Abstract: A circuit for implementing latch array functions on an integrated circuit. Portions of the logic devices included in the implementation of the latch array functions that are controlled by a common signal, may be arranged in a particular alignment. A single layer uni-directionally conductive material may connect the common signal to the logic devices.

Abstract: The disclosure relates generally to sequential state elements (SSEs), triple-mode redundant state machines (TMRSMs), and methods and systems for testing triple-mode redundant pipeline stages (TMRPSs) within the TMRSMs using triple-mode redundant SSEs (TMRSSEs). The SSEs, TMRSMs, TMRPSs, and TMRSSEs may be formed as integrated circuits on a semiconductor substrate. Of particular focus in this disclosure are SSEs used to sample and hold bit states. Embodiments of the SSEs have a self-correcting mechanism to protect against radiation-induced soft errors. The SSE may be provided in a pipeline circuit of a TMRSM to receive and store a bit state of a bit signal generated by combinational circuits within the pipeline circuit. More specifically, the SSEs may be provided in a TMRSSE configured to perform self-correction. Also disclosed are methods for using the TMRSSE to test redundant pipeline stages of the TMRSM.

Abstract: The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

Abstract: A method and device for testing through-substrate vias (TSVs) in a 3D chip stack are disclosed. In one aspect, the 3D chip stack includes at least a first die having a first electrical circuit and a second die having a second electrical circuit. The first die further includes at least one first TSV for providing electrical connection between the first electrical circuit and the second electrical circuit. The first die further includes test circuitry and at least one second TSV electrically connected between the first TSV and the test circuitry. The electrical connection between the first TSV and the second TSV is made outside the second die. In one aspect, this allows testing the first TSV in the first die even if the second die is not provided with dedicated test circuitry.

Abstract: Methods and structures for configuring an integrated circuit including repeated cells that are divided into banks having a respective power assist and a respective operational assist are provided. A method includes configuring the banks without power assist and operational assist. The method further includes selecting the power assist for a bank based on a determination that a weak cell remains in the bank after configuring the bank with the respective operational assist.

Abstract: A test system includes a logic signal voltage level conversion device, a first integrated circuit board, a second integrated circuit board, and a test device. The logic signal voltage level conversion device is connected to the first integrated circuit board, the second integrated circuit board, and the test device. When the first integrated circuit board is tested, the logic signal voltage level conversion device converts voltage levels of logic signals transmitted between the first integrated circuit board and the test device, to enable the first integrated circuit board to communicate with the test device. When the second integrated circuit board is tested, the logic signal voltage level conversion device converts voltage levels of logic signals transmitted between the second integrated circuit board and the test device, to enable the second integrated circuit board to communicate with the test device.

Abstract: What is disclosed is a user interface system for controlling a process, where the process is implemented in a machine system. The user interface system includes a user interface configured to receive user input to control the process of the machine system. The user interface system also includes a first transceiver coupled to the user interface and configured to provide user power to the user interface, where the first transceiver is configured to wirelessly receive input power from a second transceiver. The user interface system also includes a processing system configured to monitor a performance factor of the first transceiver, process the performance factor to determine when a power transfer problem exists between the second transceiver and the first transceiver, and transfer an alert in response to the power transfer problem.

Abstract: PICA test circuits are shown that include a first transistor and a second transistor laid out drain-to-drain, such that a gap between respective drain regions of the first and second transistors has a minimum size allowed by a given fabrication technology; a first NOR gate having an output connected to the drain region of the first transistor and accepting a first select signal and an input signal; and a second NOR gate having an output connected to the drain region of the second transistor and accepting a second select signal and the input signal. One of said NOR gates biases the connected transistor's drain region, according to the select signal of said NOR gate, to inhibit an optical emission when said connected transistor is triggered.

Abstract: In one embodiment, an integrated circuit includes a self calibration unit configured to iterate a test on a logic circuit in the integrated circuit at respectively lower supply voltage magnitudes until the test fails. A lowest supply voltage magnitude at which the test passes is used to generate a requested supply voltage magnitude for the integrated circuit. In an embodiment, an integrated circuit includes a series connection of logic gates physically distributed over an area of the integrated circuit, and a measurement unit configured to launch a logical transition into the series and detect a corresponding transition at the output of the series. The amount of time between the launch and the detection is used to request a supply voltage magnitude for the integrated circuit.

