With Coating Patents (Class 29/885)
  • Patent number: 11081306
    Abstract: A process of manufacturing a heat resistant and low carbon plate for a circuit breaker includes preparing a heat resistant and low carbon plate for a circuit breaker; coating the heat resistant and low carbon plate with organic material; coating the organic material with inorganic material; and heating and drying the heat resistant and low carbon plate. The process continuously grips each of heat resistant and low carbon plates conveyed on a conveyor with a coat application device being used for the coating steps. A circuit breaker having the heat resistant and low carbon plate is also provided.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: August 3, 2021
    Assignee: SHIHLIN ELECTRIC & ENGINEERING CORP.
    Inventors: Chih-Yi Li, Hsiao-Ping Fang, Hung-Chieh Chen
  • Patent number: 10461315
    Abstract: A method of producing an electrode includes preparing a temperature responsive polymer, preparing wet granules by mixing the temperature responsive polymer, a solvent, and active material particles, molding an active material film by sandwiching the wet granules between a first molding tool and a second molding tool, compressing the active material film by sandwiching the active material film between a third molding tool and a fourth molding tool, and disposing the active material film on a surface of a current collector.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 29, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Taishi Miura
  • Patent number: 10204852
    Abstract: A circuit substrate for a chip bonding thereon includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface, a first through via plug passing through the core substrate, a pad disposed on the bump-side surface, in contact with the first through via plug, and a first thickness enhancing conductive pattern disposed on a surface of the pad, which is away from the bump-side surface.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: February 12, 2019
    Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.
    Inventors: Yeh-Chi Hsu, Chen-Yueh Kung
  • Patent number: 9980390
    Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: May 22, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohiro Terada, Yoshito Fujimura, Tomoaki Okuno
  • Patent number: 9768555
    Abstract: In accordance with embodiments of the present disclosure, a connector may include a housing and a pin housed in the housing and configured to electrically couple to a corresponding electrically-conductive conduit of an information handling resource comprising the connector. The pin may include an approximate connection point at which the pin electrically couples to a corresponding pin of another connector mated to the connector and a stub extending from the approximate connection point and constructed such that a per-unit-length signal propagation delay through the stub is significantly larger than a per-unit-length signal propagation delay through the remainder of the pin excluding the stub.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: September 19, 2017
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav M. Mutnury, Raymond Dewine Heistand, II
  • Patent number: 9601425
    Abstract: The invention provides a circuit substrate and a semiconductor package structure. The circuit substrate includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface. A first through via plug passes through the core substrate. A first conductive line pattern and a second conductive line pattern adjacent to the first conductive line are disposed on the chip-side surface. A pad is disposed on the bump-side surface. The first through via plug is in direct contact with and partially overlapping the first conductive line pattern and the pad. The first conductive line pattern, the second conductive line pattern and the first through via plug are configured to transmit voltage supplies of the same type.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: March 21, 2017
    Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.
    Inventors: Yeh-Chi Hsu, Chen-Yueh Kung
  • Patent number: 9484642
    Abstract: A terminal includes a connector portion, a tubular crimp portion that crimps/joins with a wire, and a transition portion joining the two portions. The tubular crimp portion is composed of a metal member including a base material of copper or copper alloy with 0.20-1.40 mm thickness and a coating layer of tin, tin alloy, nickel, nickel alloy, silver or silver alloy with 0.2-3.0 ?m thickness formed on the base material. The tubular crimp portion has a weld portion formed by butt-welding and having, in its cross-section perpendicular to a terminal longitudinal direction, a phase existing therein of tin, tin alloy, nickel, nickel alloy, silver or silver alloy greater than 0.01 ?m2. The tubular crimp portion is a closed tubular body with one end opposite to a wire-insertion-opening being closed.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: November 1, 2016
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yoshikazu Okuno, Akira Tachibana, Kengo Mitose
  • Patent number: 9449939
    Abstract: An electronic device (10, 20, 30, 40) is provided which comprises a substrate (16) supporting an inorganic layer (11) and a joint (13), mechanically coupling a contacting element (14) to the inorganic layer (11). At least a first load distributing layer (12a) is arranged in direct contact with the inorganic layer (11) at a position of the joint (13) for relieving stress caused by an elastic mismatch between the substrate (16) and the inorganic layer (11).
