Abstract: The invention proposes a process for the surface treatment of aluminum in order to produce an electrical contact, and a corresponding component part, wherein an oxide layer on the aluminum surface is removed, for example by etching, in a first step and, in a second step, before an oxide layer is re-formed, the surface is sealed wet-chemically with a conversion layer having metal ions of zirconium or titanium.

Abstract: A network communication connector fabrication method for making network communication connectors is performed by: employing a cold drawing technique to repeatedly draw a metal round rod into a thin thickness conducting contact bar, stamping one end of the thin thickness conducting contact bar into a mating contact portion, stamping the thin thickness conducting contact to form an interference portion and a bonding portion, cutting off the thin thickness conducting contact bar subject to a predetermined length, repeating the above steps to obtain multiple metal contacts, electroplating the metal contacts, setting the metal contacts in two contact material strips and inserting the metal contacts in a mold, and then using an injection molding technique to mold an electrically insulative terminal block on the interference portions of the metal contacts to form a semi-finished product for making a network communication connector.

Abstract: An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

Abstract: A dielectric device has a first conductor and a dielectric disposed thereon. An intermediate region is formed between the first conductor and dielectric. In the intermediate region, an additive different from the first conductor and dielectric and the dielectric are mixed with each other. The additive contains at least one element of Si, Al, P, Mg, Mn, Y, V, Mo, Co, Nb, Fe, and Cr.

Abstract: A microbattery that includes, in succession starting from a first substrate: a first current collector, a first electrode, an electrolyte, a second electrode consisting of a solder joint, a second current collector and a second substrate. Additionally, a method for manufacturing a microbattery, which includes the following steps: forming a thin-film multilayer including, in succession from the first substrate, a first current collector, a first electrode, an electrolyte and a first metal film; forming a second current collector on a face of a second substrate; and forming a second electrode by soldering the first metal film and the second current collector together, said substrates being placed facing each other during assembly.

Abstract: A method of forming a connector with isolated conductive paths can include using a flexible member. An example of a method of forming a connector with isolated conductive paths can include forming a bulkhead assembly including two-or-more isolated bulkhead conductive paths. A non-bulkhead assembly can be formed including two-or-more isolated non-bulkhead conductive paths. A flexible coupling can be formed between each of the two-or-more isolated bulkhead conductive paths and each of the two-or-more isolated non-bulkhead conductive paths to form a flexible connector. Another example method can include assembling, at least partially, a connector having a groove, securing a flexible member in the groove, and flowing solder into the flexible member in the groove. Additional methods and associated apparatus and systems are disclosed.

Abstract: The present invention relates to an elongated male connector (1), for a medical device, and a method of producing the male connector (1). The male connector (1) has a longitudinal axis (2) and comprises a plurality of conductive members (3), each having an outer contact surface (4) and being separated from each other by insulating members (5). The conductive and insulating members (3, 5) are disposed along the male connector (1), such that the outer contact surfaces (4) are arranged essentially at the same surface level, and that each of the conductive members (3) has an elongated extension along the longitudinal axis (2) of the male connector (1). Each conductive member (3) is provided with an insulated microrod (6) extending at least partially along the length of the male connector (1), and the conductive members (3) are hollow and have an essentially cylindrical cross-section and form, together with the insulating members (5), a self-supporting male connector (1) having no core wire.

Abstract: The disclosure relates to a system for injecting a thermoplastic material in the fluid state, including: a dispenser adapted to be maintained at an injection temperature higher than the temperature limit at which the material is in a fluid state; an injection nozzle defining at least one portion of a transition passage; a stopper mounted inside the transition passage so as to slide between a blocking position and an opening position thereof; and control means for alternately sliding the stopper, wherein the control means comprises a jack with a rod parallel to the sliding direction of the stopper, and which is secured in an offset manner on the dispenser via a flattened beam, and a lever arranged so as to tilt about an axis so as to transmit the movements of the jack rod to the stopper.

