Abstract: An interconnection device is disclosed for providing electrical connection between two conducting elements that requires less applied force than a standard ohmic connection device of the same connection area. A surface of at least a first conducting element includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.

Abstract: An electrically connectable module is manufactured from a substrate of an electrically insulating polymer matrix doped with an electrically insulating fibrous filler capable of heat conversion to an electrically conductive fibrous filler to form a fiber-doped substrate. One end of an electrical connector is embedded in the fiber-doped substrate to locate the one end adjacent the surface of the substrate while exposing an opposite end of the electrical connector. The surface of the fiber-doped substrate is locally heated preferably with a laser to form a conductive trace by the in-situ heat conversion of the electrically insulating fibrous filler, the localized heating including the one end of the electrical connector to electrically connect the electrical connector to the conductive trace. In another embodiment, a conductive material is electrodeposited on the conductive trace by applying a voltage to the opposite end of the electrical connector.

Abstract: A tapered carbon microelectrode is produced by extruding an organic material or a composition composed of crystalline carbon fine powder and an organic binder into a thin rod form, carbonizing said rod by calcining to produce a pure carbon thin rod, soaking the resulting thin rod as an anode in an electrolytic solution, gradually pulling up the thin rod while electrochemically oxidizing the tip portion of the thin rod. Then a lead wire is connected with the thick portion of the thin rod followed by coating all the surface except the conically sharp tip portion.The tapered carbon electrode can be used for various electrochemical measurements and scanning tunneling microscope.

Abstract: A method of fabricating a pin tip is provided by a cutting and coining operation which first forms a pin tip which has a generally rounded configuration defining 4 slightly curved convex sides joined at 4 edges converging at a pin end. Thereafter the pin tip is coined again thereby overlapping portions of the conductive plating layer over the sharp edges of the pin tip.

Abstract: A movable electrical contactor having a surface thereof in slidable contact with a mating conductor, the surface being coated with a composite material in which particles of graphite (C) are dispersed in a matrix of silver (Ag). The coating film is formed by electric plating using a plating liquid of metal silver in the range of 2-100 g/l in concentration, potassium cyanide in the range of 2-250 g/l, potassium hydroxide in the range of 0.5-15 g/l, graphite powder in the range of 1-55 g/l, and a dispersant for dispersing graphite powder into plating liquid in the range of 10-2000 ppm.

Abstract: A manufacturing process for a pressure connecting terminal which includes an electrical wire connection portion having a slot for pressuring and electrically connecting an electrical wire therewith is disclosed. The pressure connecting terminal is manufactured by punching a blank out of a flat metal base plate in accordance with a predetermined pattern and folding said blank into a predetermined shape. Further, said manufacturing process comprises the steps of: punching said flat base plate so as to create at least said slot; plating at least said slot which is created in said punching step; and folding said blank into said predetermined shape after said plating step.

Abstract: An electrical connector assembly having a metal or metallized plastic housing block (10) with contact members (26) contained within channels (12) in the block (10). The metallic housing block (10) provides a shield to eliminate cross-talk between the contact members (26). The contact members (26) are directly coated with a dielectric material, except where they perform an electrical contact function, to insulate them from the metallic housing block (10).

Abstract: A method of making an electrical contact comprised of at least one, and preferably several, conical projections, is provided. The individual conical projections are comprised of an ablative material, and at least some of the conical projections include a surface which is substantially comprised of material in a thickness capable of making ohmic contact, either by wiping with an intermeshing like structure or by contacting a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed by laser. The conical projections are optionally formed on the head of a contact pin.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Abstract: An improved omega connector for electrically coupling components of a multicomponent electronic assembly comprises first and second flat end sections each formed of nonporous copper plate adapted for solder bonding to components, and an intermediate loop section formed of interwoven copper fibers extending between the end sections to provide a continous electrically conductive network therebetween. The fibers in the loop section carry a solder nonwettable coating to avoid interference with bonding operations to attach the end section to the components. Preferably, the loop section is composed of nickel-clad copper fibers. The fibrous loop section exhibits enhanced flexibility to reduce stresses attributed to shifting of the components during operation and thereby extend the useful life of the assembly.