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: September 20, 2016
    Assignee: Koninklijke Philips N.V.
    Inventor: Petrus Cornelis Paulus Bouten
  • Patent number: 9440278
    Abstract: Methods and apparatuses for roller hemming are disclosed herein. An example of a sheet metal roller hemming apparatus includes a first electrode to electrically connect to an electrical power supply and a sheet metal workpiece. The apparatus further includes a second electrode to electrically connect to the electrical power supply and the sheet metal workpiece to cause pulsed electric current to flow through a portion of the workpiece to locally increase formability in the portion of the workpiece. The apparatus still further includes a roller assembly to contact the workpiece to cause the workpiece to bend in the portion of the workpiece when the pulsed electric current is flowing through the portion of the workpiece, and to form a hem.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: September 13, 2016
    Assignees: GM Global Technologies Operations LLC, Shanghai Jiao Tong University
    Inventors: Jeff Wang, Xianghuai Dong, Yao Shen, Jun Chen
  • Patent number: 9385439
    Abstract: A metal member includes a base material composed of one of copper and a copper alloy, a white metal layer provided on the base material at a part or an entirety thereof, and an oil film provided on the white metal layer. The white metal layer has a thickness of 0.01 ?m to 0.80 ?m. A surface of the white metal layer has an arithmetic mean roughness of 0.6 ?m to 1.2 ?m. The oil film has an electric double-layer capacitance of 1.5 ?F/cm2 to 7.0 ?F/cm2.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: July 5, 2016
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Akira Tachibana, Kengo Mitose, Chikanobu Ikuta
  • Patent number: 9356368
    Abstract: An electrical connector for electrically connecting a package with a printed circuit board (PCB) with a plurality of pads and an alignment feature includes an insulating housing, a plurality of contacts received in the insulating housing and a stiffener insert molding with the insulating housing. When the stiffener is assembled upon the alignment feature correspondingly, the contacts align with the pads of the PCB correspondingly.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: May 31, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yen-Chih Chang, Nan-Hung Lin
  • Publication number: 20150147656
    Abstract: A negative electrode 1 for lithium secondary batteries, which can increase the charge/discharge capacity of a lithium secondary battery, includes a negative electrode current collector, a negative electrode active material layer, and a lithium layer. The negative electrode active material layer is disposed on regions and of the respective surfaces and of the negative electrode current collector. The lithium layer is disposed on uncovered regions and, which are regions of the respective surfaces and of the negative electrode current collector on which the negative electrode active material layer is not disposed. The lithium layer includes lithium.
    Type: Application
    Filed: May 20, 2013
    Publication date: May 28, 2015
    Applicant: SANYO Electric Co., Ltd.
    Inventors: Yasutaka Kogetsu, Kunihiko Bessho, Takashi Shimada
  • Publication number: 20150130491
    Abstract: The invention relates to a cable interface (1) for operatively connecting a plurality of coaxial cables (11). A main body (2) has a first side face and an opposing second side face (3, 4) with a plurality of blind holes (5) arranged in a pattern in the first side face (3). An internal conductor opening (7) is formed at the bottom (6) of each blind hole (5) and arranged substantially coaxial with the blind hole (5), which is likewise coated with an electrically conductive material and is used for operatively connecting an internal conductor (17) of the coaxial cable (11). The blind holes (5) cooperate with at least one first bore (8), which extends from the second side face (4) into the main body (2) and is coated with an electrically conductive material.
