Acoustic Wave Type Generator Or Receiver Patents (Class 310/334)
  • Patent number: 11513418
    Abstract: An addressing system, an addressing apparatus and a computing apparatus are provided. The addressing system includes a first acousto-optic processing component and a second acousto-optic processing component. The first acousto-optic processing component is used for generating a diffraction beam for an addressing operation in a preset number of dimensions. The second acousto-optic processing component is used for determining emitting directions of the generated diffraction beam in various dimensions, and outputting a diffraction beam according to the determined emitting directions to perform an addressing operation for a qubit array in the preset number of dimensions. A first radio frequency of the diffraction beam generated by the first acousto-optic processing component is used for compensating for a second radio frequency of diffraction beams outputted by the second acousto-optic processing component from different emitting directions.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: November 29, 2022
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Luming Duan, Zichao Zhou
  • Patent number: 11508346
    Abstract: A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an opening in the substrate. The substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT located within the cavity.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: November 22, 2022
    Assignee: InvenSense, Inc.
    Inventors: Stefon Shelton, Andre Guedes, David Horsley
  • Patent number: 11504092
    Abstract: An ultrasonic probe includes: a piezoelectric element that is used for transmitting and receiving ultrasonic waves; a signal electrode that is disposed at a rear surface side of the piezoelectric element; and a backing that is disposed at a rear surface side of the signal electrode, wherein the backing has a thermal resistance of 8 K/W or less, and the backing attenuates an ultrasonic wave with the lowest frequency by 10 dB or more, among frequencies at which transmittance and reception sensitivity of the ultrasonic probe is decreased from the maximum value thereof by 20 dB.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: November 22, 2022
    Assignee: KONICA MINOLTA, INC.
    Inventor: Ikuhiro Kitagaki
  • Patent number: 11462673
    Abstract: A piezoelectric substrate attachment structure including a cable-shaped piezoelectric substrate, a press section provided adjacent to the piezoelectric substrate and pressed from an opposite side from the piezoelectric substrate, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section. A ratio Eb/Ea of a Young's modulus Eb of the base section to a Young's modulus Ea of the press section being 10?1 or lower.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: October 4, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Mitsunobu Yoshida, Kazuhiro Tanimoto, Masahiko Mitsuzuka
  • Patent number: 11458504
    Abstract: Disclosed are systems and methods of operation for capacitive radio frequency micro-electromechanical switches, such as CMUT cells for use in an ultrasound system. An RFMEMS may include substrate, a first electrode connected to the substrate, a membrane and a second electrode connected to the membrane. In some examples, there is a dielectric stack between the first and second electrodes. The dielectric stack design minimizes drift in the membrane collapse voltage. In other examples, a voltage supply coupled to an ultrasonic array compressing the CMUT cells is adapted to provide a sequence of voltage profiles to the electrodes of the CMUT cell, wherein each profile includes a bias voltage and a stimulus voltage, and wherein a polarity of each subsequent voltage profile in the sequence is opposite to the polarity of the preceding profile. In another example, there is a capacitance sensing circuit provided, which is arranged to determine a drift voltage of the CMUT cell.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: October 4, 2022
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Sergei Shulepov, Peter Dirksen, Hans-Peter Loebl, Franciscus Paulus Maria Budzelaar, Petrus Henricus Maria Timmermans, Nico Maris Adriaan de Wild
  • Patent number: 11438705
    Abstract: A sound producing device is provided. The sound producing device comprises a substrate; and a membrane pair, disposed on the substrate, comprising a first membrane and a second membrane; wherein when a driving voltage is applied on the membrane pair, the first membrane and the second membrane deform toward each other, such that air between the first membrane and the second membrane is squeezed outward and an air pulse is generated toward a direction away from the substrate.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: September 6, 2022
    Assignee: xMEMS Labs, Inc.
    Inventors: Jemm Yue Liang, Martin George Lim
  • Patent number: 11413653
    Abstract: A sensor, sensor pad and sensor array for detecting infrasonic signals in a living organism are provided. The sensor, sensor pad and/or array can be utilized for detecting, determining and/or diagnosing level of stenosis, occlusion, or aneurysm in arteries, or other similar diagnosis. The sensor can include unique circuitry in the form of a piezoelectric plate or element sandwiched between two conductive O-rings.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: August 16, 2022
    Assignee: CVR Global, Inc.
