Abstract: A transceiver includes an array of pMUT elements, where each pMUT element includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode; and a first electrode disposed on the piezoelectric layer. Each pMUT element exhibits one or more modes of vibration.

Abstract: A characterization device for non-destructively characterizing a material includes emitter/receiver cells, each cell being able, in an emit mode, to emit ultrasound waves towards the material for characterizing, and, in a receive mode, to receive ultrasound waves that have been transmitted through the material. The non-destructive characterization device includes a ring made up of a plurality of adjacent angular sectors, each angular sector including ultrasound cells stacked in a radial direction of the ring.

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Abstract: A liquid ejecting head includes: a flow channel forming substrate that forms an individual flow channel including a nozzle and a pressure chamber, a first common liquid chamber, and a second common liquid chamber; and a pressure generating element that causes a pressure change in a liquid in the pressure chamber, in which the first common liquid chamber is coupled to the second common liquid chamber via the individual flow channel, a compliance of the first common liquid chamber is larger than a compliance of the second common liquid chamber, and in the individual flow channel, a flow channel resistance between a first coupling portion with the first common liquid chamber and the pressure chamber is smaller than a flow channel resistance between a second coupling portion with the second common liquid chamber and the pressure chamber.

Abstract: The invention comprises methods for fabricating and using a plurality of sensors on a substrate surface, such as ultrasonic sensor probes. The methods for fabricating sensors directly on the substrate surface includes the use of a template to dispose sensor material in an array and form a first layer on the substrate surface and a second template to dispose sensor electrode material in a corresponding array to form a second layer on top of the first layer. The invention provides a sensor housing that electrically connects the sensors and a computing device. The sensor housing may comprise a flexible circuit having a plurality of sensor electrode contact points corresponding to each of the sensors, at least one spring plate, a force distribution plate, and a plurality of cable wires attached to the flexible circuit and corresponding to each of sensor electrode contact points.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a semiconductor chip; a substrate facing an active surface of the semiconductor chip; and a conductive bump extending from the active surface of the semiconductor chip toward the substrate, wherein the conductive bump comprises: a plurality of bump segments comprising a first group of bump segments and a second group of bump segments, wherein each bump segment comprises the same segment height in a direction orthogonal to the active surface of the semiconductor chip, and each bump segment comprises a volume defined by the multiplication of the segment height with the average cross-sectional area of the bump segment; wherein the ratio of the total volume of the first group of bump segments to the total volume of the second group of bump segments is between about 0.03 and about 0.8.

Abstract: Provided is a sensor part having a vibrating member and a mounting method therefor that allows the sensor part to be mounted to a target member such as a bumper in a simple, efficient and reliable manner. The sensor part includes a first assembly (3) including a tubular first case (5), a vibrating member (7) temporarily retained by the first case, and a pressing member (12) slidably supported in the first case, and a second assembly (4) including a second case (34) to be connected to the first case, and a circuit board (35) for controlling the vibrating member. After the first case is fixed to the target member, the pressing member is pushed so as to release the vibrating member from the temporal retention, and press the vibrating member against the target member.

Abstract: In one form, an acoustic distance measuring circuit includes a transmitter amplifier, an acoustic transducer, and a sensing circuit. The sensing circuit includes an input adapted to be coupled to the acoustic transducer, a first correlation output for providing a chirp tail correlation signal, and a second output for providing a full chirp correlation signal. The sensing circuit provides the chirp tail correlation signal in response to correlating a chirp tail signal pattern with a received signal, and provides a full chirp correlation signal in response to correlating a full chirp signal pattern with the received signal. Further, the acoustic distance measuring circuit includes a controller adapted to be coupled to the sensing circuit that has a first input for receiving the chirp tail correlation signal and the full chirp correlation signal for determining a short range time of flight signal and a long range time of flight signal.

Abstract: A display apparatus includes a display panel configured to display an image by emitting light, and a sound generation device including a vibration generation module configured to vibrate the display panel. The vibration generation module includes a vibration element on a rear surface of the display panel, and a vibration reflecting member on the rear surface of the display panel and spaced apart from the vibration element.

