Stripline Patents (Class 333/128)
  • Patent number: 8217657
    Abstract: A diplex filter is formed by two impedance-transforming filters with separate transmission frequency ranges and with separate cut-off frequency ranges and a connection node at which two series elements of the two filters are connected. These two series elements are each fashioned as a parallel oscillating circuit, each parallel oscillating circuit exhibiting a predetermined reactance in a midband of the respective transmission frequency range and a parallel resonance in a midband of the respective cut-off frequency range. The diplex filter can be realized in a simple and cost-effective manner without ferrite-containing special components, for instance inductively coupled coils or tapped coils thereby allowing use thereof in a magnetic resonance tomograph, for example.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: July 10, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ralph Oppelt
  • Patent number: 8213894
    Abstract: For one disclosed embodiment, an integrated circuit may comprise an internal transmission line in one or more layers of the integrated circuit. The internal transmission line may be coupled to receive a signal from an external transmission line at a first end of the internal transmission line without use of termination circuitry. The internal transmission line may transmit the signal passively to a second end of the internal transmission line. The integrated circuit may also comprise first circuitry having an input coupled to the internal transmission line at a first location of the internal transmission line to receive the signal and second circuitry having an input coupled to the internal transmission line at a second location of the internal transmission line to receive the signal. The second location may be different from the first location. Other embodiments are also disclosed.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: July 3, 2012
    Assignee: Intel Corporation
    Inventors: Frank O'Mahony, Bryan Casper, James Jaussi, Matthew B. Haycock, Joseph Kennedy, Mozhgan Mansuri, Stephen R. Mooney
  • Publication number: 20120098617
    Abstract: A Wilkinson coupler mounted on a printed circuit comprises a first access port connected to a second access port and to a third access port by way of two metallic transmission lines of the same length and a load resistor mounted in short-circuit arrangement between the second and third access ports, characterized in that the load resistor is constituted of three adjacent independent resistors linked together. The coupler applies notably to the field of satellite antennas and more particularly to antenna beamforming arrays.
    Type: Application
    Filed: June 21, 2010
    Publication date: April 26, 2012
    Applicant: THALES
    Inventors: Claude Drevon, David Nevo, Laurent Bodin
  • Patent number: 8130165
    Abstract: There is disclosed an electromagnetic transmission line arrangement with a phase shifter, comprising at least one conductive branch line (51a,51b) extending from a junction point (51c) to an associated output port, for the propagation of electromagnetic signals in a frequency band along said branch line. The phase shifter includes at least one dielectric body (52,53,54) which is mounted so as to be movable sideways in a transverse direction into a delaying position at least partly covering said branch line (51a,51b). The longitudinal distribution of its dielectric material (?) is adapted to cause, when being moved transversally into said delay position, a controlled phase shift but also to secure, by way of said selected longitudinal distribution of its dielectric material in conjunction with said at least one branch line, an input impedance matching of said transmission line arrangement. The transmission line arrangement can be used in the feeding network to a microwave antenna.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: March 6, 2012
    Assignee: Powerwave Technologies Sweden AB
    Inventor: Björn Lindmark
  • Patent number: 8089327
    Abstract: A waveguide to microstrip transition having a waveguide open at one end. A dielectric substrate includes a first and a second side and a ground plane covers the first side of the substrate. The dielectric substrate overlies the waveguide opening so that the ground plane faces the waveguide and an opening in the ground plane registers with the waveguide opening. A back short having a housing is positioned on the second side of the dielectric substrate. The back short housing forms a cavity which registers with at least a portion of the ground plane opening so that microwave energy from the waveguide passes through the dielectric substrate and into the cavity defined by the back short housing. The back short housing has at least one opening to the cavity along the second side of the dielectric substrate. A pair of spaced apart microstrips on the second side of the substrate each have a free end positioned in the cavity so that the free ends of the microstrips are spaced apart from each other.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: January 3, 2012
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Alexandros Margomenos, Paul D. Schmalenberg
  • Patent number: 8076993
    Abstract: A balun circuit comprising first through third CPW lines becoming signal I/O ports, a first differential transmission line for linking the central conductor of the second CPW line and the ground conductor of the first CPW line and for linking the ground conductor of the second CPW line and the central conductor of the first CPW line, a second differential transmission line for linking the central conductors of the first and third CPW lines and for linking the ground conductors of the first and third CPW lines, and a joint for connecting at least two ground conductors of the first through third CPW lines. The differential transmission line has a first line formed in a dielectric layer on a substrate, a second line arranged in the underlying layer, and an underlying line at a fixed potential arranged between the substrate and the second line.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: December 13, 2011
    Assignee: NEC Corporation
    Inventors: Yasuhiro Hamada, Shuya Kishimoto, Kenichi Maruhashi, Masaharu Ito, Masahiro Tanomura, Naoyuki Orihashi
  • Patent number: 8072288
    Abstract: A directional coupler capable of improving a directionality of a directional coupler body including four terminals. The directional coupler includes a directional coupler body including the four terminals of an input port, an output port, a coupling port, and an isolation port; and a combiner for combining powers of an output signal of the coupling port and an output signal of the isolation port of the directional coupler body; and a directionality improving circuit for amplifying or attenuating at least one of the output signal of the coupling port and the output signal of the isolation port before outputting the same, and the combiner combines powers of the output signals amplified or attenuated by the directionality improving circuit.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: December 6, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuhisa Yamauchi, Masatoshi Nakayama, Yasuhiro Onaka, Tomokazu Hamada, Satoru Ishizaka
  • Patent number: 8068796
    Abstract: A power divider includes a substrate, a signal reception terminal formed in a first layer of the substrate for receiving signals, a first output terminal formed in the first layer for outputting radio-frequency (RF) signals, a matching terminal formed in a third layer of the substrate, a second output terminal formed in the third layer for outputting RF signals, a grounding plate formed in a second layer of the substrate, surrounding a hole and forming a circular shape, a first block transmission line formed at a position corresponding to the hole in the first layer and coupled to the signal reception terminal and the first output terminal, and a second block transmission line formed at a position corresponding to the hole in the third layer, coupled to the matching terminal and the second output terminal, and having a shape identical to a shape of the first block transmission line.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: November 29, 2011
    Assignee: Ralink Technology Corp.
    Inventors: Min-Chung Wu, Shao-Chin Lo
  • Patent number: 8041304
    Abstract: An area estimation apparatus 100 includes: a reception level receiving unit 110 configured to receive, from a plurality of the radio signal capturing terminals 40a and 40b via the network, a radio signal reception level transmitted from the radio signal transmitting terminal 10, a radio signal transmitting terminal ID for uniquely identifying the radio signal transmitting terminal 10, and a radio signal capturing terminal ID for uniquely identifying each of the plurality of radio signal capturing terminals 40a and 40b; with a presence area of the radio signal capturing terminals being known; a reception level storage unit 123 configured to store the radio signal reception level, the radio signal transmitting terminal ID and the radio signal capturing terminal ID, which are received from each of the radio signal capturing terminals 40a and 40b, in association with one another; and a presence area estimating unit 140 configured to refer to the reception level storage unit and to estimate the presence area of th
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: October 18, 2011
    Assignee: NTT DoCoMo, Inc.
