Abstract: A vibrator includes: a housing having an interior space; a vibrating member installed within the housing; a piezoelectric element installed on a top surface of the vibrating member; and space forming parts disposed to face side surfaces of the piezoelectric element, respectively, and forming a space in which a filler is provided, together with the side surfaces of the piezoelectric element.

Abstract: The crystal vibrator package includes a base substrate, a crystal piece, and a reinforcing patter. The base substrate includes first and second electrode pads formed on an upper surface of the base substrate. The crystal piece includes exciting electrodes formed on upper and lower surfaces thereof and electrically connected to the first and second electrode pads, respectively, at one side of the crystal piece. The reinforcing pattern is formed at corner portions of the crystal piece.

Abstract: A piezoelectric vibration element includes a piezoelectric substrate including (i) an excitation portion and (ii) a peripheral portion that is integrally arranged at a periphery of the excitation portion and whose thickness is smaller than that of the excitation portion. The piezoelectric vibration element further includes excitation electrodes that are arranged in a front-and-rear relationship on front and rear principal faces of the piezoelectric substrate. The excitation portion includes a first portion that is at a location of a maximum thickness of the excitation portion and a side face that is connected to (i) a principal face of the first portion and (ii) a principal face of the peripheral portion. The side face includes level difference portions having a level difference and a face that has no level difference from the principal face of the first portion to the principal face of the peripheral portion.

Abstract: A container that experiences vibrations when transported allows an inner container which defines a chamber holding a substance to move relative to an outer shell under the influence of vibrations. An energy generator such as a magnet and a corresponding coil or a piezoelectric generator that does not move with the inner container is juxtaposed with the inner container to cause an electrical current to be introduced in the inner container when the inner container moves relative to the magnet. The electrical current is dissipated as heat to transfer heat into the substance in the chamber.

Abstract: An electronic component-use package includes a base that holds an electronic component element, and terminal electrodes formed on a bottom surface of the base. The terminal electrodes have chamfered parts facing corner parts of the base bottom surface and having angles of chamfer ranging in ±10 degrees to a reference line. The reference line is a perpendicular line to a straight line that connects the corner parts of the base bottom surface to a central part on one side of the terminal electrode in proximity to a center point of the base bottom surface, the reference line L8 passing through the chamfered parts.

Abstract: An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.

Abstract: A piezoelectric actuator includes a housing body and lid wherein the housing body defines an open-ended cylindrical interior chamber extending along a displacement axis. The lid bolts to the body transverse to the open end allowing easy access to an electrostrictive assembly disposed within the chamber. The electrostrictive assembly includes an electrostrictive element affixed at one end to the housing by a cup element with an outermost cylindrical surface, and at an opposite, and free, end, to a driver having a portion with a outermost cylindrical surface. The outermost cylindrical surfaces both include circumferential sealing elements, for example, circumferential grooves in which resilient a sealing O-ring resides, or circumferential wiper seals. The assembly is dimensioned to fit wholly within the chamber, with the circumferential sealing elements establishing a hermetic seal while allowing sliding motion of the free end of the electrostrictive element, and the driver, along the displacement axis.

Abstract: A piezoelectric component in which leakage of vibration is suppressed and vibration characteristics are excellent is provided. A piezoelectric component of the invention includes a support substrate; and a piezoelectric element mounted on the support substrate. The piezoelectric element includes electrodes (vibration electrodes) on one main surface and the other main surface of the piezoelectric element so that the electrodes have an area facing each other, and a concave area extending in a width direction of the piezoelectric element, in at least one of excepted areas which are areas other than the electrodes facing each other of the one main surface and the other main surface. At least part of corner portions of the concave area which extend in the width direction forms a curved surface.

Abstract: Provided is a hybrid diode device. The hybrid diode device includes a first lower nitride layer disposed on a substrate and including a first 2-dimensional electron gas (2DEG) layer, a second lower nitride layer extending from the first lower nitride layer to the outside of the substrate and including a second 2DEG layer, a first upper nitride layer disposed on the first lower nitride layer, a second upper nitride layer disposed on the second lower nitride layer, a first cap layer disposed on the first upper nitride layer, a second cap layer disposed on the second upper nitride layer, a first electrode structure connected to the first lower nitride layer and the first cap layer; and a second electrode structure connected to the second lower nitride layer and the first electrode structure. The second lower nitride layer generates electric energy through dynamic movement.

Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, and a cover member. The IDT electrode is provided on the piezoelectric substrate. The cover member is provided above the piezoelectric substrate and separate from the IDT electrode. The cover member includes a first cover member and a second cover member. The second cover member is laminated on a side of the first cover member opposite to the piezoelectric substrate. The glass transition point of the first cover member is higher than that of the second cover member.

Abstract: In a crystal resonator, a resonator element is installed in a package via a first bonding member and a second bonding member, and when viewed from above, a distance between a first bonding center and a second bonding center is set to be L1, and a length of a perpendicular line drawn to a virtual line which connects the first bonding center and the second bonding center from the resonation area center is set to be L2, a relationship expressed by 0<L1/L2?0.97 is satisfied.

Abstract: A surface mount type quartz crystal device includes a quartz crystal vibrating piece and a base plate. The quartz crystal vibrating piece is configured to vibrate at a predetermined frequency. The base plate is made of a crystal or a glass. The base plate includes an external electrode disposed on a bottom surface of the base plate to mount the quartz crystal device. The quartz crystal vibrating piece is placed on an opposite surface of the bottom face. The external electrode includes a metal film formed on a surface of the base plate by sputtering, and an electroless plating film formed on a surface of the metal film by electroless plating. The electroless plating film includes a nickel layer including lead and bismuth.

Abstract: An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.

Abstract: A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.

Abstract: A magnetic generator may be disclosed. The magnetic generator may include one or more permanent magnets which may function in one or more ways in combination with a dielectric elastomer to efficiently produce electricity. Electricity may be produced directly by the magnets, through mechanical means as driven by the magnets, by piezoelectric means, or as desired to maintain peak efficiency. Further, systems to retain excess energy for later use, such as a flywheel or a battery may be employed.

Abstract: Portable therapeutic treatment devices and methods with a triangular arrangement of crystals in an induction coil with an external wrapped coil for sensing effected area body part emissions. A biosensor/bioscanner sensor can be used as an indicator to find an effected body part needing treatment and determine when treatment has been effective. The device can be passed over a body until a RED LED light indicates an effected part needing treatment. Treatment can occur with approximately 8 Hz emissions, and the sensor will indicate when the effected area has reached a treated state of approximately 8 Hz by lighting a GREEN LED light. Treatment can occur within approximately 2 minutes. A variety of ailments can be treated such as but not limited to inflammations, nerve problems, joint-pain, muscle-pain, gall bladder problems, and the like.

Abstract: A crystal oscillator fabrication method includes depositing mounting cement onto first and second mounting pads on a substrate to thereby define first and second electrode adhesion bumps. First and second electrodes of a crystal oscillator are electrically connected to the first and second mounting pads by contacting the first and second electrodes to the first and second electrode adhesion bumps and then curing the adhesion bumps. Next, mounting cement is deposited onto the first electrode and onto a portion of the first electrode adhesion bump to thereby define a top electrode adhesion extension. The top electrode adhesion extension is then cured.

Abstract: An acoustic resonator comprising a substantially horizontal membrane of piezoelectric material with upper and lower metal electrodes on its upper and lower faces, said membrane being attached around its perimeter to the inner side walls of a rectangular interconnect frame by an attaching polymer, the side walls of the package frame being substantially perpendicular to the membrane and comprising conducting vias within a dielectric matrix, the conducting vias running substantially vertically within the side walls, the metal electrodes being conductively coupled to the metal vias by a feature layer over the upper surface of the membrane and top and bottom lids coupled to top and bottom ends of the interconnect frame to seal the acoustic resonator from its surroundings.

Abstract: A vibration gyro device has a base part and a pair of drive vibrating arms and a pair of detection vibrating arms respectively extended from both ends in a Y-axis direction of the base part. Further, adjustment vibrating arms extended from respective ends of connecting parts respectively extended from both ends in an X-axis direction of the base part in parallel to the drive vibrating arms are provided. At the end sides of the respective adjustment vibrating arms, spindle parts as wider parts are provided. On principal surfaces of the respective adjustment vibrating arms, adjustment electrodes as membranes for adjustment of leakage output of the vibration gyro device are provided.

Abstract: A circuit substrate includes a base substrate provided with a first pad and a second pad which are electrically connected to an electronic component, a first lateral face and a second lateral face, a first terminal electrically connected to the first pad and a second terminal electrically connected to the second pad which are disposed on the first lateral face, and a third terminal and a fourth terminal which are disposed on the second lateral face. The first terminal and the fourth terminal are located at point-symmetric positions to a center of the base substrate. The second terminal and the third terminal are located at point-symmetric positions to the center of the base substrate. The third terminal and the fourth terminal are electrically connected to each other.

