Abstract: A piezoelectric component includes a main body, which is surrounded at least in part by an enclosure for protecting the main body. The enclosure includes a structured foil. A method for producing a component of this type is also specified, in which a main body of the component and a structured foil are provided. The structured foil is then wound around the main body.

Abstract: Manufacturing a semiconductor structure including modifying a frequency of a Film Bulk Acoustic Resonator (FBAR) device though a vent hole of a sealing layer surrounding the FBAR device.

Abstract: An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

Abstract: A mesa-structure crystal element includes a circumferential portion having a thin thickness, a first convex portion formed on a plane in a center side from the circumferential portion and having a first height from the circumferential portion in a first principal face and a first planar shape, and a second convex portion formed in a center side from the circumferential portion and having a second height from the circumferential portion in a second principal face opposite to the first principal face and a second planar shape, wherein at least one of an area and a planar shape is different between the first planar shape of the first convex portion and the second planar shape of the second convex portion, or the first height of the first convex portion is different from the second height of the second convex portion.

Abstract: Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material and a base board wafer even when the bonding material having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material, which is fixed in advance to an inner surface of a lid board wafer made of an insulator, to an inner surface of a base board wafer made of an insulator, the method including an anodic bonding step where an auxiliary bonding material serving as an anode is disposed on an outer surface of the lid board wafer, a cathode is disposed on an outer surface of the base board wafer, and a voltage is applied between the auxiliary bonding material and the cathode, wherein the auxiliary bonding material is made of a material that causes an anodic bonding reaction between the auxiliary bonding material and the lid board wafer in the anodic bonding step.

Abstract: The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.

Abstract: A piezoelectric device (100) comprises: a piezoelectric vibrating piece (101); a frame body (105) separated from piezoelectric vibrating piece by through-hole (108); a piezoelectric frame (10) having a supporting portion (104), a first surface (Me) and a second surface (Mi); a package lid (11) having a first connecting surface (M1) a package base (12), including a mounting surface (M4) for forming a pair of external electrodes (125) and a top surface having a second connecting surface (M2); a first sealing material (LG1) formed between the first connecting surface and the first surface; and a second sealing material (LG2) formed between the second connecting surface and the second surface. The first sealing material or the second sealing material extends to a side surface (M3) of the through-hole.

Abstract: A crystal oscillator and manufacturing method thereof are provided.

Abstract: A crystal resonation device that includes a base plate, a cap, a joining material, and a crystal resonator. The cap is provided on the base plate. The cap forms a sealed space with the base plate. The joining material joins the base plate and the cap. The joining material contains a cured material of thermosetting resin. The crystal resonator is provided on the base plate in the sealed space. The joining material is located in an outer side portion of a wall of the cap joined to the joining material.

Abstract: A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded.

Abstract: A piezoelectric actuator for a fuel injector may include a piezoelement that can be deflected along the longitudinal axis in the longitudinal direction of the fuel injector, and a separating wall for protecting the piezoelement from an overflow of a medium from the fuel-guiding part of the fuel injector, the piezoelement being preconstrained in the axial direction by the separating wall.

Abstract: An electromechanical transducer includes a first electromagnetic element and a second electromagnetic element, such as electrodes, disposed opposite to each other with a sealed cavity therebetween. The sealed cavity is formed by removing a sacrifice layer and then performing sealing. A sealing portion is formed by superposing a film of a hardened second sealing material that has fluidity at normal temperature on a film of a first sealing material that does not have fluidity at normal temperature.

Abstract: An electronic component includes: a base material having a first conductive section; an oscillation piece having a second conductive section; a first member which is covered with a third conductive section making conductive contact with the first and second conductive sections and is provided between the base material and the oscillation piece; and a second member which is provided so as to be surrounded with the base material, the oscillation piece, and the first member and holds the base material and the oscillation piece.

Abstract: A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a lid portion, and a base portion. The piezoelectric vibrating piece includes a vibrating portion, a framing portion surrounding the vibrating portion, an excitation electrode on the vibrating portion, and an extraction electrode on the framing portion. The extraction electrode is electrically connected to the excitation electrode. The lid portion is bonded to a front surface of the piezoelectric vibrating piece. The base portion is bonded to a back surface of the piezoelectric vibrating piece. The base portion includes an external electrode electrically connected to the extraction electrodes. The framing portion includes a metallic layer that allows a passivation. The metallic layer is disposed at an outer peripheral edge portion corresponding to the extraction electrode on at least one of a front surface and a back surface.