    Inventors: Naoharu Yamada, Yoshinori Isoda
  • Patent number: 8031032
    Abstract: A power amplifier (power amplifier) having multiple solid state sub-amplifiers connected in parallel between the power amplifier input and the power amplifier output are described. The signal input to the power amplifier is provided to an RF splitter connected between the power amplifier input connector and the input of each of the sub-amplifiers. The RF splitter splits the input power from the signal input and provides the power to the sub-amplifier inputs through input electrical paths. The input electrical paths from the power amplifier input to the sub-amplifiers are substantially physically identical. Each of the sub-amplifiers drive an input of an RF combiner connected between the outputs of the sub-amplifiers and the output of the power amplifier. The RF combiner combines the output power from each of the sub-amplifiers through output electrical paths, and provides the combined power to the power amplifier output.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: October 4, 2011
    Assignee: Keragis Corporation
    Inventor: Robert M. Rector
  • Patent number: 8013686
    Abstract: A miniaturized multilayer hybrid-phase signal splitter circuit is proposed, which is fully equivalent in function to a conventional rat-race coupler, but with a specialized circuit layout structure that allows its IC implementation to be more miniaturized than the conventional rat-race coupler. The proposed hybrid-phase signal splitter circuit features the use of a multilayer substrate for the layout of six transmission lines in such a manner that the transmission lines in the middle layer are inductively coupled to the transmission lines on the overlying layer as well as the transmission lines on the underlying layer to form a Marchand balun. In IC implementation, the required layout area is only about 10% of the layout area for the conventional rat-race coupler.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: September 6, 2011
    Assignee: National Taiwan University
    Inventors: Chun-Lin Kuo, Che-Chung Kuo, Huei Wang
  • Publication number: 20110204993
    Abstract: A transmission line having a plurality of branch lines that respectively include a first end part and a second end part and have a same line length, in which at least part of the plurality of branch lines includes bent shapes, the first end parts of the plurality of branch lines are connected to a common terminal, and the second end parts of the plurality of branch lines are connected to a common terminal. The plurality of branch lines may include two micro strip lines that are formed on substrates having the same dielectric constant and have bent shapes in symmetry with each other with respect to a straight line.
    Type: Application
    Filed: February 1, 2011
    Publication date: August 25, 2011
    Applicant: FUJITSU LIMITED
    Inventor: Satoshi MASUDA
  • Publication number: 20110187399
    Abstract: A signal distribution structure for distributing a signal to a plurality of devices includes a first signal guiding structure including a first characteristic impedance. The signal distribution structure also includes a node, wherein the first signal guiding structure is coupled to the node. The signal distribution structure includes a second signal guiding structure including one or more transmission lines. The one or more transmission lines of the second signal guiding structure are coupled between the node and a plurality of device connections. The second signal guiding structure includes, side-viewed from the node, a second characteristic impedance which is lower than the first characteristic impedance. The signal guiding structure also includes a matching element connected to the node.
    Type: Application
    Filed: September 19, 2008
    Publication date: August 4, 2011
    Applicant: VERIGY (SINGAPORE) PTE. LTD.
    Inventor: Bernd Laquai
  • Publication number: 20110187476
    Abstract: Embodiments are directed to a RF combiner/splitter having a first port separated from a second port and a third port by a generally tapering microstrip section. The second and third ports are separated by a generally rectangular bridge bar having a width selected to match the impedance of devices to be connected to the second and third ports and a length selected to provide a separation between the second and third ports of approximately quarter wavelength at a center point of an operational frequency of the devices. In a first embodiment, a horizontal RF choke joint is positioned between the first port and the tapering section. In a second embodiment, one choke joint is positioned between the second port and the bridge bar and a second choke joint is positioned between the third port and the bridge bar.
    Type: Application
    Filed: April 13, 2011
    Publication date: August 4, 2011
    Applicant: DOCKON AG
    Inventor: Forrest James Brown
  • Patent number: 7982556
    Abstract: According to one exemplary embodiment, a three-way splitter includes a printed element and a resistive network comprising discrete resistors. A first printed branch, second printed branch, and third printed branch distribute a received communication signal to respective outputs having substantially the same phase, frequency, and impedance. Each printed branch includes a number of substantially ninety-degree angles. In one embodiment, the printed branches are quarter wavelength transmission lines in a frequency range of 1.5 GHz. In one embodiment, the three-way splitter consumes less than one square inch of surface area on a printed circuit board, and can be used in a satellite receiving system, for example. In this embodiment, the three-way splitter is utilized for frequencies in the range of approximately 900 MHz to 2.2 GHz.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: July 19, 2011
    Assignee: Broadcom Corporation
    Inventor: Jose Ignacio Gorostegui
  • Patent number: 7982555
    Abstract: Methods and systems for processing signals via power splitters embedded in an integrated circuit package may include generating via a power splitter, one or more RF signals proportional to one or more received RF signals. The power splitter may be integrated in a multi-layer package. The generated RF signals may be processed via an integrated circuit, which may be electrically coupled to the multi-layer package. The power splitters may include quarter wavelength transmission lines. The transmission lines may include a microstrip structure or a coplanar structure. The power splitters may be bonded to one or more capacitors in the integrated circuit. The capacitors may include CMOS devices in the integrated circuit. The power splitters may include lumped devices which may include surface mount devices coupled to the multi-layer package or devices within the integrated circuit, which may be flip-chip bonded to the multi-layer package.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: July 19, 2011
    Assignee: Broadcom Corporation
    Inventor: Ahmadreza Rofougaran
  • Patent number: 7973617
    Abstract: An unequal three-way divider divides an input signal into three in-phase signals whose power ratio is different between a center and both ends. The unequal three-way divider includes an input terminal, and three output terminals for outputting a three-divided signal respectively, and three transmission lines branched from the input terminal are provided between the input terminal and the three output terminals. The transmission line connected to the center output terminal has a first transmission line which is connected in series and a second transmission line whose electrical length is ¼ wave length. Two transmission lines connected to the output terminals at both ends have a third transmission line which is connected in series and a fourth transmission line whose electrical length is ¼ wave length respectively.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: July 5, 2011
    Assignee: Panasonic Corporation
    Inventors: Hiroyuki Yurugi, Wataru Noguchi
  • Patent number: 7974103
    Abstract: A signal transfer member for a liquid crystal display (LCD) apparatus includes a power line for receiving power from an external source and for driving a semiconductor chip disposed on the transfer member or the display apparatus. The power line is bent so as to incorporate a serpentine structure, which enables the length of the power line to be easily adjusted and results in the line being longer than a power line formed with a relatively straight structure. Accordingly, the length of the power line can be adjusted to take into account the respective impedances of the chip and the external source so as to suppress electromagnetic waves in the power line. This prevents the creation of noise, distortion of signals, damage to the semiconductor chip, and disconnection of the input interconnection thereof that are caused by the electromagnetic waves, so that product yields are thereby improved.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: July 5, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myong-Bin Lim, Jae-Han Lee, Sun-Kyu Son, In-Yong Hwang
  • Publication number: 20110102101
    Abstract: Disclosed is a radio-frequency divider comprising: an input port; and two output ports, separated by a bridge bar, wherein the divider is arranged in microstrip form and the microstrip structure takes the form of a generally tapering section connecting the input port to the bridge bar such that the input port is positioned at the relatively thinner end of the tapering section and the bridge bar is positioned at the relatively wider end of the tapering section. Also disclosed is a corresponding method. The divider is able to operate equally as a combiner.
    Type: Application
    Filed: May 28, 2009
    Publication date: May 5, 2011
    Applicant: ViDi Tech AG
    Inventor: Forrest James Brown
  • Patent number: 7920035
    Abstract: A microwave, power splitter/combiner (20) is formed as part of a multilayer laminate (27, 28, 29, 33, 34) such that two ports (22, 23) are connected by plated vias (31, 32) to conductive pads (29, 30) connected across an isolation resistor (27). Furthermore, a microwave circuit is provided in the form of a multi-layer laminate including a substrate carrying a resistive layer which has been etched to define at least one resistor, a dielectric membrane covering the resistor, a conductive layer defining at least part of an electrical circuit, and said at least one resistor is electrically connected to the conductive layer by vias extending through the dielectric membrane.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: April 5, 2011
    Assignee: Selex Galileo Ltd.
    Inventor: Gary David Panaghiston
  • Publication number: 20110032049
    Abstract: In cases where a power divider is constructed by using a multilayer substrate, a power divider is obtained which is smaller in size and has a good reflection property. The power divider according to the present invention is provided with a multilayer dielectric substrate (1), strip conductor patterns (2a through 2c) formed on one surface of the multilayer dielectric substrate (1), and a ground conductor pattern (3) formed on the other surface of the multilayer dielectric substrate (1), wherein a transmission line is composed of the dielectric substrate (1), the strip conductor patterns (2a through 2c) and the ground conductor pattern (3), and the transmission line has its one end branched to form a plurality of branch lines (12a, 12b), with an isolation resistance (4) being formed between the branch lines.
    Type: Application
    Filed: April 11, 2008
    Publication date: February 10, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yukihiro Tahara, Takeshi Yuasa, Naofumi Yoneda
  • Publication number: 20100321131
    Abstract: A high isolation power divider is disclosed, which includes a substrate, a first split arm, a second split arm, a signal input unit, a connection unit, a ground layer, a slit. The signal input unit is coupled to the first split arm and the second split arm for receiving an input signal and dividing the input signal to the first split arm and second split arm. The connection unit is coupled to the first split arm and the second split arm, wherein the connection unit, the first split arm, and the second split arm are deposited on a first plane of the substrate, and surround a first area. The ground layer is deposited on the second plane of the substrate for providing grounding. The slit is formed in the ground layer, wherein at least a part of the slit is formed within a second area corresponding to the first area.
    Type: Application
    Filed: May 7, 2010
    Publication date: December 23, 2010
    Inventors: Wen-Tsai Tsai, Che-Ming Wang
  • Patent number: 7855623
    Abstract: A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: December 21, 2010
    Assignee: Tessera, Inc.
    Inventors: Ronald Green, Belgacem Haba, David William Wallis, Nicholas J. Colella
  • Patent number: 7830225
    Abstract: The present invention is an electronic signal continuity device comprising an electrically conductive case having a volume, an input port and at least two output ports. The continuity device further includes a printed circuit board (PCB) in electrical communication with the input port and the output ports. The PCB is operably configured to split an electronic signal received at the input port to the output ports. Additionally, the PCB is disposed within the volume of the electrically conductive case. Further, the PCB includes an orifice and a plurality of electronic components, wherein one of the plurality of electronic components is disposed in the orifice. The case further includes a first portion and a second portion opposing the first major portion, wherein one of the two output ports and the input port are disposed on the first portion, and one of the two output ports is disposed on the second portion.
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: November 9, 2010
    Inventor: Robert D. Gale
  • Patent number: 7830224
    Abstract: The design of a compact low-loss Magic-T is described. The planar Magic-T incorporates a compact microstrip-slotline tee junction and small microstrip-slotline transition area to reduce slotline radiation. The Magic-T produces broadband in-phase and out-of-phase power combiner/divider responses, has low in-band insertion loss, and small in-band phase and amplitude imbalance.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: November 9, 2010
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Kongpop U-Yen, Edward J. Wollack, Terence Doiron, Samuel H. Moseley
  • Patent number: 7808343
    Abstract: A radio frequency (RF) communication device may include an RF 90-degree hybrid combiner having stable phase and loss characteristics over greater than one octave of bandwidth, while providing a high degree of isolation between input and isolated port. The structure may include a first element and a second element. The first element includes a first port, a first section for phasing matching, a second section for conductive-layer inversion, a third section for phase-matching section, and a third port. The second element includes a fourth port, a fourth section for phasing matching, a fifth section for conductive-layer inversion, a sixth section for phase-matching, and a second port. In one example, the second and fifth sections are utilized for signal coupling. In another example, the first, third, fourth, and sixth sections are utilized for signal coupling. Different ports may have matched phase differences.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: October 5, 2010
    Assignee: Lockheed Martin Corporation
    Inventors: Joseph Alfred Iannotti, William J. Taft
  • Publication number: 20100225417
    Abstract: A planar N-way power divider/combiner, wherein N is an integer different from a power of two, comprising a first port, which is to be coupled to a first transmission line having a first characteristic impedance, N second ports, which are to be coupled each to a corresponding electrical load, and N division/combination branches, each coupled between the first port and a corresponding second port and each having a first stage, a second stage, and an intermediate node between the two stages. All the electrical loads have one and the same given load impedance. For each pair of planarly adjacent division/combination branches, a corresponding first uncoupling resistor is coupled between corresponding intermediate nodes and a corresponding second uncoupling resistor is coupled between the corresponding second ports.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 9, 2010
    Inventors: Antonino Mistretta, Antonino Spatola
  • Patent number: 7719385
    Abstract: Disclosed herein are a method and divider for dividing power between and supplying the parts of the power to respective radiation elements of an array antenna, and an antenna device using the divider. The division method includes the steps of dividing power, applied to a feeding unit, into two parts at a first stage of division, and supplying a first of the two parts to at least one central radiation element, and dividing a second of the two parts and supplying sub-parts of the second part to respective peripheral radiation elements, thereby supplying relatively high power to the central radiation element and relatively low power to the peripheral radiation elements.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: May 18, 2010
