Abstract: This piezoelectric vibrator is provided with a package that is structured to include a first substrate and a second substrate that are bonded to each other such that a cavity is formed therebetween, an internal electrode portion that is formed on the first substrate and housed in the cavity, a piezoelectric vibrating reed that is sealed in the cavity and also is electrically connected to the internal electrode portion in the cavity, an external electrode portion that is formed on an external surface of the first substrate, a through electrode portion that is disposed so as not to be overlapped by the external electrode portion in a thickness direction of the first substrate, while one end of the through electrode portion is electrically connected to the internal electrode portion and another end of the through electrode portion is formed on the external surface of the first substrate while penetrating through the first substrate, and a routing wiring portion that electrically connects the through electrode po

Abstract: Piezoelectric vibrating pieces are disclosed having selectively roughened surfaces. An exemplary piece is made of a piezoelectric material configured as a piezoelectric substrate. The piece also includes at least one excitation electrode and at least one extraction electrode. The substrate has opposing main surfaces initially having low surface roughness. At least one main surface is formed in a mesa or reverse mesa manner, wherein the central region has a different thickness than the peripheral region. The central region has relatively low surface roughness (irregular unevenness), while the peripheral region has relatively high surface roughness. The excitation electrode is formed on the central region (mesa or reverse mesa) while the extraction electrode (connected to the excitation electrode) is formed on the peripheral region.

Abstract: A piezoelectric vibration reed includes a pair of vibrating arm portions arranged in parallel to each other and a base portion. The base portion is integrally coupled to proximal ends of the pair of the vibrating arm portions in a longitudinal direction that the vibrating arm portions extend. The base portion includes a connecting portion, a mount portion, and a narrow portion between the connecting portion and the mount portion. The base portion further includes a pair of notched portions notched respectively inwardly from both sides of the base portion in the width direction and ribs projecting outwardly in the width direction of the base portion and arranged in the interiors of the notched portions.

Abstract: Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized, a first package plate, and a second package plate. The first package plate has a respective inner main surface defining a recess. The recess has volume and dimensions sufficient to contain at least a portion of the piezoelectric vibrating piece. The inner main surface includes a peripheral main surface that peripherally extends around the recess. The second package plate has respective inner and outer main surfaces. The inner main surface is bonded to the peripheral main surface of the first package plate using a sealing material that thus seals the piezoelectric vibrating piece inside a package formed of the first and second package plates. The sealing material includes multiple concentric bands of sealing glass and multiple concentric bands of adhesive.

Abstract: The present disclosure provides a mesa-type AT-cut quartz-crystal vibrating piece, in which amount of the vibrating unit is adjusted to appropriate amount, in order to inhibit unnecessary vibration and to prevent degradation. The mesa-type AT-cut quartz-crystal vibrating piece (30) for vibrating piece vibrates at 38.400 MHz comprises a rectangular excitation unit (31), a peripheral region (32) formed in periphery of the excitation unit and thinner than the excitation unit. The thickness difference h (?m) between one principal surface of the excitation unit and the adjacent peripheral region is obtained by the following equation: h=(0.2×Mx)?143 The length of the x-axis direction of the crystallographic X-axis is Mx (?m).

Abstract: An electronic component includes: a substrate; a functional element located on the substrate; a wiring located on the substrate and electrically connected to the functional element; a metal ceiling located above the functional element so that a space is formed between the metal ceiling and the functional element; and a sealing portion located on the metal ceiling, wherein the metal ceiling is electrically connected to a signal wiring that is included in the wiring and transmits a high-frequency signal.

Abstract: A piezoelectric device includes: a rectangular piezoelectric element formed of a piezoelectric material, the piezoelectric element having a rectangular excitation portion having an excitation electrode, a frame surrounding a circumference of the excitation portion, a connecting portion connecting one side of the rectangular excitation portion and the frame with a predetermined width; a base plate having a mounting face where a pair of external electrodes electrically connected to the excitation electrode are formed and a base bonding face bonded to one of principal faces of the frame; a lid plate bonded to the other principal face of the frame; and a bonding material for bonding the base plate, the frame, and the lid plate, wherein a trench having a length equal to or more than the predetermined width of the connecting portion is formed in at least one of the frame, the base plate, and the lid plate.

