Abstract: A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Abstract: The present invention relates to a method of properly connecting respective shields in a plurality of extra fine coaxial wires via a common conductive member. The plurality of coaxial wires having the shields that are partially exposed is arranged in parallel. A metal adhesive material is placed on the respective shields in the coaxial wires and is melted by being irradiated with laser light. Then, the respective shields are connected electrically via the common conductive member when the common conductive member is placed on the melted metal adhesive material.

Abstract: A method for repairing a damaged probe from a probe card comprising the steps of removing the damaged probe from the probe card, separating one a plurality of replacement probes from a substrate and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed.

Abstract: A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.

Abstract: A method of repairing a used electrode device 1 is disclosed wherein the method has the steps of providing a used electrode assembly 1 having an inner conductor 9 with an integral electrode tip 3 encapsulated in an insulator body 8 having an outer conductor 10 and an outer electrode tip 4C; and pressing the inner conductor 9 with integral electrode tip 3 while holding or restraining the insulator body 8 to apply an force sufficient to overcome at least partially the adhesion forces at the mating surfaces of the inner conductor 9 and the insulator body 8. Thereafter by grasping an end 9A of the inner conductor 9 opposite the tip 3 while holding the insulator body 8 and withdrawing the inner conductor 9 from the insulator body 8 the parts can be separated.

Abstract: After bringing a conductor of an electric wire into press contact to connect with a wire caulking portion of a connection terminal, the conductor and the wire caulking portion are welded to connect by irradiating laser beam to a bottom wall of the wire caulking portion. Laser irradiation is carried out intermittently by three times and the laser irradiation at the second time and thereafter which is carried out later is carried out such that during a time period in which a laser welded portion immediately previously is brought into a predetermined state of elevating temperature, portions or welded regions overlap welded regions in laser irradiation irradiated previously.

Abstract: A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position.

Abstract: The invention relates to a holder for an electric lamp (1, 1?) with contact pins (7, 8; 7?, 8?) extending to the outside for making electrical contact with the lamp (1, 1?), wherein the contact pins (7, 8; 7?, 8?) at least in some regions are coated with a layer (11) that is electrically conductive and/or that protects the contact pins (7, 8; 7?, 8?) from corrosion. The invention also relates to a method for the production of a holder for an electric lamp.

Abstract: A method for attaching a proximity probe offset to an axis defining an extension cable. The method includes a sensing element; a cylindrical part molded with a moldable material; a recess configured in one of two opposing ends defining the cylindrical part to receive the sensing element; a first and a second ferrule each extending from opposing surfaces defining an exterior of the cylindrical part, a first axis defining the first and second ferrules being offset from a second axis defining the cylindrical part; and an extension cable operably attached to the sensing element via the first and second ferrules, the sensing element being disposed offset relative to the extension cable.

Abstract: A cable with a crimping terminal includes a cable including a conductor and an insulator including a plastic material, and the crimping terminal bonded to the conductor of the cable at a crimping portion by crimping connection. The conductor of the cable is bonded to the crimping terminal by a metallic bonding material at a crimping portion, and the metallic bonding material includes silver as a main component.

Abstract: Methods for ultrasonically joining portions of a medical lead are provided. One method includes providing a conductor, a fitting and a coil electrode. The conductor has a distal portion that includes an inner conductive portion and an outer insulative portion. The fitting has a first cavity and a second cavity, the first cavity being sized and configured to receive the distal portion of the conductor and the second cavity being sized and configured to receive a portion of the coil electrode. The conductor is ultrasonically welded within the first opening, providing a mechanical and electrical attachment. The coil electrode is also electrically coupled to the fitting, providing an electrical pathway from the conductor to the coil electrode. Also provided are medical leads including ultrasonic bonds and other methods of ultrasonically joining portions of a medical lead.

Abstract: A method to produce a transponder comprises the steps of positioning a coil comprising at least one coil end in a predetermined coil position and holding all of said coil ends in a respective holding position, and holding a chip comprising at least one contact pad in a chip fixture so that all of said coil ends of the coil that should be bonded to said chip are located on one side of corresponding contact pads of the chip, and bonding of the coil ends to the contact pads.

Abstract: A monolithic, multi-layer heating element forms the high temperature tip of a glow plug assembly. The heating element includes a conductive core which is surrounded by an insulator layer, which in turn supports a resistive layer. An optional conductive jacket can surround the resistive layer. These layered components are pre-formed in prior operations and then assembled one into the other to form a precursor structure. The precursor structure is transferred to a die, where it is compressed to form a so-called green part having dimensional attributes proportional to the finished heating element. The individual layers remain substantially intact, with some boundary layer mixing possible to enhance material-to-material bonding. The green part is sintered to bond to various materials together into an essentially solid mass. Various finishing operations may be required, following which the heating element is assembled to form a glow plug.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads.

Abstract: Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).

Abstract: A method is provided for producing an electrically conductive connection between a contact element interacting with a corresponding counter-contact and several electric lines, each of which consists of several wires. The method consists of placing the lines on a contact element supporting surface, controlling the lines integrity, and fixing the lines to the contact elements by resistance welding. In particular, the contact element is provided with crimping elements which surround and/or form a ground cable terminal screwed to a mass bolt.

Abstract: A manufacturing method that includes the steps of forming an actuator unit, disposing a metallic bond and a thermosetting resin; pressing the land and the terminal; and heating the metallic bond and the thermosetting resin so that the land and the terminal are electrically connected to each other with the metallic bond being disposed in at least one of a region between the land and the terminal and a region extending over the land and the terminal along the peripheries of the land and the terminal, and a protrusion made of the thermosetting resin is formed at least in the connecting portion between the main electrode portion and the land.

Abstract: A termination for a multi-conductor cable is made by providing a metal structure that includes a plurality of parallel but spaced apart fingers that are joined together by a connecting member adjacent at least one end of each finger. Each of the conductors in the cable is connected to a respective one of the fingers at a location that is spaced from the connecting member. The cable and the fingers are then over-molded with an insulating material where the conductors are connected to the fingers. This over-molding leaves a portion of the length of each finger exposed. The connecting member is then severed and removed.

Abstract: A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.

Abstract: A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slightly moving the capillary in an almost horizontal direction after the formation of the bump to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step of cutting the gold wire at the base portion after the sliding step. In the sliding step, a moving speed of the capillary is made smaller than that in the bump forming step.

Abstract: An electrical coil assembly utilizing a bimetallic two-piece terminal construction and a method of manufacturing same are provided. The inner terminal structure utilizes a material that aids in the touchless attachment of the fine gauge magnetic wire to the inner terminal structure. The low mass of the inner terminal structure allows for increased winding speeds during the manufacturing process. The outer terminal structure utilizes a material that provides good corrosion resistance and electrical conductivity. The inner and outer terminal structures are electrically attached after the winding and electrical attachment process of the fine gauge magnetic wire. The coil and two-piece terminal connectors may then be encapsulated to provide a final electrical coil assembly.

Abstract: A method for creating a soldered joint to contacts of a piezoelectric actuator and polarizing the piezoceramic layers of the piezoelectric actuator has the steps of Polarization and soldering of the joint which are performed simultaneously such that the duration of the process is reduced.

Abstract: A method for manufacturing an ink-jet head includes the step of forming, in a substrate, through holes respectively corresponding to conductors on one face of the substrate and each having its diameter increasing from the one face toward the other face of the substrate. Here, the through holes are formed in such a manner as to satisfy R>d/2+t/tan ?, where: d represents a width of an opening of the through hole on the one face; ? represents an angle of inclination of a sidewall defining the through hole with respect to the one face; R represents a shortest distance from the center of the through hole to a periphery of an electrode that neighbors an electrode corresponding to the through hole; and t represents a thickness of the substrate.

Abstract: A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can flow. Adjacent ends of the strands are received in an interior cavity of the coupling through an opening in the coupling. A joining material is provided on a first portion of the stator bar within the coupling opening and adjacent the ends of the strands. The first portion is heated to melt the joining material. At essentially the same time, a second portion of the stator bar outside the coupling is also heated. Once the joining material is suitably molten, the first portion is allowed to cool while the second portion remains heated, thereby causing the joining material nearest the ends of the strands to solidify first.

Abstract: A wireless communication device coupled to a wave antenna that provides greater increased durability and impedance matching. The wave antenna is a conductor that is bent in alternating sections to form peaks and valleys. The wireless communication device is coupled to the wave antenna to provide wireless communication with other communication devices, such as an interrogation reader. The wireless communication device and wave antenna may be placed on objects, goods, or other articles of manufacture that are subject to forces such that the wave antenna may be stretched or compressed during the manufacture and/or use of such object, good or article of manufacture. The wave antenna, because of its bent structure, is capable of stretching and compressing more easily than other structures, reducing the wireless communication device's susceptibility to damage or breaks that might render the wireless communication device coupled to the wave antenna unable to properly communicate information wirelessly.

Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.

Abstract: Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

Abstract: A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex connectors, and receptacles. A manufacturing process relates to the manufacture of extruded power distribution assemblies and the insertion of multiple, lengths of conductor wire along the longitudinal length thereof. In such PDA's, multiple parallel bores are formed interiorly of the PDA casing or housing wherein such conductors are not inserted into the bores until after the PDA extrusions are cut to length and plug ports are formed therein.

Abstract: Coils are electrically connected to a commutator, which includes commutator segments that are arranged one after another in a circumferential direction of a dielectric body along an outer peripheral surface of the dielectric body. Each commutator segment includes a slidably contacting portion, a claw portion and a bending fulcrum portion. The slidably contacting portion is provided in one axial side of the commutator segment and is slidably contactable with each brush. The claw portion is provided in the other axial side of the commutator segment and is engageable with the corresponding coil. The bending fulcrum portion is formed on a claw portion side of the slidably contacting portion and is bent upon radially inwardly pressing the claw portion by a fusing electrode.

Abstract: Methods for creating a ground path between a stainless steel suspension and a copper trace layer in an integrated lead assembly of a disk drive suspension. The invention prevents electrostatic discharge (ESD) damage by providing a means for grounding a lead to a controlled ground potential. Although the lead and suspension are generally separated by an insulating layer such as a polymide layer, connection between the lead and suspension can be made by, for example, creating an opening in the insulation layer and depositing a conductive material such an electrically conductive glue, solder or some other material through the opening to connect the two electrically conductive layers. A rivet may also be used to connect the two electrically conductive layers through a through hole that extends through both electrically conductive layers and the electrically insulating layer.

Abstract: A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.

Abstract: An electronic component has at least one first vertical semiconductor power device with a first side and a second side opposing the first side. One side is attached to an electrically conductive surface by a diffusion solder bond and the opposing side is attached to a second electrically conductive surface by an electrically conductive height equalization layer.

Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.

Abstract: In order to make it possible to produce a secure and permanent contact connection between an electrical conductor made from a soft material, in particular an aluminum conductor, and a contact element made from a harder material, the conductor is encapsulated at least partially in a contact region by an electrically conductive material. The electrically conductive material is harder than the soft material of the conductor. The electrically conductive material is applied with the aid of a thermal spraying process, with the result that there is a pressure-free electrical connection between the soft material and the sprayed-on material. Electrical contact is made with the contact element indirectly via the sprayed-on material. The thermal encapsulation by the spraying in the contact region makes it possible for a reliable electrical contact to be made even in the case of soft materials having a tendency towards cold flow.

Abstract: A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

Abstract: A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex connectors, and receptacles. A manufacturing process relates to the manufacture of the flex connectors which have plugs provided on the opposite ends of an intermediate cable section. The intermediate cable section includes multiple conductor wires having opposite ends projecting outwardly of an outer insulative cover or jacket. The plugs are attached to the opposite ends of the cable wherein each plug includes an outer housing and cover, as well as a plurality of multi-prong quad-point electrical terminals. Each terminal is connected to a respective wire and then fitted into an appropriate socket therefore.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: During fabrication of an electrical medical lead, a cut end of a stranded wire conductor is subjected to electrical current sufficient to heat and weld the strands together upon discharge of a high voltage between the cut end and a ground metal plate formed of a material of the stranded wire conductor. The discharge of weld energy between the stranded wire cut end and the ground plate induces heat in the wire strands at the stranded wire cut end and the ground plate sufficient to transfer conductive material from the ground plate to fuse the wire strands together. The fusing inhibits unraveling of the wire strands at the fused cut end, whereby the insertion of the stranded wire cable through a lead body lumen and the connection of the fused stranded wire cut end to a further lead component, e.g., a proximal lead connector element or distal electrode, is facilitated.

Abstract: A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slightly moving the capillary in an almost horizontal direction after the formation of the bump to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step of cutting the gold wire at the base portion after the sliding step. In the sliding step, a moving speed of the capillary is made smaller than that in the bump forming step.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.

Abstract: The mechanical connection of contacts through induction soldering is improved. To which end, a plastic dome is produced through preliminary encapsulation by injection molding of at least one contact and subsequent final encapsulation, where the two contact geometries to be joined can, for example, be premated. With an appropriate solder preform, the plug-in connection can be secured through induction soldering by enclosing this dome. The appropriate tool is then placed over the plastic dome, by which the heat generated melts the solder preform and securely joins the two contacts to one another.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: The present invention is an automated wire harness machine (40) capable of manufacturing a wire harness (42) unique in-part due to the automation process. The novel wire harness is generally a plurality of bundled, preferably un-stripped, insulated wires (46). Each un-stripped end portion (180, 182) of each wire is preferably terminated to one of a series of electrical connectors (44) of the wire harness. Each connector has at least one wafer (52) which houses a plurality of terminals (54) preferably crimped and electrically terminated to the ends of the wires. The wire harness machine preferably utilizes a pallet (56) which holds all of the wafers of one wire harness. A conveyor (58) transports the pallet and wafers through a series of stations which perform automated manufacturing steps. The first station is a terminal inserter (64) which inserts and locks the terminals within pre-assigned cavities (114) of the wafers.

Abstract: A method and device for making multiple connections between electrical conductors surrounded by external insulators in overlapping flexible cables by ultrasonic welding. Overlapping conductors to be connected are arranged on a surface of a carrier disposed between a sonotrode and an electrode, the sonotrode and electrode are sequentially aligned the with overlapping points to be welded, and the conductors are ultrasonically welded at each of the overlapping points. The carrier either includes the electrode at least in designated areas, or includes penetrations constructed and arranged to receive an electrode in designated areas.

Abstract: Method for producing an electrical connector connecting between a first and a second mating contact partner, wherein at least one contact partner is surrounded by a plug housing. The first and the second contact partners are lead with latching means together to form a plug-in electrical connection in the plug housing. Laser-welding is applied to the first and the second contact partners to make the connection an integral, non-detachable connection, by directing a laser beam through a single opening in the plug housing.

Abstract: A layer for use in a modular assemblage for supporting ICES is formed with metal contacts for assembly by making a sandwich of metal interconnect members between two layers of dielectric; drilling holes through the dielectric, stopping on a metal layer bonded to the bottom surface of the module; forming blind holes stopping on the interconnect members; and plating metal through the volume of the via, both full and blind holes, thereby forming vertical and horizontal connections in a layer that be stacked to form complex interconnect assemblies.