Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.

Abstract: A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: An inspection apparatus for inspecting wires of an object in which a plurality of x-axis and y-axis wires are arranged perpendicular to each other, each x-axis and y-axis wire having a display wire and tab wire, respectively. The apparatus includes a power supply device supplying an AC signal to the wire as an inspection object; a connecting device being in conductive contact with the tab wire to transmit the AC signal, a first detecting device disposed in a non-contact manner at one end of the display wire and conductively connected to one end of the power supply device, a second detecting device disposed in the non-contact manner and opposed to the display wire and conductively connected to the one end of the power supply device, and a determining device determining quality of the wire on the basis of results of the first and second detecting devices.

Abstract: A non-contact object detection system includes a capacitor sensor and a control system, the control system providing a AES (Adaptive Excitation Signal) to the capacitor sensor, the AES (Adaptive Excitation Signal) configured according to an environment in which the capacitor sensor is deployed, the AES (Adaptive Excitation Signal) configured to produce a threshold voltage from the capacitor sensor to the control system in the environment when an object is not in a detection area of the capacitor sensor.

Abstract: Devices and methods are provided that facilitate improved input device performance. The devices and methods utilize a first substrate with proximity sensor electrodes and at least a first force sensor electrode disposed on the first substrate. A second substrate is physically coupled to the first substrate, where the second substrate comprises a spring feature and an electrode component. The electrode component at least partially overlaps the first force sensor electrode to define a variable capacitance between the first force sensor electrode and the electrode component. The spring feature is configured to facilitate deflection of the electrode component relative to the first force sensor electrode to change the variable capacitance. A measure of the variable capacitance may be calculated and used to determine force information regarding the force biasing the input device.

Abstract: A multi purpose capacitive sensor suitable for indicating close proximity of a person to a surface along a large-size truck as well as along a medium-size painting or a pocket-size mobile phone is disclosed. The sensor comprises a voltage measuring device provided with a signal ground connected to a first pole of an oscillating voltage source that has a second pole connected to a signal input of the voltage measuring device. This input has a first capacitance to earth and a second capacitance to the signal ground. A third capacitance is exhibited to earth by the second pole of said voltage source. According to the invention, a prebias component is connected between the second pole of the voltage source and the signal input of the voltage measuring device.

Abstract: A multi-channel probe plate includes an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface. Each of the coupling regions covers a different zone of a semiconductor package when the package is positioned in close proximity to the first main surface of the plate. Circuitry electrically connected to each of the coupling regions of the probe plate via a different channel is operable to: measure a parameter indicative of the degree of capacitive coupling between each coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding coupling region; provide a capacitance signal based on the parameter measured for each of the coupling regions of the probe plate; and select different ones of the capacitance signals for analysis.

Abstract: Techniques disclosed herein stress a dielectric layer until a pre-catastrophic, stress induced leakage current (SILC) condition is detected. When the pre-catastrophic SILC condition is detected, the stress is removed to prevent catastrophic failure of the dielectric and its associated device. Because these techniques prevent catastrophic failure of the dielectric layer, engineers can carry out physical failure analysis of the device, which is now known to have some type of defect due to detection of the pre-catastrophic SILC condition. In this way, the techniques disclosed herein allow engineers to more quickly determine an underlying cause of a defect so that yields can be kept at optimal levels.

Abstract: Disclosed herein is a semiconductor integrated circuit capable of detecting an abnormality that can cause a malfunction in signal transmission via an isolation element and of issuing a stop signal to the target to be controlled. The semiconductor integrated circuit includes a transmission circuit generating and outputting a transmission signal reflecting transmission data supplied from outside, a reception circuit reproducing the transmission data based on a reception signal, an isolation element isolating the transmission circuit from the reception circuit and transmitting the transmission signal as the reception signal, an abnormality detection part detecting an abnormality that can cause a malfunction in signal transmission via the isolation element, and a control part outputting a stop signal if the abnormality detection part detects the abnormality, regardless of the transmission data supplied to the transmission circuit from outside.

Abstract: A capacitive touch sensing device by detecting induced electric field includes a differential amplifier, a resistor and a signal judgment circuit. The differential amplifier is electrically connected to a touch sensor. The resistor is electrically connected to a first input end and a second input end of the differential amplifier. The signal judgment circuit is electrically connected to an output end of the differential amplifier. As the touch sensor receives an induced electric field signal, the induced electric field signal is amplified by the differential amplifier and the signal judgment circuit determines whether the amplified induced electric field signal is a touch input.

