Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.

Abstract: The invention proposes a process for the surface treatment of aluminum in order to produce an electrical contact, and a corresponding component part, wherein an oxide layer on the aluminum surface is removed, for example by etching, in a first step and, in a second step, before an oxide layer is re-formed, the surface is sealed wet-chemically with a conversion layer having metal ions of zirconium or titanium.

Abstract: A method of repairing a used electrode device is disclosed wherein a used electrode assembly has an inner conductor with an integral electrode tip; the inner conductor is encapsulated in an insulator body having an outer conductor and an outer electrode tip; and an outer sleeve is attached to the insulator body, the sleeve being filled with a particle suspended fluid and the sleeve being retained by a metal ring at the location of attachment to the insulator body prior to removing the inner conductor from the insulator body; the electrode assembly is placed in a fixture with a collet holding the metal ring in place; the sleeve is pushed upon to release the ring; and the inner conductor is pressed with the integral electrode tip while holding or restraining the insulator body to apply a force sufficient to disengage the inner conductor from the insulator body.

Abstract: A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.

Abstract: 2N (where N=1, 2, 3, . . . ) rod-shaped terminals, having overall lengths that vary in sequence, are formed out of a single metal plate by press punching. In the metal plate, rod bodies bridging between a first carrier and a second carrier are arranged so that the lengthwise direction of the rod bodies is perpendicular to the lengthwise direction of the metal plate, the 2N terminals are divided such that the first N in descending order of length are in a first group, and the remaining N are in a second group, the n-th shortest terminal and the n-th longest terminal are selected from the terminals of the first and second groups and combined one by one, and each combined pair of terminals is disposed in series over one rod body.

Abstract: A method of fabricating a substrate via structure in a substrate/chip assembly includes steps of: disposing a center via stack for electrical interconnects in the substrate/chip assembly; and providing a plurality of stacked vias surrounding the center via stack. The plurality of stacked vias encircle the center via stack, resulting in no isolated via stacks on the structure. The plurality of stacked vias have both functional and non-functional vias.

Abstract: A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract: An electrical assembly can include one or more electrical connectors. Each electrical connector can include at least a first connector housing supporting a plurality of electrical power contacts and a second connector housing supporting a plurality of electrical signal contacts. Each of the first and second connector housings can define respective receptacles that are open on respective opposed sides of the first and second connector housings. Each electrical connector can further include at least one, such as a plurality of closure members configured to close the receptacles at respective lateral sides of the first and second connector housings. The closure members of the first and second electrical connectors can comprise at least one or all of end members, interconnect members, and spacer members.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: An apparatus and method are disclosed for manufacturing an electrical connector. A mold is presented having a pair of opposing dies that each define a mold pocket. The mold pockets of each die can be joined to form a mold cavity. Plastic can be injection molded into the mold cavity to form an electrical connector housing.

Abstract: A method for producing a connector has first to fifth processes. In the first process, a contact unit having a plurality of contacts and a tying part, is formed with the contacts tied at each axial direction middle part of the contacts by the tying part and with the contacts arranged parallel to each other. In the second process, a plating layer is formed on a part of the contact unit by soaking the contact unit in a plating bath from an axial direction one end side of the contact unit to an axial direction middle part of the tying part. In the third process, the contacts are isolated by cutting the tying part. In the fourth process, a part where the plating layer is formed, of the contact is inserted into a hole of a circuit board. In the fifth process, the contacts are soldered to the circuit board.

Abstract: Band electrode arrays, methods of manufacturing, and a method of using are disclosed. The arrays have individually addressable band electrodes such that diffusion layers of the band electrodes overlap. An exemplary method of manufacturing may comprise: a first insulating layer is disposed on a substrate; a first band electrode is disposed on the first insulating layer; a second insulating layer is disposed on the first insulating layer and completely covers the first band electrode; a second band electrode is disposed on the second insulating layer; a third insulating layer is disposed on the second insulating layer and completely covers the second band electrode; the first and second band electrodes are electrically insulated from each other and individually addressable; cross-sectional surfaces of the first and second band electrodes are exposed on the test surface; and these exposed cross-sectional surfaces substantially overlap each other in a direction perpendicular to the substrate.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: Preparation is made of first and second contact assemblies in each of which ends of a plurality of contacts are respectively coupled to a plurality of coupling portions of a carrier. The coupling portions of at least one of the first and second contact assemblies are bent so as to offset the contacts in a thickness direction of the carrier. Then, the first and second contact assemblies are combined together in a state where the carriers overlap each other and the contacts are aligned with and spaced apart from each other in the same plane. After integrating the contacts, the coupling portions are cut off. Then, the integrated contacts are collectively inserted into a shell.

Abstract: Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate, masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask.

Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Abstract: A method is provided for creating an electrode node array device. First and second conductors are stamped from a stock sheet. Each of the conductors has a plurality of raised protrusions. The protrusions are interleaved in a manner in which in both directions of the array, a raised protrusion of one conductor alternates with a raised protrusion of the other conductor. The method includes assembling the device in stages on a vacuum apparatus having guide pins that interact with guide holes on laminate sheets that are applied to both sides of the first and second conductors.

Abstract: An ablation probe and method of manufacturing the ablation probe are provided. The probe comprises a probe shaft and a unibody electrode element. The unibody electrode element comprises a common electrode base located at the distal end of the shaft, and a plurality of electrode tines distally extending from the electrode base. The electrode element may be created by forming divisions (such as slits or slots) from a first end of an electrically conductive elongate member towards an opposing second end of the elongate member. Alternatively, the divisions can be formed from a first end of an electrically conductive sheet towards an opposing second end of the sheet, and then bent or rolled to form the elongate member. In either case, the common electrode base can either be separately mounted to a probe shaft, or the probe shaft can be formed from the elongate member, in which case, the electrode base will be integrated with the probe shaft as a unibody structure. The electrode tines can be optionally shaped, e.g.

Abstract: A first patterned etch stop layer and a first patterned conductor layer are laminated by a dielectric material to a second patterned etch stop layer and a second patterned conductor layer. As the etch stop metal of the first and second patterned etch stop layers is selectively etchable compared to a conductor metal of the first and second patterned conductor layers, the first and second patterned etch stop layers provide an etch stop for substrate formation etch processes. In this manner, etching of the first and second patterned conductor layers is avoided insuring that impedance is controlled to within tight tolerance.

Abstract: The present invention relates to an elongated male connector (1), for a medical device, and a method of producing the male connector (1). The male connector (1) has a longitudinal axis (2) and comprises a plurality of conductive members (3), each having an outer contact surface (4) and being separated from each other by insulating members (5). The conductive and insulating members (3, 5) are disposed along the male connector (1), such that the outer contact surfaces (4) are arranged essentially at the same surface level, and that each of the conductive members (3) has an elongated extension along the longitudinal axis (2) of the male connector (1). Each conductive member (3) is provided with an insulated microrod (6) extending at least partially along the length of the male connector (1), and the conductive members (3) are hollow and have an essentially cylindrical cross-section and form, together with the insulating members (5), a self-supporting male connector (1) having no core wire.

Abstract: A USB3.0 connector includes an insulative body, a plurality of first and second terminals, and an outer shell covering the insulative body. The insulative body includes a base that has a base upper wall, a base lower wall, and two base sidewalls. The base lower wall has a rear end notched in a frontward direction to form a plurality of alternating shallow and deep notches to position first and second legs of the first and second terminals, which are bent downwardly. The alternating shallow and deep notches space the first legs apart from the secondlegs, respectively. The number of component parts for assembly is therefore reduced.

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate, a first dielectric layer, an underfill layer, a first solder structure, and a second substrate. The first dielectric layer is formed over a top surface of the first substrate. The first dielectric layer includes a first opening extending through a top surface and a bottom surface of said first dielectric layer. The first solder structure is formed within the first opening and over a portion of the top surface of said first dielectric layer. The second substrate is formed over and in contact with the underfill layer.

Abstract: Disclosed is a method of making an arrangement for collecting or emitting light. A flexible sheet of material serves as substrate for a plurality of light collecting or emitting devices mounted in spaced relation on the sheet. The sheet has thereon electrical leads for interconnection to each device. For each device, a respective light coupler is formed by (1) forming a plurality of reflectors on the sheet around the intended periphery of the respective device, by applying reflective material to selected areas of the sheet; (2) forming cut lines around selected edges of the plurality of reflectors; (3) forming fold lines associated with the reflectors; and (4) folding the reflectors and attached substrate away from the substrate portion on which the device is mounted, to form a coupler whose interior is reflective and that is substantially closed around a main axis of light propagation into or from the respective device.

Abstract: The goal is to enhance the productivity by reducing the cost of a die. A method for selectively forming a female terminal (30) and a male terminal (40), each terminal having a square tubular box portion (31, 41) in its front and a wire crimping portion (38, 39, 48, 49) in its rear, from blanks (20) punched into a common shape is provided. In a step of punching the blank, a front projection (22) which becomes a spring piece (32) when the female terminal is produced and becomes a male tab (42) when the male terminal is produced is projected from the front end of a strip-like base plate (21) constituting a bottom plate of the square tubular box portion, and a blank in which right and left projections (28, 29) constituting the wire crimping portions are projected is formed in the rear of the base plate.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. A plurality of slots are formed in the sidewall of said interposer for the venting of gases and pressure therethrough.

Abstract: A connector assembling jig is used for a housing (20) that includes a main body (22) with terminal accommodating portions (21) and locking pieces (23) for locking terminal fittings (10) in the terminal accommodating portions (21) and in which each locking piece (23) projects from the main body (22) in an insufficient inserted state of the corresponding terminal fitting (10), and can detect insufficient insertion of the terminal fitting (10) when the terminal fitting (10) is inserted into the terminal accommodating portion (21). The connector assembling jig has a holder (30) including an accommodating recess (34) for the housing (20) and a detection arm (32) which is set to an insufficient insertion detecting posture when any locking piece (23) projects, and the accommodating recess (34) is formed with a positioning groove (68) for receiving a positioning rib (24) of the housing (20).

