Metal Patents (Class 29/879)
  • Patent number: 5481799
    Abstract: This invention relates to heat-recoverable devices that are self-heating and auto-regulating. The heat-recoverable articles of this invention comprise the combination of a heat-recoverable material and lossy heating particles, such as ferromanetic or ferrimagnetic particles, which produce heat when subjected to an alternating magnetic field and have a Curie temperature at or above the recovery temperature of the material and preferably below the decomposition temperature of the material. The particles can be in an electrically non-conductive layer, on or in thermal contact with the heat-recoverable material or can be dispersed in the heat-recoverable material. The system of this invention includes the heat-recoverable device or article, an induction coil for producing the magnetic field and an alternating current power supply for the induction coil. Preferably the power supply is high frequency and constant current, which produces efficient heating and preferred auto-regulating properties.
    Type: Grant
    Filed: April 12, 1994
    Date of Patent: January 9, 1996
    Assignee: Metcal, Inc.
    Inventor: Thomas H. McGaffigan
  • Patent number: 5448016
    Abstract: A member having a shank is selectively coated with a material such as a metal by loosely sliding a washer made of a material such as a thermoplastic or thermosetting polymer onto the shank, securing the washer such that the washer is in intimate contact with the shank, and immersing at least a portion of the member into at least one coating bath so that a portion of the member is coated and the portion of the shank in contact with the washer is not coated. The member can be an input/output pin for an electronic device and the coating can be applied by methods such as electroless plating or electrolytic plating.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: September 5, 1995
    Assignee: International Business Machines Corporation
    Inventors: Nunzio DiPaolo, Balaram Ghosal, Kim H. Ruffing
  • Patent number: 5416969
    Abstract: A sliding contact producing method is provided wherein noble metal balls are easily positioned on a metal plate; the weld strength between the noble metal ball and the metal plate can be obtained sufficiently; and a noble metal mounting jig can be prevented from damage when the metal plate is beam-welded with the noble metal ball. While being received in the recess portions of a jig, the noble metal balls are respectively contacted with bowllike recesses formed in the base surface of the metal plate. YAG laser beam is irradiated on the metal plate to weld the metal plate with the noble metal ball. Then the metal plate is sheared in a determined shape to form resilient strips. The present invention can improve welding operation efficiency and the reliability of welded portions. Since the metal plate being wider than that of the resilient strip receives beam, the metal contact mounting jig can be prevented from damage due to beam welding.
    Type: Grant
    Filed: April 28, 1993
    Date of Patent: May 23, 1995
    Assignee: Alps Electric Co., Ltd.
    Inventor: Akito Miura
  • Patent number: 5417363
    Abstract: Particularly in the case of contacts consisting of a silver-metal oxide-(AgMeO)-based material which are provided on their the back side with solder, it is noted, upon hard soldering, on a contact base that solder can ascend in undesired manner up to the contact surfaces. This is due to the heating upon the hard soldering. In accordance with the invention, the wettability of the side surfaces of the contacts is reduced to such an extent that the ascent of solder to the surface on the contact mating area is avoided. For this purpose, metal oxides are preferably introduced into the surfaces of the contacts. In the case of contacts having a base of silver-metal oxide (AgMeO), metal oxides which are already contained as active elements in the material can preferably be used.
    Type: Grant
    Filed: April 22, 1994
    Date of Patent: May 23, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Franz Hauner, Manfred Schneider, Alfred Dotzer
  • Patent number: 5361492
    Abstract: Disclosed is a cover for use in automatically mounting electric connectors to a printed-circuit board with the aid of a vacuum-suction nozzle. The cover comprises a top plate to which the vacuum-suction nozzle can be applied, and opposite hooks integrally connected to the opposite ends of the top plate which catch the opposite side walls of the connector housing. The fitting cover may be easily attached to an electric connector having pin-like terminals projecting from its upper surface to cover the pin-like terminals of the electric connector. The attaching of the fitting cover to the electric connector will provide a smooth, flat surface to the connector-and-cover combination, thereby facilitating the use of the vacuum suction nozzle to hold electrical connectors regardless of the contour of their upper surface.