    Type: Application
    Filed: October 23, 2012
    Publication date: May 14, 2015
    Inventor: Adjan Kretz
  • Patent number: 8997347
    Abstract: An improved method of making sealant containing twist-on wire connectors from a batch of components, wherein some of the components may be preassembled through automated equipment and at least one or more of the steps performed in the making of a sealant containing twist-on wire connector is performed manually at a station where an operator can simultaneously perform one or more steps to enhance the formation of a twist-on wire connector containing a sealant while at the same time eliminating upfront investments costs for a work station as well as costs for maintenance of a work station.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: April 7, 2015
    Assignee: The Patent Store LLC
    Inventors: Lloyd Herbert King, Jr., James C. Keeven
  • Patent number: 8956735
    Abstract: A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 ?m to 4.0 ?m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 ?m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: February 17, 2015
    Assignees: Kabushiki Kaisha Kobe Seiko Sho, Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Publication number: 20140347785
    Abstract: The present invention relates to a method for manufacturing an electrode of a supercapacitor, comprising: (A) providing a carbon substrate and a phosphorus-containing precursor, and mixing the carbon substrate and the phosphorus-containing precursor at a ratio of 1:100 to 1000:1 by weight; (B) heating the mixture of the carbon substrate and the phosphorus-containing precursor to a temperature between 300° C. and 1100° C. to obtain a P-doped carbon substrate; and (C) forming an electrode of a supercapacitor by using the P-doped carbon substrate. The present invention also relates to a supercapacitor which comprises: a first electrode; a second electrode; and an electrolyte that is interposed between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode is prepared by the above-mentioned method.
    Type: Application
    Filed: September 17, 2013
    Publication date: November 27, 2014
    Applicant: National Tsing Hua University
    Inventors: Chi-Chang HU, Chien-Liang LIU, Hsiao-Hsuan SHEN, Kuo-Hsin CHANG
  • Publication number: 20140339200
    Abstract: Disclosed are an electrode wire for electro-discharge machining and a method for manufacturing the same. The electrode wire includes a core wire including a first metal including copper, a first alloy layer formed at a boundary region between the core wire and a second metal plated on an outer surface of the core wire due to mutual diffusion between the core wire and the second metal, and a second alloy layer formed due to diffusion of the first metal to the second metal. A core wire material is erupted onto a surface of the electrode wire for electro-discharge machining, which includes the core wire, the first alloy layer, and the second alloy layer, along cracks appearing on the second alloy layer, so that a plurality of grains are formed on the surface of the electrode wire.
    Type: Application
    Filed: July 28, 2014
    Publication date: November 20, 2014
    Inventors: Ki-Chul SEONG, Hyun-Soo SEONG, Hyun-Kook SEONG
  • Patent number: 8882944
    Abstract: In a method for forming a rustproof film on a PC strand, the thickness of the resin film is set to 200±80 ?m, the pre-heating is performed within a temperature range from 60 to 150° C. to prevent an occurrence of a cob-webbing phenomenon as a result of melting of the synthetic resin powder coating material and the post-heating is performed within a range from 150 to 250° C. in order to uniformize the thickness of the coats adhered to the outer peripheral surfaces of the core wire and the surrounding wires, and the temperature of the pre-heating is set to be lower than the temperature of the post-heating, and the synthetic resin powder coating material including particles having diameters in a range from 0.1 to 250 ?m is used, and the line speed in the series of steps is set to 5 to 10 m/min.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: November 11, 2014
    Assignee: Kurosawa Construction Co., Ltd.
    Inventors: Ryohei Kurosawa, Kei Hirai, Naoki Matsubara
  • Publication number: 20140318959
    Abstract: Electrochemical probes for corrosion monitoring in an environment that may cause the formation of electron conducting deposits and the method for making such probes were disclosed. The probes have exposed fingered electrodes. Except for the sensing areas at the tip sections, all surfaces of the exposed electrodes are coated with an inner electrically insulating coating or tubing and one or more additional coating(s) or tube(s). One of the additional coatings is ion conducting. The electrodes are spaced such that there are gaps between the outer surfaces of the neighboring electrodes to prevent the formation of a continuously distributed electron conducting deposits between the sensing surface of one electrode and the sensing surfaces of the other electrodes. These probes are especially suitable for applications in gas systems and oil-water mixtures containing hydrogen sulphide (H2S).
    Type: Application
    Filed: April 30, 2013
    Publication date: October 30, 2014
    Inventors: Lietai Yang, Xiaodong Sun Yang
  • Publication number: 20140322991
    Abstract: An electrical connector connecting a male connector and a female connector in a freely engageable and detachable manner, in which: a male tab is provided at the male connector; a housing part where the male tab is inserted is provided at the female connector; a spring state contact piece and a beat piece to sandwich the male tab are provided at the housing part; and a protrusion protruding toward the male tab inserted into the housing part is provided at least one of the contact piece and the beat piece, wherein the protrusion includes a contact part which is in contact with the male tab inserted into the housing part and a sidewall part which is provided at a periphery of the contact part, and the contact part has so-called a star-shape in a plan view.
    Type: Application
    Filed: July 9, 2014
    Publication date: October 30, 2014
    Inventors: Masatoshi Nakamura, Akifumi Onodera, Akira Sugawara, Hiroto Narieda
  • Patent number: 8867219
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: October 21, 2014
    Assignee: Harris Corporation
    Inventors: Michael Weatherspoon, David Nicol, Louis Joseph Rendek, Jr.
  • Publication number: 20140299356
    Abstract: Embodiments of preventing unwanted damage to microelectronic substrates from laser drilling are generally described herein. In some embodiments, the method includes forming a microelectronic substrate, and adding a layer of protective material to dielectric material of the microelectronic substrate. The microelectronic substrate is configured for mounting one or more integrated circuits (ICs) thereon and includes interconnection for a plurality of electronic circuits. The protective material is configured to absorb laser energy applied in laser drilling of the microelectronic substrate.
    Type: Application
    Filed: April 4, 2013
    Publication date: October 9, 2014
    Inventors: Chong Zhang, Nikhil Sharma
  • Patent number: 8850702
    Abstract: The embodiments herein relate to a conductor cable for use in a lead and more specifically to methods and devices related to laser consolidation of the cable. The various conductor cable embodiments and methods provide for at least one end of the cable having a weld mass created by a laser welding process.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: October 7, 2014
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Peter Hall, Haiping Shao
  • Publication number: 20140262772
    Abstract: The present disclosure relates to an electrochemical test sensor for detecting the concentration of an analyte in a fluid sample. The test sensor includes a working electrode, a counter electrode, and a trigger electrode. A temporary protective layer overlies the trigger electrode and helps to maintain the function of the trigger electrode during test sensor manufacture.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: BAYER HEALTHCARE LLC
    Inventors: Andrew Edelbrock, Steven C. Charlton
  • Publication number: 20140248809
    Abstract: In a fitting type connecting terminal having male and female terminals, each of which has a tin plating layer formed on an electrically conductive base material, a surface of a contact portion of one of the male and female terminals with the other thereof has a plurality of grooves or recessed portions which are spaced from each other in longitudinal directions, and the grooves or recessed portions are formed so as to satisfy d?b, d?a?L and a+c?L assuming that the width of each of the grooves or recessed portions is a (?m), the depth thereof being b (?m), the distance between two of the grooves or recessed portions adjacent to each other in the longitudinal directions being c (?m), the sliding distance producible between the male terminal and the female terminal in a state that the male terminal is fitted into and fixed to the female terminal being L (?m), and the maximum grain size of the oxide of abrasion powder producible due to sliding between the male terminal and the female terminal being d (?m).
    Type: Application
    Filed: October 10, 2012
    Publication date: September 4, 2014
    Inventors: Akifumi Onodera, Masatoshi Nakamura, Akira Sugawara, Hiroto Narieda
  • Patent number: 8806741
    Abstract: An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 ?m. A first thermally conductive layer is applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K). A second electrically insulating layer is applied over the first thermally conductive layer and having a thickness of less than 100 ?m.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: August 19, 2014
    Assignee: Infineon Technologies AG
    Inventor: Ralf Otremba
  • Publication number: 20140215819
    Abstract: In one embodiment, an electrochemical system includes an interconnector busbar including a substrate and a coating contacting the substrate, the coating including a layer of electroplated elemental nickel.
    Type: Application
    Filed: April 14, 2014
    Publication date: August 7, 2014
    Applicant: Ford Global Technologies, LLC
    Inventor: Humi WIDHALM
  • Publication number: 20140213092
    Abstract: The invention relates to a direct plug-in element comprising: a plug housing (3), a direct contact (4) with a contact tongue (5), the contact tongue (5) having at least one contact section (50) for directly contacting an exposed contact area on a counterpart, and a catch device (6) for an interlocked connection between the plug housing (3) and the direct contact (4), in order to retain the direct contact (4) in the plug housing (3), the direct contact (4) being arranged in the plug housing (3), the contact tongue (5) having a first and second flat side (52, 53) and a first and second narrow side (54, 55), the catch device (6) comprising a first catch element (60) on the direct contact (4) and a second catch element (61) formed on the plug housing (3) complementary to the first catch element (60), the first catch element (60) being arranged on one of the flat sides (52, 53) of the direct contact (4), and the contact section (50) being arranged on one of the narrow sides (54, 55)of the contact tongue (5).
    Type: Application
    Filed: July 6, 2012
    Publication date: July 31, 2014
    Applicant: ROBERT BOSCH GMBH
    Inventor: Markus Kroeckel
  • Publication number: 20140206245
    Abstract: A connector terminal (10) which includes a barrel portion (21) to which a core wire (12) exposed from an outer cover (13) of an electric cable (11) is electrically connected, a tab terminal portion (31) that is electrically connected to a mating terminal and, a resin mold which covers and waterproofs the barrel portion (21) and an end portion of the electric cable (11). Before the connector terminal (10) is finalized, the connector terminal (10) is connected to a carrier (42) through an interconnection portion (41) and is separated from the carrier (42) at interconnection portion (41). A cutting groove (44) is formed on the interconnection portion (41) along a width direction thereof.
    Type: Application
    Filed: August 17, 2012
    Publication date: July 24, 2014
    Applicant: YAZAKI CORPORATION
    Inventor: Kei Sato
  • Patent number: 8782884
    Abstract: A method for manufacturing an electrode assembly. The method comprises: forming a comb having a plurality of electrode contacts, wherein the surface of at least one of the electrode contacts comprises a plurality of indentations such that the effective surface area per area unit of a center region of the at least one electrode contact is larger than the effective surface area per area unit of the of the region of the surface outside the center region; assembling an array of electrode contacts from the comb; molding a carrier member about the assembled array of electrode contacts, wherein a surface of the at least one electrode contact is covered by a layer of the carrier member material; and removing the layer of carrier member material on the surface of the at least one electrode contact.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: July 22, 2014
    Assignee: Cochlear Limited
    Inventors: Edmond D. Capcelea, Peter Gibson, Fysh Dadd
  • Patent number: 8785029
    Abstract: A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided. This connection plate for battery terminals (2) includes a battery terminal connection portion (4) fitted into a second hole (31) of a base (3) made of first metal, including a hole for connection (42) into which a second battery terminal (1b) is inserted and a flange portion (4b), while the battery terminal connection portion is constituted by at least a first layer (40) made of second metal, arranged on a side opposite to the base and a second layer (41) made of third metal, arranged between the base and the first layer.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: July 22, 2014
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Yoshimitsu Oda, Masaharu Yamamoto, Masaaki Ishio
  • Patent number: 8769805
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: July 8, 2014
    Assignee: Avery Dennison Corporation
    Inventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep S. Iyer, Mark A. Licon
  • Patent number: 8756777
    Abstract: A method of manufacturing a ladder filter including first and second resonators includes: forming a piezoelectric film on an entire surface of a substrate that has respective lower electrodes of the first and second resonator formed thereon, an conductive film on the piezoelectric film, and a second film on the conductive film; forming a pattern of the second film in a prescribed region in the second area; forming a first film on an entire surface of the substrate; etching the first film, forming a pattern of the first film, the second film and the conductive film in the second area, and forming a pattern of the first film and the conductive film in the first area, to form respective upper electrodes from the conductor film; and thereafter, etching the piezoelectric film to form respective patterns of the piezoelectric film in the first and second areas, respectively.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: June 24, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Shinji Taniguchi, Tokihiro Nishihara, Tsuyoshi Yokoyama, Masafumi Iwaki, Go Endo, Yasuyuki Saitou, Hisanori Ehara, Masanori Ueda
  • Publication number: 20140137404
    Abstract: The invention provides a method for manufacturing an oxygen sensor that is excellent in responsiveness and can be preferably used for diagnosis of catalyst deterioration. An oxygen sensor 1 equipped with an oxygen sensor element 11 comprising a solid electrolyte 21 and Pt coatings, as a pair of electrodes, on both surfaces of the solid electrolyte 21 is manufactured. The method comprises at least steps of: providing a Pt coating 23 on at least one of the solid electrolyte 21 surfaces exposed to the gas to be tested so as to form closed pores 23a inside the Pt coating 23; and heating either the Pt coating 23 or 24 exposed to gas to be tested in a gas atmosphere with higher oxygen concentration than that of the atmospheric gas.
    Type: Application
    Filed: July 12, 2012
    Publication date: May 22, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Masashi Kawai
  • Patent number: 8726492
    Abstract: Coating an elongate, uncoated conductive element with a substantially continuous barrier layer. The substantially continuous barrier layer is formed through relative movement of the conductive element to a frame between sequential coatings of a barrier material.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: May 20, 2014
    Assignee: Cochlear Limited
    Inventors: Peter Schuller, Jane L. Rapsey, Grant Hill
  • Publication number: 20140130349
    Abstract: In one embodiment, a method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprises: providing a substrate comprising (i) a substantially cylindrical body and (ii) a plurality of projections extending radially from the cylindrical body; coating the substrate with first conductive material; patterning the first conductive material on the cylindrical body into a plurality of traces, the plurality of traces extending along the cylindrical body and electrically contacting conductive material about the plurality of projections; providing an insulative layer over the traces; coating the insulative layer over the traces with second conductive material; patterning the second conductive material to form at least a plurality of electrode surfaces including a plurality of segmented electrodes, the segmented electrodes being in electrical contact with conductive material on projections of the plurality of projections; and electricall
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Applicant: Advanced Neuromodulation Systems, Inc.
    Inventors: John W. Swanson, Kevin Turner, Jerome Boogard
  • Publication number: 20140128954
    Abstract: The invention relates to an implantable nerve electrode (1) that comprises an electrically insulating substrate (2) with conductor traces (3) running therein, electrode contacts (4) and connection contacts (5), wherein the conductor traces (3) connect the electrode contacts (4) to the connection contacts (5), and wherein the electrode contacts (4) can be connected to the nerves of a nervous system, each of the conductor traces (3) having an at least partial sheathing (13) made of a polymer that is mechanically strong and a good insulator. The invention further relates to a method for producing an implantable nerve electrode (1).
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: CorTec GmbH
    Inventors: Martin SCHÜTTLER, Fabian KOHLER
  • Publication number: 20140109404
    Abstract: Defibrillator lead designs and methods for manufacturing a lead having attachment between a fibrosis-limiting material covering, a shocking coil electrode, and an implantable lead body are disclosed herein. An electrode coil fitting is disposed within the shocking coil electrode. In an option, the fibrosis limiting material extends past the ends of the electrode coil, and is wrapped between the coil electrode and the electrode coil member.
    Type: Application
    Filed: December 30, 2013
    Publication date: April 24, 2014
    Inventor: Devon N. Arnholt
  • Publication number: 20140107456
    Abstract: An atraumatic detection/stimulation lead is disclosed. The lead includes at least one microcable having a core cable comprising a plurality of elementary metal strands. One of the microcables has provided at its distal end an atraumatic protection device. The atraumatic protection device includes a protective coating on the distal ends of the elementary strands of the microcable, and the protective coating is covered by a protective cap of deformable material. The protective cap may be a conical distal end adapted to deform and axially flatten out. The microcable may have an overall diameter less than or equal to 1.5 French (0.50 mm).
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Inventors: Willy Régnier, Nicolas Shan
  • Publication number: 20140107455
    Abstract: Leads for use with implantable medical devices are provided. One microlead is intended to be implanted in the venous, arterial, or lymphatic networks. Its diameter may be at most equal to 1.5 French (0.5 mm), and it may include a plurality of micro-cables each including: an electrically conductive core cable for connection to one pole of a multipolar generator of an active implantable medical device, and a polymer insulation layer surrounding the core cable. At least one exposed area may be formed in the insulation layer to form a detection/stimulation electrode.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Inventors: Willy Régnier, Jean-Fraçois Ollivier, Philippe D'Hiver, Nicolas Shan
  • Publication number: 20140094892
    Abstract: In one example, a cochlear lead includes a flexible body, an array of electrodes in the flexible body, and a plurality of wires passing along the array of electrodes. The plurality of wires includes a flexural geometry between each pair of adjacent electrodes and a substantially straight geometry over the electrodes. A method for forming an electrode array with a reduced apical cross section is also provided.
    Type: Application
    Filed: May 11, 2011
    Publication date: April 3, 2014
    Inventors: Chuladatta Thenuwara, Rosa Gallegos, Lidia Vasquez, Mark B. Downing
  • Publication number: 20140090871
    Abstract: Aspects of the invention are directed to an electrode for use in an electronic device. The electrode comprises a plurality of nanostructures and a passivating film. Each nanostructure in the plurality of nanostructures contacts or is fused to one or more other nanostructures in the plurality of nanostructures. The passivating film at least partially covers the plurality of nanostructures and comprises one or more layers of graphene.
    Type: Application
    Filed: October 2, 2012
    Publication date: April 3, 2014
    Applicant: BLUESTONE GLOBAL TECH LIMITED
    Inventors: Xin Zhao, Xuesong Li
  • Patent number: 8677616
    Abstract: Matrices of multiple cast conductors, and methods for making such matrices are disclosed. Methods according to the disclosure comprise: casting a conductor matrix including a plurality of conductors joined by at least one link; applying a surface treatment to at least a portion of the matrix; finishing a contact face on at least one of the conductors; and separating the conductors from each other at the at least one link.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: March 25, 2014
    Assignee: Pratt & Whitney Canada Corp.
    Inventors: Kevin Allan Dooley, Joshua Bell
  • Patent number: 8671567
    Abstract: A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 ? and 170 ?. The contained amount of boron is from 0.02 wt % to 0.20 wt %.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: March 18, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hideki Hirakawa, Satoshi Kaizuka
  • Patent number: 8661653
    Abstract: Methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the methods include improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade from the enclosure.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: March 4, 2014
    Assignee: United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Donald Laurence Thomsen, III, Roberto J. Cano, Brian J Jensen, Stephen J Hales, Joel A Alexa
  • Patent number: 8601679
    Abstract: Disclosed is a leak detection cable that has an outer jacket layer and a four wire construction in a flat wire configuration that is twisted in a helix. Detection cables are disposed on the exterior surface adjacent openings of the jacket to allow for detection of aqueous fluids. The wire is twisted in a helix to allow adjacent detector wires to easily detect aqueous fluids. Disparate materials are used for the jacket and the coatings of the wires, to allow the jacket to be easily removed from the wires without affecting the integrity of the coatings of the wires. The four flat wire configuration is sized and spaced for easy connection to an insulation displacement connector.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: December 10, 2013
    Assignee: Raymond & Lae Engineering, Inc.
    Inventor: Donald M. Raymond
  • Publication number: 20130321963
    Abstract: An ESD circuit is disclosed. The ESD circuit includes a pad and a ground and a sensing element coupled between the pad and ground for sensing an ESD current. The sensing element generates an active sense output signal when an ESD current is sensed and an inactive sense output signal when no ESD current is sensed. The ESD circuit also includes a bypass element comprising a bi-polar junction transistor. The bypass element is coupled in parallel to the sensing element between the pad and ground. The active sense output signal causes the bypass element to be activated to provide a current path between the pad and ground.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Da-Wei LAI, Mahadeva Iyer NATARAJAN
  • Publication number: 20130316217
    Abstract: A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided.
    Type: Application
    Filed: December 7, 2011
    Publication date: November 28, 2013
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Yoshimitsu Oda, Masaharu Yamamoto, Masaaki Ishio
  • Patent number: 8590140
    Abstract: A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: November 26, 2013
    Assignee: Viking Tech Corporation
    Inventors: Shih-Long Wei, Shen-Li Hsiao, Chien-Min Shao, Chien-Hung Ho
  • Publication number: 20130309919
    Abstract: A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar 2 (connection plate for battery terminals) includes a first member (3) including a first hole (30) and an embedding hole (31), made of first metal and a second member (4) having a second hole (42), including a base (40) made of second metal, embedded in the embedding hole of the first member, while an intermetallic compound layer (5) containing at least one of the first metal and the second metal is formed on an interface between the embedding hole of the first member and the second member.
    Type: Application
    Filed: January 19, 2012
    Publication date: November 21, 2013
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Yoshimitsu Oda, Masaharu Yamamoto, Masaaki Ishio