Metal Patents (Class 29/879)
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Patent number: 5492609Abstract: An improved method of manufacture for electrolytic cathode devices that include a copper hanger-bar with a rounded underside that ensures the automatic vertical positioning of the cathode's blank starter sheet with respect to horizontal supporting bus-bars irrespective of warpage or construction defects. The mechanical connection between the hanger bar and the starter sheet is achieved by inserting the latter's upper edge into a receiving groove in the underside of the hanger bar and by welding the entire length of connection, thereby establishing a large boundary surface for good electrical conductance. One embodiment of the invention also features notched lateral edges that increase the rigidity of the starter sheet and allow the ready installation and removal of conforming insulating strips.Type: GrantFiled: October 21, 1994Date of Patent: February 20, 1996Assignee: T. A. Caid Industries, Inc.Inventor: William Assenmacher
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Patent number: 5481799Abstract: This invention relates to heat-recoverable devices that are self-heating and auto-regulating. The heat-recoverable articles of this invention comprise the combination of a heat-recoverable material and lossy heating particles, such as ferromanetic or ferrimagnetic particles, which produce heat when subjected to an alternating magnetic field and have a Curie temperature at or above the recovery temperature of the material and preferably below the decomposition temperature of the material. The particles can be in an electrically non-conductive layer, on or in thermal contact with the heat-recoverable material or can be dispersed in the heat-recoverable material. The system of this invention includes the heat-recoverable device or article, an induction coil for producing the magnetic field and an alternating current power supply for the induction coil. Preferably the power supply is high frequency and constant current, which produces efficient heating and preferred auto-regulating properties.Type: GrantFiled: April 12, 1994Date of Patent: January 9, 1996Assignee: Metcal, Inc.Inventor: Thomas H. McGaffigan
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Patent number: 5448016Abstract: A member having a shank is selectively coated with a material such as a metal by loosely sliding a washer made of a material such as a thermoplastic or thermosetting polymer onto the shank, securing the washer such that the washer is in intimate contact with the shank, and immersing at least a portion of the member into at least one coating bath so that a portion of the member is coated and the portion of the shank in contact with the washer is not coated. The member can be an input/output pin for an electronic device and the coating can be applied by methods such as electroless plating or electrolytic plating.Type: GrantFiled: July 20, 1994Date of Patent: September 5, 1995Assignee: International Business Machines CorporationInventors: Nunzio DiPaolo, Balaram Ghosal, Kim H. Ruffing
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Patent number: 5417363Abstract: Particularly in the case of contacts consisting of a silver-metal oxide-(AgMeO)-based material which are provided on their the back side with solder, it is noted, upon hard soldering, on a contact base that solder can ascend in undesired manner up to the contact surfaces. This is due to the heating upon the hard soldering. In accordance with the invention, the wettability of the side surfaces of the contacts is reduced to such an extent that the ascent of solder to the surface on the contact mating area is avoided. For this purpose, metal oxides are preferably introduced into the surfaces of the contacts. In the case of contacts having a base of silver-metal oxide (AgMeO), metal oxides which are already contained as active elements in the material can preferably be used.Type: GrantFiled: April 22, 1994Date of Patent: May 23, 1995Assignee: Siemens AktiengesellschaftInventors: Franz Hauner, Manfred Schneider, Alfred Dotzer
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Patent number: 5416969Abstract: A sliding contact producing method is provided wherein noble metal balls are easily positioned on a metal plate; the weld strength between the noble metal ball and the metal plate can be obtained sufficiently; and a noble metal mounting jig can be prevented from damage when the metal plate is beam-welded with the noble metal ball. While being received in the recess portions of a jig, the noble metal balls are respectively contacted with bowllike recesses formed in the base surface of the metal plate. YAG laser beam is irradiated on the metal plate to weld the metal plate with the noble metal ball. Then the metal plate is sheared in a determined shape to form resilient strips. The present invention can improve welding operation efficiency and the reliability of welded portions. Since the metal plate being wider than that of the resilient strip receives beam, the metal contact mounting jig can be prevented from damage due to beam welding.Type: GrantFiled: April 28, 1993Date of Patent: May 23, 1995Assignee: Alps Electric Co., Ltd.Inventor: Akito Miura