Abstract: Specific logic gates for Q-gating are selected by determining the minimum leakage state for a circuit design and then selecting logic gates that hold the circuit design in its lowest leakage state. Depending on the input desired to implement the minimum leakage state, the gate may be selected as a NOR or OR gate. Q-gating that is implemented with gates chosen to implement the minimum leakage state may be enabled during selected operating modes. The minimum leakage state of a circuit can be determined with an automatic test pattern generation (ATPG) tool.

Abstract: A scan flip-flop circuit includes an input unit and an output unit. The data output unit is configured to provide a data output terminal with a data output signal in response to a data input signal and a first control signal in a first operation mode, and the data output unit is configured to prohibit the data output terminal from being provided with a power supply voltage and a ground voltage applied to the scan flip-flop circuit in response to the data input signal and the first control signal in a second operation mode. The scan output unit is configured to provide a scan output terminal with a scan output signal in response to a scan input signal and a second control signal in the second operation mode.

Abstract: Methods and structures for configuring an integrated circuit including repeated cells that are divided into banks having a respective power assist and a respective operational assist are provided. A method includes configuring the banks without power assist and operational assist. The method further includes selecting the power assist for a bank based on a determination that a weak cell remains in the bank after configuring the bank with the respective operational assist.

Abstract: Disclosed is an integrated circuit (200) comprising a plurality of cores (110, 110), at least some of the cores being located in different power domains (VDD1, VDD2), each core being surrounded by a test wrapper (220) comprising a plurality of wrapper cells (128, 230), wherein each of said test wrappers are located in a single power domain (VDD3) and each plurality of wrapper cells comprises wrapper output cells (230) each arranged to output a signal from its associated core, each of said wrapper output cells comprising an output level shifter (232, 240) for shifting the voltage of said signal to the voltage of the single power domain (VDD3). A method for testing such an IC and standard library cells for designing such an IC are also disclosed.

Abstract: Methods and structures for configuring an integrated circuit including repeated cells that are divided into banks having a respective power assist and a respective operational assist are provided. A method includes configuring the banks without power assist and operational assist. The method further includes selecting the power assist for a bank based on a determination that a weak cell remains in the bank after configuring the bank with the respective operational assist.

Abstract: There is provided a strata manager within a 3D chip stack having two or more strata. The strata manager includes a plurality of scannable configuration registers, each being arranged on a respective one of the two or more strata for storing a set of bits. The set of bits is configured to program an operation of a corresponding one of the two or more strata on which the set of bits is stored or a device thereon. Additionally, a stratum identifier within a 3D stack and stack-wide scan circuit within a 3D stack are provided.

Abstract: A semiconductor integrated circuit according to one embodiment includes a plurality of flip-flop groups configured by dividing a plurality of flip-flops, connected in series, for carrying out a serial operation of serially transferring data, a continuous signal determination circuit configured to output a first signal if outputs of the flip-flops contained in the flip-flop group match, and output a second signal in other cases; and a clock gating circuit configured not to provide a clock signal when receiving the first signal and to provide a clock signal when receiving the second signal with respect to the flip-flops other than a head of the flip-flop group.

Abstract: In one embodiment, an integrated circuit includes a self calibration unit configured to iterate a test on a logic circuit in the integrated circuit at respectively lower supply voltage magnitudes until the test fails. A lowest supply voltage magnitude at which the test passes is used to generate a requested supply voltage magnitude for the integrated circuit. In an embodiment, an integrated circuit includes a series connection of logic gates physically distributed over an area of the integrated circuit, and a measurement unit configured to launch a logical transition into the series and detect a corresponding transition at the output of the series. The amount of time between the launch and the detection is used to request a supply voltage magnitude for the integrated circuit.