    Inventors: Peter Bakema, Bret Kline, Alan Langston, Gary Stephen
  • Patent number: 11417823
    Abstract: A sensor element includes a first reference potential side terminal located between a first signal side terminal and a second signal side terminal along a first axis passing through the first signal side terminal and the second signal side terminal in a plan view from a direction in which a first piezoelectric element and a second piezoelectric element are stacked and a second reference potential side terminal located between the first signal side terminal and the second signal side terminal along the first axis in the plan view from the direction. The first axis is located between the first reference potential side terminal and the second reference potential side terminal in the plain view from the direction.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: August 16, 2022
    Inventors: Hiroshi Komatsu, Hiroki Kawai, Mitsuhiro Tateyama
  • Patent number: 11404627
    Abstract: A tactile sensation providing apparatus includes an actuator and an object of vibration configured to provide a tactile sensation to a user by vibration of the vibration plate being transmitted to the object of vibration. The actuator includes a piezoelectric element, a vibration plate, and supports. The vibration plate has the piezoelectric element joined thereto and vibrates in accordance with displacement of the piezoelectric element. The supports support the vibration plate. The angles, when the actuator is not being driven, between the vibration plate and the supports are acute.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: August 2, 2022
    Assignee: KYOCERA Corporation
    Inventor: Fumiaki Nakao
  • Patent number: 11361575
    Abstract: Disclosed are a piezoelectric material-based electronic device having high recognition precision for a three-dimensional shape and improved durability, and a manufacturing method thereof. The electronic device includes an anodic oxide film, a first electrode provided on an upper surface of the anodic oxide film, a second electrode provided on an a lower surface of the anodic oxide film, and a piezoelectric column made of a piezoelectric material and provided between the first electrode and the second electrode.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: June 14, 2022
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Tae Hwan Song
  • Patent number: 11350959
    Abstract: A method of fabricating an ultrasonic medical device is presented. The method includes machining a surgical tool from a flat metal stock, contacting a face of a first transducer with a first face of the surgical tool, and contacting a face of a second transducer with an opposing face of the surgical tool opposite the first transducer. The first and second transducers are configured to operate in a D31 mode with respect to the longitudinal portion of the surgical tool. Upon activation, the first transducer and the second transducer are configured to induce a standing wave in the surgical tool and the induced standing wave comprises a node at a node location in the surgical tool and an antinode at an antinode location in the surgical tool.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 7, 2022
    Assignee: Cilag GmbH International
    Inventors: Jeffrey D. Messerly, Brian D. Black, William A. Olson, Frederick Estera, William E. Clem, Jerome R. Morgan, Jeffrey L. Aldridge, Stephen M. Leuck
  • Patent number: 11349451
    Abstract: An elastic wave device includes a SiNx layer stacked directly or indirectly on a supporting substrate made of a semiconductor material, a piezoelectric film stacked on directly or indirectly the SiNx layer, and an interdigital transducer electrode stacked directly or indirectly on at least one main surface of the piezoelectric film. In the SiNx layer, x is about 1.34 or more and about 1.66 or less.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: May 31, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tsutomu Takai, Koji Yamamoto, Hideki Iwamoto
  • Patent number: 11318497
    Abstract: An ultrasonic inspection device according to an embodiment includes: an ultrasonic transducer which includes at least one oscillator group having a plurality of oscillators in a plurality of regions, each region disposing at least one oscillator; a selector which selects at least one region having one or more of the oscillators to be driven from among the plurality of regions; and a driver which individually drives one or more of the oscillators of the at least one region being selected.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 3, 2022
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tsuyoshi Kobayashi, Tomio Ono, Yasuharu Hosono
  • Patent number: 11266311
    Abstract: Methods, systems, and devices for mechanically disturbing tissues of the central nervous system including a brain of a subject are provided. An elastogram of brain tissue may be generated using mesoscopic wavelength ultrasound composed of longitudinal waves in brain tissues to produce micromechanical disturbances of brain nuclei and circuits for characterization of their mechanical properties (e.g., stiffness, elasticity, rigidity, viscoelasticity). A magnetic resonance elastography (MRE) system includes an MRE engine in electronic communication with at least one transducer and with a magnetic resonance imaging (MRI) device. The MRE engine is configured to electronically control operation of the at least one transducer to emit ultrasound, to electronically receive, from the MRI device, at least one signal indicative of measurements of displacement of the brain tissue by the ultrasound, and to electronically generate an elastogram of the brain tissue based on the at least one signal.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: March 8, 2022