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Patent number: 5361492Abstract: Disclosed is a cover for use in automatically mounting electric connectors to a printed-circuit board with the aid of a vacuum-suction nozzle. The cover comprises a top plate to which the vacuum-suction nozzle can be applied, and opposite hooks integrally connected to the opposite ends of the top plate which catch the opposite side walls of the connector housing. The fitting cover may be easily attached to an electric connector having pin-like terminals projecting from its upper surface to cover the pin-like terminals of the electric connector. The attaching of the fitting cover to the electric connector will provide a smooth, flat surface to the connector-and-cover combination, thereby facilitating the use of the vacuum suction nozzle to hold electrical connectors regardless of the contour of their upper surface.Type: GrantFiled: September 24, 1993Date of Patent: November 8, 1994Assignee: Molex IncorporatedInventor: Junichi Miyazawa
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Patent number: 5351396Abstract: An electric contact is provided on at least one of a pair of conductors and includes a surface which is coated with a ceramic layer comprising at least one material selected from the group consisting of nitrides, carbides and borides of high melting point metals, this electric contact having a low contact resistance and good reliability.Type: GrantFiled: September 10, 1993Date of Patent: October 4, 1994Assignees: Sumitomo Electric Industries, Ltd., Sumitoma Wiring Systems, Ltd.Inventors: Kazuo Sawada, Atsushi Nakamura, Isao Okugawa
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Patent number: 5331734Abstract: A method for the nonvisible location of pin connectors of cylindrical multi-pin electrical devices in orientation with pin sockets for insertion of the connector pins into the pin sockets to make electrical contact.Type: GrantFiled: November 10, 1992Date of Patent: July 26, 1994Inventor: Arthur R. Hunt
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Patent number: 5285126Abstract: A press-molded collector shoe having a body made of a first carbon piece, and a layer disposed on a side thereof made of a second, less conductive carbon piece. The second piece covers only a portion of the side of the collector shoe. An electrical lead projects from a portion of the side which is not covered by the second piece. During the production of the collector shoe the surface layer is pre-pressed in a separate step and the first carbon piece into which the lead wire is imbedded and the second piece are then pressed together.Type: GrantFiled: June 18, 1991Date of Patent: February 8, 1994Assignee: Hoffmann & Co. Elektrokohle KGInventors: Peter Hoffmann, Johann Hoell
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Patent number: 5269056Abstract: Method and apparatus for butt welding a stranded wire to an electrode pin in close proximity to igniter material using laser beams. The wire and electrode pin are preferably part of an initiator assembly used in an airbag system. In a preferred embodiment, the wire is made of copper and the electrode pin is made of a steel alloy. The wire and pin are vertically aligned in contact with each other, without any external force or pressure applied to them. A plurality of beams contact portions of both materials at the same time, causing them to melt, substantially without any melted material extending beyond the width or diameter of the wire.Type: GrantFiled: September 16, 1992Date of Patent: December 14, 1993Assignee: OEA, Inc.Inventors: Robert A. Yang, David G. Lynch, Dennis L. Sims
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Patent number: 5189275Abstract: A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.Type: GrantFiled: August 21, 1989Date of Patent: February 23, 1993Assignee: GTE Products CorporationInventors: Frank J. Avellino, Richard A. Case, David T. Swanson
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Patent number: 5184400Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.Type: GrantFiled: January 17, 1992Date of Patent: February 9, 1993Assignee: Cray Computer CorporationInventors: Seymour R. Cray, Nicholas J. Krajewski
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Patent number: 5134248Abstract: Apparatus and method for making electrical contact with a thin conductive film comprising, in one embodiment, a base with a thin conductive strip and a flexible substrate affixed to the base such that the strip and the substrate abut and form a substantially planar surface. An electrical lead is affixed to the conductive strip and a thin conductive film is applied to the planar surface such that it covers at least a portion of the conductive strip.Type: GrantFiled: November 13, 1990Date of Patent: July 28, 1992Assignee: Advanced Temperature Devices, Inc.Inventors: Thomas M. Kiec, Dennis W. Livengood, Arthur P. Haag
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Patent number: 5118370Abstract: An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.Type: GrantFiled: March 18, 1991Date of Patent: June 2, 1992Assignee: Sharp Kabushiki KaishaInventor: Kazuhito Ozawa
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Patent number: 5102356Abstract: An electrical connector includes a housing and an array of terminal members having posts extending from the housing and adapted for insertion into through-holes of a circuit board. At least one board retention means is formed on at least one of the posts and is axially located a selected distance from the lower surface of the housing to be within a corresponding through-hole after insertion. The retention means is a swage defining wall engaging surfaces for engaging sidewalls of a respective through-holes during mounting of the connector to board. The swage is formed such that the far side of the post remains coplanar with the axially adjacent surfaces and a swage embossment extends laterally outwardly from at least the second side, the embossment being formed by the work end of a tool striking the third side at an angle.Type: GrantFiled: May 24, 1991Date of Patent: April 7, 1992Assignee: AMP IncorporatedInventors: Barbara A. Adams, William H. Allman, Troy E. Conner, Donald L. Forker, Edward J. Knittle, Jr., Douglas R. Sarver
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Patent number: 5072521Abstract: An electrical contact for switches, relays, voltage regulator and the like, which comprises a clad body having a contact segment of a contact stock such as silver, palladium or alloy thereof and a base segment of copper or its alloy, as a carrier of the contact segment, as well as a method of making same. The contact has a central opening passing through the contact and base segments in the body and a thickness of the contact segment is made larger at a peripheral area of the opening.Type: GrantFiled: March 27, 1991Date of Patent: December 17, 1991Assignee: Tanaka Kikinzoku Kogyo K.K.Inventors: Noboru Sasaki, Masayuki Ueyama
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Patent number: 5065504Abstract: Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.Type: GrantFiled: November 5, 1990Date of Patent: November 19, 1991Assignee: Microelectronics and Computer Technology CorporationInventor: Michael A. Olla
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Patent number: 4984359Abstract: An electrical connector (10; 10'; 10") includes a housing (11) that defines a solder element receiving channel (20). A solder element (24) is disposed within the channel (20), and a conductive pin (28; 28') is mounted in the housing (11) to pass through the channel (20) and the solder element (24). The channel (20) defines a loading axis (22) angled with respect to the pin (28; 28'), and the channel (20) is shaped to receive the solder element (24) along the loading axis (22) and positively to retain the solder element (24) from movement along the pin (28; 28'). The pin (28; 28') prevents the solder element (24) from moving along the loading axis (22) out of the channel (20).Type: GrantFiled: May 19, 1989Date of Patent: January 15, 1991Assignee: AMP IncorporatedInventor: Thomas C. Clark
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Patent number: 4973264Abstract: Daisy chain connector comprises a dielectric housing in which an electrical contact assembly is secured. Contact assembly comprises identical contact sub-assemblies, each contact sub-assembly including electrical contacts having contact sections in alignment with apertures in a front surface of the housing and terminating legs for electrical connection with signal conductors and ground conductors of electrical cables. Contacts include contact plates in engagement between contact sections and legs defining bifurcated pairs of legs for each contact so that the signal conductors of one of cables are respectively connected to one of legs and the signal conductors of the other of the cables are respectively connected to the other of legs and at least one of legs forms a ground bar to which ground conductors are connected.Type: GrantFiled: March 3, 1989Date of Patent: November 27, 1990Assignee: AMP IncorporatedInventors: Takashi Kamono, Akihiko Ohtsu
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Patent number: 4949455Abstract: An electrical pin comprises a metal pin having plated metal members at peripheral end surfaces thereof and head members including solder secured to the end surfaces of the metal pin and the plated metal members.Type: GrantFiled: February 1, 1989Date of Patent: August 21, 1990Assignee: AMP IncorporatedInventors: Keiichi Nakamura, Tsutomu Oshima, Noriharu Kurokawa, Toshihiko Kitai
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Patent number: 4922607Abstract: A cardiac pacing lead having a plurality of individually insulated conductors arranged as a multifilar coil. The lead includes a connector assembly and a ring electrode assembly, each of which are optimized for use in conjunction with conductors arranged in the form of a multifilar coil. The connector assembly takes the form of an in-line connector having a plurality of linearly arranged connecting surfaces, each coupled to one of the conductors in the multifilar coil. The ring electrode assembly is constructed such that it displays the same outer diameter as the pacing lead. In both assemblies, conductors are coupled by means of welds, rather than by crimping or swaging.Type: GrantFiled: May 25, 1988Date of Patent: May 8, 1990Assignee: Medtronic, Inc.Inventors: Phong D. Doan, James E. Upton, Douglas H. Hess, Wayne R. Bass, Keith A. Ufford
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Patent number: 4908943Abstract: To form lead or lead alloy terminals on cables comprising an insulative sheath and an aluminum core, the appropriate length of the core is bared and a metal part is fixed to the bared core. The terminal is then cast over this metal part. The metal part is compatible externally with the lead or the lead alloy forming the terminal and is compatible internally with the aluminum core. No high-resistivity substance is formed between any component layers of the resulting assembly.Type: GrantFiled: April 5, 1988Date of Patent: March 20, 1990Assignee: Precision Mecanique LabinalInventors: Bernard Harel, Jacques Lefebvre, Andre Savigny
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Patent number: 4858313Abstract: A connector for a multiple-pin electrical member includes an insulating body with opposed end faces, a side face and a plurality of holes extending between the ends for receiving pins from the member. Grooves in one face connect with the holes, and a longitudinal slot divides the grooves into two sections. Conductive material exists in each groove section and on the one face for connection to a ground. In constructing the connector conductive copper and solder plating is layered on the insulating body, and is selectively removed by mechanical action, wherein the slot is ground by a diamond clad wheel and the faces are ground with grinding pads.Type: GrantFiled: June 10, 1988Date of Patent: August 22, 1989Assignee: Labinal Components and Systems, Inc.Inventor: Robert F. Bowlin
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Patent number: 4856702Abstract: In a method for manufacturing an alloy contact between a wafer-shaped semiconductor substrate (4) and a metal contact wafer (6) a material bond for which the alloy layer reaches only slightly into the interior of the semiconductor substrate (4) is achieved by individually heating the layer arrangement of semiconductor substrate (4) and contact wafer (6) and by means of thermal radiation in a vacuum and by using panel heating elements (13, 17) whose area is larger than the area of the layer arrangement.Type: GrantFiled: March 22, 1988Date of Patent: August 15, 1989Assignee: BBC Brown Boveri AGInventor: Franz Kloucek
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Patent number: 4843190Abstract: Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces.A method for mounting contact surface elements on the ends of strip conductors along the edge of a substrate. A solder mixed with adhesive is applied to the soldering surface at ends of the strip conductors. Contact surfaces each having a refined, f.i. gold plated, top surface and an activated, f.i. tin plated, bottom surface, are placed respectively on each soldering surface. Heat is applied to melt the solder particles and provide a good electrical connection between each surface contact and strip conductor. The substrate mounted with the contact elements has a plurality of components mounted on one surface thereof and interconnected by the strip conductors. The substrate is adapted to be plugged into an edge connector along its edge with the mounted contact surface elements.Type: GrantFiled: June 15, 1987Date of Patent: June 27, 1989Assignee: E. I. DuPont De Nemours and CompanyInventor: Laurentius M. Verhoeven
