Abstract: A load board to which a socket is mounted is electrically connected to a tester. The load board includes a first optical communication unit capable of transmitting and/or receiving signals by optical wireless communication with an electronic component handling apparatus that presses a DUT against the socket.

Abstract: A semiconductor module includes a control IC mounted on a mounting substrate and a plurality of semiconductor chips mounted on the mounting substrate, and each of the plurality of semiconductor chips includes first and second transistors connected in series between a device to be inspected and a tester. The first transistor and the second transistor have a common drain electrode on a substrate side of the semiconductor chip. A source electrode of the first transistor is connected to the side of a power supply channel of the tester. A source electrode of the second transistor is connected to the side of an electrode of the device to be inspected. A control signal from the control IC is supplied to a gate electrode of each of the first and second transistors via a line so that the connection between the tester and the device to be inspected is controlled.

Abstract: A power semiconductor module includes a power electronics circuit and a measuring circuit for measuring a physical parameter occurring in the power electronics circuit and for providing a corresponding measurement signal. A transmission circuit is coupled to a secondary side of a transfer unit, and an evaluation circuit is coupled to the primary side and galvanically isolated from the transmission circuit by the transfer unit. The evaluation circuit supplies an AC voltage to the primary side, causing primary current to flow on the primary side, which in turn results in secondary current on the secondary side, the secondary current being supplied to the transmission circuit. The transmission circuit receives the measurement signal and modulates the secondary current in accordance with the measurement signal, which results in a modulation of the primary current. The evaluation circuit evaluates the modulation of the primary current and generates an output signal dependent thereon.

Abstract: A system that measures a high electric voltage on an electrical transmission line has an electro optical voltage transducer sensor connected between the electrical transmission line and ground for providing in response to the measured high electric voltage a Sin optical intensity signal and a Cos optical intensity signal. The system also has a signal processor that operates in a first state to digitally process samples of the Sin and said Cos optical intensity signals. The process samples are used to provide a representation of the high electric voltage on the transmission line. The representation can be used for one or more of metering, relaying and transient capture.

Abstract: A probe card includes a plurality of probe pins, and a switch network connected to the plurality of probe pins. The switch network is configured to connect the plurality of probe pins in a first pattern, and reconnect the plurality of probe pins in a second pattern different from the first pattern.

Abstract: A measurement apparatus is disclosed. The measurement apparatus includes a lid configured to be removably affixed to a microcircuit case. One or more penetrations through the lid allow insertion of a signal-conducting probe. The probe is removably affixed to the lid at the site of the penetration. The probe includes a central conductive pin. The central conductive pin transmits to a connection outside the case a radio-frequency signal inductively received from a source inside the case. The probe also includes a dielectric region radially surrounding a portion of the central conductive pin, and a grounded outer conductive housing radially surrounding the dielectric region and electrically isolated from the central conductive pin by the dielectric region.

Abstract: Disclosed herein is a semiconductor integrated circuit capable of detecting an abnormality that can cause a malfunction in signal transmission via an isolation element and of issuing a stop signal to the target to be controlled. The semiconductor integrated circuit includes a transmission circuit generating and outputting a transmission signal reflecting transmission data supplied from outside, a reception circuit reproducing the transmission data based on a reception signal, an isolation element isolating the transmission circuit from the reception circuit and transmitting the transmission signal as the reception signal, an abnormality detection part detecting an abnormality that can cause a malfunction in signal transmission via the isolation element, and a control part outputting a stop signal if the abnormality detection part detects the abnormality, regardless of the transmission data supplied to the transmission circuit from outside.

Abstract: A system for detecting stray voltage in a conductive object is disclosed herein. The system includes a pick-up element, electrical circuitry, a housing for enclosing the circuitry, a support for mounting the housing, and an indicator. The pick-up element is separated from the conductive object and capable of detecting an electric field from the conductive object. The support of the housing is such that the pick-up element remains separated from the conductive object. The electrical circuitry determines a voltage level corresponding to the electric field detected by the pick-up element and generates, based on a comparison of the determined voltage level relative to a reference voltage level, an indicator signal representative of whether stray voltage is present in the conductive object. Based on the indicator signal, the indicator indicates to a user of the system whether stray voltage is present in the conductive object.

Abstract: An apparatus for determining a type of an electromagnetic wave generating source, including: a measurement unit that measures electromagnetic field strength at first and second measurement points at vertically different respective distances from a main surface of an object to be measured; a calculation unit that calculates an attenuation amount of the electromagnetic field strength between the first and second measurement points using measured values of the electromagnetic field strength measured by the measurement unit; and a determination unit that determines whether the generating source is the electric current source or the magnetic current source by judging which one of a reference value of an electric current source and a reference value of a magnetic current source is close to a value of the attenuation amount calculated by the calculation unit.

Abstract: A capacitive sensor for detecting an electrical field generated by a live conductor comprises a source electrode (10), a screen element (20) and an electrical field sensor (30). Said source electrode (10) has a proximal portion (11) connected to the conductor (A) and a distal portion (12) placed inside the screen element (20). The electrical field sensor (30) is placed inside said screen element (20), and faces and is spaced apart from the distal portion (12) of said source electrode (10), in order to detect the electrical field emitted by said source electrode (10).

Abstract: An electric field detection probe includes a cable including an internal conductor line, an insulating layer that coats a surface of the internal conductor line and exposes a tip end of the internal conductor line, an external conductor layer that coats a surface of the insulating layer and exposes the tip end, and an electric field diaphragm wherein the electric field diaphragm is electrically coupled to the external conductor layer, covers the tip end surface of the cable except for an opening.

Abstract: An electrical connection defect detection system to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection system comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module, an electrode board and a plurality of grounding paths. The electrode board comprises a detection surface to be adapted to a surface of the under-test device opposite to the under-test pin to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The grounding paths are connected to one of not-under-test pin groups respectively to further connect to the ground potential. An electrical connection defect detection method is disclosed herein as well.

Abstract: A measurement apparatus is disclosed. The measurement apparatus includes a lid configured to be removably affixed to a microcircuit case. One or more penetrations through the lid allow insertion of a signal-conducting probe. The probe is removably affixed to the lid at the site of the penetration. The probe includes a central conductive pin. The central conductive pin transmits to a connection outside the case a radio-frequency signal inductively received from a source inside the case. The probe also includes a dielectric region radially surrounding a portion of the central conductive pin, and a grounded outer conductive housing radially surrounding the dielectric region and electrically isolated from the central conductive pin by the dielectric region.

Abstract: Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.

Abstract: A method for adapting the signal transmission between two electronic devices (1, 2) that are connected to each other via a physical interface and that each have a transmitter (8a, 8b) and a receiver (7a, 7b), wherein analog signals are transmitted from the transmitter (8a, 8b) of one device (1, 2) along a transmission path (9a, 9b) to the receiver (7a, 7b) of the other device (1, 2). Known scattering parameters (10a, 10b, 10c, 11d) for describing the electromagnetic wave propagation in the transmission path (9a, 9b) between the receiver (7a, 7b) of the first device (1, 2) and the transmitter (8a, 8b) of the second device (1, 2) are retrieved by the first device (1, 2), transmitted to the second device (1, 2), and parameters of the transmitter (8a, 8b) in the second device (1, 2) are adapted with reference to a high-frequency description of the transmission path (9a, 9b) as a function of all of the scattering parameters (10a to 10d, 11a to 11d) known to the two devices.

Abstract: The present invention relates to methods for inspection of defects in an electrophoretic display and related devices. The method may be carried out with one or more testing electrodes. The method comprises applying a voltage difference to two testing electrodes which are in contact with the display panel, or applying a voltage difference to a testing electrode and a electrode layer. The methods may be applied in in-line or off-line inspection of a display panel.

Abstract: Provided is an active non-contact probe card including a carrier, a support base, a piezoelectric material layer, an active sensor array chip and a control circuit. The support base is disposed on the carrier. The piezoelectric material layer is connected with the support base. The position of the active sensor array chip with respect to the carrier is determined according to the thicknesses of the support base and the thicknesses of the piezoelectric material layer. A control circuit provides a control voltage to the piezoelectric material layer to control the thickness of the piezoelectric material layer, so as to adjust the position of the active sensor array chip with respect to the carrier.