Abstract: The MEMS switch comprises a substrate with signal-lines having fixed-contacts, a movable-plate with a movable-contact, a flexible support-member supporting the movable-plate, a static-actuator and a piezoelectric-actuator configured to contact the movable-contact with the fixed-contact. The movable-contact is provided at its longitudinal center with the movable-contact, and its both the longitudinal ends with static-movable-electrode-plate. The support-member is four strips disposed on portions outside of the both width ends of the movable plate. The strip extends along the longitudinal direction of the movable plate, provided with a first end fixed to the movable plate, and provided with a second end fixed to the substrate. The piezoelectric-element is disposed on an upper surface of the strip to be located at a portion outside of the width ends of the movable-plate.

Abstract: An object of the invention is to provide a method of manufacturing a stacked crystal resonator whereby a large number of stacked crystal resonators formed on a wafer can be easily broken away from the wafer, and the risk of damage to the outside surfaces and the like of the stacked crystal resonators is reduced. There is formed a framed crystal plate connected to a first wafer by a first support section, a cover connected to a second wafer by a second support section, and a base connected to a third wafer by a third support section, and a thickness of at least one of the first support section through third support section is thinner than a thickness the connected wafer.

Abstract: The invention describes a vibrating tine level detection device, and a method of forming the same, which is particularly suitable for operation in environments subject to rapid temperature change. A piezoelectric stack, which generates vibration of the tine, is located within a cage. The cage is, in turn, located within a hollow body defined by a diaphragm, from which the tines extend, and a wall section. The cage is attached to the inside surface of the wall section, adjacent to the junction between the wall section and the diaphragm. As a consequence, the ability of the cage to maintain a substantially constant compression on the piezoelectric stack is substantially unaffected by thermal expansion or contraction of the wall section.

Abstract: Disclosed is a crystal resonator including: a first plate having a first face and a second face opposite to the first face; a second plate having a third face and a fourth face opposite to the third face; a bonding material arranged in a ring shape between the second face of the first plate and the third face of the second plate to bond the first and second plates; a first trench portion, where the bonding material intrudes along a ring shape of the bonding material, on at least one of the second or third face; and a second trench portion formed side by side with the first trench portion in an inner side of the ring shape of the bonding material on at least one of the second face or the third face.

Abstract: An oscillation device which contributes to the demand for downsizing/miniaturization and commercial production, and provides highly reliable oscillation frequency is provided. The oscillation device includes a base substrate provided with an oscillation member, a lid member that contains the oscillation member in a cavity, an adhesion layer that has a first melting point and connects the base substrate with the lid member, and a metal layer that has a second melting point higher than the first melting point and covers the base substrate, the adhesion layer and the lid member.

Abstract: A small and highly reliable acoustic wave device and a method for production of the same will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 on one main surface of the piezoelectric substrate 1; an outside connection-use conductor 3 formed on the one main surface of the piezoelectric substrate 1 and electrically connected to the SAW element 2; a columnar electrode 10 on the outside connection-use conductor 3; and a protective cover 6 defining inner walls of a vibration space 7 for vibration of the SAW element 2 and planarly surrounding a side surface of the columnar electrode 10.

Abstract: A mesa-type quartz-crystal vibrating piece includes a vibrator in a quadrangular shape with both main surfaces, a pair of excitation electrodes on both the main surfaces, a thin portion outside of the quadrangular shape, and a pair of extraction electrodes. The thin portion has a thickness thinner than a thickness of the vibrator. The pair of extraction electrodes are extracted from the excitation electrodes to a predetermined direction. A center of a first length in the predetermined direction of the excitation electrode is decentered from a center of a second length in the predetermined direction. The second length includes a length of the vibrator and a length of the thin portion. The center of the first length is decentered toward an opposite side of the extraction electrode by 25 ?m to 65 ?m.

Abstract: A piezoelectric vibrating piece includes a vibrator in a rectangular shape, a framing portion, and one connecting portion. The vibrator includes a first side and a pair of second sides. The first side extends in a first direction. The second sides extend in a second direction perpendicular to the first direction. The framing portion surrounds the vibrator across a void. The one connecting portion connects the first side of the vibrator and the framing portion together. The one connecting portion has a predetermined width in the first direction. The one connecting portion extends in the second direction.