    Assignee: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
    Inventor: William Tyler
  • Patent number: 11233188
    Abstract: An ultrasonic wave sensor includes an oscillating plate including a plurality of oscillators, a wall portion provided on the oscillating plate and surrounding the oscillator, a first piezoelectric element provided in the predetermined number of oscillators among the plurality of oscillators, and a second piezoelectric element provided in the oscillator where the first piezoelectric element is not provided. An input and an output of a drive signal are possible to the first piezoelectric element, and the first piezoelectric element is connected to at least another first piezoelectric element in parallel. The second piezoelectric element is electrically insulated from the first piezoelectric element. The second piezoelectric element is disposed between the first piezoelectric elements adjacent in one direction.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: January 25, 2022
    Inventors: Koji Ohashi, Chikara Kojima
  • Patent number: 11190164
    Abstract: A micromechanical system (MEMS) resonator includes a base substrate. A piezoelectric layer has a first electrode attached to a first surface of the piezoelectric layer and a second electrode attached to a second surface of the piezoelectric layer opposite the first electrode. The first electrode is bounded by a perimeter edge. A patterned acoustic mirror is formed on a top surface of the first electrode opposite the piezoelectric layer, such that the patterned acoustic mirror covers a border strip of the top surface of the first electrode at the perimeter edge and does not cover an active portion of the top surface of the first electrode.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: November 30, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ting-Ta Yen, Jeronimo Segovia Fernandez, Bichoy Bahr, Peter Smeys
  • Patent number: 11189777
    Abstract: A multilayer piezoelectric element includes a piezoelectric element body, a first internal electrode and a second internal electrode, a plurality of first connecting conductors, a plurality of second connecting conductors, and an external member. The piezoelectric element body is formed by laminating a plurality of piezoelectric element body layer. The piezoelectric element body includes a first main surface and a second main surface, and a side surface. The plurality of first connecting conductors are connected to the first internal electrode. The plurality of second connecting conductors are connected to the second internal electrode. The external member is conductive and is bonded to the first main surface in such a way as to cover the first end portions of the plurality of first connecting conductors. The external member is electrically connected to the plurality of first connecting conductors.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: November 30, 2021
    Assignee: TDK CORPORATION
    Inventors: Yoshiki Ohta, Tetsuyuki Taniguchi, Hideya Sakamoto, Kazushi Tachimoto, Junpei Kikuchi, Akihiro Takeda
  • Patent number: 11185886
    Abstract: A MEMS device may include a first electrode region; a first piezoelectric layer arranged over the first electrode region; a second electrode region arranged over the first piezoelectric layer; a second piezoelectric layer arranged over the first piezoelectric layer and the second electrode region; a third electrode region arranged over the second piezoelectric layer; a first input port coupled to the first electrode region and/or the second electrode region for providing a first electrical signal to the first piezoelectric layer to generate a first vibration in the first piezoelectric layer; a second input port coupled to the second electrode region and/or the third electrode region for providing a second electrical signal to the second piezoelectric layer to generate a second vibration in the second piezoelectric layer; and an output port configured to receive an output signal including a superposition of the first vibration and the second vibration.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: November 30, 2021
    Assignee: VANGUARD INIERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
    Inventors: Humberto Campanella Pineda, Joan Josep Giner De Haro, You Pak-Chum Qian, Rakesh Kumar
  • Patent number: 11167154
    Abstract: A system for use in managing a neuromodulation therapy includes an ultrasound transducer array controlled by a control unit to deliver ultrasound waveforms for causing modulation of neural tissue in a patient. The system acquires data indicating a response to the modulation, analyzes the acquired data to determine correlation data between a response to the modulation and an ultrasound control parameter, and reports the correlation data to enable identification of at least one therapy parameter to be used to deliver a neuromodulation therapy to the patient by a therapy delivery system.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: November 9, 2021
    Assignee: Medtronic, Inc.
    Inventors: Jamu Alford, Steven M. Goetz, Lothar Krinke, Mark S. Lent, Erik R. Scott, Xuan K. Wei, John D. Welter
  • Patent number: 11160530
    Abstract: An ultrasonic transducer module including: a plurality of piezoelectric elements, each being aligned in the same direction that is a longitudinal direction thereof; an electrode formed on a surface of each of the piezoelectric elements; a wiring member configured to be joined with the electrode and electrically connected with the electrode; and a dematching layer provided on a surface of each of the piezoelectric elements, the surface being opposite to another surface of the corresponding piezoelectric element on which the electrode and the wiring member are joined.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: November 2, 2021
    Assignee: OLYMPUS CORPORATION
    Inventor: Katsuhiro Wakabayashi
  • Patent number: 11141134
    Abstract: An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on the opposite side of the SCC layer. The SCC layer may have a bowl shape including pillars made of a single crystal piezoelectric material embedded in a polymer matrix. Also provided is an ultrasound transducer as above, with the back electrode split into two electrodes electrically isolated from one another. A method of forming an ultrasound transducer as above is also provided. An IVUS imaging system is provided, including an ultrasound emitter and receiver rotationally disposed within an elongate member; an actuator; and a control system controlling emission of pulses and receiving ultrasound echo data associated with the pulses. The ultrasound emitter and receiver include an ultrasound transducer as above.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: October 12, 2021
    Inventor: Paul Douglas Corl
  • Patent number: 11125727
    Abstract: A sensor or receiver array includes first and second pyroelectrically active electrodes formed of polyvinylidene difluoride and separated by a spacer layer that acts to electrically separate the pyroelectric layers while keeping them close enough such that they see effectively the same vibration or background acoustic excitation while maintaining sufficient separation to ensure that they generate significant differences in their pyroelectric responses. The structure provides two distinct signals (at separate timestamps), the difference between which provides a more accurate signal. An ultrasound detection system includes the tri-laminar sensor, disposed within a detection zone in which a test element can be positioned. The apparatus includes a processing unit, which comprises a detector unit coupled to the first and second pyroelectric elements and configured to derive a differential signal from the first and second pyroelectric elements.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 21, 2021
    Assignee: NPL Management Limited
    Inventor: Bajram Zeqiri
  • Patent number: 11107630
    Abstract: Various embodiments of the present disclosure are directed towards a piezoelectric metal-insulator-metal (MIM) device including a piezoelectric structure between a top electrode and a bottom electrode. The piezoelectric layer includes a top region overlying a bottom region. Outer sidewalls of the bottom region extend past outer sidewalls of the top region. The outer sidewalls of the top region are aligned with outer sidewalls of the top electrode. The piezoelectric layer is configured to help limit delamination of the top electrode from the piezoelectric layer.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: August 31, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao
  • Patent number: 11101424
    Abstract: An ultrasound transducer used in an ultrasound system and a method of manufacturing the same are disclosed. The ultrasound transducer is manufactured by forming a backing block including a plurality of surfaces; forming a piezoelectric layer including a first portion formed on the backing block to be in contact therewith and a second portion extending from the first portion; electrically connecting a plurality of pins to the second portion by attaching a connector having the plurality of pins for electrical connection with at least one of a transmitting unit and a receiving unit of an ultrasound system to at least one surface of the plurality of surfaces of the backing block; cutting the first portion and the second portion of the piezoelectric layer into a plurality of piezoelectric elements, wherein each of the plurality of piezoelectric elements is connected to a corresponding one of the plurality of pins of the connector; and forming a ground layer connected to the piezoelectric layer.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: August 24, 2021
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: KyungHo Lee, YoungShin Kim, Baik Woo Lee
  • Patent number: 11095235
    Abstract: A vibration type actuator uses a friction material of which a depth of impregnation with a resin can be easily measured in a non-destructive manner. The vibration type actuator has a vibrating body including an electro-mechanical energy conversion element and an elastic body; and a contact body configured to come into contact with the vibrating body. The vibration type actuator has a structure in which at least one of a friction portion of the contact body coming into contact with the vibrating body and a friction portion of the vibrating body coming into contact with the contact body has a metallic portion including a pore that is impregnated with a resin containing a fluorescent material.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: August 17, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yasuyuki Araki
  • Patent number: 11090688
    Abstract: A phased ultrasonic transducer and method for transmitting sound or ultrasound through a gaseous medium into a solid spectrum with ultrasound beam steering and focusing.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: August 17, 2021
    Inventors: Anuj M. Bhardwaj, Mahesh C. Bhardwaj, Mikel Langron, Michael Whetzel
  • Patent number: 11073913
    Abstract: In an embodiment a device includes at least one piezoelectric actuator including a plurality of piezoelectric layers and a first reinforcing element and a second reinforcing element, wherein the piezoelectric actuator is arranged between the reinforcing elements, wherein the piezoelectric actuator is configured to alter its expansion in a first direction when an electrical voltage is applied, and wherein the reinforcing elements are configured to deform on account of a change in an expansion of the piezoelectric actuator such that a central region of the respective reinforcing element is moved relative to the piezoelectric actuator in a second direction, the second direction being perpendicular to the first direction.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: July 27, 2021
    Assignee: TDK ELECTRONICS AG
    Inventors: Franz Rinner, Harald Kastl
  • Patent number: 11058396
    Abstract: A transceiver includes an array of pMUT elements, where each pMUT element includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode; and a first electrode disposed on the piezoelectric layer. Each pMUT element exhibits one or more modes of vibration.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 13, 2021
    Assignee: EXO IMAGING INC.
    Inventors: Yusuf Haque, Sandeep Akkaraju, Janusz Bryzek
  • Patent number: 11047830
    Abstract: A characterization device for non-destructively characterizing a material includes emitter/receiver cells, each cell being able, in an emit mode, to emit ultrasound waves towards the material for characterizing, and, in a receive mode, to receive ultrasound waves that have been transmitted through the material. The non-destructive characterization device includes a ring made up of a plurality of adjacent angular sectors, each angular sector including ultrasound cells stacked in a radial direction of the ring.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: June 29, 2021
    Assignee: SAFRAN
    Inventors: Mathieu Loic Ducousso, Frederic Jenson
  • Patent number: 11040535
    Abstract: A liquid ejecting head includes: a flow channel forming substrate that forms an individual flow channel including a nozzle and a pressure chamber, a first common liquid chamber, and a second common liquid chamber; and a pressure generating element that causes a pressure change in a liquid in the pressure chamber, in which the first common liquid chamber is coupled to the second common liquid chamber via the individual flow channel, a compliance of the first common liquid chamber is larger than a compliance of the second common liquid chamber, and in the individual flow channel, a flow channel resistance between a first coupling portion with the first common liquid chamber and the pressure chamber is smaller than a flow channel resistance between a second coupling portion with the second common liquid chamber and the pressure chamber.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: June 22, 2021
    Assignee: Seiko Epson Corporation
    Inventors: Katsutomo Tsukahara, Shunsuke Watanabe
  • Patent number: 11039812
    Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 22, 2021
    Assignee: Butterfly Network, Inc.
    Inventors: Jonathan M. Rothberg, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston, Gregory L. Charvat, Gregory Corteville
  • Patent number: 11022583
    Abstract: The invention comprises methods for fabricating and using a plurality of sensors on a substrate surface, such as ultrasonic sensor probes. The methods for fabricating sensors directly on the substrate surface includes the use of a template to dispose sensor material in an array and form a first layer on the substrate surface and a second template to dispose sensor electrode material in a corresponding array to form a second layer on top of the first layer. The invention provides a sensor housing that electrically connects the sensors and a computing device. The sensor housing may comprise a flexible circuit having a plurality of sensor electrode contact points corresponding to each of the sensors, at least one spring plate, a force distribution plate, and a plurality of cable wires attached to the flexible circuit and corresponding to each of sensor electrode contact points.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: June 1, 2021
    Assignee: Electric Power Research Institute, Inc.
    Inventor: Luke Justin Breon
  • Patent number: 11018099
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a semiconductor chip; a substrate facing an active surface of the semiconductor chip; and a conductive bump extending from the active surface of the semiconductor chip toward the substrate, wherein the conductive bump comprises: a plurality of bump segments comprising a first group of bump segments and a second group of bump segments, wherein each bump segment comprises the same segment height in a direction orthogonal to the active surface of the semiconductor chip, and each bump segment comprises a volume defined by the multiplication of the segment height with the average cross-sectional area of the bump segment; wherein the ratio of the total volume of the first group of bump segments to the total volume of the second group of bump segments is between about 0.03 and about 0.8.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: May 25, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pei-Haw Tsao, An-Tai Xu, Huang-Ting Hsiao, Kuo-Chin Chang
  • Patent number: 10983202
    Abstract: Provided is a sensor part having a vibrating member and a mounting method therefor that allows the sensor part to be mounted to a target member such as a bumper in a simple, efficient and reliable manner. The sensor part includes a first assembly (3) including a tubular first case (5), a vibrating member (7) temporarily retained by the first case, and a pressing member (12) slidably supported in the first case, and a second assembly (4) including a second case (34) to be connected to the first case, and a circuit board (35) for controlling the vibrating member. After the first case is fixed to the target member, the pressing member is pushed so as to release the vibrating member from the temporal retention, and press the vibrating member against the target member.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: April 20, 2021
    Assignee: NIFCO INC.
    Inventors: Hiroshi Ochiai, Tomoharu Izume
  • Patent number: 10973494
    Abstract: Flex circuits and methods for ultrasound transducers are provided herein. In at least one embodiment, an ultrasound device includes a plurality of transducer elements and a flex circuit. The flex circuit includes an insulating layer having a first surface and a second surface opposite the first surface. A plurality of first conductive pads is included on the first surface of the insulating layer, and each of the first conductive pads is electrically coupled to a respective transducer element. A plurality of second conductive pads are included on the second surface of the insulating layer, and each of the second conductive pads is electrically coupled to a respective first conductive pad and the respective transducer element.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: April 13, 2021
    Assignee: EchoNous, Inc.
    Inventors: Kelly James Koski, Joel Dean Wetzstein, Greg Nieminen
  • Patent number: 10979793
    Abstract: A display apparatus includes a display panel configured to display an image by emitting light, and a sound generation device including a vibration generation module configured to vibrate the display panel. The vibration generation module includes a vibration element on a rear surface of the display panel, and a vibration reflecting member on the rear surface of the display panel and spaced apart from the vibration element.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: April 13, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Taehyung Kim, YoungYoon You, GeunChang Park
  • Patent number: 10976423
    Abstract: In one form, an acoustic distance measuring circuit includes a transmitter amplifier, an acoustic transducer, and a sensing circuit. The sensing circuit includes an input adapted to be coupled to the acoustic transducer, a first correlation output for providing a chirp tail correlation signal, and a second output for providing a full chirp correlation signal. The sensing circuit provides the chirp tail correlation signal in response to correlating a chirp tail signal pattern with a received signal, and provides a full chirp correlation signal in response to correlating a full chirp signal pattern with the received signal. Further, the acoustic distance measuring circuit includes a controller adapted to be coupled to the sensing circuit that has a first input for receiving the chirp tail correlation signal and the full chirp correlation signal for determining a short range time of flight signal and a long range time of flight signal.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: April 13, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Marek Hustava, Tomas Suchy
  • Patent number: 10932755
    Abstract: Disclosed herein is a multi-row ultrasonic probe of which a manufacturing failure rate can be decreased. The ultrasonic probe includes a piezoelectric layer configured to generate ultrasonic waves, a sound layer provided on a rear side of the piezoelectric layer, a flexible printed circuit board provided on a rear side of the sound layer, and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board. The piezoelectric layer includes a kerf configured to divide the piezoelectric layer in a direction of elevation. The sound layer includes a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: March 2, 2021
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Jin Ho Gu, Sung Do Kwon, Seong Jin Kim, Joong Hyun Park
  • Patent number: 10921478
    Abstract: A transducer, method, and downhole tool for acoustic logging. The acoustic transducer comprises a piezoelectric material comprising a body and grooves formed on the body. The grooves comprise a first groove that intersects with a second groove on the body. The method of acoustic logging a wall comprises transmitting an acoustic pulse at the wall using the acoustic transducer. The method also comprises generating a signal indicative of a reflection of the pulse using the acoustic transducer; and determining an acoustic parameter based on the signal using a processor. The acoustic logging tool is locatable in a wellbore intersecting a subterranean earth formation. The acoustic logging tool comprises the acoustic transducer and a processor configured to determine an acoustic parameter based on a signal generated by the acoustic transducer, the signal being indicative of the acoustic wave.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: February 16, 2021
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Vinodh Kumar Palani, Jing Jin, Chin Wee Lim
  • Patent number: 10898166
    Abstract: Combined transducer arrays for imaging features of tissue include a transducer array configured for transmit-receive ultrasound imaging, and a transducer array configured for receive-only thermoacoustic imaging. The transmit-receive transducer array includes a plurality of transmit-receive array elements, and the receive-only transducer array includes a plurality of receive-only array elements. The receive-only array elements are registered with and surround the transmit-receive array elements. The receive-only transducer array and transmit-receive transducer array may be housed in an ultrasound probe. The combined transducer arrays may be used in composite imaging of tissue, based on the registration of the transmit-receive array elements and the receive-only array elements.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: January 26, 2021
    Assignee: ENDRA Life Sciences Inc.
    Inventors: Michael M. Thornton, Paul A. Picot
  • Patent number: 10903762
    Abstract: An actuator device comprises an electroactive or photoactive polymer arrangement having an effective length over which expansion or contraction is induced by actuation. The effective length is greater than the maximum linear physical dimension of the space occupied by the polymer arrangement. In this way, a compact design is provided which can support a large actuation displacement.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: January 26, 2021
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Cornelis Petrus Hendriks, Mark Thomas Johnson, Daan Anton Van Den Ende, Eduard Gerard Marie Pelssers, Roland Alexander Van De Molengraaf
  • Patent number: 10821474
    Abstract: Circuits, devices and methods generating an ultrasound pulse are provided herein. An ultrasound probe includes an array of transducer elements configured to transmit an ultrasound signal toward a target structure in a region of interest, and an array of pulse generators for driving a respective transducer element. Each of the pulse generators are coupled to a respective transducer element and include a driver circuit configured to receive a control signal and to output a driving signal, a switching element coupled to the driver circuit, and a resonant circuit coupled to the switching element and the respective transducer element, wherein the resonant circuit is configured to provide a transmit pulse to the respective transducer element based on the driving signal. The switching element may comprise a gallium nitride field effect transistor (GaN FET).
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: November 3, 2020
    Assignee: EchoNous, Inc.