Abstract: Provided is a method of testing a logic device. The method includes comparing a first test pattern provided at an input of a first chain of logic device sub-modules with an output from the first chain to determine first type failures and comparing a second test pattern provided at an input of a second chain of logic device sub-modules with an out from the second chain to determine second type failures. An occurrence of one of the first type failures renders the logic device inoperable. An occurrence of the second type of failures is tolerated.

Abstract: The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

Abstract: A receiving circuit includes: a terminating resistor to set a terminating level of a transmission line for transmitting a reception signal including a signal having a first level indicating a preamble; a detection circuit to detect whether a level of the transmission line is the first level or a second level; and an adjustment circuit to adjust a resistance of the terminating resistor, the adjustment circuit adjusting the resistance of the terminating resistor to a value such that the detection circuit detects the level of the transmission line as the second level when a data request is output to a transmitting side.

Abstract: A logic built-in self test (LBIST) system comprises a device under test having a first plurality of first bistable multivibrator circuits an LBIST controller, and a second plurality of second bistable multivibrator circuits. Each second bistable multivibrator circuit is coupled to a corresponding first bistable multivibrator circuit to swap a second state value kept by the second bistable multivibrator circuit with a first state value kept by the corresponding first bistable multivibrator circuit depending on a first control signal from the LBIST controller and the second bistable multivibrator circuits are coupled to form one or more scan chains when receiving a second control signal from the LBIST controller.

Abstract: A scan flip-flop circuit includes an input unit and an output unit. The input unit selects one of a data input signal and a scan input signal depending on an operation mode and generates an intermediate signal based on the selected signal. The output unit generates an output signal based on the intermediate signal and selects one of a data output terminal and a scan output terminal depending on the operation mode to provide the output signal through the selected output terminal. A voltage level at the selected output terminal bidirectionally transitions between a first voltage level and a second voltage level. A voltage level at a non-selected output terminal unidirectionally transitions between the first voltage level and the second voltage level.

Abstract: An electronic circuit includes a plurality of programmable components connected in an electronic chain. An interface is adapted to connect the programmable components to an external controller wherein the controller is adapted to program the programmable components. A component isolation element is connected to the interface at an input end and to the electronic chain of the programmable components at an output end wherein the isolation element is adapted to isolate one component of the programmable components from the electronic chain and wherein the one component is a safety component.

Abstract: A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connect to the digital circuits, and a non-volatile storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-volatile storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.

Abstract: A multiple level integrated circuit uses an array of oppositely oriented individually enabled buffers between through-silicon vias (TSVs) and a clocked flip-flop, for each of multiple signal lines that include TSVs. Applying and/or reading logic levels to and from the TSVs and associated flip-flops produces values that a logic element compares to expected values characterizing nominal operation or detects open and short circuit defects. A process associated with testing the TSVs during assembly comprises testing for short circuits and then exposing and connecting the TSVs via a conductive layer to check for open circuits.

Abstract: Some embodiments of the invention provide a configuration/debug network for configuring and debugging a configurable integrated circuit (IC). The configurable IC in some embodiments includes configurable resources (e.g., configurable logic resources, routing resources, memory resources, etc.) that can be grouped in conceptual configurable tiles that are arranged in several rows and columns. Some embodiments allow tiles to be individually addressed, globally addressed (i.e., all addressed together), or addressed based on their tile types. The configurable IC includes numerous user-design state elements (“UDS elements”) in some embodiments. In some embodiments, the configuration/debug network has a streaming mode that can direct various circuits in one or more configurable tiles to stream out their data during the operation of the configurable IC.

Abstract: A digital signal generator includes an input unit configured to receive signal information of a target data signal, a controller configured to calculate at least two delay values and at least two data values, the at least two delay values and the at least two data values being used to generate a data signal corresponding to the signal information input through the input unit, a multi-phase clock generator configured to delay a reference clock signal based on the at least two delay values to generate at least two clock signals having different phases, a signal generator configured to generate at least two data signals by assigning the at least two data values to the at least two clock signals, and a logic gate unit configured to generate the data signal corresponding to the signal information input through the input unit based on the at least two data signals.

Abstract: A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connect to the digital circuits, and a non-volatile storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-volatile storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.