Abstract: This invention is for a hermetic piezoelectric accelerometer sensor that can operates at high temperatures without the degradation observed on the piezoelectric elements, due to Oxygen depletion of the piezoelectric materials, when they are exposed to high temperatures, in reducing atmospheres, or low partial Oxygen pressure, inside a sealed housing. When a piezoelectric element loses Oxygen, becomes more electrically conductive, and this severe loss in resistivity, exacerbated with the increase of the temperature, makes the sensor inoperable, unreliable, or with permanent damage. The accelerometer of this invention operates effectively over a wide range of temperatures, including high temperatures above 1600° F., depending of the piezoelectric element used on the construction. The housing of the accelerometer uses a small section of metal made with Silver (or Silver alloys) to allow Oxygen diffusion through the metal, when it is exposed to high temperature.

Abstract: Methods are disclosed for manufacturing piezoelectric vibrating devices that do not acquire unwanted gas or water vapor inside their respective packages during manufacture and that attain such end by methods suitable for mass-production. An exemplary manufacturing method includes preparing a piezoelectric wafer having multiple piezoelectric frames; on the piezoelectric wafer defining at least one first through-hole per frame; preparing a base wafer having multiple package bases alignable with the frames; on the base wafer defining at least one second through-hole; preparing a lid wafer having multiple package lids alignable with the frames; applying a sealing material between a first main surface of each frame and an inner main surface of the base wafer, and between a second main surface of each frame and an inner main surface of the lid wafer; and thereby bonding the three wafers together to form multiple packaged piezoelectric devices.

Abstract: A piezoelectric vibrating device and a piezoelectric vibrating piece including an excitation unit, a framing portion and a connecting portion are provided. The excitation unit includes a first side extending in a first direction and a second side extending in a second direction. The connecting portion has a thickness of a first thickness in a third direction perpendicular to the first direction and the second direction. The excitation unit includes a first region, a second region and a third region. The pair of excitation electrodes are disposed on the first region. The second region with the first thickness is directly connected to the connecting portion. The third region is disposed between the first region and the second region. The third region has a thickness in the third direction of a second thickness. The second region has a thickness in the third direction that is thicker than the second thickness.

Abstract: A piezoelectric vibrating piece is to be bonded to and sandwiched between a lid plate and a base plate with an external electrode. The piezoelectric vibrating piece has a first main surface at the lid plate side and a second main surface at the base plate side. The piezoelectric vibrating piece includes an excitation unit, a first excitation electrode, a second excitation electrode, a framing portion, one connecting portion, a first extraction electrode, and a second extraction electrode. The connecting portion includes a planar surface parallel to both the main surfaces and a side face intersecting with the planar surface. The first extraction electrode is extracted via the connecting portion. The second extraction electrode is extracted via the connecting portion. The first extraction electrode is disposed on at least a part of the side face of the connecting portion to be extracted to the framing portion.

Abstract: A piezoelectric device includes a piezoelectric vibrating plate, a first plate, a first glass sealing material disposed in a ring shape, and an electrically conductive adhesive. The piezoelectric vibrating plate includes a piezoelectric vibrating piece, a frame body, and a pair of extraction electrodes. The piezoelectric vibrating piece includes a pair of excitation electrodes. The frame body surrounds the piezoelectric vibrating piece. The frame body is formed integrally with the piezoelectric vibrating piece. The first glass sealing material encloses a periphery of the first main surface of the frame body so as to bond the first plate and the first main surface of the frame body together.

Abstract: A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 ?m, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight, from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.

Abstract: An acoustic wave device includes a piezoelectric substrate, an IDT electrode on the substrate, an internal electrode above the substrate, a side wall above the internal electrode, a lid on the side wall, an electrode base layer on the internal electrode, a connection electrode on the electrode base layer, and an anti-corrosion layer between the internal electrode and the side wall. The internal electrode is electrically connected to the IDT electrode. The side wall surrounds the IDT electrode. The lid covers the IDT electrode to provide a space above the IDT electrode. The electrode base layer is provided outside the space and the side wall. The anti-corrosion layer protrudes outside the side wall, and is made of material less soluble in plating solution than the internal electrode. This acoustic wave device prevents the internal electrode from breaking due to plating solution, hence being manufactured at a high yield rate.