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Patent number: 4832255Abstract: This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer.Type: GrantFiled: July 25, 1988Date of Patent: May 23, 1989Assignee: International Business Machines CorporationInventors: Harry R. Bickford, Kurt R. Grebe, Caroline A. Kovac, Michael J. Palmer
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Patent number: 4783903Abstract: A method of forming a solder joint between a cup shaped high voltage terminal and a secondary lead extending from a secondary coil within a plastic case of an ignition coil. The steps include securing a solder paste to an inwardly extending end of the high voltage terminal, positioning the secondary coil lead relative to the solder paste, and heating the joint without making physical contact therewith to promote melting of the solder to secure and electrically connect the desired components.Type: GrantFiled: July 16, 1987Date of Patent: November 15, 1988Assignee: United Technologies Automotive, Inc.Inventors: James F. Fernquist, Donald E. Ellison
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Patent number: 4779789Abstract: A method and apparatus for constructing an electrical contact including welding means for welding a base element to a blank comprised of contact facing material, separating means for separating finished electrodes from the balance of the contact facing material, examining means for examining an aperture formed within the contact material blank when the finished electrode is separated from the blank, and classifying means for classifying the finished electrode as acceptable or unacceptable depending upon the examination.Type: GrantFiled: December 5, 1986Date of Patent: October 25, 1988Assignee: Ford Motor CompanyInventor: Mike Soltis
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Patent number: 4771534Abstract: This invention relates to a method of providing an injection molding heated nozzle with an improved electrical terminal. A plug is seated in a radial opening in the collar portion with heating element extending through it and the rear end of the heating element projecting a minimum distance from the front surface of the plug. The insulation and casing are stripped from the projecting portion and the exposed resistance wire is welded to a flat surface on a larger diameter threaded conductive stud. A sleeve having a threaded and broached inner surface is mounted over the stud with the outer end of the stud projecting beyond the outer end of the sleeve. The plug and sleeve are integrally brazed in place during the brazing step forming the rest of the nozzle. A liquid ceramic insulating material is poured to fill the space between the stud and the surrounding sleeve.Type: GrantFiled: November 30, 1987Date of Patent: September 20, 1988Assignee: Mold-Masters LimitedInventors: Jobst U. Gellert, Denis L. Babin
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Patent number: 4734820Abstract: Apparatus and method for removably mounting an integrated circuit package having a plurality of electrical pins wherein a plurality of mating pins each having a receptacle filled with liquid mercury are connected to the electrical pins of the integrated circuit package and the temperature reduced such that the liquid mercury solidifies thereby firmly bonding the electrical pins together. The assembly may be inserted into a Dewar type vessel and covered with a low temperature liquified gas for the dual purpose of solidfying the liquid mercury and cooling the integrated circuit package.Type: GrantFiled: April 16, 1987Date of Patent: March 29, 1988Assignee: NCR CorporationInventors: Donald K. Lauffer, Ikuo J. Sanwo, Donald G. Tipon
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Patent number: 4706382Abstract: A plated metal assembly used for packaging hybrid microcircuits features both insulated and grounding leads plated with successive layers of nickel and gold, the leads attached to a metal header which is plated only with nickel. A method for mass producing the assembly includes pre-plating the grounding leads, and brazing them to the header after the header and insulated leads have been assembled and plated.Type: GrantFiled: September 3, 1985Date of Patent: November 17, 1987Assignee: North American Philips CorporationInventors: Albert V. Suppinger, Charles W. Tinley
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Patent number: 4706383Abstract: A method of producing a nonwelding contact assembly for an electrical switch using a composite contact material formed by extruding a metal oxide core surrounded by a metal or metal alloy sheath with good welding properties to form a wire of core material having a layer of the metal or metal alloy metallurgically bonded thereto. A segment of the wire is resistance welded to a contact carrier and coined to the desired contact shape, after which the layer on the contact surface is sufficiently thin that it is oxidized to provide nonwelding characteristics after a few switch operations.Type: GrantFiled: October 27, 1986Date of Patent: November 17, 1987Assignee: Honeywell Inc.Inventor: Akbar Saffari
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Patent number: 4700877Abstract: A machine for bonding connectors to the edge of a pcb by a Luc process has upper and lower wheels which are translated along the edge of the pcb for engaging the connectors to be applied respectively to the faces of the board. The relative position of the wheels at any given time is determined by mounting one of them to move with a jaw which closes down onto one of the faces.Type: GrantFiled: March 21, 1986Date of Patent: October 20, 1987Assignee: Luc Technologies LimitedInventors: Ralph G. Dodds, Patrick B. Ryan
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Patent number: 4684203Abstract: In connection with a small-sized contact pin package for engagement with a plug socket of approximately circular cross-section, it is proposed that the contact pin package should comprise a basic pin, whose cross-section is elongate, over at least a partial section of its length, with a long cross-sectional axis, whose length corresponds approximately to the inside diameter of the plug socket, and with a short cross-sectional axis, and that there should be provided, on at least one of the basic pin partial section lateral surfaces which are vertical to the short cross-sectional axis, a contact spring subjected to bending, which spring extends in the longitudinal direction of the basic pin and is supported on this lateral surface and is conductively connected to the basic pin and is dimensioned with the circumference of the plug socket for electric contact engagement with radial tension.Type: GrantFiled: January 31, 1986Date of Patent: August 4, 1987Inventor: Otto Bihler
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Patent number: 4657323Abstract: A filter connector is provided which is rugged and can be constructed at very low cost. The connector includes a front shell of metal which has a rearwardly-facing ledge, a circuit board device which includes a board of insulative material with a circuit layer on its rearward face, a rear insulator with a front portion lying within the rear of the front shell, and several contacts extending through holes in the circuit board device and insulator. The circuit layer includes capacitors around holes through which the contacts extends, with each contact soldered to a terminal of the capacitor, and the edge of the circuit soldered to the front shell. The rear insulator is molded in place to the circuit board device and within the rear of the front shell, with some of the insulator extending rearwardly of the front shell. The portion of the insulator extending rearwardly of the front shell is devoid of any metal shell immediately surrounding it.Type: GrantFiled: January 27, 1986Date of Patent: April 14, 1987Assignee: ITT CorporationInventor: Alfred R. Erbe
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Patent number: 4642891Abstract: A method of manufacturing contact structures on a support strap wherein at least one layer of a contact material such as gold, silver or alloys thereof is applied on top of the cross-web of a T-shaped metal strip of an easily cold stampable material and sections of predetermined length are cut from the T-shaped strip thereby providing contact members with stem portions with which they are inserted from one side of a support strap through corresponding openings stamped into the support strap whereupon the stems of the contact members which project through the support strap are stamped from the other side so as to firmly engage the contact members with the support strap. This method permits automatic manufacturing without damage to the contact surface of the contact members when being mounted on the strap.Type: GrantFiled: April 12, 1985Date of Patent: February 17, 1987Assignee: Inovan-Stroebe GmbH & Co. K.G.Inventors: Guenter Weik, Max Ackermann
