Abstract: In accordance with some embodiments of the present disclosure, an oscillator may include a crystal resonator and a squaring circuit coupled to the crystal resonator and configured to convert a sinusoidal signal produced by the crystal resonator to a square-wave signal, the squaring circuit comprising a bias circuit configured to transmit a selected bias voltage for the squaring circuit, the selected bias voltage selected from a plurality of potential bias voltages. In accordance with this and other embodiments of the present disclosure, an oscillator may include a crystal resonator, an inverter coupled in parallel with the crystal resonator, and a programmable voltage regulator coupled to the inverter. The programmable voltage regulator may be configured to supply a first supply voltage to the inverter during a startup duration of the oscillator, and supply a second supply voltage to the inverter after the startup duration, wherein the second supply voltage is lesser than the first supply voltage.

Abstract: An oscillation device capable of highly accurate temperature compensation of an output frequency is provided. The oscillation device includes: first and second oscillator circuits oscillating first and second quartz-crystal resonators with overtones respectively; a frequency difference detecting part finding a value corresponding to a difference value between values corresponding to differences between f1 and f1r and between f2 and f2r, where f1 and f2 are oscillation frequencies of the first and second oscillator circuits, and f1r and f2r are oscillation frequencies of the first and second oscillator circuits at a reference temperature; and a correction value obtaining part which, based on the value corresponding to the difference value and a relation between the value corresponding to the difference value and a frequency correction value of the oscillation frequency f1, obtains the frequency correction value of f1, wherein the output frequency is corrected based on the found frequency correction value.

Abstract: To perform, in an oscillation device compensating an output frequency based on a detection result of ambient temperature, temperature compensation of the output frequency with high accuracy. First and second quartz-crystal oscillators are structured by using a common quartz-crystal piece, and when oscillation outputs of first and second oscillation circuits respectively connected to these quartz-crystal oscillators are set to f1, f2, and oscillation frequencies of the first and the second oscillation circuits at a reference temperature are set to f1r, f2r, respectively, a frequency difference being a difference between a value corresponding to a difference between f1 and f1r and a value corresponding to a difference between f2 and f2r is treated as a temperature at that time. Further, based on the frequency difference, a frequency compensation value is determined through polynomial approximation.

Abstract: A crystal oscillator with improved tolerance to radiation such as X-rays includes: a container body; a quartz crystal blank accommodated in a first recess formed on one main surface of the container body and hermetically encapsulated in the first recess by a metal cover; and an IC chip that integrates electronic circuits including at least an oscillator circuit using the crystal blank and is accommodated in the second recess formed on the other main surface of the container body. The IC chip is fixed to the bottom surface of the second recess by flip-chip bonding such that a circuit formation plane of the IC chip is opposed to the bottom surface of the second recess. A radiation protective film is formed on the main surface other than the circuit formation plane of the IC chip.

Abstract: An object of the invention is to provide a surface mount oscillator that can suppress a change with the lapse of time in frequency characteristics. A surface mount type crystal unit 1 includes: a framed crystal plate 2 in which an oscillating part 6 having a first excitation electrode 5a and a second excitation electrode 5b on opposite principal surfaces thereof is surrounded by a frame 7, and the oscillating part 6 and the frame 7 are connected by connecting parts 8a and 8b; a base 3; and a cover 4. The surface mount type crystal unit 1 has such a configuration that a first metal film 17 is formed in one area of two areas formed by dividing the principal surface of the frame 7 facing the base 3 at two positions around a circumferential direction of the frame 7, and a second metal film 18 is formed in the other area. The first metal film 17 is electrically connected to the first excitation electrode 5a, and the second metal film 18 is electrically connected to the second excitation electrode 5b.

Abstract: Aspects of the invention may comprise an integrated circuit comprising a memory, a temperature sensor, a crystal, and a communication module. Data stored in the memory may indicate a frequency of the crystal as a function of temperature and/or time. The memory may be writable via the communication module. Data stored in the memory of the integrated circuit may be updated based on an age and/or time of use of the integrated circuit. The time of use may be one or both of: how long the crystal has been oscillating since its most-recent start up, and how long the crystal has been in use over its lifetime. An electronic device may calculate a frequency of an oscillating signal output by the crystal based on a temperature indication from the temperature sensor and data read from the memory of the integrated circuit.

Abstract: A method and apparatus for compensating an oscillator in a location-enabled wireless device is described. In an example, a mobile device includes a wireless receiver for receiving wireless signals and a GPS receiver for receiving GPS signals. The mobile device also includes an oscillator having an associated temperature model. A frequency error is derived from a wireless signal. The temperature model is adjusted in response to the frequency error and a temperature proximate the oscillator. Frequency error of the oscillator is compensated using the adjusted temperature model. In another example, a frequency error is derived using a second oscillator within the wireless receiver.

Abstract: A temperature-controlled crystal oscillating unit and oscillator are provided, which can stabilize an output frequency thereof, have firmness against shock of falling etc., and are suitable for miniaturization and mass production. A crystal blank for the temperature-controlled crystal oscillating unit is formed by an inner region which is an oscillating plate; an outer region which surrounds the periphery of the inner region; and a connection portion which connects the inner region with the outer region. Electrodes are formed on two surfaces of the inner region, and a heater and a temperature sensor are disposed to surround the periphery of the electrode on one surface of the inner region where the electrode is formed thereon. The electrodes, the heater and the temperature sensor are respectively connected with terminals on the outer region by leads. A contact area between the temperature sensor and a crystal is increased.

Abstract: An amplifier circuit for amplifying output signal from the crystal oscillator circuit is connected to the output side of the crystal oscillator circuit. The amplifier circuit amplifies the difference between the output voltage of the crystal oscillator circuit and the input voltage of a CMOS inverter of the crystal oscillator circuit. For example, a differential amplifier is connected to the output side of the crystal oscillator circuit, then the output voltage of the crystal oscillator circuit and the input voltage of the CMOS inverter are connected to the inputs of the differential amplifier.

Abstract: Provided is a surface mount crystal oscillator and a substrate sheet to prevent a decrease in a frequency variable amount by reducing electrostatic capacitance of the crystal oscillator. The surface mount crystal oscillator and the substrate sheet are each configured such that one end of a crystal holding terminal is connected to a corner terminal, and another end of the crystal holding terminal is formed from a center of a short side to be shorter than the one end so as to form an area in which no pattern is formed, and a pattern of a GND terminal is formed on that portion of a rear surface of a substrate which is opposed to the area in which no pattern is formed, so that the pattern (a crystal-mounted pattern) of the crystal holding terminal and the pattern of the GND terminal are not opposed to each other across the substrate.

Abstract: A signal generating circuit for a real time clock device is disclosed, having an oscillating circuit, a voltage detecting circuit, and a control circuit. The oscillating circuit is used for generating oscillating signals. The voltage detecting circuit is used for detecting a voltage level coupled with the signal generating circuit. The control circuit is coupled with the oscillating circuit and the voltage detecting circuit. When the voltage level detected by the voltage detecting circuit locates in a predetermined range, the control circuit configures the oscillating circuit to generate the oscillating signals with a larger current at a first interval and to generate the oscillating signals with a smaller current at a second interval. The control circuit further generates a clock signal according to the oscillating signals at a third interval.

Abstract: An apparatus for providing clock and a method thereof are provided. The provided apparatus includes a frequency generation unit and a control unit. The frequency generation unit decides amplitude of a clock signal to be a first amplitude or a second amplitude in response to a mode signal. The frequency generation unit converts an external oscillation signal into the clock signal. The control unit receives the clock signal, and outputs the mode signal in response to a system status signal. The control unit outputs the clock signal to external when determining that the clock signal has a stable oscillation. When the system status signal is a power on signal, the first amplitude is used as the amplitude of the clock signal, and when the system status signal is a power off signal, the second amplitude smaller than the first amplitude is used as the amplitude of the clock signal.

Abstract: In one exemplary implementation, an electronic apparatus includes: a reference clock source, for generating a reference clock; a global navigation satellite system (GNSS) receiver for receiving satellites signals and the reference clock, comprising: a monitoring circuit, for monitoring a status of the GNSS receiver to generate a monitoring result; and a compensating circuit, coupled to the reference clock source and the monitoring circuit, for compensating the reference clock according to the monitoring result.

Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

Abstract: A resonator element includes a substrate vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on one principal surface of the substrate, and has a shape obtained by cutting out four corners of a quadrangle, and a second excitation electrode disposed on the other principal surface of the substrate, and a ratio (S2/S1) between the area S1 of the quadrangle and the area S2 of the first excitation electrode fulfills 87.7%?(S2/S1)<95.0%.

Abstract: A resonator element includes a substrate including a first principal surface and a second principal surface respectively forming an obverse surface and a reverse surface of the substrate, and vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on the first principal surface, and a second excitation electrode disposed on the second principal surface, and being larger than the first excitation electrode in a plan view, the first excitation electrode is disposed so as to fit into an outer edge of the second excitation electrode in the plan view, and the energy trap confficient M fulfills 15.5?M?36.7.

Abstract: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.

Abstract: A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other.

Abstract: There are provided a piezoelectric vibrator capable of suppressing vibration leakage while securing mounting strength of a piezoelectric vibrating reed and an oscillator, an electronic apparatus, and a radio-controlled timepiece each using the piezoelectric vibrator. The piezoelectric vibrator includes: a package that accommodates a piezoelectric vibrating reed; and a bump that mounts the base portion of the piezoelectric vibrating reed on a package. The bump includes a plurality of main bumps which is arranged in a line in the width direction of the base portion so as to be bonded to the base portion; and an auxiliary bump which is bonded to the base portion in an area between the main bumps disposed at both ends in the width direction of the base portion and an area between the main bumps and base ends of the vibrating arms in the longitudinal direction of the base portion.

Abstract: A buffer is provided. The buffer includes a buffering stage that receives an enable signal and an input signal and that provides an output signal and a bandgap stage that is coupled to the buffering stage and that is activated and deactivated by the enable signal. In particular, the buffering stage includes a buffering substage that includes a buffering transistor that is coupled to the input stage, wherein the buffering transistor is formed on a substrate, and wherein the buffering transistor has a channel with a doping concentration that is approximately the same as the substrate.

Abstract: Provided is an oscillation device capable of obtaining a stable oscillation frequency by compensating for a change in oscillation frequency caused with an elapse of operating time of a quartz-crystal oscillator. A difference value ?F between a frequency difference between first and second quartz-crystal oscillators after a predetermined period of time has elapsed from a reference time and a frequency difference between the first and second quartz-crystal oscillators at the reference time is determined.

Abstract: A quartz oscillator module includes a first quartz oscillator, a second quartz oscillator, a first electronic switch, and a second electronic switch. The first and second quartz oscillators provide two different clock signals. When the first electronic switch is turned on, the first quartz oscillator is activated. When the second electronic switch is turned on, the second quartz oscillator is activated.

Abstract: A crystal oscillator having a plurality of quartz crystals that are manufactured so that the directional orientation of the acceleration sensitivity vector is essentially the same for each crystal. This enables convenient mounting of the crystals to a circuit assembly with consistent alignment of the acceleration vectors. The crystals are aligned with the acceleration vectors in an essentially anti-parallel relationship and can be coupled to the oscillator circuit in either a series or parallel arrangement. Mounting the crystals in this manner substantially cancels the acceleration sensitivity of the composite resonator and oscillator, rendering it less sensitive to vibrational forces and shock events.

Abstract: A protective assembly that is adapted to provide temperature isolation for an electronic device is disclosed. The assembly includes a housing having a cavity with a top surface and at least one side surface. The housing is configured to accept an electronic device having a top and a bottom in the cavity with the top of the electronic device proximate to the top surface of the cavity. The housing is further configured to maintain a vacuum within the cavity. The assembly includes at least one support disposed within the cavity. The at least one support is configured to contact the housing only at a first point proximate to the top surface of the cavity and contact the electronic device only at a second point that is proximate to the bottom of the electronic device.

Abstract: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.

Abstract: A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; an external electrode that is formed on a lower surface of the base substrate; an internal electrode that is formed on an upper surface of the base substrate so as to be accommodated in the cavity; a through electrode which is formed so as to pass through the base substrate and electrically connect the external electrode with the internal electrode; a piezoelectric vibrating reed which is accommodated in the cavity in a state of being electrically connected to the internal electrode; and a getter material that is formed in the cavity, the getter material being formed of chromium or a metallic material consisting of chromium as a main ingredient.

Abstract: The vibrating device of the invention includes a base member, a lid member joined the base member to constitute a cavity, and a vibrating strip housed in the cavity. The vibrating strip includes a thick center portion and a thin outer peripheral portion, the center portion includes an exciting electrode exciting vibration, and the outer peripheral portion includes terminal electrode electrically connected to exciting electrode and having a thickness larger than that of the exciting electrode. The base member is provided with a connecting portion on the surface thereof, and the connecting portion is connected to the terminal electrode and holds the vibrating strip in a cantilevered manner. Accordingly, the vibrating strip is supported by a very small bonding surface, and a compact vibrating device subjected to little deterioration in frequency characteristics with respect to the temperature change is realized.

Abstract: A vibrator element includes: a base having a mounting surface; a vibrating arm which is extended from the base and has a first surface and a second surface that faces the first surface and is positioned on the mounting surface side, and which performs flexural vibration in a direction normal to the first and second surfaces; and a laminated structure which is provided on at least one of the first and second surfaces of the vibrating arm, and which includes at least a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, in which the vibrating arm is warped toward the mounting surface side.

Abstract: A clock generator is provided. The clock generator includes a crystal oscillator, an inverter coupled to the crystal oscillator in parallel, a first circuit and a second circuit. The crystal oscillator has a first terminal and a second terminal. The inverter generates a first signal and a second signal at the first and second terminals of the crystal oscillator, respectively. The first circuit coupled to the first terminal of the crystal oscillator generates a first clock signal with a constant frequency according to the first signal. The second circuit coupled to the second terminal of the crystal oscillator generates a second clock signal with a variable frequency according to the second signal.

Abstract: A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.

Abstract: The invention relates to a temperature compensated micromechanical resonator and method of manufacturing thereof. The resonator comprises a resonator element comprising a semiconductor crystal structure, which is doped so as to reduce its temperature coefficient of frequency, transducer means for exciting to the resonator element a vibrational mode. According to the invention the crystal orientation and shape of the resonator element are chosen to allow for a shear mode having a saddle point to be excited to the resonator element, and said transducer means are adapted to excite said shear mode to the resonator element. Accurate micromechanical resonators with now temperature drift can be achieved by means of the invention.

Abstract: The present invention relates to a measurement method of dew-point in low temperature, and more specifically to a measurement method of accurately distinguishing dew-point and frost-point using a quartz crystal microbalance dew-point sensor in a low temperature of 0° C. or less. To this end, the present invention provides a measurement method of distinguishing dew and frost point using a quartz crystal microbalance dew-point sensor in low temperature, comprising the steps of: measuring a resonant frequency of a quartz crystal microbalance dew-point sensor while slowly dropping temperature; observing shock waves of the resonant frequency; and determining dew point or frost point through the observation of the resonant frequency and shock waves of the quartz crystal microbalance dew-point sensor.

Abstract: A vibration device includes: a first vibrator having a 3rd-order function temperature characteristic in which a 3rd-order temperature coefficient is ??1, where ?1>0; and a second vibrator which is connected to the first vibrator, and has a 3rd-order function temperature characteristic in which a 3rd-order temperature coefficient is ?2, where ?2>0, wherein a difference between inflection points of the first and second vibrators is equal to or lower than 19° C., and a relationship of 0<|?1|?|2.4?2| is satisfied.

Abstract: A precise, low-consumption low-frequency oscillator includes a low-consumption low-frequency oscillator, operating at a frequency FA, a temperature-compensated oscillator B used as frequency standard, operating at a frequency FB, and a circuit for supplying a stable frequency Fcorr.

Abstract: A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.

Abstract: The present invention discloses an oscillating device for frequency detection, an ultrasonic transceiver system and a frequency detection method thereof. The oscillating device for frequency detection, which is applicable for detecting a transducer having a lowest impedance frequency and a highest impedance frequency, comprises an oscillating circuit. The oscillating circuit has a loop gain whose maximum value occurs at the lowest impedance frequency of the transducer and whose minimum value occurs at the highest impedance frequency of the transducer, wherein a difference of a phase of the loop gain and an impedance phase of the transducer is zero between the lowest impedance frequency and the highest impedance frequency, and the loop gain is of a value greater than 1 at a frequency where the phase difference is zero.

Abstract: A method of manufacturing packages includes a welding step for welding a base substrate wafer to a rivet member by heating the base substrate wafer while pressing the same by a forming die from both sides in the thickness direction is provided, wherein a rivet member receiving portion which can receive a distal end of a core member is formed in a receiving die of the forming die, and an inner surface of the rivet member receiving portion is formed into a tapered shape widening from the bottom side toward the opening side.

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board comprising a crystal oscillation circuit is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin. The outer circuit board has a temperature control circuit and a power supply circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A through slot is formed through the outer circuit board, and the thermostatic bath is inserted into the through slot. By inserting the thermostatic bath into the through slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved.

Abstract: A surface mounted oven controlled crystal oscillator includes a crystal oscillator shell, a crystal oscillation circuit, several functional pins and a base plate. The crystal oscillation circuit is accommodated in a cavity that is formed by the crystal oscillator shell and the base plated and electrically connects with the functional pins. The functional pins drill through the base plate from the cavity. An insulating layer is formed between each functional pin and the base plate. The surface mounted oven controlled crystal oscillator further includes several pads formed at an outer surface of the base plate. The insulating layer is also formed between each pad and the base plate, and the functional pins are electrically connected with the corresponding pads respectively. Added pads, the oven controlled crystal oscillator has high stability, simple manufacturing process, and low manufacturing cost.

Abstract: The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed.

Abstract: A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

Abstract: A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

Abstract: A piezoelectric vibration reed includes a pair of vibrating arm portions arranged in parallel to each other and a base portion. The base portion is integrally coupled to proximal ends of the pair of the vibrating arm portions in a longitudinal direction that the vibrating arm portions extend. The base portion includes a connecting portion, a mount portion, and a narrow portion between the connecting portion and the mount portion. The base portion further includes a pair of notched portions notched respectively inwardly from both sides of the base portion in the width direction and ribs projecting outwardly in the width direction of the base portion and arranged in the interiors of the notched portions.

Abstract: There are disclosed a constant voltage circuit which can realize a low consumption current, and a crystal oscillation circuit using the constant voltage circuit. When the constant voltage circuit is provided with a temperature characteristic regulation element, it is possible to minimize a difference between a negative tilt of a constant voltage to a temperature change and a negative tilt of the smallest operation voltage that can oscillate in the crystal oscillation circuit to the temperature change, so that the consumption current of the crystal oscillation circuit can be decreased. Furthermore, when a constant current generated by the constant voltage circuit is decreased, the consumption current of the constant voltage circuit can be decreased, and the consumption current of the whole oscillation device can be decreased.

Abstract: An oscillator circuit includes a resonator (SAW resonator), an amplifier circuit, and a switching element (NMOS switch). The amplifier circuit has a feedback path from one end to the other end of the resonator, a first inductance element (elongated coil) provided in the feedback path, and a variable capacitance element (variable capacitance diode) provided in the feedback path in series with the first inductance element. The switching element is provided in parallel to a circuit part including the first inductance element and the variable capacitance element.

Abstract: An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.

Abstract: A piezoelectric vibration device is provided that can reduce the stress and strain that transmit through a base substrate. The piezoelectric vibration device includes a piezoelectric vibrating reed that oscillates in an AT mode, and that includes excitation electrodes respectively formed on the front and back surfaces of the reed. One of the excitation electrodes is connected to the base substrate via a metal bump on a center line passing across the shorter sides of the piezoelectric vibrating reed and in the vicinity of one of the shorter sides of the piezoelectric vibrating reed. The other excitation electrode is connected to the base substrate via a metal bump on the same side as the above shorter side, and in the vicinity of a portion where the shorter side of the piezoelectric vibrating reed crosses one of the longer sides of the piezoelectric vibrating reed.

Abstract: An oscillation circuit includes: a first oscillation circuit and a second oscillation circuit, wherein the first oscillation circuit includes a first input side electrode electrically connected to a first oscillator and a first output side electrode electrically connected to the first oscillator, and the second oscillation circuit includes a second input side electrode electrically connected to a second oscillator and a second output side electrode electrically connected to the second oscillator, wherein the distance between the first output side electrode and the second input side electrode is greater than the distance between the first input side electrode and the first output side electrode.

Abstract: A vibrator element includes: a base section formed on a plane including a first direction and a second direction perpendicular to the first direction; and a vibrating arm extending from the base section in the first direction, wherein the vibrating arm flexurally vibrates in a normal direction of the plane, and has a first surface one of compressed and extended due to the flexural vibration and a second surface one of extended when the first surface is compressed and compressed when the first surface is extended, the first surface is provided with a first mass section, and the second surface is provided with a second mass section, and at least one of the first mass section and the second mass section has a portion, which fails to be opposed to the other of the first mass section and the second mass section in a plan view in the normal direction.

Abstract: An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element (5) is accommodated in a container (1) and an IC element (7) for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element (5) is mounted on a lower surface of the container (1). A plurality of electrode pads (10) at least including plural crystal electrode pads connected to the crystal oscillator element (5), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows×n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element (7) is electrically connected to the electrode pads (10).