Abstract: A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole.

Abstract: To obtain an inexpensive piezoelectric vibration component having vibration characteristics whose degradation resulting from deposition of moisture due to a temperature change is less likely to occur without increasing the cost of a sealing structure and the number of parts, a piezoelectric vibration component includes a piezoelectric vibrating element accommodated in a package being sealed, and when the volume of the piezoelectric vibrating element is Ve and the volume within the package obtained by subtraction of the volume Ve of the piezoelectric vibrator from the volume of the space of the package is Vp Ve/Vp>(Se×M)/{(Sp+Se)×2.72} where Se is the surface area of the piezoelectric vibrating element, Sp is the surface area of the space inside the package when the piezoelectric vibrating element inside the package is absent, and M is the maximum mass of moisture per unit volume [?g/mm3] at the use temperature and 100% relative humidity.

Abstract: The present disclosure provides the piezoelectric devices in which the bonding condition of devices can be easily observed. The piezoelectric device (100) comprises: a piezoelectric vibrating piece that vibrates when electrically energized; a first plate (110) and a second plate (120) fabricated by transparent materials; and a sealing material (150a) formed in between the first plate and second plate and in periphery of the first plate and second plate, the sealing material having a slit (151b) within the predetermined width (WX, WZ) of the sealing material.

Abstract: In an exemplary method for making crystal vibrating devices, four wafers are provided: a crystal wafer, a base wafer, a first-lid wafer, and a second-lid wafer. The crystal wafer defines multiple crystal vibrating pieces including respective frames and respective electrodes formed on both main surfaces thereof. The base wafer defines multiple base plates bondable to one main surface of respective frames. The first-lid wafer defines multiple first lids bondable to the other main surface of the respective frames. Each first lid defines a void registrable with respective electrodes. The second-lid wafer is sized similarly to and bondable to the first-lid wafer so as to sealably close the voids. In a first bonding step the crystal wafer is bonded to the base wafer and first-lid wafer. In a subsequent adjustment step the thickness of at least one electrode per each crystal vibrating piece is adjusted to adjust the vibrational frequency of the respective vibrating portion.

Abstract: A piezoelectric device including a tuning-fork piezoelectric vibrating element having a base and a pair of vibrating arms positioned parallel to each other and extending from the base at right angles. The piezoelectric device further including a pair of support arms extending from the base positioned parallel to each other and in the same direction as the vibrating arms. A package is included having a lid and a housing recess sealed by the lid wherein the tuning-fork piezoelectric vibrating element is housed. A pair of supports are provided on a bottom face of the housing recess for fixing the tuning-fork piezoelectric vibrating element by the support arms. A clearance groove is formed in the bottom face of the housing access to prevent the tuning-fork piezoelectric vibrating element from colliding against the bottom face of the housing recess.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed.

Abstract: Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials 20, 21 having different activation temperatures and which are capable of being activated by heating is disposed in the cavity C.

Abstract: A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics is provided. The surface acoustic wave device has a piezoelectric substrate 1, an IDT 2 formed on one major surface of the piezoelectric substrate 1 and having at least one comb-shaped electrode, and a protective cover 6 forming a hollow containing space 7 with the one major surface by covering the IDT 2 above the one major surface. The protective cover 6 is provide with a through hole 15 and composed, at least partially, of a photocurable material containing an acid generator which contains fluorine.

Abstract: This disclosure provides systems, apparatus and techniques by which electromechanical resonators are implemented. In one aspect, by mechanically loading the resonator body in specific ways, multiple resonance modes are created within the resonator body resulting in wider bandwidths.