    Type: Grant
    Filed: September 24, 1993
    Date of Patent: November 8, 1994
    Assignee: Molex Incorporated
    Inventor: Junichi Miyazawa
  • Patent number: 5351396
    Abstract: An electric contact is provided on at least one of a pair of conductors and includes a surface which is coated with a ceramic layer comprising at least one material selected from the group consisting of nitrides, carbides and borides of high melting point metals, this electric contact having a low contact resistance and good reliability.
    Type: Grant
    Filed: September 10, 1993
    Date of Patent: October 4, 1994
    Assignees: Sumitomo Electric Industries, Ltd., Sumitoma Wiring Systems, Ltd.
    Inventors: Kazuo Sawada, Atsushi Nakamura, Isao Okugawa
  • Patent number: 5331734
    Abstract: A method for the nonvisible location of pin connectors of cylindrical multi-pin electrical devices in orientation with pin sockets for insertion of the connector pins into the pin sockets to make electrical contact.
    Type: Grant
    Filed: November 10, 1992
    Date of Patent: July 26, 1994
    Inventor: Arthur R. Hunt
  • Patent number: 5285126
    Abstract: A press-molded collector shoe having a body made of a first carbon piece, and a layer disposed on a side thereof made of a second, less conductive carbon piece. The second piece covers only a portion of the side of the collector shoe. An electrical lead projects from a portion of the side which is not covered by the second piece. During the production of the collector shoe the surface layer is pre-pressed in a separate step and the first carbon piece into which the lead wire is imbedded and the second piece are then pressed together.
    Type: Grant
    Filed: June 18, 1991
    Date of Patent: February 8, 1994
    Assignee: Hoffmann & Co. Elektrokohle KG
    Inventors: Peter Hoffmann, Johann Hoell
  • Patent number: 5269056
    Abstract: Method and apparatus for butt welding a stranded wire to an electrode pin in close proximity to igniter material using laser beams. The wire and electrode pin are preferably part of an initiator assembly used in an airbag system. In a preferred embodiment, the wire is made of copper and the electrode pin is made of a steel alloy. The wire and pin are vertically aligned in contact with each other, without any external force or pressure applied to them. A plurality of beams contact portions of both materials at the same time, causing them to melt, substantially without any melted material extending beyond the width or diameter of the wire.
    Type: Grant
    Filed: September 16, 1992
    Date of Patent: December 14, 1993
    Assignee: OEA, Inc.
    Inventors: Robert A. Yang, David G. Lynch, Dennis L. Sims
  • Patent number: 5189275
    Abstract: A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: February 23, 1993
    Assignee: GTE Products Corporation
    Inventors: Frank J. Avellino, Richard A. Case, David T. Swanson
  • Patent number: 5184400
    Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.
    Type: Grant
    Filed: January 17, 1992
    Date of Patent: February 9, 1993
    Assignee: Cray Computer Corporation
    Inventors: Seymour R. Cray, Nicholas J. Krajewski
  • Patent number: 5134248
    Abstract: Apparatus and method for making electrical contact with a thin conductive film comprising, in one embodiment, a base with a thin conductive strip and a flexible substrate affixed to the base such that the strip and the substrate abut and form a substantially planar surface. An electrical lead is affixed to the conductive strip and a thin conductive film is applied to the planar surface such that it covers at least a portion of the conductive strip.
    Type: Grant
    Filed: November 13, 1990
    Date of Patent: July 28, 1992
    Assignee: Advanced Temperature Devices, Inc.
    Inventors: Thomas M. Kiec, Dennis W. Livengood, Arthur P. Haag
  • Patent number: 5118370
    Abstract: An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.