Abstract: Flex circuits and methods for ultrasound transducers are provided herein. In at least one embodiment, an ultrasound device includes a plurality of transducer elements and a flex circuit. The flex circuit includes an insulating layer having a first surface and a second surface opposite the first surface. A plurality of first conductive pads is included on the first surface of the insulating layer, and each of the first conductive pads is electrically coupled to a respective transducer element. A plurality of second conductive pads are included on the second surface of the insulating layer, and each of the second conductive pads is electrically coupled to a respective first conductive pad and the respective transducer element.

Abstract: Disclosed herein is a multi-row ultrasonic probe of which a manufacturing failure rate can be decreased. The ultrasonic probe includes a piezoelectric layer configured to generate ultrasonic waves, a sound layer provided on a rear side of the piezoelectric layer, a flexible printed circuit board provided on a rear side of the sound layer, and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board. The piezoelectric layer includes a kerf configured to divide the piezoelectric layer in a direction of elevation. The sound layer includes a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer.

Abstract: A transducer, method, and downhole tool for acoustic logging. The acoustic transducer comprises a piezoelectric material comprising a body and grooves formed on the body. The grooves comprise a first groove that intersects with a second groove on the body. The method of acoustic logging a wall comprises transmitting an acoustic pulse at the wall using the acoustic transducer. The method also comprises generating a signal indicative of a reflection of the pulse using the acoustic transducer; and determining an acoustic parameter based on the signal using a processor. The acoustic logging tool is locatable in a wellbore intersecting a subterranean earth formation. The acoustic logging tool comprises the acoustic transducer and a processor configured to determine an acoustic parameter based on a signal generated by the acoustic transducer, the signal being indicative of the acoustic wave.

Abstract: An actuator device comprises an electroactive or photoactive polymer arrangement having an effective length over which expansion or contraction is induced by actuation. The effective length is greater than the maximum linear physical dimension of the space occupied by the polymer arrangement. In this way, a compact design is provided which can support a large actuation displacement.

Abstract: Combined transducer arrays for imaging features of tissue include a transducer array configured for transmit-receive ultrasound imaging, and a transducer array configured for receive-only thermoacoustic imaging. The transmit-receive transducer array includes a plurality of transmit-receive array elements, and the receive-only transducer array includes a plurality of receive-only array elements. The receive-only array elements are registered with and surround the transmit-receive array elements. The receive-only transducer array and transmit-receive transducer array may be housed in an ultrasound probe. The combined transducer arrays may be used in composite imaging of tissue, based on the registration of the transmit-receive array elements and the receive-only array elements.

Abstract: Circuits, devices and methods generating an ultrasound pulse are provided herein. An ultrasound probe includes an array of transducer elements configured to transmit an ultrasound signal toward a target structure in a region of interest, and an array of pulse generators for driving a respective transducer element. Each of the pulse generators are coupled to a respective transducer element and include a driver circuit configured to receive a control signal and to output a driving signal, a switching element coupled to the driver circuit, and a resonant circuit coupled to the switching element and the respective transducer element, wherein the resonant circuit is configured to provide a transmit pulse to the respective transducer element based on the driving signal. The switching element may comprise a gallium nitride field effect transistor (GaN FET).

Abstract: A vibrating device includes a diaphragm, a piezoelectric element, and a wiring board. The piezoelectric element and the wiring board are bonded to a first principal plane of the diaphragm. The wiring board is electrically connected with the piezoelectric element. The piezoelectric element includes a piezoelectric element body, a plurality of internal electrodes, and a plurality of external electrodes. The piezoelectric element body has a second principal plane, a third principal plane, and a side surface. The third principal plane and the side surface are bonded to the first principal plane. The wiring board has a resin film, a plurality of conductors, and a coating film. The coating film is disposed on the plurality of conductors in such a way as to cover the plurality of conductors. One end portions of the plurality of conductors are exposed from the coating film and electrically connected with corresponding external electrodes.

