Abstract: A probe sterilization device is provided. The probe sterilization device including: a housing defining a cavity with an opening, the housing including a cover plate capable of covering the opening; a cover plate drive, capable of driving, in response to a cover plate drive control signal, the cover plate to move so as to open the opening; a support, arranged in the housing and capable of fixing the probe; an ultraviolet light source, arranged in the housing and capable of being turned on in response to a light source control signal; and a processor, electrically connected to the cover plate drive and capable of sending the cover plate drive control signal to the cover plate drive, and electrically connected to the ultraviolet light source and capable of sending the light source control signal to the ultraviolet light source.

Abstract: The present invention provides a resin composition used for producing an acoustic member, the resin composition comprising: a thermosetting resin; and two or more types of particles dispersed in the thermosetting resin, the two or more types of particles comprising: heavy particles that have a higher density than the thermosetting resin and are particles other than metal particles; and light particles that have a lower density than the thermosetting resin, and the total content of the heavy particles and the light particles relative to the entire volume of a cured product of the resin composition being 10 vol % or more.

Abstract: The present application provides a multilayer lateral mode coupling method for phased array construction and transducer devices built accordingly. This disclosure describes and demonstrates that the electrical impedance of a phased array can be substantially reduced and readily controlled to be close to the source impedance. The fabrication process is relatively simple and inexpensive. In addition, the elements are robust for use in 1.5, 2, 3 or other dimensional configurations, over an extended period of operation, without structural failure, and providing a high power output required for imaging and/or medical therapy applications.

Abstract: A housing of an ultrasonic sensor includes a plurality of layers of a housing material integrally connected together to form the housing. A first section of the housing has a first plurality of layers of the housing material each with a first thickness. A second section of the housing has a second plurality of layers of the housing material each with a second thickness. The second thickness is greater than the first thickness and an ultrasonic wave transmitted through the housing has a greater transmission efficiency in the first section than in the second section.

Abstract: One or more embodiments of the present disclosure provide a vibration sensor. The vibration sensor may include a housing structure, an acoustic transducer, and a vibration unit. The acoustic transducer may be physically connected to the housing structure. An acoustic cavity may be formed at least partially by the housing structure and the acoustic transducer. The vibration unit may be configured to divide the acoustic cavity into a plurality of acoustic cavities. The plurality of acoustic cavities may include a first acoustic cavity. The first acoustic cavity may be in acoustic communication with the acoustic transducer. The vibration unit may include an elastic element and a mass element. The elastic element and the mass element may be located in the acoustic cavity, and the mass element may be connected to the housing structure or the acoustic transducer through the elastic element.

Abstract: An ultrasonic sensor includes a housing, a piezoelectric element on a bottom plate inside the housing, a signal terminal, and a flexible circuit. The flexible circuit is connected to the piezoelectric element and to an end portion of the signal terminal. A side wall includes a pair of thicker portions that oppose each other and a pair of thinner portions with a thickness less than that of the pair of thicker portions and that oppose each other. At least one of the thicker portions includes a recess at an inner surface thereof, and a portion of the flexible circuit is positioned inside the recess.

Abstract: An ultrasonic imaging system has a bias-switchable, ultrasonic transducer array and a bipolar voltage source. The array has a dielectric layer having a top surface and a bottom surface; top and bottom electrode strips in electrical contact with the top and bottom surface of the dielectric layer, the bottom electrode strips being oriented at a non-zero angle relative to the top electrode strips. There is an acoustic matching layer or multiplicity of matching layers on the front-side of the array and a leakage-current mitigation layer. The bipolar voltage source is connected to each of the top and bottom electrode strips to induce a polarization in the dielectric layer, the bipolar voltage source being capable of switching between a high voltage state and a low voltage state. A controller controls the bipolar voltage source, and pulsing to and receiving signals from the top and bottom electrode strips.

Abstract: A capacitive micro-machined ultrasonic transducer, CMUT, device in which integrated probe circuitry includes both the ultrasound transmission and reception circuitry and a DC-DC converter for generating a bias voltage for the CMUT cell. The high voltage pulses of a pulser circuit and a high voltage DC bias voltage are both generated by a single probe circuit, which is local to the CMUT cell.

Abstract: An ultrasonic transducer includes a case, a piezoelectric element, a wiring member, a foaming member, and a vibration damping material. The case includes a bottom wall. The piezoelectric element is disposed on the bottom wall inside the case. The wiring member is electrically connected to the piezoelectric element. The foaming member is disposed on the piezoelectric element. The vibration damping material is disposed between the piezoelectric element and the foaming member. The foaming member has a bottom surface opposing the piezoelectric element in a thickness direction of the piezoelectric element. A plurality of depressions is formed on the bottom surface. The vibration damping material bonds the piezoelectric element and the bottom surface.

Abstract: An ultra-wide bandwidth acoustic transducer may include multiple layers, including an inner piezoelectric layer, a polymer coupling layer and an outer piezoelectric layer. The polymer layer may be located between, and may be bonded to, the inner and outer piezoelectric layers. The transducer may have multiple eigenfrequencies of vibration. These eigenfrequencies may include primary resonant frequencies of the inner and outer piezoelectric layers respectively and may also include resonant frequencies that arise due to coupling between the layers. An acoustic backscatter system may employ such a transducer in backscatter nodes as well as in a transmitter. The multiple eigenfrequencies may enable the system to perform spread-spectrum communication at a high throughput. These multiple eigenfrequencies may also enable each backscatter node to shift frequency of an uplink signal, which in turn may enable the system to mitigate self-interference and to decode concurrent signals from multiple backscatter nodes.

Abstract: An ultrasonic transducer is described, including a piezoelectric element, a fluid medium contact layer, a matching layer between the piezoelectric element and the fluid medium contact layer, and a backing layer. Ultrasound sensor devices utilising the ultrasonic transducer are also described, for use in systems for analysing a fluid such as milk.

Abstract: A decoupling element for an ultrasonic sensor is disclosed. The ultrasonic sensor is able to be attached to a flat component for a vehicle. The flat component includes a cutout. The ultrasonic sensor includes a cylindrical ultrasonic transceiver element which is able to be introduced into the cutout. The decoupling element includes a hollow-cylindrical element for enclosing the cylindrical ultrasonic transceiver element of the ultrasonic sensor and a plurality of support ribs which are arranged in the radial direction outside the hollow-cylindrical element and are spaced apart from one another in a circumferential direction of the hollow-cylindrical element for supporting the decoupling element on a region of the flat component outside the cutout when the cylindrical ultrasonic transceiver element with the hollow-cylindrical element enclosing it is introduced by an end portion at an axial end into the cutout.

Abstract: A sonar survey system and method excites reflectors using a broadband message that excites all frequencies within the band providing for selection and evaluation of frequencies of interest after the survey is completed.

Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.

Abstract: In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

Abstract: A transducer includes: a film support portion having a hollow portion; a vibration film displaceable in a film thickness direction; a piezoelectric element, the piezoelectric element including a pair of electrodes and a piezoelectric film; and in regions overlapping the hollow portion, a plurality of first regions having a first total film thickness which is a sum of a film thickness of the vibration film and a film thickness of the piezoelectric element, and a plurality of second regions having a second total film thickness which is a sum of a film thickness of the vibration film and a film thickness of the piezoelectric element, the second total film thickness being different from the first total film thickness. The first regions and the second regions are alternately arranged, and one of the first regions is adjacent to a connection portion between the film support portion and the vibration film.

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

Abstract: The embodiments disclose an ultrasonic transducer that can require a piezoelectric element attached to the transducer to be constantly under high pressure, and this required pressure can be provided and maintained by the transducer's design at all temperatures during its operation. The exemplary ultrasonic transducer can eliminate a failure of the bond between the piezoelectric element and a delay block by using the mechanical structure to hold all components in place while permitting the piezoelectric transducer to generate pulses of the desired frequency, frequency bandwidth, and pulse width without undesired echoes and/or attenuations.

Abstract: Disclosed are multi-poled piezoelectric devices with improved packing density and methods for making such multi-poled piezoelectric devices with improved packing density. The multi-poled piezoelectric devices comprise: a) a top electrode, a piezoelectric layer, and a bottom electrode fabricated on a substrate; b) vias generated by etching the piezoelectric layer, the top electrode, or both; and c) a re-distribution layer (RDL) deposited over one or more of: the top electrode, the piezoelectric layer, the bottom electrode, or the one or more vias.

Abstract: A display device, a method for producing a display device, and a gesture recognition method are disclosed. The display device includes a display module including a base and an array substrate, a resin layer, a first electrode layer, a pixel definition layer, a light-emitting unit layer, a second electrode layer disposed opposite to the first electrode layer, and an encapsulation layer. The light-emitting unit layer is between the first electrode layer and the second electrode layer and includes a plurality of light-emitting units respectively in a plurality of openings of the pixel definition layer, and an ultrasonic sensor including the second electrode layer, a piezoelectric material layer between the first electrode layer and the pixel definition layer, and a third electrode layer between the pixel definition layer and the resin layer. The piezoelectric material layer includes a plurality of piezoelectric material units separated by the plurality of light-emitting units.

Abstract: Disclosed herein are ultrasonic transducer systems with hybrid contacts comprising: an ultrasonic transducer element comprising a substrate and a membrane; an electrical circuitry; and one or more contacts connected to the ultrasonic transducer element and the electrical circuitry, wherein the one or more contacts are: designed geometrically using a set of rules; arranged with respect to the membrane based on the set of rules or a second set of rules, or both.

Abstract: The present invention relates to a system for the controlled fragmentation of solids by means of acoustic beams, comprising at least one acoustic beam generation unit (100); and one feedback and control unit (200) of said generation unit (100). Advantageously, the acoustic beams generated by the system are acoustic vortex beams; and the feedback and control unit (200) further comprises a feedback subsystem (12), configured to receive the information relating to the fragmented solids and to utilize it so as to adapt the operation of the acoustic beam generation unit (100). Given that the generation of shearing stresses is more efficient using vortex beams, the amplitudes of the ultrasonic field needed to fragment the calculi are much lower than in current extracorporeal shock wave lithotripsy techniques. Likewise, the system minimizes unwanted effects on soft tissues surrounding the solid.

Abstract: An ultrasound transducer of a vehicle system includes a support member that attaches to and connects to the bottom portion of a membrane of the ultrasound transducer and supports the membrane, wherein the support member includes one or more cantilevers with a first end attaching to the membrane and a second end attaching to a support portion of the support member that attaches to the substrate, wherein the cantilever extends across and floats above the substrate, wherein the first end of the cantilever includes a stub extending away from a surface of the cantilever, wherein the stub extends away from the surface without contacting the substrate, wherein the one or more cantilevers includes one or more piezoelectric layers on the surface of the cantilever.

Abstract: A film bulk acoustic resonator (FBAR) chip and package structure with improved power tolerance includes: a first substrate having a plurality of FBARs each having a bottom electrode, a piezoelectric material, and a top electrode, and first bonding pads connected to the bottom electrodes or the top electrodes of the FBARs; and a second substrate having a plurality of vias passing therethrough, second bonding pads located on one end surface of the vias facing the first substrate, and external connection pads located on the other end surface of the vias which does not face the first substrate, wherein the first substrate and the second substrate are bonded by means of bonding of the first bonding pads and the second bonding pads.