    Type: Grant
    Filed: March 18, 1991
    Date of Patent: June 2, 1992
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Kazuhito Ozawa
  • Patent number: 5102356
    Abstract: An electrical connector includes a housing and an array of terminal members having posts extending from the housing and adapted for insertion into through-holes of a circuit board. At least one board retention means is formed on at least one of the posts and is axially located a selected distance from the lower surface of the housing to be within a corresponding through-hole after insertion. The retention means is a swage defining wall engaging surfaces for engaging sidewalls of a respective through-holes during mounting of the connector to board. The swage is formed such that the far side of the post remains coplanar with the axially adjacent surfaces and a swage embossment extends laterally outwardly from at least the second side, the embossment being formed by the work end of a tool striking the third side at an angle.
    Type: Grant
    Filed: May 24, 1991
    Date of Patent: April 7, 1992
    Assignee: AMP Incorporated
    Inventors: Barbara A. Adams, William H. Allman, Troy E. Conner, Donald L. Forker, Edward J. Knittle, Jr., Douglas R. Sarver
  • Patent number: 5072521
    Abstract: An electrical contact for switches, relays, voltage regulator and the like, which comprises a clad body having a contact segment of a contact stock such as silver, palladium or alloy thereof and a base segment of copper or its alloy, as a carrier of the contact segment, as well as a method of making same. The contact has a central opening passing through the contact and base segments in the body and a thickness of the contact segment is made larger at a peripheral area of the opening.
    Type: Grant
    Filed: March 27, 1991
    Date of Patent: December 17, 1991
    Assignee: Tanaka Kikinzoku Kogyo K.K.
    Inventors: Noboru Sasaki, Masayuki Ueyama
  • Patent number: 5065504
    Abstract: Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: November 19, 1991
    Assignee: Microelectronics and Computer Technology Corporation
    Inventor: Michael A. Olla
  • Patent number: 4984359
    Abstract: An electrical connector (10; 10'; 10") includes a housing (11) that defines a solder element receiving channel (20). A solder element (24) is disposed within the channel (20), and a conductive pin (28; 28') is mounted in the housing (11) to pass through the channel (20) and the solder element (24). The channel (20) defines a loading axis (22) angled with respect to the pin (28; 28'), and the channel (20) is shaped to receive the solder element (24) along the loading axis (22) and positively to retain the solder element (24) from movement along the pin (28; 28'). The pin (28; 28') prevents the solder element (24) from moving along the loading axis (22) out of the channel (20).
    Type: Grant
    Filed: May 19, 1989
    Date of Patent: January 15, 1991
    Assignee: AMP Incorporated
    Inventor: Thomas C. Clark
  • Patent number: 4973264
    Abstract: Daisy chain connector comprises a dielectric housing in which an electrical contact assembly is secured. Contact assembly comprises identical contact sub-assemblies, each contact sub-assembly including electrical contacts having contact sections in alignment with apertures in a front surface of the housing and terminating legs for electrical connection with signal conductors and ground conductors of electrical cables. Contacts include contact plates in engagement between contact sections and legs defining bifurcated pairs of legs for each contact so that the signal conductors of one of cables are respectively connected to one of legs and the signal conductors of the other of the cables are respectively connected to the other of legs and at least one of legs forms a ground bar to which ground conductors are connected.
    Type: Grant
    Filed: March 3, 1989
    Date of Patent: November 27, 1990
    Assignee: AMP Incorporated
    Inventors: Takashi Kamono, Akihiko Ohtsu
  • Patent number: 4949455
    Abstract: An electrical pin comprises a metal pin having plated metal members at peripheral end surfaces thereof and head members including solder secured to the end surfaces of the metal pin and the plated metal members.
    Type: Grant
    Filed: February 1, 1989
    Date of Patent: August 21, 1990
    Assignee: AMP Incorporated
    Inventors: Keiichi Nakamura, Tsutomu Oshima, Noriharu Kurokawa, Toshihiko Kitai
  • Patent number: 4922607
    Abstract: A cardiac pacing lead having a plurality of individually insulated conductors arranged as a multifilar coil. The lead includes a connector assembly and a ring electrode assembly, each of which are optimized for use in conjunction with conductors arranged in the form of a multifilar coil. The connector assembly takes the form of an in-line connector having a plurality of linearly arranged connecting surfaces, each coupled to one of the conductors in the multifilar coil. The ring electrode assembly is constructed such that it displays the same outer diameter as the pacing lead. In both assemblies, conductors are coupled by means of welds, rather than by crimping or swaging.
    Type: Grant
    Filed: May 25, 1988
    Date of Patent: May 8, 1990
    Assignee: Medtronic, Inc.
    Inventors: Phong D. Doan, James E. Upton, Douglas H. Hess, Wayne R. Bass, Keith A. Ufford
  • Patent number: 4908943
    Abstract: To form lead or lead alloy terminals on cables comprising an insulative sheath and an aluminum core, the appropriate length of the core is bared and a metal part is fixed to the bared core. The terminal is then cast over this metal part. The metal part is compatible externally with the lead or the lead alloy forming the terminal and is compatible internally with the aluminum core. No high-resistivity substance is formed between any component layers of the resulting assembly.
    Type: Grant
    Filed: April 5, 1988
    Date of Patent: March 20, 1990
    Assignee: Precision Mecanique Labinal
    Inventors: Bernard Harel, Jacques Lefebvre, Andre Savigny
  • Patent number: 4858313
    Abstract: A connector for a multiple-pin electrical member includes an insulating body with opposed end faces, a side face and a plurality of holes extending between the ends for receiving pins from the member. Grooves in one face connect with the holes, and a longitudinal slot divides the grooves into two sections. Conductive material exists in each groove section and on the one face for connection to a ground. In constructing the connector conductive copper and solder plating is layered on the insulating body, and is selectively removed by mechanical action, wherein the slot is ground by a diamond clad wheel and the faces are ground with grinding pads.
    Type: Grant
    Filed: June 10, 1988
    Date of Patent: August 22, 1989
    Assignee: Labinal Components and Systems, Inc.
    Inventor: Robert F. Bowlin
  • Patent number: 4856702
    Abstract: In a method for manufacturing an alloy contact between a wafer-shaped semiconductor substrate (4) and a metal contact wafer (6) a material bond for which the alloy layer reaches only slightly into the interior of the semiconductor substrate (4) is achieved by individually heating the layer arrangement of semiconductor substrate (4) and contact wafer (6) and by means of thermal radiation in a vacuum and by using panel heating elements (13, 17) whose area is larger than the area of the layer arrangement.
    Type: Grant
    Filed: March 22, 1988
    Date of Patent: August 15, 1989
    Assignee: BBC Brown Boveri AG
    Inventor: Franz Kloucek
  • Patent number: 4843190
    Abstract: Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces.A method for mounting contact surface elements on the ends of strip conductors along the edge of a substrate. A solder mixed with adhesive is applied to the soldering surface at ends of the strip conductors. Contact surfaces each having a refined, f.i. gold plated, top surface and an activated, f.i. tin plated, bottom surface, are placed respectively on each soldering surface. Heat is applied to melt the solder particles and provide a good electrical connection between each surface contact and strip conductor. The substrate mounted with the contact elements has a plurality of components mounted on one surface thereof and interconnected by the strip conductors. The substrate is adapted to be plugged into an edge connector along its edge with the mounted contact surface elements.
    Type: Grant
    Filed: June 15, 1987
    Date of Patent: June 27, 1989
    Assignee: E. I. DuPont De Nemours and Company
    Inventor: Laurentius M. Verhoeven
  • Patent number: 4832255
    Abstract: This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer.
    Type: Grant
    Filed: July 25, 1988
    Date of Patent: May 23, 1989
    Assignee: International Business Machines Corporation
    Inventors: Harry R. Bickford, Kurt R. Grebe, Caroline A. Kovac, Michael J. Palmer
  • Patent number: 4783903
    Abstract: A method of forming a solder joint between a cup shaped high voltage terminal and a secondary lead extending from a secondary coil within a plastic case of an ignition coil. The steps include securing a solder paste to an inwardly extending end of the high voltage terminal, positioning the secondary coil lead relative to the solder paste, and heating the joint without making physical contact therewith to promote melting of the solder to secure and electrically connect the desired components.
    Type: Grant
    Filed: July 16, 1987
    Date of Patent: November 15, 1988
    Assignee: United Technologies Automotive, Inc.
    Inventors: James F. Fernquist, Donald E. Ellison
  • Patent number: 4779789
    Abstract: A method and apparatus for constructing an electrical contact including welding means for welding a base element to a blank comprised of contact facing material, separating means for separating finished electrodes from the balance of the contact facing material, examining means for examining an aperture formed within the contact material blank when the finished electrode is separated from the blank, and classifying means for classifying the finished electrode as acceptable or unacceptable depending upon the examination.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: October 25, 1988
    Assignee: Ford Motor Company
    Inventor: Mike Soltis
  • Patent number: 4771534
    Abstract: This invention relates to a method of providing an injection molding heated nozzle with an improved electrical terminal. A plug is seated in a radial opening in the collar portion with heating element extending through it and the rear end of the heating element projecting a minimum distance from the front surface of the plug. The insulation and casing are stripped from the projecting portion and the exposed resistance wire is welded to a flat surface on a larger diameter threaded conductive stud. A sleeve having a threaded and broached inner surface is mounted over the stud with the outer end of the stud projecting beyond the outer end of the sleeve. The plug and sleeve are integrally brazed in place during the brazing step forming the rest of the nozzle. A liquid ceramic insulating material is poured to fill the space between the stud and the surrounding sleeve.
    Type: Grant
    Filed: November 30, 1987
    Date of Patent: September 20, 1988
    Assignee: Mold-Masters Limited
    Inventors: Jobst U. Gellert, Denis L. Babin
  • Patent number: 4734820
    Abstract: Apparatus and method for removably mounting an integrated circuit package having a plurality of electrical pins wherein a plurality of mating pins each having a receptacle filled with liquid mercury are connected to the electrical pins of the integrated circuit package and the temperature reduced such that the liquid mercury solidifies thereby firmly bonding the electrical pins together. The assembly may be inserted into a Dewar type vessel and covered with a low temperature liquified gas for the dual purpose of solidfying the liquid mercury and cooling the integrated circuit package.
    Type: Grant
    Filed: April 16, 1987
    Date of Patent: March 29, 1988
    Assignee: NCR Corporation
    Inventors: Donald K. Lauffer, Ikuo J. Sanwo, Donald G. Tipon
  • Patent number: 4706382
    Abstract: A plated metal assembly used for packaging hybrid microcircuits features both insulated and grounding leads plated with successive layers of nickel and gold, the leads attached to a metal header which is plated only with nickel. A method for mass producing the assembly includes pre-plating the grounding leads, and brazing them to the header after the header and insulated leads have been assembled and plated.
    Type: Grant
    Filed: September 3, 1985
    Date of Patent: November 17, 1987
    Assignee: North American Philips Corporation
    Inventors: Albert V. Suppinger, Charles W. Tinley
  • Patent number: 4706383
    Abstract: A method of producing a nonwelding contact assembly for an electrical switch using a composite contact material formed by extruding a metal oxide core surrounded by a metal or metal alloy sheath with good welding properties to form a wire of core material having a layer of the metal or metal alloy metallurgically bonded thereto. A segment of the wire is resistance welded to a contact carrier and coined to the desired contact shape, after which the layer on the contact surface is sufficiently thin that it is oxidized to provide nonwelding characteristics after a few switch operations.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: November 17, 1987
    Assignee: Honeywell Inc.
    Inventor: Akbar Saffari
  • Patent number: 4700877
    Abstract: A machine for bonding connectors to the edge of a pcb by a Luc process has upper and lower wheels which are translated along the edge of the pcb for engaging the connectors to be applied respectively to the faces of the board. The relative position of the wheels at any given time is determined by mounting one of them to move with a jaw which closes down onto one of the faces.
    Type: Grant
    Filed: March 21, 1986
    Date of Patent: October 20, 1987
    Assignee: Luc Technologies Limited
    Inventors: Ralph G. Dodds, Patrick B. Ryan
  • Patent number: 4684203
    Abstract: In connection with a small-sized contact pin package for engagement with a plug socket of approximately circular cross-section, it is proposed that the contact pin package should comprise a basic pin, whose cross-section is elongate, over at least a partial section of its length, with a long cross-sectional axis, whose length corresponds approximately to the inside diameter of the plug socket, and with a short cross-sectional axis, and that there should be provided, on at least one of the basic pin partial section lateral surfaces which are vertical to the short cross-sectional axis, a contact spring subjected to bending, which spring extends in the longitudinal direction of the basic pin and is supported on this lateral surface and is conductively connected to the basic pin and is dimensioned with the circumference of the plug socket for electric contact engagement with radial tension.
    Type: Grant
    Filed: January 31, 1986
    Date of Patent: August 4, 1987
    Inventor: Otto Bihler
  • Patent number: 4657323
    Abstract: A filter connector is provided which is rugged and can be constructed at very low cost. The connector includes a front shell of metal which has a rearwardly-facing ledge, a circuit board device which includes a board of insulative material with a circuit layer on its rearward face, a rear insulator with a front portion lying within the rear of the front shell, and several contacts extending through holes in the circuit board device and insulator. The circuit layer includes capacitors around holes through which the contacts extends, with each contact soldered to a terminal of the capacitor, and the edge of the circuit soldered to the front shell. The rear insulator is molded in place to the circuit board device and within the rear of the front shell, with some of the insulator extending rearwardly of the front shell. The portion of the insulator extending rearwardly of the front shell is devoid of any metal shell immediately surrounding it.
    Type: Grant
    Filed: January 27, 1986
    Date of Patent: April 14, 1987
    Assignee: ITT Corporation
    Inventor: Alfred R. Erbe
  • Patent number: 4642891
    Abstract: A method of manufacturing contact structures on a support strap wherein at least one layer of a contact material such as gold, silver or alloys thereof is applied on top of the cross-web of a T-shaped metal strip of an easily cold stampable material and sections of predetermined length are cut from the T-shaped strip thereby providing contact members with stem portions with which they are inserted from one side of a support strap through corresponding openings stamped into the support strap whereupon the stems of the contact members which project through the support strap are stamped from the other side so as to firmly engage the contact members with the support strap. This method permits automatic manufacturing without damage to the contact surface of the contact members when being mounted on the strap.
    Type: Grant
    Filed: April 12, 1985
    Date of Patent: February 17, 1987
    Assignee: Inovan-Stroebe GmbH & Co. K.G.
    Inventors: Guenter Weik, Max Ackermann
  • Patent number: 4635024
    Abstract: A method of welding electrical contacts onto conductive bodies including engaging a surface of the contact with the conductive body and passing a welding current through a pair of spaced surface areas of the contact to provide weld action and wherein a rib portion between the pair of spaced areas retains unoxidized metal thereon to improve electrical contact properties of any article made and utilizing the contact and particularly the ribbed area thereof for make and break engagement with other members of an electric circuit.A new control article is also provided wherein a contact therein has a raised center rib thereon for contacting an associated means for make and break circuit action, which contact is made from silver or silver alloy and has uncontaminated silver on the surface of the rib or center area of the contact.
    Type: Grant
    Filed: August 20, 1984
    Date of Patent: January 6, 1987
    Inventors: Robert M. Wells, Alton R. Wells
  • Patent number: 4627682
    Abstract: Multi-pin male and female contact bars with composite contact posts having U-shaped upper contact post portions with two spaced tines and a transverse web portion to which is butt-welded a pin with an enlarged attachment head. The tines serve as spring tines of female contact members, or as cable-penetrating contact blades of male contact members, the associated butt-welded pins being solder pins for connection to a printed circuit board or male plug pins, respectively. The upper contact post portions are produced as die-cut segments of a sheet metal strip which remain connected to a carrier strip, until inserted into the contact post housing of the contact bar and severed from the carrier strip by a break-away movement.
    Type: Grant
    Filed: July 30, 1984
    Date of Patent: December 9, 1986
    Inventor: Karl Hehl
  • Patent number: 4625400
    Abstract: A method of producing a strip adapted for use as an electrical contact terminal comprising the following steps. First, a strip of relatively flexible substrate material is provided. Then, a substantially continuous strip of powdered metal or metal alloy is deposited onto a surface of the strip to produce the electrical contact terminal.
    Type: Grant
    Filed: July 6, 1983
    Date of Patent: December 2, 1986
    Assignee: Olin Corporation
    Inventor: Julius C. Fister
  • Patent number: 4614836
    Abstract: A connector or clip for grounding one or more electrical conducting leads in a microelectronic circuit case. A connector in the form of a metal plate attached to a wall of a case and to an insulated lead projecting through the wall, providing an electrical conducting path between the lead and the case. A connector plate with a flat face and a slot therein, and in one embodiment with an outwardly projecting tab at the bottom of the slot, with the connector being suitable for attachment by low temperature and high temperature brazing and spot welding.
    Type: Grant
    Filed: March 19, 1984
    Date of Patent: September 30, 1986
    Assignee: Axia Incorporated
    Inventors: Charles L. Carpenter, Jerry L. Carter, Terry D. McElwee
  • Patent number: 4593464
    Abstract: Conductive terminals (40) are plastically deformed whereby to connect electrically and mechanically to one or another of a pair of tubular electrical conductors (10,20) of a triaxial connector. Each terminal has an annular groove (41) therein received within a respective notch (13) in a lip extending from one of the respective tubular conductors (20, 30) and the terminal is struck to deform the walls of the groove around the lip. The other end of each terminal (40) is connected to the connector housing (1) by a plastic potting compound (50).
    Type: Grant
    Filed: October 29, 1984
    Date of Patent: June 10, 1986
    Assignee: Allied Corporation
    Inventors: Robert L. Williams, Christopher Marks
  • Patent number: 4587728
    Abstract: A coating in the form of a silver-based foil or strip is fixed onto a protuberance of a contact finger by resistance brazing while applying a force to crush the protuberance which constitutes the foundation of the strip.
    Type: Grant
    Filed: February 8, 1984
    Date of Patent: May 13, 1986
    Assignee: Merlin Gerin
    Inventor: Jean-Paul Favre-Tissot
  • Patent number: 4573265
    Abstract: Method of making electrical contacts by providing a continuous clad strip having a strip of contact material bonded to a base metal contact blade strip, removing contact material at spaced intervals from the strip, and severing the base metal strip in the intervals to form individual contacts in which the contact element is spaced inwardly from the margins of the contact blade.
    Type: Grant
    Filed: March 19, 1984
    Date of Patent: March 4, 1986
    Assignee: Checon Corporation
    Inventors: Donald E. Conaway, Jr., Ernest M. Jost
  • Patent number: 4537743
    Abstract: The disclosed electrode composition for a vacuum switch comprises copper, as a principal ingredient, a low melting point metal such as Bi, Pb, In, Li, Sn or any of their alloys, in a content not exceeding 20% by weight, a first additional metal such as Te, Sb, La, Mg or any of their alloys and a refractory metal such as Cr, Fe, Co, Ni, Ti, W or any of their alloys in a content less than 40% by weight.