Abstract: A sensor has a strip resonator filter that energizes an emitter patch which emits an electric field out from the strip resonator filter (away from the strip resonator filter). The capacitance of the filter, or specifically the coupling capacitance and radiation pattern of the slotted patch, is altered when an object such as a finger is near the sensor. Resulting changes in a signal outputted by the filter can be used to determine how close the object is to the sensor. The strip resonator filter may be a half wavelength strip resonator coupled filter having three separate strips. The patch may have a slot and two accompanying strips. An arrangement of multiple sensors may detect the position of an object in two or three dimensions.

Abstract: An improved system for capacitive testing electrical connections in a low signal environment. The system includes features that increase sensitivity of a capacitive probe. One feature is a spacer positioned to allow the probe to be partially inserted into the component without contacting the pins. The spacer may be a collar on the probe that contacts the housing of the component, contacts the substrate of the circuit assembly, or both. In some other embodiments, the spacer may be a riser extending beyond the surface of the sense plate that contacts the component, a riser portion of the component, or a combination of both. The spacer improves sensitivity by establishing a small gap between a sense plate of the probe and pins under test without risk of damage to the pins. A second feature is a guard plate of the probe with reduced capacitance to a sense plate of the probe. Reducing capacitance also increases the sensitivity of the probe.

Abstract: An input device is disclosed, including a first drive electrode comprising a resistive material and a first sense electrode disposed proximate to the first drive electrode. The input device further includes a processing system which is coupled with the first drive electrode and the first sense electrode. In one embodiment, the processing system is configured for electrically driving a first end of the first drive electrode and electrically driving a second end of the first drive electrode to cause a change in a voltage gradient along a length of the first drive electrode. In such an embodiment, the change in the voltage gradient generates a first electrical signal in the first sense electrode. The processing system also acquires a first measurement of the first electrical signal and determines positional information along the length of the first drive electrode based upon the first measurement, wherein the positional information is related to an input object.

Abstract: Methods and related systems are described for determining the casing attenuation factor for various frequencies from measurements of the impedance of the transmitting or receiving coil of wire of. The compensation is based on two relationships. The first relationship is between one or more measured impedance parameters and the product of casing conductivity, casing thickness and electromagnetic frequency. The second relationship is between the casing correction factor and the product of casing conductivity, casing thickness and electromagnetic frequency.

Abstract: An electrical connection defect detection system to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection system comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module, an electrode board and a plurality of grounding paths. The electrode board comprises a detection surface to be adapted to a surface of the under-test device opposite to the under-test pin to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The grounding paths are connected to one of not-under-test pin groups respectively to further connect to the ground potential. An electrical connection defect detection method is disclosed herein as well.

Abstract: An apparatus includes: a strip line cell 100 having a first conductor board that has the width larger than the width of RFID tag T1 that receives a predetermined radio wave signal and reacts, to which first conductor board an electric signal that corresponds to the radio wave signal is supplied from outside, and a second conductor board opposed to the first conductor board, wherein the RFID tag T1 is arranged on other side with the opposite side opposed to the second conductor board, of the first conductor board that transmits the radio wave signal with an output according to an electric power that the electric signal possesses; a reader writer 20 that supplies the electric signal to the first conductor board of the strip line cell 100; and a computer 30 that confirms presence of reaction in the RFID tag T1.

Abstract: Structures for aligning wafers and methods for operating the same. The structure includes (a) a first semiconductor wafer including a first capacitive coupling structure, and (b) a second semiconductor wafer including a second capacitive coupling structure. The first and second semiconductor wafers are in direct physical contact with each other via a common surface. If the first and second semiconductor wafers are moved with respect to each other by a first displacement distance of 1 nm in a first direction while the first and second semiconductor wafers are in direct physical contact with each other via the common surface, then a change of at least 10?18 F in capacitance of a first capacitor comprising the first and second capacitive coupling structures results. The first direction is essentially parallel to the common surface.

Abstract: Each sensor of a linear array of sensors includes, in part, a sensing electrode and an associated feedback circuit. The sensing electrodes are adapted to be brought in proximity to a flat panel having formed thereon a multitude of pixel electrodes in order to capacitively measure the voltage of the pixel electrodes. Each feedback circuit is adapted to actively drive its associated electrode via a feedback signal so as to maintain the voltage of its associated electrode at a substantially fixed bias. Each feedback circuit may include an amplifier having a first input terminal coupled to the sensing electrode and a second input terminal coupled to receive a biasing voltage. The output signal of the amplification circuit is used to generate the feedback signal that actively drives the sensing electrode. The biasing voltage may be the ground potential.

Abstract: An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal.