Abstract: Embodiments of a process comprising forming one or more micro-electro-mechanical (MEMS) probe on a conductive metal oxide semiconductor (CMOS) wafer, wherein each MEMS probe comprises a cantilever beam with a fixed end and a free end and wherein the CMOS wafer has circuitry thereon; forming an unsharpened tip at or near the free end of each cantilever beam; depositing a silicide-forming material over the tip; annealing the wafer to sharpen the tip; and exposing the sharpened tip.

Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

Abstract: According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

Abstract: In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A method for manufacturing a bump of a probe card is disclosed. In accordance with the present invention, the bump has a high aspect ratio, a high elasticity, a high durability suitable for testing a high speed device. The bump is formed using a sacrificial substrate as a mold to have a shape of ? or II for elasticity and durability.

Abstract: A method for producing electric contact parts includes the following stages: a) stamping a strip of electric conducting parts connected together in the longitudinal direction (X-X) by a continuous strip; b) inserting said strip inside a mould; c) over-moulding the conducting parts with insulating material depending on the final form envisaged for the electric contact part; d) cutting the continuous strip in the region of the flat pins; e) extracting the finished parts.

Abstract: A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part.

Abstract: The invention relates to a test device for electrical testing of a unit under test, in particular for the testing of wafers, having a contact head which can be associated with the unit under test and is provided with contact elements which are in the form of pins and form a contact pin arrangement, and having an electrical connecting apparatus, which has contact surfaces which make a touching contact with those ends of the contact elements which face away from the test plane accommodating the unit under test. The invention provides that the contact surfaces are on axial contact elements which extend in the axial direction and are in the form of mechanically processed contact surfaces.

Abstract: A method is disclosed for making a connector for preventing electrostatic discharge during connection of a USB-type connector. The connector includes a grounding clip provided within a recess formed at least partially down into the surface of the second level of the base block. The grounding clip may have a proximal end affixed to a proximal end of a signal ground pin of the plurality of signal pins, though the grounding clip and signal ground pin may be coupled at other locations along their lengths. The connector including the grounding clip may be affixed to a semiconductor device. A portion of the grounding clip is provided at a height above the surface of the base block such that, when a shroud is slid around the connector, the shroud engages and remains in contact with the grounding clip. Accordingly, any electrostatic discharge built up in the shroud travels from the shroud, through the ESD grounding clip, to the signal ground pin where it is harmlessly dissipated.

Abstract: A plate member includes a frame portion (51) provided in a state of coupling both one end portion and other end portion and mounting terminal portions (44) protruding from the one end portion and the other end portion of said frame portion (51) to approach each other, from which a PCB joint portions (46) to be a mounting portion to a PCB are formed by cutting and bending when manufacturing a magnetic element. Further, a winding number adjustment means (41), which is capable of selecting joint portions with ends of a coil and adjusting the winding number of the coil in accordance with the selection, protrudes from the one end portion and the other end portion to approach each other farther as compared to the mounting terminal portions (44).

Abstract: An architecture for increasing the normalized working range of connectors having arrays of small contacts. One configuration includes a plurality of pairs of opposed contacts that are arranged in a staggered fashion. The opposed contacts are configured to engage an external contact array in a staggered fashion. The contact arm length of elastic contacts can be substantially greater than the effective array pitch of the plurality of pairs of opposed contacts. Accordingly, the vertical displacement range of three dimensional contacts formed in the connector can be much greater than for in-line contact arrangements.

Abstract: A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions disposed on opposite sides of the flexible insulating sheet that form a contact channel region that retains a rim portion surrounding an opening. The electrical connector provides a flexible carrier for the contacts to conform to irregular mating surfaces of components to be joined. For a given contact height, the electrical connector further provides a minimum electrical path length for components connected by the contacts board. In one aspect, the metallic contacts including at least one side containing elastic portions are formed from sheets of conductive material. In one aspect, circular shaped contacts are singulated after opposing conductive sheets are joined in regions within the openings of the flexible insulating sheet.

Abstract: A method for producing stator packs for long-stator linear motors of magnetic levitation vehicles is described. At first steel sheets are stacked to form a sheet stack, cross members are inserted into grooves of the sheet stack and the sheet stack and the cross members are connected with each other to form a solid structural unit. Further it is provided to so insert the structural unit into an open-top casting mold that the cross members are laid onto rims of the casting mold by means of head parts provided at their ends and are positioned by means of positioning pins provided at said ends. Afterwards the filling of the casting mold with a casting resin mixture takes place, advantageously pressureless, for the formation of a corrosion protection layer surrounding the sheet stack. After the hardening of the casting resin mixture the finished stator pack can be removed from the casting mold.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. The conductors are bent as necessary and passed in a reel-to-reel manner through an insert injection molding process to form an electrically insulating casing about the conductors. After the molding process, the ribbon is singulated to obtain individual lead frame connectors. The individual conductors encased in the casing can be electrically separated by punching out a connecting conductive structure through a hole formed in the casing. The connecting conductive structure mechanically secures the conductors to each other during the molding process and, when punched out, substantially eliminate stubs that could otherwise degrade the RF performance of the lead frame connectors.

Abstract: The present invention generally relates to a method for forming a flat panel for an X-ray detector device. The method comprises forming an active area of a first size on a substrate of a second size and extending at least one contact of the active area. The method further comprises trimming the substrate to the first size forming the flat panel.

Abstract: An electrical box is mounted on a wall stud, and a wiring panel is installed within the electrical box so as to partition the interior of the electrical box into a user inaccessible wiring compartment and a user accessible module compartment. A protective cover is attached to the wiring panel so as to protect the wiring panel during a makeup phase of wall panel installation and painting. After the makeup phase, the protective cover is removed from the wiring panel and a module having a user operable electrical function is mounted to the wiring panel within the user accessible module compartment.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: A device has a first terminal, second terminal and at least four lateral faces provided with contact areas, of which two respective ones each are mutually opposite. The contact areas of the mutually opposite lateral faces are connected to different ones of the first and second terminals.

Abstract: Disclosed is a heat staking process using a configuration to join two conductive yarn traces or pads by piercing them with a thermo plastic stud shaped somewhat like a rivet with a pointed post to pierce the fabrics. A properly designed tool can be lowered to meet the pointed tip of the stud and by using the proper heat and proper compression will join the two fabric pieces mechanically and electrically. The heat and compression formed stud 50 will provide mechanical strength and actually seal the connection if so required.

Abstract: A nanoprobe includes a substrate having a layer, which forms a projected portion. A plurality of conductive lines is adhered to the projected portion and the lines extend beyond an end of the projected portion by a distance to form contact points, wherein the lines are connected to material of the projected portion to provide stiffness and the contact points provide flexibility during use.

Abstract: A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

Abstract: A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

Abstract: The present invention discloses a manufacturing method for electrical connector, comprising the following steps: (1) provide an electrical insulating body disposed with a plurality of contact portions; (2) coat a first conductive layer of copper on the electrical insulating body with physical vapor deposition; (3) coat a second conductive layer of copper on the first conductive layer. A manufacturing method of electrical connector according to the present invention provides a simply manufacturing process without many steps of compressing or bending to process conductive terminals, guarantees a good quality of electrical conduction from the coated layer, and provides an effective contact between the electrical connector and its butted electronic devices.

Abstract: A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.

Abstract: A method for manufacturing an electrical contact includes providing a series of electrical contacts joined on a carrier strip to a plating station followed by an induction heating station. At the plating station, plating the electrical contacts with a conductive alloy coating to form coated electrical contacts. At the induction heating station, induction heating the coated electrical contacts.

Abstract: A high speed electrical connector is provided that comprises a substantially planar dielectric, a substantially planar ground plane, and a signal conductor. The ground plane is disposed on one planar surface of the planar dielectric and the signal conductor is disposed on the opposing planar surface of the planar dielectric.

Abstract: There is disclosed a method for manufacturing and mounting electric contacts for control members of small dimensions, particularly for control members used in the horological field.

Abstract: It is an object of the present invention to provide a contact press-fitting apparatus which can perform the press-fitting of all of the contacts with high reliability, without leading to problems such as buckling of the contacts, even in cases where the array pitch of the contacts is uneven. The contact press-fitting apparatus comprises a supporting member which is inserted into the press-fitting head from a direction perpendicular to the press-fitting direction of the press-fitting head, and which supports the side surfaces of the contacts on the sides that the abutting part does not abut against.

Abstract: A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract: The invention is to provide a method of making an electrical connector. The method of making an electrical connector includes the following steps: (1) providing an insulator, which has a plurality of contact portions and a plurality of connecting portions, (2) coating a conducting layer on the insulator by a physical coating method, and (3) cutting the conducting layer between the contact portions and the connecting portions, such that the contact portions are formed as independent conducting areas. According to the method of making an electrical connector of the invention, the method is simple and does not use conducting terminals that have been compressed or bent several times. In this way, the quality is easily ensured, and the electrical connectors made by the method are capable of performing effective contacting with the electrical components.

Abstract: A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract: A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.

Abstract: A method of simultaneously fabricating a plurality of circuit blocks is presented. Each circuit block is configured for aligned positioning onto a housing of an individual electrical connector. The method includes simultaneously fabricating a plurality of circuits on a single sheet of material and cutting a repeating pattern of holes across the sheet of material. Then the sheet is separated into individual identical sections that have one or more peripheral edge. A circuit board is defined by each section. Each of the sections has a peripheral shape that is defined by the one or more peripheral edges. The peripheral shape is sized and configured to be receivable in only one orientation into a housing of an electrical connector. The holes are cut in the sheet of material such that holes are associated with each peripheral edge of each section.

Abstract: A method of forming solder connection portions on first electrode pads and on second electrode pads, comprises a first step of arranging solder balls on the first electrode pads by arranging a first mask on a base mask; a second step of arranging solder balls on the second electrode pads by arranging a second mask on the base mask; and a third step of melting the solder balls. The base mask has first opening portions corresponding to the first electrode pads and second opening portions corresponding to the second electrode pads and having a size different from that of the first opening portions. The first mask has opening portions corresponding to the first opening portions and covering the second opening portions. The second mask has opening portions corresponding to the second opening portions and covers the first opening portions.

Abstract: A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interposer (1), have their heads made uniform in height by causing the terminals (4) to project from a surface of a board (2) coated with a resist film, and applying a cutting tool (19) to the surface of the board (2) having the terminals project therefrom to carry out lathe turning for the heads of the terminals (4), while having the terminal board held by a rotatable chuck table (17) and rotating the chuck table (17).

Abstract: A method and apparatus for connecting a plurality of coaxial cables to a printed circuit board in a compact connector. The apparatus is generally comprised of a flexible carrier, means for attaching the cable to the flexible carrier, a conductive base plate and a rigid beam providing pressure such that the electrical contact between the coaxial cable and the printed circuit board is maintained. The method generally comprises the steps of stripping the coaxial cables, bonding the coaxial cable to a flexible carrier, positioning the coaxial cables over traces of a printed circuit board providing pressure such that electrical contact is maintained between the cables and the printed circuit board.

Abstract: The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.

Abstract: Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in an aperture disposed from the first surface to the second surface. To contact the electrical devices, the contact includes a center portion from which extends two diverging, cantilevered spring arms that project beyond either surface of the electrical connector. To shorten the path that current must travel through the contact, one spring arm terminates in a bellows leg that extends proximate to the second spring arm. When placed between the electrical devices, the spring arms are deflected together causing the bellows leg to press against the second spring arm. For retaining the contact within the aperture, the contact also includes retention members extending from the center portion that engage the insulative housing.

Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

Abstract: A spring system arrangement and a related connector are disclosed. The purpose is to allow the use of contact springs, such as coil contact springs, with relatively large size body, to be located on a small center distance, i.e. pitch, and to electrically connect with contact pads of high density electronic devices, having a small device pitch. The device pitch can be smaller than the diameter of the spring body itself. In order to achieve this desired small spring pitch and high density, the contact springs are located in a nested head-to-toe and/or staggered orientation. Furthermore, the connectors utilize guide plates, referred to as combs, to accurately control the alignment of the contact springs tips to the contact pads of the electronic devices.

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

Abstract: In one aspect, the invention provides a method for making an electrical connector. The method may include: obtaining a part having a first end portion, a second end portion, and an interim 1 portion between the first and second end portions; flattening the second end portion; trimming the flattened second end portion; and forming a hole in the flattened second end portion.

Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.

Abstract: A method of manufacturing a protruding-volute contact for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming; and performing convex formation of a metal microstructure made from the layer consisting of metallic material so as to form a spiral spring that protrudes volutedly outward. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.

Abstract: A method of making an electrical connector includes the steps of: providing a connector body (2) having an insert (5) defining a recessed area (54a) at one side and a number of channels (54b) at an opposite side; assembling a ground bus (4) to the recessed area of the insert, the ground bus including a carrier strip (46) with a number of fingers (460) extending therefrom; assembling a number of signal contacts (3) to the channels of the insert, each signal contact including a board mounting portion (32); and displacing the carrier strip such that each finger extends into space (320) between the mounting portions of two adjacent signal contacts.

Abstract: A method of manufacturing contact sheets is provided, including the steps of providing an electrically conductive sheet to form a conductive member. The conductive member includes a plurality of adjacent contact members joined by a plurality of linking portions. At least one base sheet is provided having a plurality of openings formed therein. The conductive member is positioned and secured to at least one surface of the base sheet such the contact members are positioned in the openings. The contact members are processed to (i) sever the linking portions from adjacent contact members and (ii) to form extending contact portions having a predetermined configuration. The position of the linking portions prior to severing is such that opposing severed faces of the linking portions are separated from each other and the contact members are electrically insulated from one another.

Abstract: Electrically conductive movable elements 15 which are moved from a waiting position to a conduction position by an insertion operation of corresponding male terminals 7 are disposed in all female terminals 9 into which the male terminals are to be respectively inserted in a correct connection condition. Only when the male terminals 7 are correctly inserted into the female terminals 9, the movable elements 15 are moved to the conduction positions to be in contact with conductive portions 17 of a conduction test device 16, respectively, thereby establishing a conductive condition.

Abstract: A method for heat-treating a plurality of microelectronic structures attached to a non-metallic substrate is disclosed. The method comprises the steps of: (a) placing the non-metallic substrate and the plurality of microelectronic structures in an oscillating electromagnetic field, whereby the plurality of microelectronic structures are heated by the oscillating electromagnetic field and the non-metallic substrate is essentially not heated by the oscillating electromagnetic field; (b) maintaining the non-metallic substrate and the plurality of microelectronic structures in the oscillating electromagnetic field until each of the plurality of microelectronic structures obtains a defined heat-treatment temperature substantially greater than an ambient temperature; (c) removing the non-metallic substrate and the plurality of microelectronic structures from the oscillating electromagnetic field; and (d) cooling the plurality of microelectronic structures to the ambient temperature.