Abstract: A latent-image measuring device that measures the state of a photoconductor. The latent-image measuring device emits a charged-particle beam to the photoconductor to detects a charged-particle signal obtained through the emission of the charged-particle beam. The latent-image measuring device then exposes the photoconductor a plurality of times to form electrostatic latent images on the photoconductor, and measures an amount of change in latent-image depth while changing a time interval between a plurality of exposures.

Abstract: Fixtures according to the present invention include fixing surfaces in the same shape as end surfaces of a device under test which is to be measured while an electromagnetic wave to be measured at a frequency equal to more than 0.01 [THz] and equal to or less than 100 [THz] is irradiated on the device under test. The end surfaces are fixed to the fixing surfaces. When a refractive index of the fixtures is n0, and a refractive index of the device under test is n1, a relationship n1?0.1?n0?n1+0.1 holds. The fixtures do not cover a side surface of the device under test. The fixtures are rotated about a straight line orthogonal to the fixing surfaces as a rotational axis.

Abstract: To analyze an electric component in depth, provision is made to submit the aforementioned component to focused laser radiation. It is shown that by modifying the altitude of the focus in the component, some internal parts of the aforementioned component can be characterized more easily.

Abstract: The present disclosure provides methods and apparatus that enable characterization of an electrical property of a semiconductor specimen, e.g., dopant concentration of a near-surface region of the specimen. In exemplary method, a target depth for measurement is selected. This thickness may, for example, correspond to a nominal production thickness of a thin active device region of the specimen. A light is adjusted to an intensity selected to characterize a target region of the specimen having a thickness no greater than the target depth and a surface of the specimen is illuminated with the light. An AC voltage signal induced in the specimen by the light is measured and this AC voltage may be used to quantify an aspect of the electrical property, e.g., to determine dopant concentration, of the target region.

Abstract: The present invention relates to a device for testing an optoelectronic module, comprising a first source for generating an electromagnetic beam or particle beam, a second source for illuminating the optoelectronic module; and a detector. In addition, a method for testing an optoelectronic module is provided comprising illuminating the optoelectronic module, directing an electromagnetic beam or particle beam and detecting defects in the optoelectronic module. The illumination additional to the electromagnetic beam or particle beam makes defects visible which otherwise would not be detected.

Abstract: Surface photo-voltage measurements are used to accurately determine very long steady state diffusion length of minority carriers and to determine iron contaminant concentrations and other recombination centers in very pure wafers. Disclosed methods use multiple (e.g., at least two) non-steady state surface photovoltage measurements of diffusion length done at multiple (e.g., at least two) modulation frequencies. The measured diffusion lengths are then used to obtain a steady state diffusion length with an algorithm extrapolating diffusion length to zero frequency. The iron contaminant concentration is obtained from near steady state measurement of diffusion length at elevated frequency before and after iron activation. The concentration of other recombination centers can then be determined from the steady state diffusion length and the iron concentration measured at elevated frequency.

Abstract: Apparatus for inspection and fault analysis of semiconductor chip includes stage on which to mount LSI chip, and test pattern generator supplying test pattern via stage to LSI chip. Apparatus also includes optical system having function of modulating laser beam. This optical system operates so that LSI chip is scanned and illuminated by modulated laser beam. IR-OBIRCH controller performs image processing of taking out only signal of preset frequency from signal from LSI chip via lock-in amplifier, and correlates signal taken out with scanning points. Lock-in amplifier is adapted to take out only signal of preset frequency from signal from LSI chip. A display section displays image based on image signal from IR-OBIRCH controller which confirms presence or absence of abnormal current route in LSI chip based on image signal.

Abstract: A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

Abstract: A system and method for localization and resolvability of an integrated circuit includes selecting one or more electrical stimuli to be applied to a device under test such that the electrical stimuli are chosen to provide a baseline image and a distinguishing image effect as a result of the chosen stimuli when applied to the device under test. The one or more electrical stimuli are applied to the device under test. Emissions from the device under test are measured to provide a measurement data set from the one or more electrical stimuli using one or more measurement tools for collecting the baseline image and the distinguishing image effect. The measurement data set is analyzed to localize and evaluate circuit structures by comparing the baseline image and the distinguishing image effect.

Abstract: The present disclosure provides a semiconductor test system. The semiconductor test system includes a wafer stage to hold a wafer having a plurality of light emitting devices (LEDs); a probe test card operable to test each test field of the wafer; and a light detector integrated with the probe test card to collect light from a LED of the wafer.

Abstract: An accelerometer with improved immunity to sensitivity drift is disclosed. In some embodiments, the accelerometer comprises an actuator that induces a known acceleration on a reference frame. A signal based on this known acceleration is used to calibrate the accelerometer to mitigate the effects due to at least one of sensitivity drift, D.C. bias drift, sense laser wavelength drift, and resonant frequency drift.

Abstract: An apparatus for providing modulation mapping is disclosed. The apparatus includes a laser source, a motion mechanism providing relative motion between the laser beam and the DUT, signal collection mechanism, which include a photodetector and appropriate electronics for collecting modulated laser light reflected from the DUT, and a display mechanism for displaying a spatial modulation map which consists of the collected modulated laser light over a selected time period and a selected area of the IC.

Abstract: An apparatus for analyzing an integrated circuit to which one or more test signals are applied. An example apparatus includes an objective lens that views reflections from the integrated circuit, a device that houses at least two optical fibers, a component that receives reflections from the objective lens and directs the received reflections to the device, and a photo-diode that receives a reflection received by the device. The apparatus includes a beam splitter that directs reflections from the integrated circuit to a detector. A processing device generates an image signal based on a signal received from the detector and a display outputs an image based on the image signal. The component includes a scan mirror that reflects the collimated reflections to a collimating lens that focuses the reflections from the scan mirror toward the device.

Abstract: In a modulated optical reflectance (MOR) system, a laser noise suppression technique utilizes a reference beam split optically from a probe laser prior to injection of a beam from the probe laser into an MOR signal path. The reference beam and a probe beam reflected from the sample are sent to first and second detectors, which produce first and second signals. A signal combiner receives the second signal at a first input and produces a combiner signal that corresponds to a difference between signals applied to the first and a second input. A level balancer receives the first signal and a signal derived from the combiner signal and produces a balancer output that is coupled to the second input of the signal combiner. The combination of the balancer output and the second signal tends to cancel out an average value of the second signal from the combiner signal.

Abstract: A scanning/imaging system wherein an external stimulus is used for exciting a device under test (DUT). A stimulus source is included for providing a stationary stimulus with a controllable spot size to a device under test (DUT), the controllable spot size covering a portion of the DUT for excitation by the stationary stimulus. A sensor is operable for capturing at least one of a functional response signal and an optical image signal emanating from the DUT portion. A linear positioning device is operable to facilitate scanning of remaining portions of the DUT until a predetermined area thereof has been traversed. A controller is operably coupled to the linear positioning device, stimulus source and the sensor for providing the overall control thereof.

Abstract: Systems, methods, and computer readable media storing instructions for such methods relate to generating test vectors that can be used for exercising a particular area of interest in an integrated circuit. The test vectors generally include a non-overlapping repeating and/or predictable sequence of care bits (a care bit pattern) that can be used by a tester to cause the exercise of the area and collect emissions caused by exercising the area. Such emissions can be used for analysis and debugging of the circuit and/or a portion of it. Aspects can include providing a synchronization signal that can be used by a tester to allow sensor activation at appropriate times.