    Inventor: Ronald W. Broad
  • Patent number: 10825980
    Abstract: A vibrating device includes a diaphragm, a piezoelectric element, and a wiring board. The piezoelectric element and the wiring board are bonded to a first principal plane of the diaphragm. The wiring board is electrically connected with the piezoelectric element. The piezoelectric element includes a piezoelectric element body, a plurality of internal electrodes, and a plurality of external electrodes. The piezoelectric element body has a second principal plane, a third principal plane, and a side surface. The third principal plane and the side surface are bonded to the first principal plane. The wiring board has a resin film, a plurality of conductors, and a coating film. The coating film is disposed on the plurality of conductors in such a way as to cover the plurality of conductors. One end portions of the plurality of conductors are exposed from the coating film and electrically connected with corresponding external electrodes.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: November 3, 2020
    Assignee: TDK CORPORATION
    Inventors: Kaoru Kijima, Tatsuya Taki, Kazushi Tachimoto, Toshiki Maruyama
  • Patent number: 10809233
    Abstract: A backing component configured to receive and attenuate transmitted acoustic signals from a transducer element in an ultrasound probe is disclosed. The backing component has a unitary structure of a first material and a second material, and a variation in packing density of the first material across at least a portion of a thickness of the backing component. Further, a method of making a backing component for a transducer element in an ultrasound probe is disclosed. The method includes performing an additive manufacturing technique using a first material and a second material to form the backing component that has a unitary structure of the first material and the second material. Performing the additive manufacturing technique involves varying a packing density of the first material across at least a portion of thickness of the backing component.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: October 20, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Jessica Lynn Abraham, Jimmie Autrey Beacham, Scott William Easterbrook
  • Patent number: 10802123
    Abstract: An ultrasound probe may include a mechanical transducer and a probe housing. The mechanical transducer may be rotatable about an axis. The mechanical transducer may be operable to acquire ultrasound image data at one or more rotational positions of a plurality of rotational positions. The probe housing may include a probe cap covering the mechanical transducer. The mechanical transducer may be directed toward the probe cap at each of the plurality of rotational positions. The probe cap may include a defined structure having a first thickness and a remainder portion having a second thickness different than the first thickness. In various embodiments, at least a portion of the defined structure is at a center section of the probe cap corresponding with a center rotational position of the mechanical transducer.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: October 13, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Stefan Holl, Franz Steinbacher
  • Patent number: 10795042
    Abstract: An ultrasonic transducer may comprise a transducer body including a first face and a second face disposed on opposite sides of the transducer body, wherein the transducer body comprises a piezoelectric material; a first transducer edge disposed on the transducer body; and a second transducer edge disposed on the transducer body, wherein the first edge is disposed on the transducer body substantially opposite from the second edge, and wherein the first and second transducer edges intersect a perimeter of the transducer body, and wherein the first and second edge forms an angle no less than 3 degrees.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 6, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Jing Jin, Yao Ge
  • Patent number: 10770641
    Abstract: A piezoelectric element includes first and second electrodes, a first piezoelectric body layer, and a plurality of first through-hole conductors. The first and second electrodes oppose each other. The first piezoelectric body layer is disposed between the first electrode and the second electrode. The plurality of first through-hole conductors penetrates the first piezoelectric body layer and is connected to the first electrode and the second electrode. When seen in an opposing direction of the first and second electrodes, the plurality of first through-hole conductors is arrayed in a matrix.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 8, 2020
    Assignee: TDK CORPORATION
    Inventors: Yoshiki Ohta, Hideya Sakamoto, Kazushi Tachimoto, Nobuo Furukawa, Akihiro Takeda
  • Patent number: 10751755
    Abstract: An apparatus comprises an ultrasonic transducer having a first and second electrode and switches which configured to selectively connect the first and second electrodes to a transmit voltage source or to a receive amplifier. The switches are configured to selectively connect a first input of the amplifier to the first electrode of the transducer and to selectively connect a second input of the amplifier to the second electrode of the transducer. The switches are also configured to selectively connect the voltage source to the first and second electrodes of the transducer. The transducer may include a piezoelectric layer attached to and sandwiched between the first electrode and the second electrode, and a flexible membrane attached to the first electrode. The piezoelectric layer may be patterned to form an annular ring at the outer diameter of the flexible membrane.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: August 25, 2020
    Assignee: Chirp Microsystems, Inc.
    Inventors: David A. Horsley, Andre Guedes, Meng-Hsiung Kiang, Richard Przybyla, Stefon Shelton
  • Patent number: 10736607
    Abstract: An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and/or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 11, 2020
    Assignee: Koninklijke Philips N.V.
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Angel Metodiev Savov
  • Patent number: 10730074
    Abstract: A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200° C.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: August 4, 2020
    Assignee: Ionix Advanced Technologies Ltd
    Inventors: Timothy James Stevenson, Timothy Paul Alistair Comyn