Forming Array Of Contacts Or Terminals Patents (Class 29/884)
  • Patent number: 10998657
    Abstract: Contacts that can be highly corrosion resistant, can be readily manufactured, and can conserve precious materials. One example can provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer can be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact can be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: May 4, 2021
    Assignee: Apple Inc.
    Inventors: Hani Esmaeili, Kenneth Michael Bagwell, Holly Ubellacker, Judy Hsien-Chih Liu, Eric S. Jol, Christoph Bitterlich, Michael W. Barnstead, Christoph Werner
  • Patent number: 10840629
    Abstract: An edge card connector assembly has a harness-side portion connectable to a cable and a card-side portion adapted to receive a planar structure edgewise therein in a plane of entry. The edge card connector has a plurality of resilient electrical contacting members extending through the wall and is adapted for electrical connection with the cable in the harness-side portion and with the planar structure in the card-side portion. Upper and lower contacting members are disposed above and below the plane, respectively, such that the received planar structure impinges on the contacting members to urge the upper and lower contacting members away from the plane, and the upper and lower contacting members exert opposing holding pressure on the upper and lower surfaces of the planar structure at respective contact points.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: November 17, 2020
    Assignee: Biosense Webster (Israel) Ltd.
    Inventor: Sharona Ben Shoshan
  • Patent number: 10772206
    Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: September 8, 2020
    Assignee: Intel Corporation
    Inventors: Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Eng Huat Goh, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah
  • Patent number: 10770841
    Abstract: A connector system is disclosed that is configured to provide terminals that support data rates of 10 Gbps or more. Such a connector system includes a wafer set configured to enable broad-side coupling of a differential pair of terminals across an air channel formed between the terminals.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: September 8, 2020
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 10476211
    Abstract: A connector system is disclosed that is configured to provide terminals that support data rates of 10 Gbps or more. Such a connector system includes a wafer set configured to enable broad-side coupling of a differential pair of terminals across an air channel formed between the terminals.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 12, 2019
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 10456196
    Abstract: Methods and systems treat abnormal cardiac electrical activity employing a probe having first and second ablation electrodes disposed on a distal portion of the probe and a sensing electrode disposed between the first and second ablation electrodes, bringing the probe into contact with cardiac tissue, and applying energy through the first and second ablation electrodes to ablate target tissue along an ablation path, monitoring cardiac electrical activity using the sensing electrode to detect the cardiac electrical activity. After making an observation that the cardiac electrical activity is no longer detectable by the sensing electrode, energy application is terminated.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: October 29, 2019
    Assignee: Biosense Webster (Israel) Ltd.
    Inventors: Assaf Govari, Andres Claudio Altmann, Yaron Ephrath
  • Patent number: 10276985
    Abstract: A high-speed plug-in card connector comprising two terminal assemblies with reversely arranged internal structure and a housing. Each terminal assembly includes a metal sheet, a conductive plastic, and an injection-molded terminal strip. The conductive plastic is formed on the side of the metal sheet by injection molding and connects the metal sheet with a ground terminal of the terminal strip. The conductive plastics of the two terminal assemblies are located in the very middle of the connector. The conductive plastics fix the two terminal assemblies together with a snap-in connection. The housing is clamped at the end on the side where the two terminal assemblies are snapped together.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: April 30, 2019
    Assignee: AMPHENOL COMMERCIAL PRODUCTS (CHENGDU)) CO. LTD
    Inventors: Xiaogang Liu, Rongzhe Guo, Lei Liao
  • Patent number: 10164380
    Abstract: A connector system is disclosed that is configured to provide terminals at a 0.5 mm pitch with providing for high data rates of 10 Gbps or more. In an embodiment, a 4X connector can be provided that is about the size of a convention SFP connector while still supporting relatively high data rates. This connector can be stacked to provide additional density.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 25, 2018
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 9927487
    Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 27, 2018
    Assignee: MPI CORPORATION
    Inventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
  • Patent number: 9698507