Abstract: A backing component configured to receive and attenuate transmitted acoustic signals from a transducer element in an ultrasound probe is disclosed. The backing component has a unitary structure of a first material and a second material, and a variation in packing density of the first material across at least a portion of a thickness of the backing component. Further, a method of making a backing component for a transducer element in an ultrasound probe is disclosed. The method includes performing an additive manufacturing technique using a first material and a second material to form the backing component that has a unitary structure of the first material and the second material. Performing the additive manufacturing technique involves varying a packing density of the first material across at least a portion of thickness of the backing component.

Abstract: An ultrasound probe may include a mechanical transducer and a probe housing. The mechanical transducer may be rotatable about an axis. The mechanical transducer may be operable to acquire ultrasound image data at one or more rotational positions of a plurality of rotational positions. The probe housing may include a probe cap covering the mechanical transducer. The mechanical transducer may be directed toward the probe cap at each of the plurality of rotational positions. The probe cap may include a defined structure having a first thickness and a remainder portion having a second thickness different than the first thickness. In various embodiments, at least a portion of the defined structure is at a center section of the probe cap corresponding with a center rotational position of the mechanical transducer.

Abstract: An ultrasonic transducer may comprise a transducer body including a first face and a second face disposed on opposite sides of the transducer body, wherein the transducer body comprises a piezoelectric material; a first transducer edge disposed on the transducer body; and a second transducer edge disposed on the transducer body, wherein the first edge is disposed on the transducer body substantially opposite from the second edge, and wherein the first and second transducer edges intersect a perimeter of the transducer body, and wherein the first and second edge forms an angle no less than 3 degrees.

Abstract: A piezoelectric element includes first and second electrodes, a first piezoelectric body layer, and a plurality of first through-hole conductors. The first and second electrodes oppose each other. The first piezoelectric body layer is disposed between the first electrode and the second electrode. The plurality of first through-hole conductors penetrates the first piezoelectric body layer and is connected to the first electrode and the second electrode. When seen in an opposing direction of the first and second electrodes, the plurality of first through-hole conductors is arrayed in a matrix.

Abstract: An apparatus comprises an ultrasonic transducer having a first and second electrode and switches which configured to selectively connect the first and second electrodes to a transmit voltage source or to a receive amplifier. The switches are configured to selectively connect a first input of the amplifier to the first electrode of the transducer and to selectively connect a second input of the amplifier to the second electrode of the transducer. The switches are also configured to selectively connect the voltage source to the first and second electrodes of the transducer. The transducer may include a piezoelectric layer attached to and sandwiched between the first electrode and the second electrode, and a flexible membrane attached to the first electrode. The piezoelectric layer may be patterned to form an annular ring at the outer diameter of the flexible membrane.

Abstract: An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and/or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.

Abstract: A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200° C.

Abstract: A method for the batch production of acoustic wave filters comprises: synthesizing N theoretical filters, each filter defined by a set of j theoretical resonator(s) having a triplet C0ij,eq, ?rij,eq and ?aij,eq, these parameters grouped into subsets; determining a reference resonator structure for each subset, naturally having a resonant frequency ?r,ref, where ?aij,eq<?r,ref<?rij,eq; determining, for each theoretical resonator, an elementary building block comprising an intermediate resonator R?ij, a parallel reactance Xpij and/or a series reactance Xsij, the intermediate resonator R?ij having a triplet C0ij, ?r,ref and ?a,ref, the parameters C0ij, Xpij and/or Xsij defined so the elementary building block has a triplet: C0ij,eq, ?rij,eq and ?aij,eq; determining the geometrical dimensions of the actual resonators Rij of the filters so they have a capacitance C0ij; producing each actual resonator; associating series and/or parallel reactances with actual resonators in order to form the elementary buildin

Abstract: Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Abstract: A system and method for ultrasonic sensing, wherein an ultrasonic receiver array includes multiple ultrasonic sensor pixels, and each sensor pixel includes an ultrasonic receiver configured to read an ultrasonic signal. An ultrasonic transmitter array, composed of multiple elements, transmits ultrasonic signals which may be reflected from an object and received at the ultrasonic receivers, wherein a sensor controller applies excitation signals to the transmitter array with a temporal delay between excitation signals.

Abstract: In a piezoelectric element, internal stress generated in an inactive portion at the time of sintering when a piezoelectric element is fabricated or stress applied from the outside to the inactive portion is absorbed by a recess of a lower surface of a first through hole conductor and a recess of an upper surface of a second through hole conductor. Accordingly, for example, deformation, rupture, or the like of the through hole conductor is prevented, and conduction failure or disconnection of an electrode layer or a through hole conductor is prevented. Further, in the inactive portion, since a protrusion of the piezoelectric layer enters the recess of the through hole conductor, a holding force of the piezoelectric layer with respect to the through hole conductor increases, and deformation of the through hole conductor is prevented or obstructed.

Abstract: An electronic device may have input devices and/or output devices based on piezoelectric components. Piezoelectric components may include piezoelectric ink in which particles of piezoelectric material are dispersed in a binder. The piezoelectric ink may be printed or otherwise deposited onto a substrate to form piezoelectric ink traces. The piezoelectric ink traces may be deposited on flexible substrates such as elastic speaker diaphragms or flexible fabric layers. The piezoelectric traces may be part of a key in a keyboard or a stand-alone button. In arrangements where the piezoelectric trace forms part of a key in a keyboard, the piezoelectric trace may be coupled to a grid of horizontal and vertical signal lines. The signal lines may convey key press data from the piezoelectric trace to control circuitry and/or may supply control signals from the control circuitry to the piezoelectric trace to produce haptic output.

Abstract: Sold-state intravascular ultrasound (IVUS) imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient circuit architectures and electrical interfaces for an ultrasound transducer array used in a solid-state IVUS system. In one embodiment, an intravascular ultrasound (IVUS) device includes: a flexible elongate member; an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including an ultrasound transducer array; an interface coupler disposed at a proximal portion of the flexible elongate member; and a cable disposed within and extending along a length of the flexible elongate member between the ultrasound scanner assembly and the interface coupler. The cable includes four conductors electrically coupling the ultrasound scanner assembly and the interface coupler.

Abstract: The a vibration sensor comprising a membrane that can be stimulated so as to oscillate by means of a piezoelectric drive, and a mechanical oscillator arranged on the membrane, at least one piezoelectric element of the drive comprising at least one first electrical contact structure on an upper side of the piezoelectric element and at least one second electrical contact structure on a lower side of the piezoelectric element, such that the at least one piezoelectric element is designed so that an active area of the piezoelectric element corresponds to an area of a mechanical deformation of the unidirectional curvature of the membrane, during a pre-defined eigenmode of the mechanical oscillator.

Abstract: An ultrasonic element array includes a first piezoelectric element, a second piezoelectric element, a third piezoelectric element, and a fourth piezoelectric element each having a piezoelectric material sandwiched by a first electrode and a second electrode, a first wire connecting the second electrode of the first piezoelectric element and the second electrode of the second piezoelectric element, a second wire connecting the second electrode of the third piezoelectric element and the second electrode of the fourth piezoelectric element, a third wire connecting to the second wire over the first wire, and an insulating film located between the first wire and the third wire, wherein the insulating film has an inorganic insulating film made of an inorganic material and an organic insulating film made of an organic material, and the inorganic insulating film covers the piezoelectric elements.

Abstract: An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.

Abstract: An apparatus includes a film bulk acoustic resonator and a field effect transistor. The film bulk acoustic resonator includes first and second electrodes separated by a piezoelectric material. The piezoelectric material is configured such that the application of a potential difference between the first and second electrodes enables the generation of an acoustic wave and associated surface charge in the piezoelectric material. The field effect transistor includes a channel, and source and drain electrodes configured to enable a flow of electrical current through the channel when a potential difference is applied between the source and drain electrodes. The surface charge generated in the piezoelectric material induces a corresponding charge in the first electrode causing a variation in the electrical current flowing through the channel via a portion of the first electrode, the variation in electrical current producing an output signal having a frequency corresponding to that of the acoustic wave.

Abstract: A reaction mass seismic survey source that is located in an underground casing. The seismic source includes a non-planar base plate; a reaction mass located on the non-planar base plate; and a flextensional element housed in a recess of the reaction mass and configured to vibrate the non-planar base plate when actuated, to generate seismic waves underground.

Abstract: An ultrasonic probe includes: a piezoelectric element that transmits and receives an ultrasonic wave; one or a plurality of acoustic matching layers disposed on a subject side of the piezoelectric element; and a conductor layer that applies a voltage to the piezoelectric element, wherein the conductor layer is disposed between the piezoelectric element and the acoustic matching layer, or between the plurality of acoustic matching layers, a magnitude of an acoustic impedance of the conductor layer is between a magnitude of an acoustic impedance of a layer disposed on one surface side of the conductor layer and a magnitude of an acoustic impedance of a layer disposed on the other surface side of the conductor layer, and the conductor layer has a Vickers hardness (Hv) of 50 or more and 600 or less.

Abstract: A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Abstract: A heart rate monitor provides a pulse or heartbeat, but without the on-going or continuous phase signal of ECG and/or with a delay relative to the actual heartbeat. For phase determination in echocardiography, the heartbeat from the heart rate monitor is used to assist in identification of phase from acquired ultrasound data. Rather than relying on just ECG or just image processing, the worn or handheld heart rate monitor is used to simplify the image process-based identification of phase.

Abstract: An electronic device includes: a top panel having a manipulation surface; a position detector configured to detect a position of a manipulation input performed on the manipulation surface; a vibrating element; and a drive controlling part configured to drive the vibrating element for generating a natural vibration in an ultrasound frequency band at the manipulation surface such that an intensity of the natural vibration is changed in accordance with the position of the manipulation input performed on the manipulation surface and a time change degree of the position, wherein a width of the vibrating element in a direction in which an amplitude of the natural vibration changes is set based on a ratio between a flexural rigidity of the top panel and a flexural rigidity of the top panel and the vibrating element at a portion where the vibrating element is attached to the top panel.

Abstract: Sold-state intravascular ultrasound (IVUS) imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient circuit architectures and electrical interfaces for an ultrasound transducer array used in a solid-state IVUS system. In one embodiment, an intravascular ultrasound (IVUS) device includes: a flexible elongate member; an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including an ultrasound transducer array; an interface coupler disposed at a proximal portion of the flexible elongate member; and a cable disposed within and extending along a length of the flexible elongate member between the ultrasound scanner assembly and the interface coupler. The cable includes four conductors electrically coupling the ultrasound scanner assembly and the interface coupler.

Abstract: An ultrasonic transducer includes a housing and a piezo element. The piezo element is inserted into a cavity of the housing and the housing has a covering which covers the cavity. A spring element is disposed between the covering and the piezo element. The spring element applies a spring force onto the piezo element and the covering has a plurality of conductor tracks or paths which contact through or plate through the covering. An assembly for insertion into the housing and a method for assembling an ultrasonic transducer are also provided.

Abstract: Provided are a pickup sensor and a biological sensor that are small-sized and can detect micro vibration efficiently and stably with high accuracy. The pickup sensor includes an electroacoustic converter film including: a piezoelectric polymer composite in which piezoelectric particles are dispersed in a viscoelastic matrix that is formed of a polymer material having viscoelasticity at normal temperature; two thin film electrodes that are laminated on opposite surfaces of the piezoelectric polymer composite, respectively; and a protective layer that is laminated on at least one of the two thin film electrodes, in which at least a part of a surface of the electroacoustic converter film is an abutting surface that abuts against a test object, and the thin film electrode on a surface opposite to the abutting surface is grounded.

Abstract: Provided are an ultrasonic probe capable of forming an image without degradation even when the frequency band of a photoacoustic wave and the frequency band of an ultrasonic wave used in ultrasonography are separated from each other, and an inspection object imaging apparatus including the ultrasonic probe. The ultrasonic probe includes a first array device capable of transmitting and receiving an ultrasonic wave; and a second array device capable of receiving a photoacoustic wave. The first array device includes plural electromechanical transducers arranged in a direction perpendicular to a scanning direction, the second array device includes plural electromechanical transducers arranged in a two-dimensional manner, and the first array device and the second array device are provided on the same plane and in the scanning direction.

Abstract: What is described is a MEMS device comprising a piezoelectric actuator, which includes a film of piezoelectric material. The film is penetrated by a plurality of holes.

Abstract: An ultrasound sensor includes a substrate having an opening portion, a diaphragm that blocks the opening portion, and an ultrasound element including a first electrode, a piezoelectric layer, and a second electrode that is laminated on the substrate. The first electrode, piezoelectric layer, and the second electrode are laminated onto the substrate on a side opposite of the opening portion of the diaphragm and overlap to form an active portion. A movable portion of the diaphragm is oscillatable by the active portion and a resonance frequency adjustment portion for adjusting a resonance frequency of the movable portion is provided on a lateral side of the active portion opposing the movable portion.

Abstract: The present application provides a multilayer lateral mode coupling method for phased array construction and transducer devices built accordingly. This disclosure describes and demonstrates that the electrical impedance of a phased array can be substantially reduced and readily controlled to be close to the source impedance. The fabrication process is relatively simple and inexpensive. In addition, the elements are robust for use in 1.5, 2, 3 or other dimensional configurations, over an extended period of operation, without structural failure, and providing a high power output required for imaging and/or medical therapy applications.

Abstract: Methods, systems, and techniques for controlling voltage applied across a piezoelectric stack of a downhole acoustic transmitter. At least one of the temperature of the stack and the compressive stress applied to the stack is monitored. At least one of the temperature of the stack and the compressive stress applied to the stack is compared to a temperature threshold and a stress threshold, respectively. When the stack signal is an alternating voltage signal and when at least one of the temperature of the stack and the compressive stress applied to the stack respectively exceeds the temperature threshold and the stress threshold, the stack signal is modified such that a negative polarity portion of the stack signal has a maximum magnitude less than a magnitude of a negative polarity limit.

Abstract: In an ultrasonic transducer assembly, a conformable ultrasonic transducer has a piezoelectric layer and electrodes able to conform to curved surfaces, and a clamp for pressing the transducer into ultrasonic contact with a curved surface. Conformability is ensured with a thin, porous piezoelectric layer and suitable electrical conductors and insulators. The ultrasonic transducer may operate without further thermal shielding under harsh environments and/or at high temperatures.

Abstract: An ultrasonic transducer and an ultrasonic probe including the same are provided. The ultrasonic transducer includes a piezoelectric layer configured to convert an electric signal and an ultrasound into each other, and a dematching layer having a uniform thickness, the dematching layer being arranged on a partial region of the piezoelectric layer and configured to reflect the second ultrasound wave that is incident on the dematching layer.

Abstract: An ultrasound device for checking the quality of a composite material structure during the production cycle. Preferably, the device is incorporated into a production tooling performing the LRI process in which the composite material structure is placed between two molds during the production cycle. A layer of piezoelectric material is deposited on the face of one of the molds, opposite the face which is in contact with the structure. One face of an electrically insulating flexible material film is placed against the outer face of the piezoelectric material layer. The face of the film further includes conductive pads in contact with the piezoelectric material layer. Each pad is energized by electric voltage applied by a conductive strip. Each pad forms an independent ultrasonic transducer with the region of the piezoelectric material layer opposite of its placement.

Abstract: Embodiments of a dermatological cosmetic treatment and imaging system and method can include use of transducer to simultaneously or substantially simultaneously produce multiple cosmetic treatment zones in tissue. The system can include a hand wand, a removable transducer module, a control module, and/or graphical user interface. In some embodiments, the cosmetic treatment system may be used in cosmetic procedures, including brow lifts, fat reduction, sweat reduction, and treatment of the décolletage. Skin tightening, lifting and amelioration of wrinkles and stretch marks are provided.