Abstract: A flexural vibration piece includes a base, and a vibrating arms extending therefrom, each pair of vibrating arms has a first groove formed in the extension direction of the vibrating arm in one main surface following the direction in which the pair of vibrating arms are aligned, and a second groove formed side by side to the first groove in another main surface, the sum of the depths of the first and second groove portions is greater than the interval between the one main surface and the other main surface, and a mass portion is provided on each of the pair of vibrating arms, on the one main surface which is the opening side of the first grooves formed toward the outer sides opposite the inner sides on which the vibrating arms face each other.

Abstract: To provide a method of manufacturing a quartz resonator element having a small CI value, a quartz resonator element manufactured by this method, a quartz resonator, and a quartz oscillator. In a method of manufacturing a quartz resonator element in which on a surface of a plate-shaped quartz piece, a thin film-shaped electrode in order to excite the quartz piece is provided, a first metal layer that is composed of chromium and whose thickness is not less than 20 ? nor more than 45 ? is formed on the surface of the quartz piece (P4), and next, a second metal layer that is composed of gold or silver and whose thickness is not less than 500 ? nor more than 950 ? is formed on an upper surface of the first metal layer (P5), and then, the electrode made up of the first metal layer and the second metal layer is provided (P6). Thereafter, a quartz substrate on which the electrode is formed is heated at a temperature range of not less than 200° C. nor more than 400° C.

Abstract: Providing a method for manufacturing a package capable of improving production efficiency.

Abstract: Tuning-fork type quartz-crystal vibrating pieces are disclosed, of which the vibration frequency can be adjusted without increasing CI. An exemplary piezoelectric device has a pair of vibrating arms extending in a predetermined direction from a first edge of a base. Respective first grooves are defined in a first principal surface of the vibrating arms. The first grooves extend in the predetermined direction, and have first excitation electrodes extending from a back-edge surface but not completely to a front-edge surface of the grooves. Respective second grooves are defined in a second principal surface, opposite the first principal surface, of the vibrating arms. The second grooves extend in the predetermined direction, and have second excitation electrodes extending from a back-edge surface completely to a front-edge surface of the second grooves.

Abstract: An object is to provide a crystal device that uses a mesa-structure crystal piece in which frequency adjustment is possible. A configuration is such that in a crystal device having: a crystal piece having a thick portion and a thin portion, with an excitation electrode formed on both main faces of the thick portion, and a lead out electrode electrically connected to the excitation electrode, formed on an end portion; a container main body having a concavity for accommodating the crystal piece; and a cover that is connected to an open end face of the container main body and hermetically seals the crystal piece, a frequency adjustment metal film which is electrically isolated from the excitation electrode and made independent, is formed on the thin portion of the crystal piece.

Abstract: A package inner peripheral face 13 of a base 4 is made up of a vertical face 14 and a horizontal face 15, and electrode pads 7 (71 to 78) are formed on the vertical face vertical face 14 of the base 4. The electrode pads 71 to 78 are formed on the vertical face 14 of the base 4 including an intersection line 17 at which the vertical face 14 and the horizontal face 15 intersect; for example, electrode pads 74 and 75 that serve as hetero electrodes are formed adjacently. The distance between the electrode pads 74 and 75 that are adjacent along the intersection line 17 of the vertical face 14 of the base 4 is longer than the shortest distance between the electrode pads 74 and 75 that are adjacent on the vertical face 14 of the base 4.

Abstract: Provided is a piezoelectric vibrator which is also compatible with the miniaturization thereof. In a piezoelectric vibrator where a piezoelectric vibrating piece is sealed in a cavity formed between a lid substrate and a base substrate made of a glass material, one through hole is formed in the base substrate, a pair of through electrodes are arranged in the through hole, the through hole is filled with a glass frit and the glass frit is solidified by baking so that the through hole is sealed by the glass fit. By arranging the pair of through electrodes in one through hole, one through hole is provided for one piezoelectric vibrator and hence, bending strength of the base substrate can be increased. Further, the piezoelectric vibrator is compatible with the miniaturization thereof.

Abstract: To facilitate positioning of an external terminal and ensure sufficient solder joint strength at the time of mounting a piezoelectric device on a mounting board by soldering. In a crystal device of the present invention, an external terminal is formed, for example, at four corners on an external bottom surface of a base having a rectangular shape as seen in a plan view, and the external terminals include two active terminals arranged opposite to each other on a diagonal line, and two ground terminals arranged opposite to each other on another diagonal line crossing the diagonal line. An arbitrary sign, character, or figure is marked on a mounting surface of at least one ground terminal of external terminals to determine the direction of the active terminal.