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Patent number: 4635024Abstract: A method of welding electrical contacts onto conductive bodies including engaging a surface of the contact with the conductive body and passing a welding current through a pair of spaced surface areas of the contact to provide weld action and wherein a rib portion between the pair of spaced areas retains unoxidized metal thereon to improve electrical contact properties of any article made and utilizing the contact and particularly the ribbed area thereof for make and break engagement with other members of an electric circuit.A new control article is also provided wherein a contact therein has a raised center rib thereon for contacting an associated means for make and break circuit action, which contact is made from silver or silver alloy and has uncontaminated silver on the surface of the rib or center area of the contact.Type: GrantFiled: August 20, 1984Date of Patent: January 6, 1987Inventors: Robert M. Wells, Alton R. Wells
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Patent number: 4627682Abstract: Multi-pin male and female contact bars with composite contact posts having U-shaped upper contact post portions with two spaced tines and a transverse web portion to which is butt-welded a pin with an enlarged attachment head. The tines serve as spring tines of female contact members, or as cable-penetrating contact blades of male contact members, the associated butt-welded pins being solder pins for connection to a printed circuit board or male plug pins, respectively. The upper contact post portions are produced as die-cut segments of a sheet metal strip which remain connected to a carrier strip, until inserted into the contact post housing of the contact bar and severed from the carrier strip by a break-away movement.Type: GrantFiled: July 30, 1984Date of Patent: December 9, 1986Inventor: Karl Hehl
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Patent number: 4625400Abstract: A method of producing a strip adapted for use as an electrical contact terminal comprising the following steps. First, a strip of relatively flexible substrate material is provided. Then, a substantially continuous strip of powdered metal or metal alloy is deposited onto a surface of the strip to produce the electrical contact terminal.Type: GrantFiled: July 6, 1983Date of Patent: December 2, 1986Assignee: Olin CorporationInventor: Julius C. Fister
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Patent number: 4614836Abstract: A connector or clip for grounding one or more electrical conducting leads in a microelectronic circuit case. A connector in the form of a metal plate attached to a wall of a case and to an insulated lead projecting through the wall, providing an electrical conducting path between the lead and the case. A connector plate with a flat face and a slot therein, and in one embodiment with an outwardly projecting tab at the bottom of the slot, with the connector being suitable for attachment by low temperature and high temperature brazing and spot welding.Type: GrantFiled: March 19, 1984Date of Patent: September 30, 1986Assignee: Axia IncorporatedInventors: Charles L. Carpenter, Jerry L. Carter, Terry D. McElwee
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Patent number: 4593464Abstract: Conductive terminals (40) are plastically deformed whereby to connect electrically and mechanically to one or another of a pair of tubular electrical conductors (10,20) of a triaxial connector. Each terminal has an annular groove (41) therein received within a respective notch (13) in a lip extending from one of the respective tubular conductors (20, 30) and the terminal is struck to deform the walls of the groove around the lip. The other end of each terminal (40) is connected to the connector housing (1) by a plastic potting compound (50).Type: GrantFiled: October 29, 1984Date of Patent: June 10, 1986Assignee: Allied CorporationInventors: Robert L. Williams, Christopher Marks
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Patent number: 4587728Abstract: A coating in the form of a silver-based foil or strip is fixed onto a protuberance of a contact finger by resistance brazing while applying a force to crush the protuberance which constitutes the foundation of the strip.Type: GrantFiled: February 8, 1984Date of Patent: May 13, 1986Assignee: Merlin GerinInventor: Jean-Paul Favre-Tissot
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Patent number: 4573265Abstract: Method of making electrical contacts by providing a continuous clad strip having a strip of contact material bonded to a base metal contact blade strip, removing contact material at spaced intervals from the strip, and severing the base metal strip in the intervals to form individual contacts in which the contact element is spaced inwardly from the margins of the contact blade.Type: GrantFiled: March 19, 1984Date of Patent: March 4, 1986Assignee: Checon CorporationInventors: Donald E. Conaway, Jr., Ernest M. Jost
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Patent number: 4537743Abstract: The disclosed electrode composition for a vacuum switch comprises copper, as a principal ingredient, a low melting point metal such as Bi, Pb, In, Li, Sn or any of their alloys, in a content not exceeding 20% by weight, a first additional metal such as Te, Sb, La, Mg or any of their alloys and a refractory metal such as Cr, Fe, Co, Ni, Ti, W or any of their alloys in a content less than 40% by weight.Type: GrantFiled: June 25, 1984Date of Patent: August 27, 1985Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takashi Yamanaka, Yasushi Takeya, Mitsumasa Yorita, Toshiaki Horiuchi, Kouichi Inagaki, Eizo Naya, Michinosuke Demizu, Mitsuhiro Okumura
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Patent number: 4519666Abstract: The invention is a method for mounting tubular electrical conductors (10, 20) of a triaxial connector to the connector housing and the connector thus formed (1) and is characterized by a plurality of electrically conducting terminals (40) that have an annular groove (41) therein that mate with a respective notch (13) in the respective tubular conductors (20, 30). The other end of each terminal (40) is connected to the housing (1) by a plastic potting compound (50).Type: GrantFiled: August 15, 1983Date of Patent: May 28, 1985Assignee: Allied CorporationInventors: Robert L. Williams, Christopher Marks
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Patent number: 4495255Abstract: A very thin gold coating (e.g., 270 to 3,500 Angstroms) is vapor deposited on the surface of a nickel substrate. A short radiant energy pulse from a laser having a pulse length of about 130 nanoseconds is directed at the coated surface to melt portions of the gold coating and the nickel substrate therebelow. The energy pulse is removed to permit the melted material to resolidify as an alloy with a high concentration of gold at the surface thereof.Type: GrantFiled: October 30, 1980Date of Patent: January 22, 1985Assignee: AT&T Technologies, Inc.Inventors: Clifton W. Draper, John M. Poate
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Patent number: 4453033Abstract: A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.Type: GrantFiled: March 18, 1982Date of Patent: June 5, 1984Assignee: Isotronics, Inc.Inventors: Raymond J. Duff, Steven A. Tower, Jay S. Greenspan
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Patent number: 4439281Abstract: Electrode structures made from metallized bodies of a fibrous nature, for example from metallized felt, possess the advantage, deriving from their intrinsic stiffness, of requiring no internally fitted supporting structure. It is, however, difficult to attach the current lead-out tabs to an electrode structure of this type, because it is hightly susceptible to mechanical damage at the point of attachment. These difficulties are avoided, according to the present invention, when the edge of the electrode structure is reinforced, to a width of about 0.3 to about 1 cm, by means of an electrodeposited metal coating. If appropriate, the reinforcement of the edge can also be carried out simultaneously with the production, by electrodeposition, of the electrode structure. The current lead out-tab can be attached to the reinforced edge avoiding such difficulties.Type: GrantFiled: October 21, 1982Date of Patent: March 27, 1984Assignee: Deutsche AutomobilgesellschaftInventors: Claus Schneider, Gabor Benczur-Urmossy
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Patent number: 4437236Abstract: Process for locating solder on a precalculated position on an electrical terminal. Metal strip stock coated with a thin layer of solder is fed through a strip guide for precisely positioning the metal strip stock between a pair of rollers. A solder wire is cold bonded to the metal strip stock and the strip stock is subsequently stamped into a terminal.Type: GrantFiled: January 25, 1982Date of Patent: March 20, 1984Assignee: E. I. Du Pont de Nemours and CompanyInventor: Joseph A. Oswald, Jr.
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Patent number: 4429458Abstract: Immediately after a composite electric contact is made from wires by cold welding and in a manner as it has been cold welded, it is brought onto a supporting metal and subjected to pressure and resistance heat exerted by a pair of electrodes whereby the contact and the supporting metal are spot welded in situ without adversely affecting the supporting metal such as warping thereof and whereby cold welded abutting ends of the contact are released from stress which is produced by cold welding and the contact is annealed in whole.Type: GrantFiled: December 18, 1980Date of Patent: February 7, 1984Assignee: Chugai Denki, Kogyo K.K.Inventor: Akira Shibata