Abstract: A piezoelectric vibrating piece is provided including: a pair of vibrating arm sections; a base section which is provided between the pair of vibrating arm sections; and connecting sections which connect base end sections of the pair of vibrating arm sections and a base end section of the base section, in which the vibrating arm sections have bending points and the vibrating arm sections extend in a direction away from the base section from the base end sections of the vibrating arm sections to the bending points, and the vibrating arm sections extend along the base section from the bending points to leading end sections of the vibrating arm sections.

Abstract: Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess.

Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).

Abstract: The piezoelectric device comprises a piezoelectric vibrating piece having a base portion, a pair of vibrating arms extending in a specified direction from the base portion, and a pair of connection portions disposed on the pair of the supporting arms; a package having a bottom surface which accommodates the piezoelectric vibrating piece and side faces surrounding the bottom surface, in which a pair of electrode pads corresponding to the connection portions are formed on the bottom surface; and adhesive for bonding the pair of the electrode pads with the pair of connection portions. One electrode pad and the other electrode pad, with adhesive applied to the electrode pads, are shifted with respect to each other in a predetermined direction.

Abstract: A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: A piezoelectric vibrating piece includes a pair of vibrating arm portions, a base portion which is arranged between a pair of vibrating arm portions, and connecting portions which connect proximal end portions of a pair of vibrating arm portions and a proximal end portion of the base portion. Narrow width portions are provided at the base of the base portion.

Abstract: Quartz-crystal vibrating devices are disclosed, including vibrating and frame portions separated by a through-slot. An edge surface of the slot has a protrusion preventing unwanted formation of artifact “electrodes.” The vibrating portion and frame are made of AT-cut quartz as a unit. A joining portion couples the frame and vibrating portion together across the through-slot. A package base has two external electrodes. A third frame region has first and second plane surfaces. The protrusion projects toward the vibrating portion and has first and/or second sloped surfaces. First and second extraction electrodes extend from respective excitation electrodes via respective joining portions to respective external electrodes. The extraction electrodes pass across the first plane surface and first sloped surface or across the second plane surface and second slanted surface.

Abstract: The piezoelectric device (100) stores a piezoelectric vibrating piece (10) which vibrates whenever an electrical voltage is applied. The piezoelectric device comprises: a package lid (11) having a first peripheral surface (M1) which surrounds a plane surface in a predetermined width; and a package base (12) comprising a second peripheral surface (M2) bonded to the first peripheral surface of the package lid and a recess portion recessed from the second peripheral surface. The first peripheral surface of the package lid and the second peripheral surface of the package base are rough surfaces, respective metal films (AC1, AC2) are formed on each rough surface, and the package lid and the package base are bonded using a sealing material (LG) formed between the metal films.

Abstract: A unit comprises a quartz crystal resonator having a base portion, and first and second vibrational arms, each of the first and second vibrational arms having opposite main surfaces. At least two grooves are formed in at least one of the opposite main surfaces of each of the first and second vibrational arms so that a distance in the width direction of the at least two grooves measured from an outer edge of the one of the at least two grooves to an outer edge of the other of the at least two grooves is less than 0.05 mm.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A method of manufacturing a ladder filter including first and second resonators includes: forming a piezoelectric film on an entire surface of a substrate that has respective lower electrodes of the first and second resonator formed thereon, an conductive film on the piezoelectric film, and a second film on the conductive film; forming a pattern of the second film in a prescribed region in the second area; forming a first film on an entire surface of the substrate; etching the first film, forming a pattern of the first film, the second film and the conductive film in the second area, and forming a pattern of the first film and the conductive film in the first area, to form respective upper electrodes from the conductor film; and thereafter, etching the piezoelectric film to form respective patterns of the piezoelectric film in the first and second areas, respectively.

Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.

Abstract: Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate.

Abstract: An acoustic wave device includes, a substrate, an acoustic wave device chip that has a vibration part exciting an acoustic wave and is mounted on a surface of the substrate so that the vibration part is exposed to a space formed between the substrate and the acoustic wave device chip, and a joining part that is provided so as to surround the vibration part and joins the substrate and the acoustic wave device chip together. The joining part includes a first member made of solder, and a second member that is stacked on the first member and is made of a substance having a melting point higher than the solder. The second member has a thickness larger than a coplanarity of the surface of the substrate.

Abstract: An electronic component includes: an element that is located on a substrate; a signal wiring that is located on the substrate and electrically connected to the element; a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity; a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; and an insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a lid portion, and a base portion. The piezoelectric vibrating piece includes: a vibrating portion; a framing portion surrounding the vibrating portion; an excitation electrode in the vibrating portion; and an extraction electrode electrically connected to the excitation electrode in the framing portion. The lid portion is bonded to a front surface of the piezoelectric vibrating piece via a bonding material. The base portion includes an external electrode bonded to a back surface of the piezoelectric vibrating piece via a bonding material and electrically connected to the extraction electrode. The excitation electrode and the extraction electrode each include: a foundation film formed of metal to be rendered passive; and a first metal film and a second metal film laminated to the foundation film. The foundation film has a film thickness of 1.0 nm to 8.0 nm.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.

Abstract: An electronic component includes: a substrate; a functional element located on the substrate; a wiring located on the substrate and electrically connected to the functional element; a metal ceiling located above the functional element so that a space is formed between the metal ceiling and the functional element; and a sealing portion located on the metal ceiling, wherein the metal ceiling is electrically connected to a signal wiring that is included in the wiring and transmits a high-frequency signal.

Abstract: A tuning fork vibrator includes a package having an internal space having a rectangle column shape; a tuning fork vibration piece including a base, two vibration arms extending in parallel form the base and a first arm and a second arm extending obliquely from the base so as to interpose the two vibration arms, the tuning fork vibration piece having a length from the base to a tip in an extended direction of the two vibration arms which is longer than each side of the bottom surface of the internal space, wherein the tuning fork vibration piece is placed in the internal space with the extended direction set along a diagonal direction of the internal space, and a tip part of the first arm and a tip part of the second arm of the tuning fork vibration piece are fixed to the bottom surface of the internal space.

Abstract: A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.

Abstract: A method and apparatus for packaging a Surface Acoustic Wave (SAW) piezoelectric device into a SAW tagging device for use in a harsh environment is provided. An exemplary SAW tagging device comprises a SAW piezoelectric device within a header container. The header container is electrically connected to an antenna system that comprises an antenna substrate, a dielectric disk that may operate as an antenna reflector in combination with a metal base. The antenna system, antenna substrate, dielectric disk and header container are all contained within a cavity in the metal base. The SAW tagging device is completely encased in a chemical, temperature and environmentally resistive and durable material that is transparent to the operating radio frequency of the SAW piezoelectric device contained therein.

Abstract: This disclosure provides systems, apparatus and techniques by which electromechanical resonators are implemented. In one aspect, by mechanically loading the resonator body in specific ways, multiple resonance modes are created within the resonator body resulting in wider bandwidths.

Abstract: Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.

Abstract: A manufacturing method, which realizes general versatility of an external connection terminal by reducing deterioration of characteristics and a decrease in yield rate of a piezoelectric device in an external connection terminal forming process, and a piezoelectric device manufactured by this method are provided. Before a piezoelectric device is sealed together with a ceiling layer to form a package, an electrode structure serving as an external connection terminal is provided beforehand on a substrate mounted with a key area of the device, and after formation of the key area of the device, the piezoelectric device is sealed and packaged together with the ceiling layer. The piezoelectric device of the present invention can accommodate a three-dimensional structure by providing a rewiring layer on a principal surface of the substrate.

Abstract: The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing.

Abstract: A piezoelectric vibrator including a package having a base member, a lid member forming a cavity with respect to the base member, and a piezoelectric vibrating piece mounted on a mount surface and housed inside the cavity, in which the piezoelectric vibrating piece has a pair of vibrating arm portions and a base portion cantilever-supporting base end portions of the pair of vibrating arm portions and being mounted on the mount surface, a concave portion for avoiding contact with respect to tip portions when the vibrating arm portions are displaced in a thickness direction is formed on the mount surface, contact portions contacted by main surfaces of the vibrating arm portions facing the mount surface, and clearance portions for avoiding contact with at least one edge-line portion of two edge-line portions where the main surface intersects with two side surfaces.

Abstract: One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.

Abstract: A method of making a handheld, electromechanical device useful in mammalian body-care includes the steps of: a) forming a one-piece housing having a single opening defined by a rim; b) assembling a unitary insert; c) inserting the unitary insert through the single opening of the housing; d) removably applying a cover having an exterior surface to close the opening of the one-piece housing; and e) attaching the unitary insert to at least one of the one-piece housing and the removable cover. The rim of the one-piece housing circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover closes off the opening of the one-piece housing.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: Methods of testing packaged thin-film piezoelectric-on-semiconductor (TPoS) microelectromechanical resonators having hermetic seals include measuring a quality factor (Q) of resonance of the packaged resonator at at least two unequal temperatures to determine whether a ?Q/?T is significantly different (e.g, by at least 50%) over a temperature range (?T) spanning a smallest and largest of the at least two temperatures. These measurements are performed for a packaged resonator having a QAIR<QTED, where QAIR is the quality factor of resonance of the packaged resonator due to air damping and QTED is the quality factor of resonance of the packaged resonator due to thermoelastic damping.

Abstract: Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films.