Abstract: An ultrasonic sensor includes a piezoelectric element, a cell case configured to support the piezoelectric element bonded to a front portion of the cell case at an inside of the cell case, the cell case having an opening at a rear portion thereof, a PCB assembly electrically connected to the piezoelectric element, a housing coupled to the opening of the cell case while receiving the PCB assembly therein and configured to seal a space required for electrical connection between the piezoelectric element in the cell case and the PCB assembly, a filler filling the space required for electrical connection between the piezoelectric element and the PCB assembly, after completion of the electrical connection between the piezoelectric element and the PCB assembly, and a rear cover configured to seal a rear opening formed at the housing in order to allow insertion of the PCB assembly.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a piezoelectric membrane overlying a substrate. A plurality of conductive layers is disposed within the piezoelectric membrane. The plurality of conductive layers comprises a first conductive layer over a second conductive layer. The first conductive layer comprises a first electrode and the second conductive layer comprises a second electrode. A first conductive via is disposed in the piezoelectric membrane and contacts the first electrode. A second conductive via is disposed in the piezoelectric membrane and contacts the second electrode. A sidewall of the second conductive via comprises a vertical sidewall segment overlying a slanted sidewall segment.

Abstract: A MEMS device having a body with a first and a second surface, a first portion and a second portion. The MEMS device further has a cavity extending in the body from the second surface; a deformable portion between the first surface and the cavity; and a piezoelectric actuator arranged on the first surface, on the deformable portion. The deformable portion has a first region with a first thickness and a second region with a second thickness greater than the first thickness. The second region is adjacent to the first region and to the first portion of the body.

Abstract: An ultrasound transducer array includes an array of elongate support members that are displaceable and/or deformable relative to each other in the elongation direction of the elongate support members, each elongate support member having a patient facing surface carrying an ultrasound transducer tile; and multiple sensors, each adapted to detect the relative displacement and/or deformation of one of the elongate support members. The ultrasound transducer array may be included in an ultrasound system.

Abstract: An optoelectronic circuit used with signal light comprises photonic devices disposed on a platform. The photonic devices are configured to condition the signal light and are fabricated with an optical characteristic being electronically tunable. A fabricated performance of the optical characteristic can be varied from a target performance due to a difference (e.g., alteration, change, error, or discrepancy) in the process used to fabricate the device. A ground bus, a power bus, and banks of electronic components are disposed on the platform in electrical communication with the photonic devices. The electronic components in a given bank are selectively configurable to tune the optical characteristic of the associated device so a variance can be diminished between the fabrication and target performances of the device's optical characteristic due to the difference in the fabrication process.

Abstract: Provided are an ultrasonic imaging method and device, and a storage medium. The ultrasonic imaging method includes: acquiring an ultrasonic echo signal; segmenting the ultrasonic echo signal into a first predetermined number of sub-echo signals according to scan depths; performing amplitude apodization on each sub-echo signal with a predetermined window function to obtain processed sub-echo signals; completing ultrasonic imaging according to the processed sub-echo signals.

Abstract: A transducer array for ultrasound applications includes a plurality of transducer elements that are provided with self-aligned connections to a flexible cable. The array is easy to manufacture and suited for wearable, wireless, and other small ultrasound devices. A simple and efficient method of producing a robust transducer array involves at least partially separating the transducer elements after their connection to their respective conductors.

Abstract: Disclosed is a piezoelectric transducer which is mounted to a target in use, comprising: a piezoelectric element having a front face which faces the target, and an opposing rear face which faces away from the target, wherein the piezoelectric element has a first acoustic impedance; an compression element located on the rear surface side of the piezoelectric element, the compression element having a second acoustic impedance which is less than the first acoustic impedance; and, a compression mechanism which urges the compression element towards the piezoelectric element such that the compression element is compressed between the compression mechanism and piezoelectric element.

Abstract: Planar phased ultrasound transducer including a first layer including a sheet of piezoelectric material, a piezo frame surrounding an outer perimeter of the sheet of piezoelectric material, and an epoxy material placed between the piezo frame and the sheet of piezoelectric material. The transducer includes a flex frame secured to a back side of the first layer.

Abstract: A low-profile ultrasonic wave generation device is provided that includes a drive unit having a piezoelectric member and an electrode formed on a surface of the piezoelectric member. The drive unit as a whole vibrates flexurally. The connection member is connected to a portion of the drive unit that includes a point of maximum displacement of the drive unit when the drive unit is subjected to flexural vibration. The vibrating unit is connected to the connection member. The vibrating unit vibrates due to the flexural vibration of the drive unit being transmitted by the connection member and thereby generates ultrasonic waves.

Abstract: Systems and methods are provided for compressing and decompressing data in an ultrasound beamformer. The systems and methods include an encoder for compressing delay data based at least in part on a smoothness of a delay profile, and for compressing apodization data based at least in part on a smoothness of an apodization profile.

Abstract: A phased ultrasonic transducer and method for transmitting sound or ultrasound through a gaseous medium into a solid spectrum with ultrasound beam steering and focusing.

Abstract: Methods, apparatuses, and systems for two-way satellite communication and an asymmetric-aperture antenna for two-way satellite communication are disclosed. In one embodiment, a beam pattern for an asymmetric-aperture antenna is offset in a narrow beamwidth direction, and the offset beam pattern is directed by a mechanical gimbal, with the beam pattern offset made to reduce interference with an adjacent satellite. In additional embodiments, operational areas near the equator are identified for a given offset beam pattern, or a beam pattern offset may be adjusted over time to compensate for movement of the asymmetric-aperture antenna when attached to an airplane, boat, or other mobile vehicle.

Abstract: A device (1) comprising an electro-ceramic component (2) which has a first electrical contact (3A), provided on a first side face (2A) of the electro-ceramic component (2) in the excitation zone (11), and a second electrical contact (3B) provided on a second side face (2B) of the electro-ceramic component (2). A sealing compound (20) is placed around the electro-ceramic component (2) so that the first electrical contact (3A) and the second electrical contact (3B) are covered by the sealing compound (20) and a free end (26) of a section (24) of the high-voltage zone (12) of the electro-ceramic component (2) projects beyond a free end (22) of the sealing compound (20).

Abstract: An ultrasonic sensor includes an ultrasonic transducer; a first voltage output circuit to output a transmission voltage signal that oscillates between a first high voltage and a first low voltage, supplied to a first terminal of the ultrasonic transducer; a reception circuit to detect a voltage signal generated at a second terminal of the ultrasonic transducer; and the second voltage output circuit to output a second high voltage smaller than the first high voltage. The first voltage output circuit includes a first switching unit to perform switching between supplying the transmission voltage signal in ultrasonic transmission; and fixing a potential of the first terminal in ultrasonic reception. The second voltage output circuit includes a second switching unit that performs switching between supplying the second high voltage to the second terminal in ultrasonic transmission; and electrically separating the second voltage output circuit from the second terminal in ultrasonic reception.

Abstract: A phase array acoustic device using array of horns and optional faceplates is presented. Said horn phased-array acoustic device can be used as a passive sensor, a sound projector, or both (sonar). It is shown that by correct selection of the fill-factor and apodization faceplate, grating-lobes and side-lobes cab be greatly reduced. An optional use of acoustic valves as phase-shifter in the wave domain to improve Signal to Noise Ratio is presented. An optional aperiodic tiling of the horns' mouth to reduces aliasing is presented.

Abstract: A coherence indicator of received signals is calculated for pixels with a small amount of calculation, and a high-quality ultrasound image is obtained. A plurality of types of images in which a sound speed for beamforming is changed into a plurality of types are generated. By arranging, in order of the sound speed for beamforming, signal intensities of the pixels at corresponding positions between the plurality of types of images, a change in signal intensities in a direction of the sound speed for beamforming is obtained. A coherence indicator representing coherence of the received signals used for beamforming of the pixels is calculated based on the obtained change in the signal intensities.

Abstract: Disclosed is a method for treating sulfur-containing organic wastewater by integrating an energy supply unit and a treatment unit into an integrated device. The treatment unit is used to purify sulfur-containing organic wastewater with an initial concentration of organic sulfur, so that the organic sulfur content in the treated sulfur-containing organic wastewater is within a preset range to enable the device to efficiently purify and treat sulfur-containing organic wastewater with different initial concentrations of organic sulfur, the efficiency of purifying sulfur-containing organic wastewater can be improved to a certain extent, the purification cost can be reduced, and the competitiveness of enterprise can be enhanced.

Abstract: A flexible ultrasound transducer according to an embodiment of the present disclosure includes a substrate having a central part and a plurality of extended parts extending from the central part; an ultrasound probe disposed at the central part of the substrate to acquire an ultrasound image of a region of interest; and a focused ultrasound output unit disposed at the extended parts of the substrate to output a focused ultrasound to the region of interest, wherein the focused ultrasound output unit disposed at the extended parts of the substrate has a flexible property and is deformable. According to the structure of an embodiment, it is possible to simultaneously achieve ultrasound imaging and ultrasonic therapy such as lesion stimulation or removal through focused ultrasound, and adjust the focal position of focused ultrasound or improve the focal sensitivity through flexible movement.

Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a piezoelectric plate having front and back surfaces, a portion of the piezoelectric plate forming a diaphragm, a conductor pattern on the front surface, the conductor pattern including an interdigital transducer (IDT), fingers of the IDT on the diaphragm, and a front-side dielectric layer on the front surface of the piezoelectric plate between the interleaved fingers. A resonant frequency is determined, in part, by a thickness of the front-side dielectric layer. A ratio of a mark of the interleaved fingers to a pitch of the interleaved fingers is greater than or equal to 0.12 and less than or equal to 0.3.

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.

Abstract: Described are micromachined ultrasonic transducers (MUTs) with convex or concave electrodes, which have enhanced pressure amplitude and frequency response behavior when driven at fundamental and harmonic frequencies, as well as methods of making the same.

Abstract: A device for emitting an ultrasound acoustic wave in a propagation medium, comprising: a package including a base substrate and a cap coupled to the base substrate and defining therewith a chamber in the package; a semiconductor die, coupled to the base substrate in the chamber, comprising a semiconductor body; a micromachined ultrasonic transducer (MUT) integrated at least in part in the semiconductor body and including a cavity in the semiconductor body and a membrane suspended over the cavity; and an actuator, operatively coupled to the membrane, which can be operated for generating a deflection of the membrane. The membrane is designed in such a way that a resonance frequency thereof matches an acoustic resonance frequency that, during operation of the MUT, develops in said chamber of the package.

Abstract: Transducer assembly transmits ultrasonic energy towards a zone acoustically coupled to an object or area of interest, and comprises a piezoelectric subassembly matching a curved support layer disposed behind said subassembly. Piezoelectric subassembly comprises piezoelectric elements and metal connections. Piezoelectric elements are disposed along a first azimuth direction to form parallel curved segments of piezoelectric elements extending in a second elevation direction, each being in contact with a corresponding metal connection extending in the elevation direction for transmitting/receiving electric signals to/from each piezoelectric segment.

Abstract: A touch-sensitive user input device comprising: a first electrode layer comprising a first plurality of electrodes; a second electrode layer comprising a second plurality of electrodes; an insulating layer disposed between the first electrode layer and the second electrode layer; and at least one piezoelectric transducer, wherein an electrode of the at least one piezoelectric transducer is coupled to the first plurality of electrodes of the first electrode layer.

Abstract: A piezoelectric device includes a piezoelectric array, a resin portion, a first electrode, and a second electrode. The piezoelectric array includes piezoelectric pillars having a columnar shape and made of piezoelectric ceramic. The piezoelectric pillars are provided along a row direction and a column direction in a two-dimensional array such that the piezoelectric pillars are parallel or substantially parallel to each other in height direction thereof. The resin portion is located in and preferably fills a gap between the piezoelectric pillars. The first electrode includes first electrode wires extending in the column direction. The second electrode includes second electrode wires extending in the row direction. Both of the piezoelectric pillars and the resin portion resonantly vibrate in a thickness longitudinal vibration mode, and a resonant frequency of the resin portion is higher than a resonant frequency of the piezoelectric pillars by about 15% or greater.