    Abstract: A package structure of a power module includes an insulation frame, a first circuit substrate, an insulation cover, plural first pins, plural posts and a fastening element. The insulation frame includes a sidewall and a first coupling part. The first coupling part is externally protruded from the sidewall. The first coupling part includes a first mounting structure. The first circuit substrate is combined with a bottom part of the insulation frame. The insulation cover is combined with a top part of the insulation frame. The insulation cover includes a second coupling part. The second coupling part includes a second mounting structure. The plural posts are embedded in the at least one first coupling part of the insulation frame, and partially penetrated through the second coupling part. The fastening element is connected with the first mounting structure and the second mounting structure.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: July 4, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Kai-Ti Chang, Ching-Chi Yang, Hsueh-Kuo Liao, Chuna-Jia Cheng
  • Patent number: 9559451
    Abstract: A press-fit terminal is made up of a wire material of predetermined length. At a first end of wire material of the press-fit terminal is formed a tip for insertion into a substrate, and at the other end is formed a connection portion for connection to a corresponding terminal. A press-fit portion for press-fitting into the substrate is formed at the tip side of the wire material of the press-fit terminal, and a shoulder portion is formed to the connecting portion side of the press-fit portion. By making use of the press-fit terminal, damage to the substrate and breakage of contacts can be minimized, consistent insertion force and retaining force can be attained.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: January 31, 2017
    Assignee: J.S.T. MFG. CO., LTD.
    Inventors: Yoshihide Uchida, Takeshi Hinakawa
  • Patent number: 9515461
    Abstract: A modular electric power distribution system transmits power between a power source and control modules for power consumers. The system includes a power distribution unit mounted on each module and bridge assemblies which connect adjacent distribution units.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: December 6, 2016
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Timothy Brian Billman, Scott Anthony Faulkner, Shane Wiest
  • Patent number: 9306562
    Abstract: The present invention relates to a household appliance (1) comprising a panel (2) which is produced from at least partially electrically conductive material, a transparent non-conductive plate (3) which is placed onto the panel (2), more than one sensor (4) which is located on the non-conductive plate (3) and detects the touch of the user on the non-conductive plate (3), a circuit board (5) which evaluates the signals received from the sensor (4) and controls the operation of the household appliance (1) according to these signals, and at least one transmission element (6) which transmits the signals received from the sensor (4) to the circuit board (5).
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: April 5, 2016
    Assignee: ARCELIK ANONIM SIRKETI
    Inventors: Mucahit Bacaksiz, Ahmet Ihsan Yuce
  • Publication number: 20150146384
    Abstract: Disclosed are a multi connector, a wiring method thereof and a display apparatus having the same that is configured to use a common interface (CI) module for data communication between an electronic apparatus and an external apparatus or a plug used for an electronic connection of elements, regardless of standard conditions such as the number of terminals. The multi connector includes a body portion including a first slot portion and a second slot portion; a substrate portion including a substrate having a first surface; a plurality of first connection terminals provided on the first surface and extending to an inside of the first slot portion; and a plurality of second connection terminals provided on the first surface and extending to an inside of the second slot portion.
    Type: Application
    Filed: July 24, 2014
    Publication date: May 28, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Sung-Il CHOI
  • Patent number: 9027241
    Abstract: A method of assembling a medical electrical lead. The method comprises providing a modular connector assembly including three contacts coupled to three contact conductors, selecting a lead body assembly from a group of different lead body assemblies which includes a first lead body assembly having only two conductors for and a second lead body assembly having three conductors; and coupling each of the conductors of the selected lead body assembly with a corresponding contact conductor of the modular connector assembly.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: May 12, 2015
    Assignee: Medtronic, Inc.
    Inventors: Bruce R. Mehdizadeh, Thomas C. Bischoff, Scott J. Robinson, Eric M. Stetz, James W. Millin
  • Publication number: 20150116923
    Abstract: An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable cassettes include floating connectors. The cable cassettes are modular assemblies that contain all the wiring and connectors. As the connectors float in the cable cassettes, the cable cassettes are blind mated to the bulkhead as standalone units.
    Type: Application
    Filed: July 15, 2014
    Publication date: April 30, 2015
    Inventors: David Skirmont, Dan Kilkenny, Anthony Vanderveen, Peter Doyle
  • Patent number: 9015937
    Abstract: A crimping terminal fitting has a wire barrel (21) to be crimped and connected to core strands (31) of a wire (30). The wire barrel (21) has a base plate (23) continuously extending from a ground terminal (11) in a longitudinal direction. Two core crimping pieces (25) extend from the opposite sides of the base plate (23). A thinned portion (27) is formed at least at a leading end of each core crimping piece (25) and is thinner than the base plate (23).
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: April 28, 2015
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Eiko Ukai
  • Publication number: 20150091600
    Abstract: A test socket for IC devices includes a multi-layered socket housing with at least one center layer and first and second surface layers. The first and second surface layers have a thickness and dielectric constant less than that of the center layers. A plurality of contact members are located in center openings in the center layer with distal ends extending into openings in the first and second layers. The distal ends of the contact members having at least one dimension greater than the openings in the first and second surface layers to retain the contact members in the socket housing. The contact members include center portions with major diameters less than the diameters of the center openings, such that an air gap is maintained between the contact members and the center layer.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 2, 2015
    Inventor: JAMES RATHBURN
  • Patent number: 8984748
    Abstract: A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 24, 2015
    Assignee: Hsio Technologies, LLC
    Inventor: James Rathburn
  • Patent number: 8959764
    Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu
  • Patent number: 8939793
    Abstract: An apparatus having a connector housing having an interior socket to receive a connector plug. The connector housing including a mounting hole through the interior socket, the mounting hole comprising a top opening in a first side of the interior socket and a bottom opening in a second side of the interior socket, the first side opposite the second side. A central axis of the mounting hole is oriented perpendicular to a central axis of the interior socket and the central axis of the mounting hole intersects the central axis of the interior socket, the mounting hole to allow a mounting element to pass through the interior socket along the central axis of the mounting hole.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: January 27, 2015
    Assignee: Amazon Technologies, Inc.
    Inventor: Valentin Shaun de la Fuente
  • Patent number: 8904633
    Abstract: An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: December 9, 2014
    Assignee: TRW Automotive U.S. LLC
    Inventors: Mike Blossfeld, Luis Fernando Sanchez
  • Patent number: 8898896
    Abstract: The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: December 2, 2014
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Francois Marion, Damien Saint-Patrice
  • Publication number: 20140345134
    Abstract: A method of manufacturing an insertion-type connector having at least two mutually electrically insulated conductor contacts with the conductor contacts cut from a metal sheet in such a way that they are connected together via a connecting part of the metal sheet, the conductor contacts being partly embedded in an electrically insulating material to form an electrically insulating housing which fixes the conductor contacts relative to one another, and the connecting part then separated off.
    Type: Application
    Filed: December 3, 2012
    Publication date: November 27, 2014
    Inventor: Martin Zebhauser
  • Patent number: 8887387
    Abstract: A method of making a lead for a stimulation device includes forming at least one pre-electrode in the shape of a ring, the at least one pre-electrode comprises at least two thin-walled portions separated by at least two thick-walled portions; disposing the at least one pre-electrode near a distal end of a lead body; joining at least one conductor to each thick-walled portion of the at least one pre-electrode; and grinding the lead body and the at least one pre-electrode to remove the thin-walled portions of the at least one pre-electrode to form segmented electrodes from the thick-walled portions of the at least one pre-electrode.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: November 18, 2014
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventor: Anne Margaret Pianca
  • Publication number: 20140310957
    Abstract: Electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to an underlying substrate are provided. Certain of the electrical connectors can be configured to be mounted to a substrate configured in accordance with the MicroTCA® press fit footprint. Additionally, electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to respective alternative footprints, and substrates configured in accordance with the respective alternative footprints are provided. The disclosed electrical connectors and corresponding substrate footprints can operate to transmit data at speed up to and in excess of 25 Gigabits per second.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 23, 2014
    Inventors: Jonathan E. Buck, Madhumitha Rengarajan
  • Publication number: 20140309510
    Abstract: A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.