Abstract: Electrical contact terminals having two layer plated coating thereon is disclosed. The coating consists of a layer of palladium having a macrostress in the range of 30,000 to 140,000 psi and a layer of gold, the gold being at lest 99.9% pure and having a Knoop hardness from 60 to 90. A coating comprised of medium stress palladium and gold substantially and unexpectedly inmproves the durability of terminals as compared to similar coatings using gold and low or high stress palladium.

Abstract: Connectors with a barrel-shaped ferrule are produced from an intermediate which is embodied by metallic strip consisting of a plurality of connector blanks linked together by interconnecting means, each blank comprising a first ferrule-forming part and a second tongue-forming part, and including a first zone which comprises all the first parts, and an adjacent second zone which comprises all the second parts and all the interconnecting means, the side edges of neighbouring first parts in the strip being separated by free interspaces and a continuous layer or cover of insulating material being adhesively applied on the first zone, on at least one obverse surface of the strip, so as to extend beyond a terminal edge of the first part, the said layer being within said interspaces cut through and bent so as to form at least one flap sufficiently large to adhere when folded back.

Abstract: An electrostatic chuck is provided with an electrode split into two sections. The separate sections are joined through a tapered joint and bonded using epoxy. An insulator electrically separates the two sections and covers the top of the joined sections to form a clamping surface. The geometry of the electrode forms three annular regions, dividing the clamping surface into two equal areas distributed symmetrically. Moreover, the split-ring electrostatic chuck just described is fabricated by forming the two, separate electrodes; coating the separate electrodes with an insulator; joining the electrodes; machining the joint, top surface of the electrodes to form a single, co-planar, flat, smooth surface; and applying an insulator to that top surface.

Abstract: An electrical shunting contact and method for producing the same for mounting between adjacent first contacts in a first connector and for self-operatively providing a short circuit between the adjacent first electrical contacts when corresponding second contacts of a second connector are demated from the first connector. The electrical shunting contact comprises a conductive member having opposing legs joined by a resilient bridge, each leg having a non-conductive protuberance projecting outwardly therefrom. Under demated conditions, a contact edge of each leg abuts the adjacent first contacts between which the shunting contact is mounted to form a short circuit therebetween and the non-conductive protuberance is disposed in a chamber located just above the first contact. The presence of a second contact forces the legs of the shunting contact to be compressed out of engagement with the first contacts, thereby creating an open circuit between the adjacent first contacts.

Abstract: A method of making electrical contacts (10) for either tin or gold-plating without changing the overall dimensional shape of the contact (10) has been disclosed. The method includes the step of providing a given spring rate for a pair of cantilever beams (26) by cutting the beam (26) to a predetermined width without changing the length thereof.

Abstract: A method for manufacturing preforms coated with hard solder for repairing interconnect interruptions. The manufacture of preforms with which interconnect interruptions are bridged and that are electrically and mechanically joined to the interconnect at both sides of the interruption was previously carried out by punching from a metal band coated with hard solder. In the course of the miniaturization of interconnects to a width of less than 100 .mu.m, such a punching method is no longer feasible. The present etching technique provides a preform panel having a plurality of preforms, whereby, a hard solder layer has not yet been applied to the metal band at the point in time of etching. This avoids what are referred to as under-etchings. The method provides that a hard solder layer is applied by sputtering on the etched-out preform that is merely composed of a substrate that was manufactured from the metal band.

Abstract: A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively. A plurality of discrete metalized conductive pathways are formed on the intermediate portion ad first and second end portions of the insulative substrate.

Abstract: Integrated circuit dies, while still in wafer form, are prepared for stacking without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The insulating layer and the electrically conductive layer can be further extended to the backside of the dies if desired. The dies are separated from each other and can be assembled in a stack and/or surface mounted to a substrate.

Abstract: In a connective jumper, recesses are defined in jumper connecting portions and surfaces of the recesses are plated. Thus, the connective jumper can be strongly soldered. Even if cracking is caused in the soldering portions, progress of cracking can be reduced since such cracking can be easily visually inspected. A manufacturing method whereby such connective jumpers can be efficiently manufactured with high mass productivity at a low manufacturing cost is also provided.

Abstract: Integrated circuit dies, while still in wafer form, are prepared for surface mounting direct to a substrate without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The dies are separated from each other and may be surface mounted to a substrate by soldering.