    Assignee: Sunwoo Communication Co., Ltd
    Inventors: Jong-In Choi, Young-Jai Kim, Dae-Sung Kim, Yu-Rin Kim
  • Patent number: 7710216
    Abstract: A balun circuit includes a first CPW line 11, a second CPW line 12a, and a third CPW line 12b that serve as signal input/output ports; a first CPS line 14a that is a differential transmission line, the first CPS line 14a relaying the first CPW line 11 to the second CPW line 12a; a second CPS line 14b that is a differential transmission line, the second CPS line 14b relaying the first CPW line 11 to the third CPW line 12b; and at least one connection section that connects grounded conductors of each of the first CPW line 11, the second CPW line 12a, and the third CPW line 12b.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: May 4, 2010
    Assignee: NEC Corporation
    Inventors: Yasuhiro Hamada, Keiichi Ohata, Kenichi Maruhashi, Takao Morimoto, Masaharu Itou, Shuuya Kishimoto
  • Patent number: 7696841
    Abstract: A power amplifier includes a quadrature hybrid and input impedance matching network. The power amplifier also includes at least one amplifier that includes an output electrode, and a quadrature hybrid and output impedance matching network. The quadrature hybrid and input impedance matching network exhibits a low pass frequency response.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: April 13, 2010
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventor: Pin-Fan Chen
  • Patent number: 7671702
    Abstract: A power combiner comprising an LC lattice structure is shown, together with a method for generating a planar wave front. The LC structure can comprise constant or voltage dependent capacitors. Either the delay or the characteristic impedance of the two-dimensional transmission line formed by the LC lattice structure are kept constant. A planar wave propagating along one direction of the transmission line gradually experiences higher impedances at the edges, creating a lower resistance path for the current in the middle. This funnels more power to the center as the wave propagates.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: March 2, 2010
    Assignee: California Institute of Technology
    Inventors: Ehsan Afshari, Harish Bhat, Seyed Ali Hajimiri
  • Patent number: 7663449
    Abstract: A divider may include a stem or first port, and two or more branch ports connected or coupled directly or indirectly to the first port. As mentioned, a divider may include multiple sections. In some examples, a divider may include at least an inductively uncoupled section and an inductively coupled section. An uncoupled section may be characterized by a plurality of associated transmission lines that are substantially inductively uncoupled. On the other hand, a coupled section may include a plurality of associated transmission lines that are substantially inductively coupled. A divider section may include a resistor connected between ends of associated first and second transmission lines in a coupled or uncoupled section. In some examples, one or more uncoupled sections are connected in series to the first port and one or more coupled sections are connected in series between the uncoupled sections and the second and third ports.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: February 16, 2010
    Assignee: Werlatone, Inc
    Inventor: Allen F. Podell
  • Patent number: 7663455
    Abstract: A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: February 16, 2010
    Assignee: TDK Corporation
    Inventors: Tomoyuki Goi, Hideaki Fujioka, Masami Itakura, Hideya Matsubara
  • Publication number: 20090295500
    Abstract: A radio frequency power splitter/combiner employs a multilayer printed circuit board (PCB). A first power splitter/combiner section is formed on a first layer of the multilayer PCB and has signal propagation traces coupling a first major port to a first pair of minor ports. A second power splitter/combiner section is formed on a second layer of the multilayer PCB and has signal propagation traces coupling a second major port to a second pair of minor ports. At least one signal ground is formed on one or more layers of the multilayer PCB intermediate the first layer and the second layer. The at least one signal ground isolates the first power splitter/combiner section from the second power splitter/combiner section.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 3, 2009
    Inventor: Fred H. Ives
  • Patent number: 7626473
    Abstract: Provided is a signal transmission line for a millimeter-wave band. The signal transmission line includes: a dielectric substrate; an input line formed on the dielectric substrate; a pair of serial transmission lines formed on the dielectric substrate, the serial transmission lines being branched at, separated from, and electromagnetically connected in series with one end of the input line; a pair of parallel transmission lines respectively formed on the dielectric substrate at both sides of the input line and the serial transmission lines, and having both ends separated from and electromagnetically connected in parallel with one end of each of the input line and the serial transmission lines; and a pair of wires electrically connected between the other ends of the parallel transmission lines and a connection pad of a monolithic microwave integrated circuit (MMIC). An electrical signal of about 57 to 63 GHz generated from a monolithic microwave integrated circuit (MMIC) can be efficiently transferred.
