Abstract: The present invention provides a method and apparatus for measuring alignment, rotation and bias of mask layers in semiconductor manufacturing by examining threshold voltage variation.

Abstract: A dark spot defect of an EL element is detected based on an emission brightness or a current flowing through the EL element when an element driving transistor which controls a drive current to be supplied to the EL element is operated in its linear operating region and the EL element is set to an emission level. A dim spot defect caused can be detected based on a current flowing through the EL element when the element driving transistor is operated in its saturation operating region and the EL element is set to the emission level. When an abnormal display pixel is detected based on an emission brightness, a pixel which is determined as an abnormal display pixel and which is not determined as a dark spot defect is determined, and the pixel is detected as a dim spot defect caused by the characteristic variation of the element driving transistor.

Abstract: An embodiment of an electronic device includes a logic circuit, a switching element, and a quiescent current (IDDQ) evaluation circuit. The logic circuit is coupled to a first ground node. The switching element is coupled between the first ground node and a second ground node. The switching element is configurable in an electrically non-conductive state when the electronic device is in an IDDQ evaluation state, and in an electrically conductive state when the electronic device is not in the IDDQ evaluation state. When the electronic device is in the IDDQ evaluation state, the IDDQ evaluation circuit is configured to provide a first output signal when an IDDQ indicating voltage across the first and second ground nodes exceeds a reference voltage. Other embodiments include methods for producing an indication of IDDQ in an electronic device and methods for fabricating an electronic device with the capability of producing an IDDQ indication.

Abstract: A method and apparatus for detecting a high energy event in a transistor includes performing the steps of: monitoring a gate to source voltage of a transistor during transistor start up, continuously determining a derivative of the monitored gate to source voltage with respect to time, and detecting a high energy event when the derivative of the gate to source voltage exceeds a predetermined threshold.

Abstract: In a particular embodiment, a method includes receiving a testing activation signal at a controller coupled to a semiconductor device. The method further includes biasing a well of at least one transistor of the semiconductor device in response to the received testing activation signal. The bias is provided by a biasing circuit that is responsive to the controller. While the well is biased, a test of the semiconductor device is performed to generate testing data.

Abstract: A test structure is provided that utilizes a time division sampling technique along with a statistical modeling technique that uses metal-oxide-semiconductor field effect transistor (MOSFET) saturation and linear characteristics to measure the mean (average) and sigma (statistical characterization of the variation) of a large population of electrical characteristics of electrical devices (e.g., integrated circuits) at high speed. Such electrical characteristics or sampling parameters include drive currents, leakage, resistances, etc.

Abstract: A test circuit includes a signal level modifying circuit. The signal level modifying circuit modifies at least one of signal levels of an inverting input signal and a noninverting input signal supplied to a differential input circuit in response to a test signal outputted from a signal output circuit to make a difference between signal levels of the inverting input signal and the noninverting input signal smaller than that in a normal operation. Here, the test signal indicates a test mode in which input/output characteristics of the differential input circuit is tested.

Abstract: A semiconductor wafer includes a plurality of die areas including circuit elements, and at least one test module (TM) on the wafer outside the die areas. The TMs include a test circuit including plurality of test transistors arranged in a plurality of rows and columns. The plurality of test transistors include at least three terminals (G, S, D and B). The TMs each include a plurality of pads. The pads include a first plurality of locally shared first pads each coupled to respective ones of a first of the three terminals, a second plurality of locally shared second pads each coupled to respective ones of a second of the three terminals, and at least one of the plurality of pads coupled to a third of the three terminals. The TM provides at least 2 pin transistor selection for uniquely selecting from the plurality of test transistors for testing.

Abstract: A transistor array for testing is provided. The transistor array includes a plurality of tested units. Each of the tested unit includes a tested transistor and a first to third switches. The tested transistor has a control terminal, a first and a second terminals and a bulk. The first switch is coupled between the first terminal and a leakage transporting line. The second switch is coupled between the second terminal and the leakage transporting line. The third switch is coupled between the control terminal and a bias providing line. The first to third switches are turned on or turned off according to a control signal. When the tested transistor is selected to be tested, the first to third switches are turned on according to the control signal.