Abstract: A method of preparing a finished panel and latch combination, wherein the panel and latch mounting combination are seamless and attractive.

Abstract: An integrated circuit device includes an integrated circuit substrate having a two piece package thereon. The package has a hermetically sealed cavity therein and a crystal resonator within the cavity. The crystal resonator includes at least one electrode electrically coupled to a portion of the integrated circuit substrate by an electrically conductive via, which extends at least partially through the package. The package may include a material selected from a group consisting of glass and ceramics. The crystal resonator includes a crystal blank and first and second electrodes on first and second opposing sides of the crystal blank. The package includes a base having a recess therein and a cap hermetically sealed to the base. The cap includes first and second electrical traces thereon, which are electrically connected to the first and second electrodes of the crystal resonator.

Abstract: A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a base plate, and a lid plate. The base plate includes one principal surface where the piezoelectric vibrating piece is placed and includes a connecting electrode electrically connected to the extraction electrode, and another principal surface including a mounting terminal. The lid plate seals the vibrator. The lid plate seals the vibrator. At least a part of the mounting terminal includes a first metal film, a second metal film, and an electroless plating film. The second metal film is formed to cover the first metal film or is formed at a part of a surface of the first metal film. The second metal film has a different area from the first metal film. The electroless plating film is formed at least on a surface of the second metal film by electroless plating.

Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator.

Abstract: A piezoelectric vibrator including a package having a base member, a lid member forming a cavity with respect to the base member, and a piezoelectric vibrating piece mounted on a mount surface and housed inside the cavity, in which the piezoelectric vibrating piece has a pair of vibrating arm portions and a base portion cantilever-supporting base end portions of the pair of vibrating arm portions and being mounted on the mount surface, a concave portion for avoiding contact with respect to tip portions when the vibrating arm portions are displaced in a thickness direction is formed on the mount surface, contact portions contacted by main surfaces of the vibrating arm portions facing the mount surface, and clearance portions for avoiding contact with at least one edge-line portion of two edge-line portions where the main surface intersects with two side surfaces.

Abstract: A piezoelectric oscillator includes a piezoelectric vibrating piece, an integrated circuit, and a package. The package includes a first layer, a second layer, a third layer, and a fourth layer. The ceiling surface as a portion of the inferior surface of the third layer has a rectangular shape surrounded by short sides and long sides. The ceiling surface includes a pair of frequency checking terminals electrically connected to the connecting electrodes and control terminals to control the integrated circuit. The pair of the frequency checking terminal are adjacent to one another. The respective frequency checking terminals are disposed in contact with any of the long sides and one of the short sides. The control terminals are extracted to the top surface of the third layer, and overlap the frequency checking terminals in a vertical direction on the top surface of the third layer to be connected to the mounting terminals.

Abstract: A crystal device is provided, in which a peeling of a bonding material is prevented by using the bonding material having a thermal expansion coefficient which is between the coefficients in a first direction and a second direction of a bonding surface of a crystal element. A crystal device includes a rectangular crystal element formed with a crystal material that includes an excitation part and a frame surrounding the excitation part. The device further includes a rectangular base bonded to a principal surface of the frame, and a lid bonded to another principal surface of the frame; and the frame, the base and the lid have edges respectively along a first direction and a second direction intersecting with the first direction. The bonding material is applied having a thermal expansion coefficient that is between the coefficients in the first direction and second direction of the crystal element.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A piezoelectric device capable of adjusting shape/position of connection electrodes is provided to accommodate a first or second oscillating plate (piezoelectric). The second oscillating plate is shorter than the first oscillating plate, each oscillating plate includes an excitation and an extraction electrodes. The extraction electrode is electrically connected with a connection electrode via conductive adhesive agent in a package. The package includes a carrier section, carrying the first or the second oscillating plate thereon. The connection electrode is disposed on at least a portion of a surface of the carrier section. When the extraction electrode of the first oscillating plate is electrically connected with the connection electrode, the excitation electrode on one side of the first oscillating plate is not electrically connected with the connection electrode on the other side. The extraction electrodes of the second oscillating plate can be electrically connected with the connection electrodes.

Abstract: A vibration gyro device has a base part and a pair of drive vibrating arms and a pair of detection vibrating arms respectively extended from both ends in a Y-axis direction of the base part. Further, adjustment vibrating arms extended from respective ends of connecting parts respectively extended from both ends in an X-axis direction of the base part in parallel to the drive vibrating arms are provided. At the end sides of the respective adjustment vibrating arms, spindle parts as wider parts are provided. On principal surfaces of the respective adjustment vibrating arms, adjustment electrodes as membranes for adjustment of leakage output of the vibration gyro device are provided.