    Type: Grant
    Filed: October 14, 2007
    Date of Patent: December 1, 2009
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Ho Young Kim, Hae Cheon Kim, Hyun Kyu Yu, Young Jun Chong
  • Patent number: 7605672
    Abstract: The present invention is directed to a balun that includes a first coupler structure having a first port of a balanced port pair and an unbalanced port. A second coupler structure includes a second port of the balanced port pair. The second coupler port structure being connected to the first coupler structure such that the second port of the balanced port pair is DC isolated from the first port of the balanced port pair without decoupling components.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: October 20, 2009
    Assignee: Anaren, Inc.
    Inventor: Niels H. Kirkeby
  • Publication number: 20090243753
    Abstract: Methods and systems for processing signals via power splitters embedded in an integrated circuit package may include generating via a power splitter, one or more RF signals proportional to one or more received RF signals. The power splitter may be integrated in a multi-layer package. The generated RF signals may be processed via an integrated circuit, which may be electrically coupled to the multi-layer package. The power splitters may include quarter wavelength transmission lines. The transmission lines may include a microstrip structure or a coplanar structure. The power splitters may be bonded to one or more capacitors in the integrated circuit. The capacitors may include CMOS devices in the integrated circuit. The power splitters may include lumped devices which may include surface mount devices coupled to the multi-layer package or devices within the integrated circuit, which may be flip-chip bonded to the multi-layer package.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 1, 2009
    Inventor: Ahmadreza Rofougaran
  • Patent number: 7579929
    Abstract: A small-sized, high-performance transmission circuit is provided which avoids degradation in transmission line characteristics caused by coupling, due to a transmission line and a leader electrode to an external electrode which are oppositely facing, of the electromagnetic field induced by the transmission line and the electromagnetic field induced by the leader electrode. In order to attain the aforementioned object, the present invention comprises a first shield layer which is a first ground electrode, a second shield layer which is a second ground electrode, and a spiral-shaped transmission line facing the first shield layer and the second shield layer which is disposed between the first shield layer and the second shield layer. The spiral portion of the transmission line, when viewed from the top face or the bottom face of the transmission line, is disposed on the inside of the first shield layer and the second shield layer.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: August 25, 2009
    Assignee: Hitachi Media Electronics Co., Ltd.