Abstract: An integrated circuit having a monitor circuit for monitoring timing in a critical path having a target timing margin is disclosed. The monitor circuit has two shift registers, one of which includes a delay element that applies a delay value to a received signal. The inputs to the two shift registers form a signal input node capable of receiving an input signal. The monitor circuit also has a logic gate having an output and at least two inputs, each input connected to a corresponding one of the outputs of the two shift registers. The output of the logic gate indicates whether the target timing margin is satisfied or not satisfied.

Abstract: Multiple pads are provided to a semiconductor chip of a semiconductor device. A first pad is arranged on a path for a first signal set to a voltage that corresponds to a first level in the active state. The first signal is input to the semiconductor chip from outside the semiconductor device, or is output to outside the semiconductor device from the semiconductor chip. A second pad is provided in order to receive a setting voltage. A first pin is connected to a first pad via a connection member, and receives the first signal from outside the semiconductor device, or from the semiconductor chip via the first pad. A second pin receives, from outside, a second signal set to a voltage that corresponds to the first level or a second level which is the complement of the first level.

Abstract: According to one embodiment, an input circuit includes an input buffer, a control unit, a holding unit, a feedback unit. The input buffer receives a signal input from an outside. The input buffer includes a plurality of CMOS inverters connected in parallel. The plurality of CMOS inverters includes a plurality of PMOS transistors and a plurality of NMOS transistors. The control unit selects one or more PMOS transistors from the plurality of PMOS transistors so as to enter an operable state. The control unit selects one or more NMOS transistors from the plurality of NMOS transistors so as to enter an operable state. The holding unit holds a level of a signal transferred from the input buffer in synchronization with a clock signal. The holding unit outputs the held signal level. The feedback unit feeds the level of the signal output from the holding unit back to the control unit.

Abstract: A system and method to select a gate to be modified as a test isolation gate is disclosed. In a particular embodiment, a circuit includes a combinational logic portion including a logic path including a test isolation gate between a starting element and an ending element. The logic path includes at least a first gate element between the starting element and the test isolation gate. The logic path also includes at least a second gate element between the test isolation gate and the ending element. The starting element and the ending element are coupled to be tested via a scan chain test process during a test mode. In the test mode, an output of the second gate element is fixed at a constant logic level.

Abstract: Embodiments of the present invention provide an inequality indication system (IIS). The IIS provides built in test support which enables evaluation, in an on-chip digital logic circuit, of digital values as inequalities, with either a single pass/fail bit expressed on a device I/O or a readable register containing inequality evaluation results. The IIS enables the movement of value evaluation onto the device (chip) using a common simple method, well suited to address/data type structures or scan based structures, instead of off-chip, which then requires tester dependent custom code. The IIS, when enabled, overrides the TDO signal to allow it to function as an inequality indicator instead of a standard test data out signal.

Abstract: Embodiments of the present invention provide an inequality indication system (IIS). The IIS provides built in test support which enables evaluation, in an on-chip digital logic circuit, of digital values as inequalities, with either a single pass/fail bit expressed on a device I/O or a readable register containing inequality evaluation results. The IIS enables the movement of value evaluation onto the device (chip) using a common simple method, well suited to address/data type structures or scan based structures, instead of off-chip, which then requires tester dependent custom code. The IIS, when enabled, overrides the TDO signal to allow it to function as an inequality indicator instead of a standard test data out signal.

Abstract: An integrated circuit includes a first multiplexer (mux) with multiple inputs and configured to produce a mux output signal. The electronic circuit also includes a first gated buffer to receive the mux output signal from the first multiplexer and produce a first gated buffer output signal, a second gated buffer to receive the first gated buffer output signal and to produce a second gated buffer output signal to be provided to a pin, and a receive buffer. The receive buffer is coupled to the pin and receives an input signal from the pin. The electronic circuit operates in a test mode in which the second gated buffer is disabled preventing a test signal provided to an input of the first mux from reaching the pin. Instead, the test signal is provided through the first mux to the first gated buffer and to the receive buffer thereby testing the first mux.

Abstract: Systems and methods are provided to determine a solid operating timing window for an integrated circuit device, the solid timing window used to determine a key timing index. The key timing index provides an indication of the quality of an integrated circuit over a range of operating conditions. In at least one embodiment a method is provided, the method comprising generating a plurality of combinations of operating parameters, for each of the plurality of combinations of operating parameters setting the respective combination of operating parameters, operating the integrated circuit under the set respective combination of operating parameters, and determining a data valid window for the integrated circuit. The solid operating timing window for the integrated circuit is then determined using the data valid windows for the plurality of combinations of operating parameters, where the solid operating timing window is the logical intersection of the determined data valid windows.

Abstract: When an operation of a specified one of monitor circuits is defective or any of elements forming a ring oscillator in each of the monitor circuits has characteristic abnormality, if voltage control is performed based on a result from the monitor operating at a lowest speed, a required voltage may be overestimated. This results in an increase in power consumption, and also causes an accuracy reduction when the average value of detection results from the multiple monitors is calculated. The multiple monitor circuits are provided. Of the detection results therefrom, any detection result falling outside a predetermined range is ignored, and the average value of the remaining monitor results is used as a final monitor detection value.

Abstract: There is provided a strata manager within a 3D chip stack having two or more strata. The strata manager includes a plurality of scannable configuration registers, each being arranged on a respective one of the two or more strata for storing a set of bits. The set of bits is configured to program an operation of a corresponding one of the two or more strata on which the set of bits is stored or a device thereon. Additionally, a stratum identifier within a 3D stack and stack-wide scan circuit within a 3D stack are provided.

Abstract: There is provided a strata manager within a 3D chip stack having two or more strata. The strata manager includes a plurality of scannable configuration registers, each being arranged on a respective one of the two or more strata for storing a set of bits. The set of bits is configured to program an operation of a corresponding one of the two or more strata on which the set of bits is stored or a device thereon. Additionally, a stratum identifier within a 3D stack and stack-wide scan circuit within a 3D stack are provided.

Abstract: An embodiment of the invention relates to an integrated circuit such as an FPGA wherein a stable unique identifier is produced by reading an intrinsic characteristic of the IC such as a physically unclonable function, and a related method. In one embodiment, a first unique identifier is generated using the intrinsic characteristic and is subdivided into a plurality of first subsets. A second unique identifier is received and subdivided into a plurality of second subsets. The first and second subsets are compared to identify matching subsets to generate the stable unique identifier. Each of the one or more matching subsets includes a particular one of the plurality of first subsets that matches a corresponding one of the plurality of second subsets. The stable unique identifier can be integrated into logic of the IC. Prior to comparing the subsets, the first and second subsets can be transformed with one-way functions.

Abstract: An integrated circuit, or combination of integrated circuits, has a primary interconnect, a redundant interconnect, and circuitry connecting the primary and redundant interconnects allowing selection of the redundant interconnect to bypass the primary interconnect.

Abstract: A die includes a plurality of through-substrate vias (TSVs) penetrating a substrate of the die, wherein the plurality of TSVs are grouped as a plurality of TSV pairs. A plurality of contact pads is coupled to the plurality of TSVs, wherein the plurality of contact pads is exposed on a first surface of the die. The die further includes a plurality of balanced pulse comparison units, wherein each of the plurality of balanced pulse comparison units includes a first input and a second input coupled to a first TSV and a second TSV of one of the plurality of TSV pairs. The die further includes a plurality of pulse latches, each including an input coupled to an output of one of the plurality of balanced pulse comparison units.

Abstract: An integrated circuit (70) having parallel scan paths (824-842, 924-942) includes a pair or pairs of scan distributor (800,900) and scan collector (844,944) circuits. The scan paths apply stimulus test data to functional circuits (702) on the integrated circuit and receive response test data from the functional circuits. A scan distributor circuit (800) receives serial test data from a peripheral bond pad (802) and distributes it to each parallel scan path. A scan collector circuit (844) collects test data from the parallel scan paths and applies it to a peripheral bond pad (866). This enables more parallel scan paths of shorter length to connect to the functional circuits. The scan distributor and collector circuits can be respectively connected in series to provide parallel connections to more parallel scan paths. Additionally multiplexer circuits (886,890) can selectively connect pairs of scan distributor and collector circuits together.

Abstract: A BIST circuit for high speed applications includes a phase difference detection circuit, a period-to-current conversion circuit having an input coupled to an output of the phase difference detection circuit and a current-to-voltage conversion circuit coupled to an output of the period-to-current conversion circuit. The phase difference detection circuit includes first NAND logic for receiving as inputs an input clock signal and a delayed version of an inverted version of the input clock signal; second NAND logic for receiving as inputs the inverted version of the input clock signal and a delayed version of the input clock signal; third NAND logic for receiving as inputs the input clock signal and the delayed version of the input clock signal; and fourth NAND logic for receiving as inputs the inverted version of the input clock signal and a delayed version of the inverted version of the input clock signal.

Abstract: A Field Programmable Gate Arrays (FPGA) connection control board is provided. The FPGA connection control board includes a printed circuit board (PCB), a plurality of first connection terminals formed at an upper part of the PCB, a plurality of second connection terminals formed at a lower part of the PCB and a plurality of switches each for selectively connecting each of the plurality of first connection terminals with each of the plurality of second connection terminals.

Abstract: A testing circuit for verifying the impedance of off-chip drivers includes: a plurality of off-chip drivers (OCD), each off-chip driver including a through-silicon via (TSV); an IREF test pad, for driving a current to the plurality of off-chip drivers; a plurality of pre-drivers, each respective pre-driver coupled to one of the plurality of off-chip drivers, wherein the plurality of pre-drivers are configured to turn on the off-chip drivers; a VREF test pad, for inputting a reference voltage to the testing circuit; a plurality of input buffers (IB) for outputting a plurality of comparison results, each of the plurality of input buffers configured to output the plurality of comparison results according to the reference voltage and the voltage at the TSV nodes; and a test pad, coupled to the plurality of IBs, for receiving the comparison results to determine whether the impedance of each OCD is within a desired range.

Abstract: A method for a singular programming a programmable component in an electronic circuit includes providing a plurality of programmable components connected between each other in an electronic chain arrangement; providing an interface adapted to connect the programmable components to an external controller wherein the controller is adapted to program the programmable components; isolating and programming a safety component by setting an output pin in the safety component to logical state zero at first power up of the electronic circuit and logical state zero causes input and output data lines from the interface to be connected just to the safety component; and setting the output pin in the safety component to logical state one wherein the logical state one causes input and output data lines from the interface to disconnect from the safety component and connect to the electronic chain of the plurality of programmable components excluding the safety component.

Abstract: An integrated circuit having a monitor circuit for monitoring timing in a critical path having a target timing margin is disclosed. The monitor circuit has two shift registers, one of which includes a delay element that applies a delay value to a received signal. The inputs to the two shift registers form a signal input node capable of receiving an input signal. The monitor circuit also has a logic gate having an output and at least two inputs, each input connected to a corresponding one of the outputs of the two shift registers. The output of the logic gate indicates whether the target timing margin is satisfied or not satisfied.

Abstract: A system and method for detecting soft-failures in integrated circuits is provided. A circuit includes a combinatorial logic block having a first signal input and a second signal input, and a latch coupled to an output of the combinatorial logic block. The combinatorial logic block produces a pulse when only one of either a first signal provided by the first signal input or a second signal provided by the second signal input is a logical high value, and the latch captures the pulse if the pulse has a pulse width greater than a second threshold. The pulse has a pulse width that is based on a timing difference between a first signal transition on the first signal and a second signal transition on the second signal, the combinatorial logic block produces the pulse if the timing difference is greater than a first threshold, and the combinatorial logic block operates with balanced inputs.

Abstract: A method for testing a line including an input/output pin of a programmable logic circuit, said line including at least one individual line extending from the input/output pin to a peripheral element, said input/output pin being able to be either at a high logic level or at a low logic level opposite to the high logic level. The method includes, between an initial driving instant and a final driving instant, a step for driving the input/output pin in which a driving voltage is applied to the terminals of the input/output pin.