Abstract: An embodiment of the invention is an organic thin film transistor chemical sensor. The sensor includes a substrate. A gate electrode is isolated from drain and source electrodes by gate dielectric. An organic ultra-thin semiconductor thin film is arranged with respect to the gate, source and drain electrodes to act as a conduction channel in response to appropriate gate, source and drain potentials. The organic ultra-thin film is permeable to a chemical analyte of interest and consists of one or a few atomic or molecular monolayers of material. An example sensor array system includes a plurality of sensors of the invention. In a preferred embodiment, a sensor chip having a plurality of sensors is mounted in a socket, for example by wire bonding. The socket provides thermal and electrical interference isolation for the sensor chip from associated sensing circuitry that is mounted on a common substrate, such as a PCB (printed circuit board).

Abstract: In accordance with a exemplary embodiments, methods for performing reliability testing of a plurality of transistors formed on a substrate includes simultaneously stressing the plurality of transistors by applying a voltage potential from each of a plurality of voltage sources to respective drain contacts of a like plurality of row groups and to gate contacts of a like plurality of column groups for a time interval, while applying a reference potential to the substrate and source contacts of the plurality of transistors. After stressing the plurality of transistors for a time interval, the transistors are each measured individually to collect reliability data.

Abstract: The present invention provides a method. The method includes operating a plurality of field-effect-transistors (FETs) under a first operation condition; reversing an operation direction for at least one of the plurality of FETs for a brief period of time; measuring a second operation condition of the one of the plurality of FETs during the brief period of time; computing a difference between the second operation condition and a reference operation condition; and providing a reliability indicator based upon the difference between the second and the reference operation conditions, wherein the plurality of FETs are employed in a single integrated circuit (IC).

Abstract: A method of determining one or more transistors within a particular circuit to be respectively replaced with a hardened transistor includes: identifying, as not requiring hardening, one or more transistors; identifying, as candidates for hardening, each transistor in the circuit not previously identified as not requiring hardening; and employing the hardened transistor in place of a transistor identified as a candidate for hardening. The circuit is a latch and the transistor is an SOI CMOS FET. The transistor is also an SOI transistor. The series transistor includes first and second series-connected transistors having a shared source/drain region whereby a drain of the first series-connected transistor is merged with a source of the second series-connected transistor.

Abstract: A current sense circuit, including a voltage regulator, for detecting current conducted by a device under test (DUT) for a wide range of currents, while still providing fine granularity for detecting low/small currents. Two current branches/paths may be established to the supply terminal of the DUT. A switching device, e.g. a transistor device, may be operated to enable a first current branch of the two current branches, or both current branches to conduct current, responsive to the size of the current flowing in the first current branch. The total current conducted by the DUT may be equivalent to a sum of the respective currents flowing in the two current branches. When the switching device is turned off, very small currents conducted by the DUT may be measured with fine granularity. When the switching device is turned on, substantially larger currents conducted by the DUT may be measured.

Abstract: According to one embodiment, a surface-plasmon (SP) beam generated by an SP source and directed via an SP waveguide is applied to a gate node of a field-effect transistor (FET). The FET also has a source node and a drain node. In a representative configuration, the gate, source, and drain nodes are electrically biased to pass an electrical current between the source and drain nodes in a manner that makes the electrical current responsive to the intensity of the SP beam.

Abstract: This invention provides a high voltage thyristor valve multi-injection test method, it can meet one way valve and double valve operation test and over current test requirements. It has high equivalence and good flexibility. It includes FACTS double way thyristor valve and normal direct current thyristor valve operation tests and over current test. This method is novel, flexible, can carry out many different test and their mixture test and including the high voltage thyristor valve different tests.

Abstract: Systems and methods for closed loop feedback control of integrated circuits. In one embodiment, a plurality of controllable inputs to an integrated circuit is adjusted to achieve a predetermined value of a dynamic operating indicator of the integrated circuit. An operating condition of an integrated circuit is controlled via closed loop feedback based on dynamic operating indicators of the integrated circuit's behavior.

Abstract: A monitoring circuit 14, 16, 18, 20, 22 for monitoring an operating parameter of an integrated circuit 2 comprises a ring oscillator circuit 80 comprising a plurality of serially connected inverting stages 82-1, 82-2, 82-3. At least one of the inverting stages 82-1, 82-2 comprises at least one leakage transistor 64-1, 64-2 which is configured to operate in a leakage mode in which substantially all current through the at least one leakage transistor is a leakage current, and a capacitive element 70-1 arranged to be charged or discharged in dependence on the leakage current. The ring oscillator circuit 80 thus generates an oscillating signal with an oscillation period dependent on a rate at which the capacitive element 70-1 is charged or discharged. The operating parameter controls a magnitude of the leakage current so that the oscillation period indicates the operating parameter.

Abstract: An electrical circuit device includes a semiconductor component which has power terminals and a control terminal electrically insulated from the power terminals, for applying a control voltage, and a control terminal contact surface for contacting the control terminal for measuring the electrical behavior of the semiconductor component. A connection device is provided, via which the control terminal is electrically connectable to a series device, the connection device being transferable from a nonconductive state into a conductive state, in which the control terminal is connected to the series device.

Abstract: Systems and methods for adjusting threshold voltage. A threshold voltage of a transistor of an integrated circuit is measured. A bias voltage, which when applied to a body well of the transistor corrects a difference between the threshold voltage and a desired threshold voltage for the transistor, is determined. The bias voltage is encoded into non-volatile storage on the integrated circuit. The non-volatile storage can be digital and/or analog.

Abstract: A method can include obtaining a voltage across a first transistor as an obtained voltage. The method can also include multiplying the obtained voltage by a predetermined multiple M to yield a multiplied voltage. The method can further include applying the multiplied voltage to a second transistor, wherein the second transistor is N times smaller than the first transistor. The method can additionally include providing an output current of the second transistor as an M/N scaled estimate of an output current of the first transistor.

Abstract: A semiconductor circuit apparatus having a clock oscillating circuit includes a first inverter circuit having a power supply terminal connected to a power supply potential via a first power supply potential connection transistor and a ground terminal connected to a ground potential via a first ground potential connection transistor, an inverter circuit block having a second inverter circuit connected to the power supply potential via a second power supply potential connection transistor and to the ground potential via a second ground potential connection transistor and connected to the first inverter circuit in parallel and a selection circuit block that outputs a power supply potential connection signal to any one of gate terminals of the first and second power supply potential connection transistors and a ground potential connection signal to any one of gate terminals of the first and second ground potential connection transistors.

Abstract: A system is used with a plurality of modules, each module requiring galvanic isolation from the other modules. Galvanic isolators are employed, each having an input and an output, the output galvanically isolated from the input, the output responsive to the input according to a response characteristic of the isolator. Each module has, a respective first isolator and a respective second isolator. The input of each respective first isolator and each respective second isolator for each module is disposed controllably to receive an activation signal from the module indicative of a module fault to be annunciated or to receive a test signal from the module, the test signal being smaller than the activation signal. The outputs of the respective first isolators are aggregated to a first node and the outputs of the respective second isolators are aggregated to a second node.

Abstract: An AC stress test circuit for HCI degradation evaluation in semiconductor devices includes a ring oscillator circuit, first and second pads, and first and second isolating switches. The ring oscillator circuit has a plurality of stages connected in series to form a loop. Each of the stages comprises a first node and a second node. The first and second isolating switches respectively connect the first and second pads to the first and second nodes of a designated stage and both are switched-off during ring oscillator stressing of the designated stage. The present invention also provides a method of evaluating AC stress induced HCI degradation, and a test structure.

Abstract: A circuit and method are provided for detecting a power of a signal amplified in a power amplifier. A diode and a voltage bias source are used to shift a voltage of the signal taken at a base of an amplifying transistor of the power amplifier, to generate a positive signal. The positive signal is provided to a base input of an emitter follower exhibiting high input impedance to generate a power detector output which follows the positive signal.

Abstract: A method and system for measuring laser induced phenomena changes of at least one of a resistance, a capacitance and an inductance in a semiconductor device. The method comprises applying a biasing voltage from an emitter-follower circuit to a device under test (DUT); inducing said changes in the DUT; and measuring a voltage change in a collector portion of the emitter-follower circuit as a measure for said changes.

Abstract: A Schmitt trigger circuit having a test circuit and method for testing are provided. The Schmitt trigger test circuit includes switches for reconfiguring the Schmitt trigger for testing by shorting the input and output terminals of an inverter and by opening a feedback path to allow the application of test voltages to the gates of feedback transistors coupled to the inverter. The method includes: directly connecting an input terminal of the inverter to an output terminal of the inverter; providing a first power supply voltage to the feedback transistors coupled to the inverter; measuring a first voltage at the input terminal; removing the first power supply voltage from the feedback transistors; providing a second power supply voltage to the feedback transistors. The test circuit and method reduce the test time by eliminating the need to ramp an input voltage while monitoring the output.

Abstract: A system and method for characterizing process variations are provided. A circuit comprises a plurality of inverters arranged in a sequential loop, and a plurality of transmission gates, with each transmission gate coupled between a pair of serially arranged inverters. Each transmission gate comprises a first field effect transistor (FET) having a first channel, and a second FET having a second channel. The first channel and the second channel are coupled in parallel and a gate terminal of the first FET and a gate terminal of the second FET are coupled to a first control signal and a second control signal, respectively.

Abstract: Systems and methods for closed loop feedback control of integrated circuits. In one embodiment, a plurality of controllable inputs to an integrated circuit is adjusted to achieve a predetermined value of a dynamic operating indicator of the integrated circuit. An operating condition of an integrated circuit is controlled via closed loop feedback based on dynamic operating indicators of the integrated circuit's behavior.

Abstract: An apparatus and method for measuring the characteristics of a semiconductor device is disclosed. The measuring apparatus may include first to M-th (wherein M is a positive integer not less than 1) starved devices each being biased in response to a bias voltage varying in accordance with a variable first supply voltage, thereby varying an amount of current flowing through a semiconductor device included in the starved device. Interconnect lines may interconnect the first to M-th starved devices. A measuring unit measures at least one of a delay time caused by the semiconductor devices of the starved devices themselves, and a compound delay time caused by the semiconductor devices of the starved devices themselves plus a delay time caused by the interconnect lines. The measured results can be analyzed under conditions more approximate to diverse situations exhibited in practical chips in accordance with development of manufacturing processes and techniques.

Abstract: In a semiconductor integrated circuit wherein low-threshold-voltage and high-threshold-voltage transistors are disposed mixedly, the operating speed of each transistor can be properly controlled in speed control execution through regulation of a power supply voltage VDD. The semiconductor integrated circuit comprises an internal circuit and measuring circuits. The internal circuit comprises a low-threshold-voltage MOS transistor and a high-threshold-voltage MOS transistor, and the degree of threshold voltage variation of the low-threshold-voltage MOS transistor is larger than the degree of threshold voltage variation of the high-threshold-voltage MOS transistor. The measuring circuit detects which one of fast, typical, and slow states is taken by both the low-threshold-voltage MOS transistor and the high-threshold-voltage MOS transistor.

Abstract: A circuit having an external test voltage includes an amplifier, a first P-type metal-oxide-semiconductor transistor, a second P-type metal-oxide-semiconductor transistor, at least one reference resistor, at least one test resistor, a first upper resistor, a second upper resistor and a lower resistor. The second P-type metal-oxide-semiconductor transistor is the same as the first P-type metal-oxide-semiconductor transistor. A difference between a voltage of a test output terminal of each test resistor and a voltage of a reference output terminal of a corresponding reference resistor is kept at a predetermined value by duplicating a current flowing through the first P-type metal-oxide-semiconductor transistor to the second P-type metal-oxide-semiconductor transistor, and feeding an external test voltage to a second terminal of the second upper resistor.

Abstract: Systems and methods for adjusting threshold voltage. A threshold voltage of a transistor of an integrated circuit is measured. A bias voltage, which when applied to a body well of the transistor corrects a difference between the threshold voltage and a desired threshold voltage for the transistor, is determined. The bias voltage is encoded into non-volatile storage on the integrated circuit. The non-volatile storage can be digital and/or analog.

Abstract: A semiconductor device is disclosed. The structure includes: a first field-effect transistor (FET); and a second FET of similar polarity to the first FET, wherein a body of the first FET is electrically coupled to a body of the second FET, and a source of the first FET is electrically coupled to a source of the second FET, such that a body voltage of the second FET controls a body voltage of the first FET.

Abstract: The invention relates to a measuring arrangement, a semiconductor arrangement and a method for operating a reference source, wherein at least one semiconductor component and a voltage source are connected to a measuring unit and the measuring unit provides a measured value that is proportional to the number of defects.

Abstract: A test structure for testing transistor gate structures in an IC device includes one or more probe pads formed at an active area of the IC device; one or more first conductive lines formed at the active area of the IC device, in electrical contact with the one or more probe pads; one or more second conductive lines formed at a gate conductor level of the IC device, in electrical contact with the one or more first conductive lines; and a gate electrode structure to be tested in electrical contact with the one or more second conductive lines; wherein the electrical contact between the one or more second conductive lines and the one or more first conductive lines is facilitated by a localized dielectric breakdown of a gate dielectric material disposed between the one or more second conductive lines and the one or more first conductive lines.

Abstract: This invention discloses a method for calibrating a gate resistance measurement of a semiconductor power device that includes a step of forming a RC network on a test area on a semiconductor wafer adjacent to a plurality of semiconductor power chips and measuring a resistance and a capacitance of the RC network to prepare for carrying out a wafer-level measurement calibration of the semiconductor power device. The method further includes a step of connecting a probe card to a set of contact pads on the semiconductor wafer for carrying out the wafer-level measurement calibration followed by performing a gate resistance Rg measurement for the semiconductor power chips.

Abstract: A leak current detection circuit that improves the accuracy for detecting a leak current in a MOS transistor without enlarging the circuit scale. The leak current detection circuit includes at least one P-channel MOS transistor which is coupled to a high potential power supply and which is normally inactivated and generates a first leak current, at least one N-channel MOS transistor which is coupled between a low potential power and at least the one P-channel MOS transistor and which is normally inactivated and generates a second leak current, and a detector which detects a potential generated at a node between the at least one P-channel MOS transistor and the at least one N-channel MOS transistor in accordance with the first and second leak currents.

Abstract: A circuit for testing a floating body field-effect transistor (FET), and a related method, are provided. Embodiments of this invention include a circuit including a contacted-body FET structure that can be operated in a floating body mode or a body-contacted mode, and a passgate FET. A body of the contacted-body FET structure is connected to the drain of the passgate FET. Voltage can be applied to the passgate FET to either allow or restrict current flow through the passgate FET, to operate the contacted-body FET structure in body contacted mode or floating body mode. Data can be taken in each mode and compared to extract a floating body voltage.

Abstract: Multi-purpose poly edge test structure. According to an embodiment, the present invention provides a test structure. The test structure includes a doped silicon substrate, the doped silicon substrate being grounded, the doped silicon substrate including a first gate structure and a second gate structure, the first and second gate structures overlaying the doped silicon substrate. The test structure also includes a first conducting pad being electrically coupled to the first gate structure. The test structure also includes a second conducting pad being electrically coupled to the second gate structure.

Abstract: A method comprising applying a first voltage to a first transistor to create a defect in the first transistor, wherein (i) the first voltage is greater than a maximum operational voltage of the first transistor and (ii) the maximum operational voltage does not cause a defect in the first transistor when applied to the first transistor. The method further includes determining whether the first transistor has been programmed, including (i) measuring a first current through the first transistor, (ii) measuring a second current through a second transistor, and (iii) comparing the measured first current to the measured second current, wherein a difference between the measured first current and the measured second current indicates that the first transistor has been programmed.

Abstract: A method of measuring a parameter of a device in a circuit includes providing a device under test (DUT). The DUT includes a metal oxide semiconductor (MOS) transistor having a gate, a source, and a drain coupled to a first voltage supply node. The method further includes coupling a constant current source to the source of the transistor, coupling an operational amplifier to the transistor, and measuring a parameter of the transistor.

Abstract: A CMOS-controlled printhead sense circuit includes a CMOS control circuit module operable as a transmission gate switchable between first and second signal levels and a CMOS sense circuit module operable in a printhead sense mode in response to the CMOS control circuit module being switched to the first level and in a transparent mode in response to the control circuit module being switch to the second level. The CMOS control circuit module includes a combination of PMOS and NMOS FETs which define a CMOS switchable transmission gate. The CMOS sense circuit module includes a combination of PMOS and NMOS FETs which define respectively a switch device switchable between high and low states corresponding to the sense and transparent modes and a load enhancement device for the switch device.

Abstract: The present invention provides devices and methods for testing the electrical performance of thin-film transistor backplane arrays and protecting thin-films during testing and handling.

Abstract: The present invention provides devices capable of testing the electrical performance of thin-film transistor backplane arrays and methods for their use.

Abstract: An active matrix substrate including: gate lines; source lines arranged in a direction orthogonal to each of the gate lines; a gate short-circuit line to short-circuit the gate lines; a source short-circuit line to short-circuit the source lines; gate line thin film transistors each having a drain electrode being connected to the corresponding one of the gate lines, and a source electrode being connected to the gate short-circuit line; and source line thin film transistors each having a drain electrode being connected to the corresponding one of the source lines, and a source electrode being connected to the source short-circuit line, in which the gate line thin film transistors and the source line thin film transistors are of depletion-mode, and the gate electrode of each of the source line thin film transistors is connected to the gate short-circuit line.

Abstract: The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon wafer, a dielectric breakdown characteristic of the insulator film by applying an electric field from the electrodes thus formed to the insulator film, the method in which the silicon wafer is evaluated at least by setting an area occupied by all the electrodes thus formed to 5% or more of an area of a front surface of the silicon wafer when the one or more electrodes are formed. This provides an evaluation method that can detect a defect by a simple method such as the TDDB method with the same high degree of precision as that of the DSOD method.

Abstract: One aspect is a circuit arrangement having a load current path with a load transistor having a first and a second load path terminal and a control terminal. A first measurement current path includes a measuring transistor having a first and a second load path terminal and a control terminal. The control terminals and first load path terminals of the load transistor and the measuring transistor are coupled. A first regulating circuit has a controllable resistor and is designed to drive the resistor depending on electrical potentials at the second load path terminals of the load transistor and of the measuring transistor. A current mirror circuit is coupled between the first measurement current path and a second measurement current path. A deactivation circuit is designed to deactivate the first regulating circuit depending on a current flowing through the measuring transistor.

Abstract: A process monitor measures the absolute value of unit sample resistors and transistors on a common Integrated Circuit (IC) substrate. This information can be used to adjust the gain of an amplifier assembly to a desired value, or to determine the true, corrected gain of such the amplifier assembly. Also, process information about process variations corresponding to the common IC substrate can be collected from the process monitor. Gain correction factors are derived and applied to the amplifier assembly to compensate for the process variations using the gain value and the process information.

Abstract: Provided is a test method by which a transistor whose reliability is low can be detected with low stress and high accuracy in a shorter period of time than a BT test. Provided is to detect a transistor whose reliability is high in a shorter period of time than a BT test and manufacture an electronic device with high reliability efficiently. Hysteresis characteristics revealed in the result of the Vg-Id measurement with light irradiation to the transistor correlate with the result of a BT test; whether the reliability of the transistor is Good or Not-Good can be judged. Accordingly, the test method by which a transistor whose reliability is low can be detected with low stress and high accuracy in a shorter period of time than a BT test can be provided.