Abstract: An electrode for use in producing copper in either a conventional electrowinning cell or the direct electrowinning cell is provided. The electrode includes a hanger bar and an electrode body coupled with the hanger bar. The electrode body includes at least one conductor rod having a core and an outer layer surrounding the core and a substrate coupled with the conductor rod.

Abstract: Battery cell 1, in particular flat battery cell, comprising at least one packaging for receiving at least one electric cell, at least one conductor 3, which has at least one base section 4 and at least one contacting section 5, wherein said contacting section is bent relative to the base section 4.

Abstract: An electrical connector assembly (100) comprises: a first insulative housing having a base portion (11) and a mating portion (12), and a second insulative housing (4) located on the base portion. The second insulative housing defines a body portion (41) and a tongue portion (42). A number of contacts (2) are formed in the first and second insulative housings. Each of the contact defines a first mating section (201) and a second mating section (202), and a curved connecting section connected with the first and second mating sections. A first metallic shell (3) encloses and engages with the first insulative housing. A second metallic shell (5) encloses the second insulative housing and engages with the first insulative housing. And, a metallic connecting piece (6) respectively connects with the first and second metallic shells.

Abstract: An electrical connector having a fusible element for mounting on a substrate includes an insulative housing and a contact terminal retained in the insulative housing. The contact terminal includes a resilient contacting arm extending beyond a mating face of the insulative housing and a soldering portion for mating with the fusible element. A gelatinous flux is deployed on the fusible element, and/or on the soldering portion, and/or between the fusible element and the soldering portion, and then flux is dried to immovably fix the fusible element with respect to the soldering portion. The dried flux will be re-juvenile to clean and remove an oxidized layer originally existed on the soldering portion so as to achieve robust welding quality. Besides, a method for trimming an electrical connector to have robust welding properties is also disclosed.

Abstract: A solar assembly includes an electrical connection and junction box and a solar cell module. The junction box has an electrically conducting structure including an electrical conductor path. The solar cell module has an electrical conductive strip. A flexible electric conductor is connected with the conductor path and is materially bonded with the conductive strip in an electrically conducting manner such that the conductor path electrically contacts the conductive strip via the electric conductor.

Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.

Abstract: A manufacturing method of an electric contact and manufacturing equipment of the electric contact. A contact and a metal base are superimposed and support by a jig, and a rotational tool, which rotates at a predetermined speed and advances/retracts to/from the jig, is pressed into a surface, which is not contacted with the contact, of the metal base while being rotated, so that the contact and the metal base are joined by solid state diffusion welding by using frictional heat generated by friction between the rotational tool and the metal base, and then the rotational tool is retracted from the metal base.

Abstract: A method of manufacture of an integrated circuit package-on-package system includes providing a base package and providing solder caps on the top of the base package configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the base package, and configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.

Abstract: A socket (100) comprises a base (1), a plurality of contacts (4, 3) respectively disposed therein and a plurality of solder balls (5) each connecting to the corresponding contacts (4, 3), the base comprises a central slot (1041) for receiving a module and a plurality of passageways (1031, 1022) at two sides of the central slot (4041) to receive the contacts (4, 3), respectively, the contact (4, 3) comprises a body portion (41, 31) positioned in the base (1), a contact portion (431, 331) extending from the body portion (41, 31) into the central slot (1041) and a tail (42, 32) extending from the body portion (41, 31), the solder balls (5) are positioned by the tails (421, 321) of the contacts (4, 3).

Abstract: A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: The present invention generally relates to an automated solar cell electrical connection device that is positioned within an automated solar cell fabrication system. The automated solar cell electrical connection device includes a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device.

Abstract: The present invention relates to a pin-less registration method for a plurality of laminate elements in a selected stack orientation. The method involves the use of an optical step that images portions of each laminate and determines a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element. A computer operation control system provides instructions for positioning laminate elements to a corrected stack orientation during an assembly of the stack. Following the assembly of the stack an induction welding step occurs at predetermined locations to secure the pinless alignment.

Abstract: Disclosed herein is an electrode terminal connecting member to connect two or more battery cells in series and/or in parallel to each other so as to manufacture a battery cell core pack, wherein the electrode terminal connecting member includes a plate body having a size sufficient to connect electrode terminals of the battery cells arranged in at least 2×2 matrix to each other, and the electrode terminals of the battery cells are directly coupled to the plate body in a state in which the plate body is not bent.

Abstract: An apparatus includes a pair of connectors, two or more conductive paths formed in each connector in the pair of connectors, and a shroud encompassing at least a portion of the pair of connectors. The pair of connectors includes a first connector and a second connector. The first connector is substantially more flexible than the second connector, and each connector in the pair of connectors includes a bulkhead. Each of the two or more conductive paths in each connector in the pair of connectors is electrically isolated from all other conductive elements in the pair of connectors. The shroud is located between the bulkheads and disposed about the pair of connectors when the pair of connectors are coupled together electrically.

Abstract: An electrode for use in producing copper in either a conventional electrowinning cell or the direct electrowinning cell is provided. The electrode includes a hanger bar and an electrode body coupled with the hanger bar. The electrode body includes at least one conductor rod having a core and an outer layer surrounding the core and a substrate coupled with the conductor rod.

Abstract: Connection of electrical cables comprising a connecting cable 2 formed from aluminium strands 4 and a metal connecting part 6. Contact corrosion is prevented when the welding takes place by firmly bonding the connecting cable 2 to the connecting part 6 by means of ultrasonic welding in such a way that a sealant 8 which is displaced between the connecting cable 2 and the connecting part 6 during the ultrasonic welding is situated between the aluminium strands 4.

Abstract: A secondary battery includes first and second collecting plates branching out from an electrode terminal, and first and second electrode assemblies rolled up in a jelly-roll type unit, the first electrode assembly having a first non-coating portion adhered to the first collecting plate, the second electrode assembly having a second non-coating portion adhered to the second collecting plate, and the first and second collecting plates being on facing surfaces of respective first and second non-coating portions. The first non-coating portion is spaced apart from a roll center of the first electrode assembly by a first predetermined distance along a direction directed away from the second non-coating portion, and the second non-coating portion is spaced apart from a roll center of the second electrode assembly by a second predetermined distance along a direction directed away from the first non-coating portion.

Abstract: A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.

Abstract: An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell.

Abstract: To provide a producing method of a spiral contact that exhibits, even in a hot environment, low permanent set in fatigue, excellent spring characteristic and excellent electrical conductivity. In the producing method in which atoms of a dissimilar metal are diffused and infiltrated into a surface layer of the spiral contact (7) by being heated in a state where the spiral contact (7) is brought into contact with the dissimilar metal, by heating titanium (or aluminum) deposited on the surface of the spiral contact, copper of a Cu substrate (1) and nickel which is a core material of the spiral contact (7), atoms of Ti (or Al) and atoms of Cu are diffused and infiltrated into the surface layer of the core material (Ni) to form alloys (7c) and (7d). The heating temperature is set such that a lower limit thereof is the temperature corresponding to 0.

Abstract: An electrical connector including a base pad formed of aluminum and having a bottom surface. An electrical contact can be connected to the base pad. A layer of copper can be on the bottom surface of the base pad.

Abstract: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.

Abstract: Surface-active dopants are added to a portion of a circuit package before a reflow process to promote wetting and reduce the formation of solder bump bridges. The circuit package has a solder element that electrically connects the circuit package to a substrate. A reflow process is performed to attach the solder element to a pad on the circuit package. During the reflow process, the surface-active dopants diffuse to the surface of the solder element and form an oxide passivation layer on the surface of the solder element.

Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.

Abstract: An individual cell for a battery comprises an electrode stack disposed within a cell housing and a method for the production thereof. The individual electrodes, preferably electrode foils, are electrically connected to lead vanes, and at least electrodes of different polarity are separated and insulated from each other by a separator preferably a separator foil. Lead vanes of the same polarity are electrically connected to each other to form a pole. The lead vanes of a pole are electrically compressed with each other and/or welded to each other.

Abstract: A battery module includes: a plurality of rechargeable batteries; and a connector for connecting a first terminal of one of the plurality of rechargeable batteries and including a first material, to a second terminal of another one of the plurality of rechargeable batteries and including a second material, wherein welded portions connect the connector to the first terminal and the second terminal, respectively, at least one of the welded portions including a nugget zone including a mixture of the respective materials of the connector and a corresponding one of the first terminal or the second terminal.

Abstract: A power source apparatus includes a case 92 housing a power generating element therein and having a hole portion 93h formed therein, the hole portion communicating from the exterior to the interior, an external electrode terminal 94 provided near the hole portion 93h outside the case 92, and an internal terminal 9a having one end electrically connected to a battery element 91 housed in the case 92 and the other end protruded to the outside of the case 92 through the hole portion 93h and subjected to swaging, the other end fixing the external electrode terminal 94 to the case 92. The other end of the internal terminal 9a subjected to the swaging has a region of a smaller thickness in a direction parallel with a central axis direction of the hole portion 93h than at a position abutting on the hole portion 93h.

Abstract: A battery (100) provided by the present invention includes an electrode body (80) having a positive electrode and a negative electrode (84), a bottomed battery case (10) for holding the electrode body (80), and a current collecting plate (20) that connects the battery case (10) with either the positive electrode or the negative electrode of the electrode body. A part of the current collecting plate (20) and a bottom part (16) of the battery case (10) are fixed to each other by welding, and a sealed structure (40) that surrounds a weld (30) composed of a portion that has been welded is formed at the periphery of the weld (30).

Abstract: What is described is a thermoelectric module composed of p- and n-conductive thermoelectric material legs which are connected to one another alternately via electrically conductive metallic contacts, wherein the electrically conductive metallic contacts are connected to the thermoelectric material legs by hard soldering or high-temperature soldering with a solder comprising metal and glass.

Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.

Abstract: Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.

Abstract: The embodiments herein relate to a conductor cable for use in a lead and more specifically to methods and devices related to laser consolidation of the cable. The various conductor cable embodiments and methods provide for at least one end of the cable having a weld mass created by a laser welding process.

Abstract: The embodiments herein relate to a connection body for welding a conductor member to a functional lead component such as a fixation base or terminal pin. The various connection body embodiments each have at least one slot defined in a wall of the connection body at which the conductor member is laser welded to the connection body.

Abstract: An electrical contact including a head, a tail including an opposing pair of major surfaces and a hole, a body connected at one end thereof to the head and at another end thereof to the tail, a peg arranged adjacent to the hole and to extend perpendicular or substantially perpendicular to one of the opposing pair of major surfaces and including at least one beveled side, and a solder member attached to the tail such that the peg creates and fits in a protrusion in a surface of the solder member when the solder member is attached to the tail, such that a portion of the solder member extends into the hole, and such that the solder member engages the at least one beveled side of the peg.

Abstract: A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.

Abstract: A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.

Abstract: Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.

Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.

Abstract: Methods of making a light emitter are disclosed herein. An embodiment of a method comprises fabricating a line of first leads, the line of first leads comprising a plurality connected individual first leads; fabricating a line of second leads, the line of second leads comprising a plurality of connected individual second leads; physically connecting the line of first leads to the line of second leads, wherein a first individual first lead is adjacent a first individual second lead; attaching a light emitting device to the first individual first lead; electrically connecting the light emitting device to the first individual second lead; encapsulating a portion of the individual first lead and a portion of the individual second lead as a single unit; and separating the encapsulated first individual lead and the second individual lead from the first line of leads and the second line of leads.

Abstract: An electronic module includes a first substrate having at least one electronic component, and a housing embedded in the substrate and designed as an injection molded housing or a transfer molded housing, and which includes electrical leads protruding from the housing, connected to the first substrate and designed as a pressed screen. At least one further second substrate provided with second electrical is embedded in the housing, the second leads being designed as a second pressed screen, and the two pressed screens being directly connected to each other in at least one location.

Abstract: A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.