Abstract: A mesa-type quartz-crystal vibrating piece includes a vibrator in a quadrangular shape with both main surfaces, a pair of excitation electrodes on both the main surfaces, a thin portion outside of the quadrangular shape, and a pair of extraction electrodes. The thin portion has a thickness thinner than a thickness of the vibrator. The pair of extraction electrodes are extracted from the excitation electrodes to a predetermined direction. A center of a first length in the predetermined direction of the excitation electrode is decentered from a center of a second length in the predetermined direction. The second length includes a length of the vibrator and a length of the thin portion. The center of the first length is decentered toward an opposite side of the extraction electrode by 25 ?m to 65 ?m.

Abstract: A piezoelectric device 100 is provided with an element-mounting member 110, a piezoelectric element 120 mounted on the element-mounting member 110, a metal pattern 118 which is formed at the surface of the element-mounting member 110 and includes an element-mounting region 118a and a lead region 118b, and an integrated circuit element 130 which is electrically connected to the element-mounting region 118a of the metal pattern 118 by solder bump 132, wherein the metal pattern 118 has a projecting part 119 which is provided between the element-mounting region 118a and the lead region 118b, and at least the surface portion of the projecting part 119 is made of a metal oxide.

Abstract: A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

Abstract: A piezoelectric vibrator is provided in which a piezoelectric vibrating piece is accommodated in a package, the piezoelectric vibrating piece including: a pair of vibrating arm sections; a base section to which each base end of the pair of vibrating arm sections is connected; and a support arm section that is connected to the base section between the pair of vibrating arm sections and extends from the base section to the same side as the vibrating arm sections, in which the piezoelectric vibrating piece is supported within the package in mount sections provided in the support arm section, and in which the mount sections are provided in a region which is defined between a position of which a distance from an end section of the base section opposite to the side where the support arm section is connected to the side of a leading end of the support arm section is 25% of a width dimension of the base section along the width direction and a position of which the distance is 65% of the width dimension.

Abstract: A piezoelectric vibrating piece includes a pair of vibrating arm portions which are arranged with a center axis interposed therebetween, a base portion which is arranged between a pair of vibrating arm portions and fixed to the outside, and a pair of connecting portions which connect proximal end portions of a pair of vibrating arm portions and a proximal end portion of the base portion. The distance between distal end portions of the vibrating arm portions and the center axis is smaller than the distance between the proximal end portions of the vibrating arm portions and the center axis.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece with a pair of excitation electrodes, a base plate, and a non-conductive bonding material. The base includes a pair of castellations that are hollowed into a side face from the mounting surface to the bonding surface. The pair of castellations include a first surface and a second surface. The first surface extends outward from the mounting surface toward the bonding surface side. The second surface extends outward from the bonding surface toward the mounting surface side. The second surface has a smaller area than an area of the first surface. A wiring electrode is disposed on the first surface, the second surface, and a side face of the bonding material. The wiring electrode is of a same electrode layer as the external electrode. The wiring electrode extends from the external electrode to the extraction electrodes.

Abstract: An oscillator device includes: a structural layer extending over a first side of a semiconductor substrate; a semiconductor cap set on the structural layer; a coupling region extending between and hermetically sealing the structural layer and the cap and forming a cavity within the oscillator device; first and second conductive paths extending between the substrate and the structural layer; first and second conductive pads housed in the cavity and electrically coupled to first terminal portions of the first and second conductive paths by first and second connection regions, respectively, which extend through and are insulated from the structural layer; a piezoelectric resonator having first and second ends electrically coupled, respectively, to the first and second conductive pads, and extending in the cavity; and third and fourth conductive pads positioned outside the cavity and electrically coupled to second terminal portions of the first and second conductive paths.

Abstract: A piezoelectric vibrating piece is to be bonded to and sandwiched between a lid plate and a base plate with an external electrode. The piezoelectric vibrating piece has a first main surface at the lid plate side and a second main surface at the base plate side. The piezoelectric vibrating piece includes an excitation unit, a first excitation electrode, a second excitation electrode, a framing portion, one connecting portion, a first extraction electrode, and a second extraction electrode. The connecting portion includes a planar surface parallel to both the main surfaces and a side face intersecting with the planar surface. The first extraction electrode is extracted via the connecting portion. The second extraction electrode is extracted via the connecting portion. The first extraction electrode is disposed on at least a part of the side face of the connecting portion to be extracted to the framing portion.

Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).

Abstract: A piezoelectric resonating element includes a piezoelectric substrate that includes a rectangular vibrating section and a thick section integrally formed with the vibrating section, excitation electrodes, and lead electrodes. The thick section includes a first thick section and a second thick section of which one end is formed continuous to the first thick section. The first thick section includes a first inclined section of which the thickness changes and a first thick section main body of a quadrangle column shape, and at least one slit is provided in the first thick section.

Abstract: A quartz vibrator that includes a substrate, a quartz vibrating element, and a dome-shaped cap. The quartz vibrating element is mounted on the substrate. The cap is bonded to the substrate. The cap defines and forms a sealed space that seals the quartz vibrating element along with the substrate. The cap has a side wall portion, a ceiling portion, and a connecting portion. The side wall portion encloses the quartz vibrating element. The ceiling portion is positioned above the quartz vibrating element. The connecting portion connects the side wall portion and the ceiling portion. The connecting portion is thinner than the side wall portion and the ceiling portion.

Abstract: An electronic component includes an electronic component body having a plurality of electrodes and a sealing film sandwiching the electronic component body from both surfaces. The sealing film is sealed along its entire periphery. Extraction electrode portions are formed on an inner surface of the sealing film which is in contact with the electronic component body, and at positions corresponding to the electrodes, and are in contact with the electrodes.

Abstract: A method of manufacturing an electronic component includes bonding a dome-shaped cap having a recess to a substrate on which are disposed a vibrator and a bonding material projecting in a rounded shape and surrounding the vibrator while the cap is disposed so that an open side of the recess faces the substrate and is relatively pressed to the substrate side. The bonding material is disposed so that, relative to the vibrator, an outer side end portion of the cap is located on the inner side of the bonding material or an inner side end portion of the cap is located on the outer side of the bonding material.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a base, a first lid, and a second lid. The piezoelectric vibrating piece includes an electrode. The base holds the piezoelectric vibrating piece. The first lid is bonded to the base. The first lid houses the piezoelectric vibrating piece in a cavity. The first lid has an opening portion that opens the cavity. The second lid is bonded to a front surface of the first lid so as to cover the opening portion. The opening portion is fabricated at a position overlapping a portion including a region of the piezoelectric vibrating piece excluding the electrode, or a portion including a region excluding the piezoelectric vibrating piece in plan view.

Abstract: A piezoelectric device including a tuning-fork piezoelectric vibrating element having a base and a pair of vibrating arms positioned parallel to each other and extending from the base at right angles. The piezoelectric device further including a pair of support arms extending from the base positioned parallel to each other and in the same direction as the vibrating arms. A package is included having a lid and a housing recess sealed by the lid wherein the tuning-fork piezoelectric vibrating element is housed. A pair of supports are provided on a bottom face of the housing recess for fixing the tuning-fork piezoelectric vibrating element by the support arms. A clearance groove is formed in the bottom face of the housing access to prevent the tuning-fork piezoelectric vibrating element from colliding against the bottom face of the housing recess.

Abstract: Tuning-fork type quartz-crystal vibrating pieces are disclosed, of which the vibration frequency can be adjusted without increasing CI. An exemplary piezoelectric device has a pair of vibrating arms extending in a predetermined direction from a first edge of a base. Respective first grooves are defined in a first principal surface of the vibrating arms. The first grooves extend in the predetermined direction, and have first excitation electrodes extending from a back-edge surface but not completely to a front-edge surface of the grooves. Respective second grooves are defined in a second principal surface, opposite the first principal surface, of the vibrating arms. The second grooves extend in the predetermined direction, and have second excitation electrodes extending from a back-edge surface completely to a front-edge surface of the second grooves.

Abstract: A method capable of manufacturing a quartz vibrator by disposing a metallic bonding material on one main surface of a ceramic plate having a quartz vibrating element mounted thereon. Thereafter, the bonding of a cap having a recess to the ceramic plate by disposing the cap on the one main surface of the ceramic plate so that an open side of the recess faces the ceramic plate, melting the bonding material, and then allowing the bonding material to set, is carried out.

Abstract: The invention relates to actuator module (22) having a piezoceramic multilayer actuator (1) arranged in a casing (23). In order to avoid an increase in conductivity and hence rising leakage current at the actuator surface even after a long period of use, the invention proposes that the casing (23) is hermetically sealed, and a chamber (24) is arranged between the multilayer actuator (1) and the casing (23), which chamber is entirely or partially filled with a medium (21) that chemically transforms and/or binds water.

Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).