Abstract: A piezoelectric vibrating piece and a piezoelectric device are provided, in which the deterioration of the vibrating characteristics of a vibrating portion is prevented. The piezoelectric vibrating piece comprises a rectangular-shaped first surface having a long side and a short side; a second surface opposing the first surface; and side surfaces, connecting the first surface and the second surface. The piezoelectric vibrating piece further comprises a first excitation electrode formed on a central part of the first surface; a first extraction electrode extracted from the first excitation electrode to an outer peripheral portion of the second surface via only the side surface at the short side; a second excitation electrode formed on the second surface opposite to the first excitation electrode; and a second extraction electrode extracted from the second excitation electrode to the outer peripheral portion of the second surface.

Abstract: The present invention discloses a method for assembling a 3D microelectrode structure. Firstly, 2D microelectrode arrays are stacked to form a 3D microelectrode array via an auxiliary tool. Then, the 3D microelectrode array is assembled to a carrier chip to form a 3D microelectrode structure. The present invention uses an identical auxiliary tool to assemble various types of 2D microelectrode arrays having different shapes of probes to the same carrier chip. Therefore, the method of the present invention increases the design flexibility of probes. The present invention also discloses a 3D microelectrode structure, which is fabricated according to the method of the present invention and used to perform 3D measurement of biological tissues.

Abstract: A quartz crystal vibrator element having the weight section is provided with the intermediate weight section formed to have an arm width W1 larger (thicker) than the arm width W of the vibrating arm section and smaller (thinner) than the arm width W2 of the tip weight section, thereby making the intermediate weight section follow the vibration (the amplitude) of the vibrating arm section. Further, the tip weight section formed to have an arm width W2 larger (thicker) than the arm width W1 of the intermediate weight section is provided, thereby making the tip weight section follow the vibration (the amplitude) of the vibrating arm section and the intermediate weight section. Therefore, the vibration characteristics of the vibrating arm section can be stabilized.

Abstract: A sensor device includes a substrate, an IC chip, a sensor element, bonding wires, and a lid. The substrate includes a plurality of metal posts which are disposed so as to be electrically independent of each other and an insulator which is filled in a gap between faces different from first faces and second faces of the plurality of metal posts and integrally fixes the plurality of metal posts. The IC chip has electrode pads on an active face and is fixed to a first metal post. The sensor element has vibrating portions and is supported by the IC chip by bonding a supporting portion to the active face of the IC chip. The bonding wires electrically connect the electrode pads with second metal posts. The lid is disposed so as to cover the IC chip and the sensor element.

Abstract: A piezoelectric substrate includes vibrating arms, a base portion to which one end portion of each vibrating arm is connected, spindle portions formed in the other end portion of each vibrating arm, formed to have a large width, and having first groove portions formed therein, and second groove portions that are formed along the resonator center line of each vibrating arm, and flexure-torsional combined resonator is excited. A piezoelectric resonator element has flexural resonator of flexure-torsional combined resonator that is excited as its principal resonator and sets the cutting angle of the piezoelectric substrate, the widths and the depths of the first groove portion and the second groove portion, and the thickness of the vibrating arm such that the frequency-temperature characteristics represent third-order characteristics with respect to the temperature.

Abstract: The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing.

Abstract: A piezoelectric vibrating piece includes a pair of vibration arm portions that is placed in a row in a width direction; a base portion to which proximal end sides in the pair of vibration arm portions in an extending direction are connected; and weight metal films that are formed on outer surfaces of the vibration arm portions, wherein the weight metal films are formed in positions that avoid regions of tip portions in the vibration arm portions in a longitudinal direction.

Abstract: A crystal device includes leading electrodes that are formed on a base substrate, and a bump for mounting a piezoelectric vibrating reed on the leading electrodes, and alignment marks for performing the positioning of the bump are formed on the base substrate separately from the leading electrodes.

Abstract: An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed.