Abstract: The present invention relates to an oven controlled crystal oscillator that can obtain stable oscillation frequency by reducing a temperature change in an oscillation element. The oven controlled crystal oscillator comprises; a heat-conducting plate mounted on one surface of a circuit board, a crystal resonator mounted on a surface of the heat-conducting plate opposite to the surface of the circuit board, an oscillation element constituting an oscillation circuit together with the crystal resonator, and a thermistor that detects temperature of the crystal resonator, a heating resistance which heats the crystal resonator, and a temperature control element including at least a power transistor, to constitute a temperature control circuit together with the thermistor and the heating resistance.

Abstract: An orthogonally referenced integrated ensemble for navigation and timing includes a dual-polyhedral oscillator array, including an outer sensing array of oscillators and an inner clock array of oscillators situated inside the outer sensing array. The outer sensing array includes a first pair of sensing oscillators situated along a first axis of the outer sensing array, a second pair of sensing oscillators situated along a second axis of the outer sensing array, and a third pair of sensing oscillators situated along a third axis of the outer sensing array. The inner clock array of oscillators includes a first pair of clock oscillators situated along a first axis of the inner clock array, a second pair of clock oscillators situated along a second axis of the inner clock array, and a third pair of clock oscillators situated along a third axis of the inner clock array.

Abstract: A piezoelectric resonating element includes a piezoelectric substrate that includes a rectangular vibrating section and a thick section integrally formed with the vibrating section, excitation electrodes, and lead electrodes. The thick section includes a first thick section and a second thick section of which one end is formed continuous to the first thick section. The first thick section includes a first inclined section of which the thickness changes and a first thick section main body of a quadrangle column shape, and at least one slit is provided in the first thick section.

Abstract: A piezoelectric resonating element includes a piezoelectric substrate having a rectangular vibrating portion and a thick-walled portion, excitation electrodes and, and lead electrodes. The thick-walled portion includes a fourth thick-walled portion, a third thick-walled portion, a first thick-walled portion, and a second thick-walled portion. The third thick-walled portion includes a third slope portion and a third thick-walled body, and at least one slit is formed in the third thick-walled portion.

Abstract: A method of manufacturing a quartz crystal unit comprises disposing a metal film on opposite surfaces of a quartz crystal wafer and then etching the wafer to form a two-line tuning fork resonator vibratable in a flexural mode of an inverse phase. A groove is formed in the opposite main surfaces of both tines, and the length of each groove is determined relative to the length of the resonator so that the series resistance of the fundamental mode of vibration of the resonator is less than the series resistance of the second overtone mode of vibration thereof. The resonator is then mounted in case after which the resonant frequency of the resonator is adjusted.

Abstract: An oscillation circuit has a first inverter connected to an external piezoelectric resonator, a first feedback resistor disposed between input/output terminals of the first inverter, first/second variable capacitive elements connected to input/output of the first inverter, a charging circuit supplying input/output terminal with a reference current to charge the capacitive element, a comparator comparing a charging voltage of input/output with a reference voltage, and a control circuit that, in a calibration operation, at a first time, causes the charging circuit to start supply the reference current to the input terminal or the output terminal, and, at a second time after the first time, generates the control signal for setting a capacitance value of the first or second variable capacitive element so that the charging voltage becomes close to the reference voltage according to a comparison result of the comparator.

Abstract: A temperature-compensated crystal oscillator includes a crystal resonator; and an oscillator circuit for performing temperature compensation.

Abstract: To determine the level of frequency drift of a crystal oscillator as a result of a change in the its temperature, the temperature of the crystal oscillator is sensed and used together with previously stored data that includes a multitude of drift values of the frequency of the crystal oscillator each associated with a temperature of the crystal oscillator. Optionally, upon initialization of a GPS receiver in which the crystal oscillator is disposed, an initial temperature of the crystal oscillator is measured and a PLL is set to an initial frequency in association with the initial temperature. When acquisition fails in a region, the ppm region is changed. The temperature of the crystal oscillator is periodically measured and compared with the initial temperature, and the acquisition process is reset if there is a significant change in temperature. The GPS processor enters the tracking phase when acquisition is successful.

Abstract: A surface acoustic wave resonator includes: an IDT which is disposed on a quartz crystal substrate with an Euler angle of (?1.5°???1.5°, 117°???142°, 41.9°?|?|?49.57°) and which excites a surface acoustic wave in an upper mode of a stop band; and an inter-electrode-finger groove formed by recessing the quartz crystal substrate between electrode fingers of the IDT, wherein the following expression: 0.01??G where ? represents a wavelength of the surface acoustic wave and G represents a depth of the inter-electrode-finger groove, is satisfied and when a line occupancy of the IDT is ?, the depth of the inter-electrode-finger groove G and the line occupancy ? are set to satisfy the following expression: ?2.5×G/?+0.675????2.5×G/?+0.775.

Abstract: In one embodiment, the present invention includes a method of correcting the frequency of a crystal oscillator. The method includes establishing an operating baseline for the crystal oscillator using a frequency reference, storing information in memory, and adjusting the frequency according to the information. The information corresponds to the operating baseline. Adjusting the frequency occurs in response to a power-on event and the absence of the frequency reference.

Abstract: A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members 8 are disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members.

Abstract: It is possible to reduce the size of a surface acoustic wave resonator by enhancing the Q value. In a surface acoustic wave resonator in which an IDT having electrode fingers for exciting surface acoustic waves is formed on a crystal substrate, a line occupying ratio is defined as a value obtained by dividing the width of one electrode finger by the distance between the center lines of the gaps between one electrode finger and the electrode fingers adjacent to both sides thereof, and the IDT includes a region formed by gradually changing the line occupying ratio from the center to both edges so that the frequency gradually becomes lower from the center to both edges than the frequency at the center of the IDT.

Abstract: Methods and systems are provided to calibrate an oscillator circuit to reduce frequency pulling as a result of a change in power to a portion of the oscillator circuit. In an embodiment, an oscillator is coupled to a clock buffer circuit and a tuning capacitor configured to tune a frequency of the oscillator to a baseline frequency required for cellular communications. A change in power to the clock buffer circuit initiates a change in an amount of capacitance seen by the oscillator, which negatively impacts the tuning of the oscillator. A register stores a frequency offset caused by the change in power, and the tuning capacitor is adjusted, using the frequency offset, in response to the change in power, such that the total amount of capacitance seen by the oscillator is not changed when the change in power occurs.

Abstract: A crystal oscillator circuit is configured to output an oscillation signal. A bias circuit responds to control signal to generate a bias current for application to the crystal oscillator circuit. A current generator generates a sense current from the control signal. The sense current is compared to a reference current by a comparator circuit. The comparator circuit generates a ready signal in response to the comparison. The ready signal is indicative of whether the oscillation signal output from the crystal oscillator circuit is ready for use by other circuitry. The reference current may be generated by a circuit which replicates the bias circuit.

Abstract: A circuit comprises a frequency divider configured to receive an oscillating signal generated by an oscillator and to divide the oscillating signal into a clock signal, wherein the division ratio of the frequency divider is set to a value equal to one of: the integer part of the resonant frequency of the oscillator and the integer part of the resonant frequency of the oscillator plus 1. The circuit further comprises a control element which switchable connects or disconnects a calibration element to alter the frequency of the oscillation signal input to the frequency divider based on a number of oscillations that have transpired in the oscillating signal.

Abstract: Provided is a fundamental wave/overtone crystal oscillator to obtain fundamental wave oscillation and overtone oscillation with one crystal unit and to optimize the excitation current depending on the fundamental wave oscillation and the overtone oscillation. The fundamental wave/overtone crystal oscillator includes a crystal unit that oscillates with fundamental waves or with overtones, and an oscillator circuit that amplifies an excitation current from the crystal unit and outputs an oscillatory frequency. A capacitor Cf and a capacitor Co are connected in parallel with the base of a transistor in the oscillator circuit as well as the emitter. A switch is provided so as to connect or disconnect the capacitor Cf with respect to the circuit in response to a switching signal. The switch turns ON when the crystal oscillator oscillates with fundamental waves, and turns OFF when the crystal oscillator oscillates with overtones.

Abstract: A piezoelectric device and a fabricating method thereof are provided. Variation of output frequency is suppressed by forming an organic resin to protect an IC chip that is mounted in a cavity of a container body, and damage that may occur to the IC chip during the mounting process is prevented. The piezoelectric device includes a container body, a crystal resonator, an IC chip and a cover body. A surface of the IC chip, which is a mounting surface for mounting to the container body, has bumps thereon for connecting to terminal pads of a circuit wiring pattern configured on a bottom surface of a bottom cavity of the container body, and the other surface of the IC chip has an insulating protective sheet adhered and fixed thereon.

Abstract: An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.

Abstract: A piezoelectric vibration element includes a piezoelectric substrate including a thin vibration region and a thick section integrated along three sides excluding one side of the vibration region, excitation electrodes respectively arranged on the front and rear surfaces of the vibration region, and lead electrodes. The thick section includes a first thick section and a second thick section arranged to be opposed to each other across the vibration region and a third thick section connected between proximal ends of the first and second thick sections. The second thick section includes an inclined section connected to the one side of the vibration region, a second thick section main body connected to the other side of the inclined section, and at least one slit for stress relaxation.

Abstract: A crystal oscillator clock circuit which facilitates switching its output between an internally generated clock signal and an externally generated clock signal. A feedback loop detects the presence of an externally generated clock signal applied to an output pin of a crystal oscillator circuit and powers down the internally generated clock signal. As a result, the crystal oscillator clock circuit simply passes the externally generated clock signal as its output signal.

Abstract: Aspects of a method and system for compensating temperature readings from a temperature sensing crystal integrated circuit are provided. An electronic device may digitize a temperature indication received from a temperature sensing circuit, digitize one or more calibration voltages received from said temperature sensing circuit, and calculate a compensated temperature indication utilizing the digitized calibration voltage(s), and the digitized temperature indication, and data from a table that characterizes behavior of the temperature sensing circuit as a function of temperature. One or more circuits in the electronic device may be controlled based on the compensated temperature indication. The compensated temperature indication may compensate for a gain error and/or offset error of a digital to analog converter that digitizes the temperature indication and the calibration voltage(s). There may be two calibration voltages.

Abstract: A quartz crystal vibrator element having the weight section is provided with the intermediate weight section formed to have an arm width W1 larger (thicker) than the arm width W of the vibrating arm section and smaller (thinner) than the arm width W2 of the tip weight section, thereby making the intermediate weight section follow the vibration (the amplitude) of the vibrating arm section. Further, the tip weight section formed to have an arm width W2 larger (thicker) than the arm width W1 of the intermediate weight section is provided, thereby making the tip weight section follow the vibration (the amplitude) of the vibrating arm section and the intermediate weight section. Therefore, the vibration characteristics of the vibrating arm section can be stabilized.

Abstract: An oscillator comprises an inverter, with a resonator connected between an input and an output of the inverter. A transistor external to the inverter is connected in a current mirror mode with a transistor of the inverter so that the inverter's transistor copies the current of the external transistor. The external transistor has its drain terminal connected to the gate terminals of the inverter's transistor and of the external transistor. A current source is connected to the gate terminal of the inverter's transistor, and a switch is connected between the drain and gate terminals of the external transistor. Circuitry controls the switch so as to open the connection between the drain and gate terminals of the external transistor at the beginning of a start-up phase of the oscillator.

Abstract: The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals.

Abstract: There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; on the back surface of the ceramic base, mount terminals connected to the through terminals are formed; and the opening end face of a metal cover joined onto the ceramic base via the molten resin comprises a flange having an inclined face in the surface mount crystal oscillator.

Abstract: An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customer's motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.

Abstract: There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; and on the back surface of the ceramic base, mount terminals connected to the through terminals are formed in the surface mount crystal oscillator.

Abstract: An amplitude control circuit includes a pair of peak detectors. The pair of peak detectors are responsive to a voltage reference generator. The amplitude control circuit is configured to be responsive to an oscillating signal of a crystal oscillator and configured to generate a control signal to control an amplitude of the oscillating signal.

Abstract: An orthogonally referenced integrated ensemble for navigation and timing includes a dual-polyhedral oscillator array, including an outer sensing array of oscillators and an inner clock array of oscillators situated inside the outer sensing array. The outer sensing array includes a first pair of sensing oscillators situated along a first axis of the outer sensing array, a second pair of sensing oscillators situated along a second axis of the outer sensing array, and a third pair of sensing oscillators situated along a third axis of the outer sensing array. The inner clock array of oscillators includes a first pair of clock oscillators situated along a first axis of the inner clock array, a second pair of clock oscillators situated along a second axis of the inner clock array, and a third pair of clock oscillators situated along a third axis of the inner clock array.

Abstract: A crystal device includes; a base, a framed crystal vibrating blank in which a mesa section is formed on an upper face end bonded to a seal path on an upper surface of the base via a low melting point glass layer or a resin adhesive layer, and a lid bonded to a seal path on an upper surface of the framed crystal vibrating blank via a low melting point glass layer or a resin adhesive layer. A pillow made of low melting point glass or a resin adhesive that suppresses vibration amplitude at the time of a drop impact of the framed crystal vibrating blank is formed on a rear surface of the lid simultaneously with the low melting point glass layer or the resin adhesive layer.

Abstract: Provided is a piezoelectric vibrator which is also compatible with the miniaturization thereof. In a piezoelectric vibrator where a piezoelectric vibrating piece is sealed in a cavity formed between a lid substrate and a base substrate made of a glass material, one through hole is formed in the base substrate, a pair of through electrodes are arranged in the through hole, the through hole is filled with a glass frit and the glass frit is solidified by baking so that the through hole is sealed by the glass fit. By arranging the pair of through electrodes in one through hole, one through hole is provided for one piezoelectric vibrator and hence, bending strength of the base substrate can be increased. Further, the piezoelectric vibrator is compatible with the miniaturization thereof.

Abstract: An oscillation circuit includes a parallel resonant quartz crystal oscillator and a variable capacitor which are connected with each other in parallel. In addition, the oscillation circuit can further include a first variable resistor and a second variable resistor. The first resistor is connected to the quartz crystal oscillator in parallel. The second resistor is connected to the variable capacitor in series first and then connected to the quartz crystal oscillator in parallel.

Abstract: A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.

Abstract: A piezoelectric vibration element includes: a piezoelectric substrate; excitation electrodes that are arranged so as to face each other on both principal faces of the piezoelectric substrate; drawn-out electrodes; and pads. The piezoelectric substrate includes an excitation portion that is located at the center and a peripheral portion that is thin-walled to be thinner than the thickness of the excitation portion and is disposed on a peripheral edge thereof. The pads have support areas that fix the piezoelectric substrate to a support member at positions of the piezoelectric substrate corresponding to corner portions. The excitation electrodes are formed over the excitation portion and a vibration area that is at least a part of the peripheral portion.

Abstract: The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes.

Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

Abstract: The invention relates to a micromechanical resonator comprising a substrate (1) of first material (2), a resonator (3) suspended to the supporting structure (1), the resonator (3) being at least partially of the same material (2) as the supporting structure and dimensioned for resonation at a specific frequency f0, coupling means (5) for initiating, maintaining and coupling the resonation of the resonator (3) to an external circuit (6), and the resonator (3) including second material (4), the thermal properties of which being different from the first material (2). In accordance with the invention the resonator (3) includes the second material (4) located concentrated in specific places of the resonator (3).

Abstract: A photoresist film forming process through a spin coating method is included, the photoresist film forming process is performed by rotating a square wafer, a spin chuck is provided with a column portion, a penetration hole through which the column portion penetrates is formed in a flow regulating plate, a plurality of blowing holes blowing gas toward a second surface of a square wafer are provided in the upper surface of the flow regulating plate at the inner side in relation to the outer edge of the square wafer in the radial direction of the wafer maintaining portion and at the outer side in relation to the inner circumferential surface of the penetration hole in a radial direction of the wafer maintaining portion.

Abstract: A voltage controlled oscillator (VCO) securing a wide range of variable amount of oscillatory frequency is provided. In the VCO, a resistor R1 and a capacitor C1 are connected in series on a line of a crystal resonator and a control voltage supply terminal, a cathode of a variable-capacitance diode VD1 is connected between the R1 and the C1, and an anode of the VD1 is grounded. A parallel-connected circuit is disposed between the C1 and a port connected with the crystal resonator, the parallel-connected circuit including a variable-capacitance diode VD2 and a capacitor C3 connected in series, an expansion coil L1, and a Q dump resistor R6 which are connected in parallel. The parallel-connected circuit on an input side is grounded via a resistor R4, and a point between the R1 and the C1 and a point between the VD2 and the C3 are connected via a resistor R5.

Abstract: A device for compensating for the frequency of a resonator includes (a) a temperature sensor, (b) a sequencer determining a second compensation signal on the basis of the temperature and corresponding to a positive value N, and a third compensation signal on the basis of the temperature corresponding to a ratio between a positive integer S and N, S being lower than or equal to N, and (c) a variable counter receiving the compensation signals and generating a fourth output signal every N periods of a clock signal from the resonator and generating a fifth signal for modifying the charge capacity of the resonator.

Abstract: A quartz crystal vibrator element having the weight section is provided with the intermediate weight section formed to have an arm width W1 larger (thicker) than the arm width W of the vibrating arm section and smaller (thinner) than the arm width W2 of the tip weight section, thereby making the intermediate weight section follow the vibration (the amplitude) of the vibrating arm section. Further, the tip weight section formed to have an arm width W2 larger (thicker) than the arm width W1 of the intermediate weight section is provided, thereby making the tip weight section follow the vibration (the amplitude) of the vibrating arm section and the intermediate weight section. Therefore, the vibration characteristics of the vibrating arm section can be stabilized.

Abstract: A piezoelectric vibrator, an oscillator, an electronic device and a ratio timepiece are provided which are capable of increasing a capacitance C0 while achieving miniaturization and cost reduction. The piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed on which an excitation electrode is formed, and external electrodes. An electrode pattern for capacitance adjustment, which extends along a routing electrode, is provided extending from a routing electrode.

Abstract: A SAW resonator which, using a quartz crystal substrate with Euler angles (?1.5°???1.5°, 117°???142°, and 41.9°?|?|?49.57°), includes an IDT that excites a stop band upper end mode SAW, and an inter-electrode finger groove provided between electrode fingers configuring the IDT. When a wavelength of the SAW is ?, a first depth of the inter-electrode finger groove is G, a line occupation rate of the IDT is ?, and an electrode film thickness of the IDT is H, ?, G, ? and H satisfy the relationship of 0<H?0.005?, 0.01??G?0.09?, and 0.18???0.71.

Abstract: A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements.

Abstract: The invention relates to an oven controlled crystal oscillator for surface mounting with reduced height (low profile). The oven controlled crystal oscillator for surface mounting comprises: a flat first substrate made of ceramic and on which are installed a crystal device and a heat resistor; and a second substrate made of a glass epoxy resin which is quadrangular in plan view and which faces the first substrate and has a larger external shape in plan view than the first substrate. The second substrate has an opening into whose center the crystal device is inserted, and has terminal sections on four locations corresponding to the surface outer periphery of the first substrate and the peripheral surfaces of the opening in the second substrate, and the terminal sections of the first substrate and second substrate are connected by solder.

Abstract: A rapidly adjustable local oscillation (LO) module for use in a radio transmitter or a radio receiver includes an oscillation generating module and a high frequency switching module. The oscillation generating module is operably coupled to generate a plurality of local oscillations. The high frequency switching module is operably coupled to, for a first one of a plurality of transmission paths, provide one of the plurality of local oscillations when a first transmission path selection indication is in a first state and provide another one of the plurality of local oscillations when the first transmission path selection indication is in a second state and, for a second one of the plurality of transmission paths, provide the one of the plurality of local oscillations when a second transmission path selection indication is in a first state and provide the another one of the plurality of local oscillations when the second transmission path selection indication is in a second state.

Abstract: A piezoelectric vibrating piece includes a pair of vibration arm portions that is placed in a row in a width direction; a base portion to which proximal end sides in the pair of vibration arm portions in an extending direction are connected; and weight metal films that are formed on outer surfaces of the vibration arm portions, wherein the weight metal films are formed in positions that avoid regions of tip portions in the vibration arm portions in a longitudinal direction.

Abstract: An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed.

Abstract: A crystal device includes leading electrodes that are formed on a base substrate, and a bump for mounting a piezoelectric vibrating reed on the leading electrodes, and alignment marks for performing the positioning of the bump are formed on the base substrate separately from the leading electrodes.

Abstract: There is provided a temperature compensated piezoelectric oscillator which excels in frequency stability and has a good electronic noise characteristic, and with which a circuit can be structured simply. An auxiliary oscillator unit 21 sharing a crystal substrate 2 with a main oscillator unit 11 outputting a set frequency f0 to an outside is used as a temperature detecting unit 32 detecting a temperature T for obtaining a compensation voltage ?V in a temperature compensated piezoelectric oscillator (TCXO), and electrodes 13, 23 of the main oscillator unit 11 and the auxiliary oscillator unit 21 are provided separately on the crystal substrate 2. For example, a fundamental wave and an overtone are used or a thickness shear vibration and a contour shear vibration are used in the main oscillator unit 11 and the auxiliary oscillator unit 21, respectively.