor is electrically coupled to the housing via direct contact between the bonding conductor and the housing and/or via indirect contact through the fastener. An integrally formed surface of the housing prevents the bonding conductor from moving out from under the head.

Abstract: A feedthrough device and brazing process for joining the constituent parts of the feedthrough device, while allowing a lead to pass therethrough in a nonconductive manner. The feedthrough comprises at least one lead, a ferrule defining a capacitor recess and defining an insulator recess, an insulator disposed in the insulator recess of the ferrule, the insulator defining a passageway sized to allow the lead to pass therethrough. The feedthrough further comprises a capacitor disposed in the capacitor recess and defining a capacitor passageway sized to allow the lead to pass threrethrough, and the capacitor comprises first and second sets of plates, wherein the first set of plates is conductively coupled to the ferrule and the second set of plates is conductively coupled to the lead. Brazing is a two step process wherein the braze joints between the insulator and the lead and between the insulator and ferrule are formed first at a first temperature using an insulator braze material.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.