    Type: Grant
    Filed: June 25, 1984
    Date of Patent: August 27, 1985
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takashi Yamanaka, Yasushi Takeya, Mitsumasa Yorita, Toshiaki Horiuchi, Kouichi Inagaki, Eizo Naya, Michinosuke Demizu, Mitsuhiro Okumura
  • Patent number: 4519666
    Abstract: The invention is a method for mounting tubular electrical conductors (10, 20) of a triaxial connector to the connector housing and the connector thus formed (1) and is characterized by a plurality of electrically conducting terminals (40) that have an annular groove (41) therein that mate with a respective notch (13) in the respective tubular conductors (20, 30). The other end of each terminal (40) is connected to the housing (1) by a plastic potting compound (50).
    Type: Grant
    Filed: August 15, 1983
    Date of Patent: May 28, 1985
    Assignee: Allied Corporation
    Inventors: Robert L. Williams, Christopher Marks
  • Patent number: 4495255
    Abstract: A very thin gold coating (e.g., 270 to 3,500 Angstroms) is vapor deposited on the surface of a nickel substrate. A short radiant energy pulse from a laser having a pulse length of about 130 nanoseconds is directed at the coated surface to melt portions of the gold coating and the nickel substrate therebelow. The energy pulse is removed to permit the melted material to resolidify as an alloy with a high concentration of gold at the surface thereof.
    Type: Grant
    Filed: October 30, 1980
    Date of Patent: January 22, 1985
    Assignee: AT&T Technologies, Inc.
    Inventors: Clifton W. Draper, John M. Poate
  • Patent number: 4453033
    Abstract: A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.
    Type: Grant
    Filed: March 18, 1982
    Date of Patent: June 5, 1984
    Assignee: Isotronics, Inc.
    Inventors: Raymond J. Duff, Steven A. Tower, Jay S. Greenspan
  • Patent number: 4439281
    Abstract: Electrode structures made from metallized bodies of a fibrous nature, for example from metallized felt, possess the advantage, deriving from their intrinsic stiffness, of requiring no internally fitted supporting structure. It is, however, difficult to attach the current lead-out tabs to an electrode structure of this type, because it is hightly susceptible to mechanical damage at the point of attachment. These difficulties are avoided, according to the present invention, when the edge of the electrode structure is reinforced, to a width of about 0.3 to about 1 cm, by means of an electrodeposited metal coating. If appropriate, the reinforcement of the edge can also be carried out simultaneously with the production, by electrodeposition, of the electrode structure. The current lead out-tab can be attached to the reinforced edge avoiding such difficulties.
    Type: Grant
    Filed: October 21, 1982
    Date of Patent: March 27, 1984
    Assignee: Deutsche Automobilgesellschaft
    Inventors: Claus Schneider, Gabor Benczur-Urmossy
  • Patent number: 4437236
    Abstract: Process for locating solder on a precalculated position on an electrical terminal. Metal strip stock coated with a thin layer of solder is fed through a strip guide for precisely positioning the metal strip stock between a pair of rollers. A solder wire is cold bonded to the metal strip stock and the strip stock is subsequently stamped into a terminal.
    Type: Grant
    Filed: January 25, 1982
    Date of Patent: March 20, 1984
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Joseph A. Oswald, Jr.
  • Patent number: 4429458
    Abstract: Immediately after a composite electric contact is made from wires by cold welding and in a manner as it has been cold welded, it is brought onto a supporting metal and subjected to pressure and resistance heat exerted by a pair of electrodes whereby the contact and the supporting metal are spot welded in situ without adversely affecting the supporting metal such as warping thereof and whereby cold welded abutting ends of the contact are released from stress which is produced by cold welding and the contact is annealed in whole.
    Type: Grant
    Filed: December 18, 1980
    Date of Patent: February 7, 1984
    Assignee: Chugai Denki, Kogyo K.K.
    Inventor: Akira Shibata
  • Patent number: 4414735
    Abstract: Metal section for making a conductor element with double contact face, adapted to be cut into portions, or electrical contacts.This section comprises a base arranged to abut and be fixed on a face of the conductor element, and a body, extending on either side of the base, and having two opposite contact surfaces.
    Type: Grant
    Filed: April 16, 1981
    Date of Patent: November 15, 1983
    Assignee: Crouzet
    Inventor: Raymond Buisson