Abstract: A receptacle block defines one or more sockets at which plugs may be received. Each socket contains a first set of contacts and a second set of contacts. Each socket also includes a sensing contact that interacts with the second set of contacts to close an electrical switch. For example, the sensing contact can interact with an arm extending from one of the contacts of the second set. Closure of the switch can be detected and interpreted to indicate that a plug has been received at the respective socket.

Abstract: A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.

Abstract: Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

Abstract: A method for forming a lead or lead extension includes forming an arrangement of elongated conductors. Each of the conductors extends from a proximal end of the arrangement to a distal end of the arrangement. Each of the conductors includes a layer of insulation disposed over a conductive core. A conductor-separating element is disposed over either the proximal end or the distal end of the arrangement. The conductor-separating element includes a plurality of ablation windows defined in a body. An end of at least one of the elongated conductors is radially extended over a portion of the conductor-separating element such that a portion of the at least one elongated conductor extends across at least one of the ablation windows. Insulation from the portion of the at least one conductor extending across the ablation window is ablated to expose a portion of the conductive core of the elongated conductor.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and mounting at least one interposer on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. At least one sidewall of the interposer is slitted to facilitate the venting of gases and pressure therethrough. The method includes arranging a plurality of electrically-conductive elements about the surface of the at least one hemi-toroidal interposer and extending them radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract: A technique for anchoring carbon nanotube columns to a substrate can include use of a filler material placed onto the surface of the substrate into area between the columns and surrounding a base portion of each of the columns.

Abstract: A contactor includes conductive parts for electrical connection with input/output terminals of an IC device; beam parts with the conductive part provided on their main surfaces; and a base part supporting the beam parts in a cantilever manner, the base part has a support region supporting the beam parts and mark formation regions at which first positioning marks are provided, and weakened parts relatively weaker in strength than other parts of the base part are provided between the support region and mark formation regions.

Abstract: In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.

Abstract: Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.

Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.

Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structures and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract: A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture.

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

Abstract: A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract: A socket receptive to insertion of an integrated circuit (IC) printed circuit board (PCB) includes a housing, conductors, and vents. The housing has first and second sides corresponding to a length of the IC PCB. The conductors are mounted within the housing to mate with corresponding conductors of the IC PCB upon insertion of the IC PCB into the housing, and have leads adapted to being soldered to corresponding conductors of a host PCB. The vents are within the housing and are adapted to dissipate heat resulting from soldering the leads to the host PCB to minimize warping of the housing during soldering. The vents are further adapted to compensate for a mismatch between a coefficient of thermal expansion (CTE) of the housing and a CTE of the host PCB during soldering, regardless of the CTE of the host PCB.

Abstract: A junction box for a solar panel comprises a housing, a lid, a first connector and a second connector. The housing comprises sidewalls and a top wall defining an interior space. The first coupling comprises a first contact element and the second coupling comprises a second contact element. Said contact elements penetrate at least one of the sidewalls, so that the contact elements provide an electrical contact from external contact elements to internal contact elements, such as solder tails. Internal contact elements are arranged at least partially in said interior space. The top wall comprises an opening extending only partially in said top wall. Said opening is located such in the top wall that access to said solder tails in a substantially perpendicular direction to the surface of a solar panel for connecting the solder tail to the solar panel is provided.

Abstract: An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and a semiconductor chip attached to the lead frame.

Abstract: A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is disposed on a supporting plate, and an embedded component is disposed in the through hole, wherein the second metallic layer contacts the supporting plate, and the embedded component has at least one electrode contacting the supporting plate. The embedded component is mounted in the through hole. The supporting plate is removed. The first and second metallic layers are removed, and the thickness of the electrode of the embedded component is decreased. Third and fourth metallic layers are formed respectively, wherein the fourth metallic layer is electrically connected to the electrode of the embedded component. Finally, the third and fourth metallic layers are patterned so as to respectively form first and second patterned circuit layers.

Abstract: An electrical connector includes an insulative housing, a plurality of terminals and a pair of board locks retained in the housing. The insulative housing defines a mating surface, a mounting surface opposite to the mating surface, a plurality of passageways penetrating through the mating surface and a pair of slots penetrating through the mounting face and a first side face of the insulative housing. The terminals are received in the passageways. The board locks are secured in the corresponding slots of the insulative housing. Each board lock includes a retention portion and a lock tail extending from the retention portion beyond the mounting face. The insulative housing further defines a pair of block portions unitarily protruding from the first side face adjacent to the corresponding slots, and each board lock includes a retaining portion abutting against the corresponding block portion on a face opposite to the mounting face.