Abstract: A connector for a multiple-pin electrical member includes an insulating body with opposed end faces, a side face and a plurality of holes extending between the ends for receiving pins from the member. Grooves in one face connect with the holes, and a longitudinal slot divides the grooves into two sections. Conductive material exists in each groove section and on the one face for connection to a ground. In constructing the connector conductive copper and solder plating is layered on the insulating body, and is selectively removed by mechanical action, wherein the slot is ground by a diamond clad wheel and the faces are ground with grinding pads.

Abstract: An electroceramic device formed of a body of electroceramic material and a process of making the device is disclosed. The body has an outer perimeter edge and two sides, each of the sides forming an exterior face. At least one groove is disposed on one of the exterior faces of the body, the groove extending from the edge and forming an opening on the exterior face. A lead wire is disposed in the groove and extends outwardly from the body through the edge. A metallized, electrically conductive coating is disposed on each of the exterior faces, and are electrically insulated from each other. The coating fills any voids left between the lead wire and the interior of the groove, whereby to hold the lead wires in place within the groove and form an electrical connection with the coating. Another lead wire is provided for the other coating, and that lead wire may be disposed in another similar groove.

Abstract: A method of making single-piece contact springs by continuous punching from a metal strip. Each contact spring has in the finished state two spring arms which extend symmetrically relative to each other and are connected to a common connecting member. The spring arms have each a contact bend which are directed toward and are in contact with each other. The other end of the spring has a connecting post preferably provided with a press-in portion. A gap for the later formation of the spring arms is made during one of the punching operations of the blank in the plane of the strip as a scrapless punching cut. Simultaneously with the scrapless punching operation, one of the spring arms is bent out of the plane of the strip near the connecting member and is placed by a stamping operation into a position approximately parallel to the other spring arm which remained in the plane of the strip.

Abstract: In the manufacture of an electrical strain gauge the strain-responsive circuit element is formed from a thin film deposit on a surface of a metal substrate on which an insulating film has already been deposited. Connections are made directly to the circuit element by the ends of conductor leads that are bonded into insulating plugs in apertures in the substrate. The plugs and the insulating film are glasses to which the substrate and the circuit element are bonded. A further glass layer encapsulates the circuit element. As a result a very robust form of gauge is provided that can be used in high temperatures and in chemically active environments.

Abstract: A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel process station or post identification or signature encoding apparatus for use on a telecommunications bus or the equivalent. Such identification of signature encoding apparatus may be configured for conventional binary coding. Both frequency and current derivative mode apparatus are disclosed.

Abstract: A method for solid phase welding gold to electrical contact terminals is disclosed. The contact zones of the terminals are moved past and held against a rotating cylinder that has gold electrolytically deposited thereon. The gold is transferred from the cylinder to the contact zones of the terminals by friction welding. The deposited gold is also described.

Abstract: An apparatus for automatically processing the wire ends of cores includes a forming die for bending the axially projecting wire ends back to project parallel to one another generally away from the core. Cores are received in a receiving station aligned with the forming die and orientated so that the wire ends are spaced as far as possible from the die. When the wire ends are sensed to be in the correct orientation, an actuator is operated to push the core through the forming die. The core with its wire ends bent back is then preferably stepped through a series of processing stations to trim and tin the wire ends and then ejected from the machine. A series of cores can be stepped continuously one after the other through the machine.

Abstract: A method is disclosed for producing a small-diameter metal tube having a coating of a different metal on selected portions of its inner surface, the tube being used for the body of a plunger-type electrical contact. A flat piece of metal from which the tube is to be made is coated with a predetermined pattern of a second metal on at least one preselected portion of its surface, then the flat piece is subjected to deep drawing operations to produce a tube coated with a predetermined pattern of the second metal on preselected portions of its interior surface.

Abstract: A replaceable insulating sleeve is disposed around the lower end of a drill string used in drilling a well. The sleeve is restrained from rotating relative to the drill string, but can be released and quickly slipped off the drill string in the field to permit rapid replacement if damaged, or if alternate equipment is required. The sleeve carries sensing means for measuring a characteristic of formations penetrated by the well. Anchor means on the sensing means prevents it from rotating relative to the sleeve.

Abstract: A process for silver plating a rotary switch contact assembly wherein a brass metal plate and a plastic rotor retainer are first formed, force-fitted together and then silver-plated as an assembly.

Abstract: An implantable device is provided by a process that includes preparing a substrate which has a low impedance carbon coating over a porous substrate. The carbon coating is a carbon lattice formed by plasma depositing a hydrocarbon within an energized gaseous environment. The implantable device is one into which tissue ingrowth is desired, such as electrodes for cardiac and neurostimulation.

Abstract: The method for producing a sleeve or ferrule for use in joining together the ends of strands of high tensile strength, single strand wire of any gauge from 12 to 18 gauge.

Abstract: A re-work method for removing extraneous plated metal layer areas from the surface of a ceramic substrate containing refractory metal areas wherein the substrate is heated at a temperature for a time sufficient to strengthen the bond between the plated metal layer and the refractory metal areas while simultaneously reducing the strength of the bond between the extraneous plated metal layer overlying the ceramic and the ceramic, immersing the substrate in a liquid, and applying localized ultrasonic energy in close proximity to the extraneous metal areas to be removed.

Abstract: An electrical connector which is covered on its exterior surface with a non-adhering, non-electrically conductive material. The electrical contact surfaces of the electrical connector are free of the non-electrically conductive material. This electrical connector is manufactured by mounting the electrical connector on a mounting fixture wherein the electrical contact surfaces are in direct contact with the mounting fixture, heating the electrical connector to within a desired temperature range, then submerging the electrical connector in a quantity of powdered plastic which evenly coates the exterior surface of the electrical connector, removing the electrical connector from the powdered plastic, reheating of the electrical connector to cause fusing of the powdered plastic into an integral mass, cooling of the electrical connector and then removing such from the mounting fixture.

Abstract: A method of making a gold plated socket contact characterized by heat treating in a vacuum furnace the previously formed and partially gold plated inner sleeve (10) of a three piece contact assembly.

Abstract: A method is provided for forming a pick-up stylus having a record engaging edge located at a predetermined angle with respect to an electrically conductive surface. Two identical jewel elements each having a flat surface, joined together along their flat surfaces. The forward end of the joined work product is ground to a conical tip and the work product is then separated into the two elements each now having a semi-conical tip. A pair of flats are gound on each tip on opposite sides of the semi-cone apex. The flats extend from the previously joined flat surface and intersect each other along an edge which defines the predetermined angle with the previously joined flat surface.

Abstract: A replaceable insulating sleeve is disposed around the lower end of a drill string used in drilling a well. The sleeve is restrained from rotating relative to the drill string, but can be released and quickly slipped off the drill string in the field to permit rapid replacement if damaged, or if alternate equipment is required. The sleeve carries sensing means for measuring a characteristic of formations penetrated by the well.

Abstract: A method of fabricating a printed circuit board is disclosed. The method comprises forming a metal substrate having a through-hole pattern. The metal substrate is coated with a dielectric powder having a suitable flow length value to form a dielectric coat on the substrate having a sufficient through-hole edge coverage. The dielectric coated substrate is then treated with a second powder to form a satisfactory topcoat thereon. Electrical circuitry is then formed on the topcoat in conjunction with the through hole pattern.

Abstract: A method is disclosed for manufacturing insulated electrical terminals in which the insulation is uniformly distributed over all portions of the terminal which are to be insulated. The present invention concerns a treatment of the terminal between the stages in which the terminal is initially stamped and formed and the stage in which the coating of insulation material is applied to the terminal. In this intermediate stage the terminal is subjected to a treatment which reduces any sharp edges, burrs, or the like to have radii of curvature thereby allowing the insulation coating to uniformly flow on the entire surface of the terminal.

Abstract: An ink composition for deposition upon the surface of a semiconductor device to provide a contact area for connection to external circuitry is disclosed, the composition comprising an ink system containing a metal powder, a binder and vehicle, and a metal frit. The ink is screened onto the semiconductor surface in the desired pattern and is heated to a temperature sufficient to cause the metal frit to become liquid. The metal frit dissolves some of the metal powder and densifies the structure by transporting the dissolved metal powder in a liquid sintering process. The sintering process typically may be carried out in any type of atmosphere. A small amount of dopant or semiconductor material may be added to the ink systems to achieve particular results if desired.

Abstract: The method of making a metal lead frame wherein a metal lead frame blank is stamped or etched from a metal strip so as to provide a die attach pad and a plurality of leads attached to the pad. Prior to separating the leads from the pad a retainer is applied to the leads adjacent the pad so that the leads are held in fixed positions during and after their separation from the pad.