    Type: Application
    Filed: June 25, 2014
    Publication date: October 16, 2014
    Inventors: Joseph Y. Lucisano, Richard E. Calou, Mark B. Catlin, Joe T. Lin, Timothy L. Routh
  • Patent number: 8857052
    Abstract: A flexure assembly includes two metallic flexure arrays molded into a thermoplastic support base. The two flexure arrays are positioned in parallel in the thermoplastic support base to allow rotational movement about one axis while providing high stiffness with respect to off-axis movement. Flexible supports in the two flexure arrays may be interleaved to form a cross flexure configuration. Off-axis stiffness of the flexure assembly prevents harmonic resonance in directions that cannot be compensated for in a single-axis actuator.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: October 14, 2014
    Assignee: Prysm, Inc.
    Inventor: Bruce A. Borchers
  • Patent number: 8850702
    Abstract: The embodiments herein relate to a conductor cable for use in a lead and more specifically to methods and devices related to laser consolidation of the cable. The various conductor cable embodiments and methods provide for at least one end of the cable having a weld mass created by a laser welding process.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: October 7, 2014
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Peter Hall, Haiping Shao
  • Patent number: 8832936
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: September 16, 2014
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Publication number: 20140245606
    Abstract: A USB3.0 connector includes an insulative body, a plurality of first and second terminals, and an outer shell covering the insulative body. The insulative body includes a base that has a base upper wall, a base lower wall, and two base sidewalls. The base lower wall has a rear end notched in a frontward direction to form a plurality of alternating shallow and deep notches to position first and second legs of the first and second terminals, which are bent downwardly. The alternating shallow and deep notches space the first legs apart from the second legs, respectively. The number of component parts for assembly is therefore reduced.
    Type: Application
    Filed: May 14, 2014
    Publication date: September 4, 2014
    Applicant: EXCEL CELL ELECTRONIC CO., LTD.
    Inventors: Chih-Ming LIN, Lee-Yen SUN
  • Publication number: 20140213085
    Abstract: A card edge connector includes an ejector (3) with a pushing portion (32) extending from distal end thereof, the ejector (3) moves between an opening station and a locking station, and at least pair detecting contacts (4) which includes two detecting pins (41, 42), one of the detecting pins defines a spring engaging arm having an engaging portion (425) opposite to the pushing portion (32) which presses on the engaging portion (425) in the locking station or leave the engaging portion (425) in the opening station, thereby making the two detecting pins engage or disengage with each other for detecting if a memory card is inserted in the card edge connector or not.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 31, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: ZE-LIN YAO, XIAO-ZHI FU
  • Patent number: 8782884
    Abstract: A method for manufacturing an electrode assembly. The method comprises: forming a comb having a plurality of electrode contacts, wherein the surface of at least one of the electrode contacts comprises a plurality of indentations such that the effective surface area per area unit of a center region of the at least one electrode contact is larger than the effective surface area per area unit of the of the region of the surface outside the center region; assembling an array of electrode contacts from the comb; molding a carrier member about the assembled array of electrode contacts, wherein a surface of the at least one electrode contact is covered by a layer of the carrier member material; and removing the layer of carrier member material on the surface of the at least one electrode contact.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: July 22, 2014
    Assignee: Cochlear Limited
    Inventors: Edmond D. Capcelea, Peter Gibson, Fysh Dadd
  • Publication number: 20140188086
    Abstract: A catheter handle, including a housing, configured to be gripped by an operator of a catheter coupled to the housing during a medical procedure using the catheter, the housing being formed of a first polymer and having an aperture formed therein. The handle includes an insert, formed of a second polymer, and configured to be introduced into the aperture so as to mate therewith. The handle further includes a plurality of contacts, configured to be implanted into the insert in a preset spatial relationship.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: BIOSENSE WEBSTER (ISRAEL), LTD.
    Inventors: Assaf Govari, Christopher Thomas Beeckler
  • Patent number: 8752284
    Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: June 17, 2014
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas
  • Publication number: 20140141647
    Abstract: An improved electronic receptacle connector employs contacts that are partially encapsulated with a thermally conductive polymer. The thermally conductive polymer aids in the distribution of heat within the contact and may further form heat transfer features to conduct heat to other connector components such as the shell. The thermally conductive polymer may be used to encapsulate multiple contacts within a substantially unitary block.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Applicant: Apple Inc.
    Inventor: Trent K. Do
  • Publication number: 20140090246
    Abstract: An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
    Type: Application
    Filed: November 5, 2013
    Publication date: April 3, 2014
    Applicant: TRW Automotive U.S. LLC
    Inventors: Mike Blossfeld, Luis Fernando Sanchez
  • Patent number: 8671567
    Abstract: A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 ? and 170 ?. The contained amount of boron is from 0.02 wt % to 0.20 wt %.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: March 18, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hideki Hirakawa, Satoshi Kaizuka
  • Patent number: 8656577
    Abstract: A method of manufacturing an electrode for use in a plasma arc torch is provided that includes forming a conductive body to define a proximal end portion, a distal end portion, a distal end face disposed at the distal end portion, a central cavity, and a central protrusion disposed within the central cavity near the distal end portion. A plurality of emissive inserts are inserted through the distal end face and into the central protrusion. The plurality of emissive inserts are pressed into the central protrusion and both a proximal end portion of the central protrusion and the plurality of emissive inserts are deformed such that the plurality of emissive inserts extend radially and outwardly from the distal end portion at an angle relative to the distal end portion.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: February 25, 2014
    Assignee: Thermal Dynamics Corporation
    Inventors: Nakhleh Hussary, Christopher J. Conway
  • Patent number: 8656581
    Abstract: A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: February 25, 2014
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Makoto Murai, Yasuhiro Kohara, Ryosuke Usui
  • Patent number: 8650750
    Abstract: A data cable connector module with a fixation element for the positioning and fixation of the cable conductors of a multi core cable, conductor receiving units for bent IDCs, IDC receiving units for fixation of connected IDCs; a centric metallic shield star electrically conductively connected with a fixation element housing; and a contact module with a contact module metal housing, an isolation socket for the reception of bent slide circuit board contacts; at least one circuit board, a front connector face; and a fixation element connector face with at least one end isolator block guided plug-in contacts, the fixation element and the contact module being developed so that they can be brought into contact with the IDCs, causing the cable conductors of the fixation element to be electrically conductively connected with the slide contacts of the contact module; and a process for the assembly of the module to a cable.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: February 18, 2014
    Assignee: LEONI Kabel Holding GmbH
    Inventors: Yvan Engels, Ernst Klees, Joachim Zellner, Wolfgang Schuh
  • Patent number: 8637771
    Abstract: The disclosed invention describes a motor/generator coil produced using rectangular electric current conductors of any thickness and width. A unique joint between the up and down segments of the coil turn enables an improved conductor packing ratio and geometrical orientation that minimizes the effect of eddy currents. The resulting coil produces higher power than typical wire wound motors but is lighter weight and physically smaller in size. In addition, the coil can be free-standing, and is capable of slotless and/or ironless core device configuration.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: January 28, 2014
    Inventors: Greald W Yankie, Gregory S Graham
  • Patent number: 8627564
    Abstract: An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is moimtabie in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: January 14, 2014
    Assignee: TRW Automotive U.S. LLC
    Inventors: Mike Blossfeld, Luis Fernando Sanchez
  • Publication number: 20140007427
    Abstract: The invention relates to a method for fabricating a plug (18) formed from a plug housing (19) and elongate contacts (3), the contacts (3) comprising a bent longitudinal axis (23) inside the finished plug (18), characterised by: introducing front portions (3a) of the contacts (3) into contact receptacles (17) of a plug housing part (7); holding the plug housing part (7) by means of a first holding arrangement (15) of a plug fabrication device (20); holding rear portions (3b) of the contacts (3) by means of a second holding arrangement (21) of the plug fabrication device (20); pivoting the first holding arrangement (15) with the plug housing part (7) held thereby relative to the second holding arrangement (21) with the contacts (3) held thereby, whereby the longitudinal axis (23) of the contacts (3) is bent in the region between their front portions (3a) and their rear portions (3b).
    Type: Application
    Filed: April 18, 2013
    Publication date: January 9, 2014
    Applicant: Schleuniger Holding AG
    Inventor: Schleuniger Holding AG
  • Publication number: 20130328484
    Abstract: Connector adapters that may allow contacts in a connector insert to form electrical connections with contacts in an incompatible connector receptacle. One example may provide a connector adapter for providing a connection between a connector insert and an incompatible connector receptacle. The connector adapter may be a magnetic connector providing a magnetic connector receptacle at a first end to accept a connector insert having an attraction plate. This connector adapter may further provide a connector insert having an attraction plate at a second end to insert into a magnetic connector receptacle on an electrical device.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 12, 2013
    Applicant: Apple Inc.
    Inventors: Cesar Lozano Villarreal, James G. Smeenge, Chiew-Siang Goh
  • Publication number: 20130330977
    Abstract: Connector receptacles for hard-disk drives that do not consume a significant amount of space. One connector receptacle may include a housing having one or more horizontal slots corresponding to one or more tongues of a connector insert. The connector receptacle may include a number of vertical slots, each having a contact to form an electrical connection with a contact on the one or more tongues. These contacts may emerge from the top of the housing to connect to a flexible conductor. A stiffening layer may be placed over the top of the flexible conductor. The housing may also include vertical bridging pieces that may be located between a top portion and a bottom portion of the connector receptacle. Shielding may be included above, in front of, or below the housing, or any combination thereof.
    Type: Application
    Filed: June 10, 2012
    Publication date: December 12, 2013
    Applicant: Apple Inc.
    Inventor: Brett Degner
  • Publication number: 20130323969
    Abstract: A socket for electronic components includes a shield plate assembly that is formed by combining first shield plates with second shield plates in the form of a lattice and has conductivity, and contact units electrically connected to electrode terminals of electronic components are disposed in openings of the lattice of the shield plate assembly so that the electrode terminals are electrically connected to the wiring of a wiring board. The shield plate assembly is formed in a shape where lines where openings of the lattice are lined up in a first direction are arranged side by side in a second direction orthogonal to the first direction, and the openings of the adjacent lines are formed so as to be shifted relative to the openings of the next lines in the first direction by a half of the length of the side of the opening that extends in the first direction.
    Type: Application
    Filed: May 10, 2013
    Publication date: December 5, 2013
    Applicant: ALPS ELECTRIC CO., LTD.
    Inventors: Takeki Uozumi, Nobuyuki Okuda, Shigetomo Chiba
  • Patent number: 8591272
    Abstract: By using a lead frame as an intermediate member, a contact group of a connector is manufactured. The lead frame includes a plurality of first leads arranged on a plane and spaced from one another, a plurality of pairs of second leads, each pair being arranged on the plane between the first leads, and a connecting portion connecting the first and the second leads on one end side. The second leads have a pitch which is greater on the other end side than that on the one end side to make the second leads approach the first leads on the other end side, respectively. The lead frame further includes bridge portions connecting approached ones of the first and the second leads to each other at a portion where an interval between the first and the second leads is reduced.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 26, 2013
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Masayuki Shiratori, Shuichi Aihara, Masayuki Katayanagi, Osamu Hashiguchi
  • Publication number: 20130289681
    Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.
    Type: Application
    Filed: February 21, 2013
    Publication date: October 31, 2013
    Applicant: MEDTRONIC, INC.
    Inventors: Rajesh V. Iyer, Michael G. Marinkov, Lea A. Nygren, Brad C. Tischendorf
  • Patent number: 8549746
    Abstract: The invention proposes a process for the surface treatment of aluminum in order to produce an electrical contact, and a corresponding component part, wherein an oxide layer on the aluminum surface is removed, for example by etching, in a first step and, in a second step, before an oxide layer is re-formed, the surface is sealed wet-chemically with a conversion layer having metal ions of zirconium or titanium.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: October 8, 2013
    Assignee: VALEO Schalter und Sensoren GmbH
    Inventors: Hans-Wilhelm Wehling, Stefan Robert Muller, Dietmar Gruedl