    Inventors: Osamu Hikino, Masashi Ohki, Hideaki Sunayama
  • Patent number: 7541892
    Abstract: According to one exemplary embodiment, a three-way splitter includes a printed element and a resistive network comprising discrete resistors. A first printed branch, second printed branch, and third printed branch distribute a received communication signal to respective outputs having substantially the same phase, frequency, and impedance. Each printed branch includes a number of substantially ninety-degree angles. In one embodiment, the printed branches are quarter wavelength transmission lines in a frequency range of 1.5 GHz. In one embodiment, the three-way splitter consumes less than one square inch of surface area on a printed circuit board, and can be used in a satellite receiving system, for example. In this embodiment, the three-way splitter is utilized for frequencies in the range of approximately 900 MHz to 2.2 GHz.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 2, 2009
    Assignee: Broadcom Corporation
    Inventor: Jose Ignacio Gorostegui
  • Patent number: 7528675
    Abstract: Disclosed are a microstrip-type BALUN (BALance to UNbalance transformer), broadcast receiving apparatus using the same, and a method for forming the same. The BALUN includes a board and a microstrip line formed on the board for transforming an input unbalanced signal into a balanced signal. Since the microstrip-type BALUN is realized by a microstrip line which is a distributed constant line, the microstrip-type BALUN has an excellent performance even for high-frequency signals. Similarly, a broadcast receiving apparatus to which a microstrip-type BALUN is applied also has an excellent performance for high-frequency broadcasting signals.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: May 5, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Bum-youl Bae
  • Patent number: 7483606
    Abstract: The present invention provides a splitter. The splitter includes a substrate and a layer formed on the substrate. The layer is patterned such that a signal applied to at least one input port is provided to a plurality of output ports. The relative power of the signal provided at each of the plurality of output ports is determined by at least one property of the substrate and at least one property of the layer.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: January 27, 2009
    Assignee: Alcatel-Lucent USA Inc.
    Inventor: Norbert Carsten Metz
  • Publication number: 20090009261
    Abstract: A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip transmission line and has upper opening parts corresponding in position to the branch lines. A lower ground layer is disposed under the strip transmission line and has lower opening parts corresponding in position to the branch lines. The upper and lower opening parts are symmetric about the branch lines of the strip transmission line.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 8, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Ki-Jae Song
  • Publication number: 20080315977
    Abstract: A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: Tessera, Inc.
    Inventors: Ronald Green, Belgacem Haba, David William Wallis, Nicholas J. Colella
  • Patent number: 7456704
    Abstract: A power combiner comprising an LC lattice structure is shown, together with a method for generating a planar wave front. The LC structure can comprise constant or voltage dependent capacitors. Either the delay or the characteristic impedance of the two-dimensional transmission line formed by the LC lattice structure are kept constant. A planar wave propagating along one direction of the transmission line gradually experiences higher impedances at the edges, creating a lower resistance path for the current in the middle. This funnels more power to the center as the wave propagates.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 25, 2008
    Assignee: California Institute of Technology
    Inventors: Ehsan Afshari, Harish Bhat, Seyed Ali Hajimi{grave over (r)}i
  • Publication number: 20080218294
    Abstract: According to one exemplary embodiment, a three-way splitter includes a printed element and a resistive network comprising discrete resistors. A first printed branch, second printed branch, and third printed branch distribute a received communication signal to respective outputs having substantially the same phase, frequency, and impedance. Each printed branch includes a number of substantially ninety-degree angles. In one embodiment, the printed branches are quarter wavelength transmission lines in a frequency range of 1.5 GHz. In one embodiment, the three-way splitter consumes less than one square inch of surface area on a printed circuit board, and can be used in a satellite receiving system, for example. In this embodiment, the three-way splitter is utilized for frequencies in the range of approximately 900 MHz to 2.2 GHz.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 11, 2008
    Inventor: Jose Ignacio Gorostegui
  • Patent number: 7400215
    Abstract: A power combining array and method of increasing performance in a power combining array includes a waveguide enclosure having a plurality of slotline modules disposed therein. The slotline modules include input and output antennas that have varying physical characteristics to overcome differences in field intensity across the slotline module configuration and to account for phase changes. The varying physical characteristics include differences in longitudinal position, thickness, dielectric constant, and circuit element configurations. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or the meaning of the claims.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: July 15, 2008
    Assignee: Wavestream Corporation
    Inventors: Blythe Chadwick Deckman, James Jordan Rosenberg, Chun-Tung Cheung, Michael Peter DeLisio, Jr.
  • Patent number: 7324060
    Abstract: An RF power divider circuit unequally divides an input signal into first and second signal components of unequal power. The circuit includes a single input port, first and second output ports, and a combination of a plurality of quarter wave transformers and a plurality of resistors coupled between the input port and the first and second output ports.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: January 29, 2008
    Assignee: Raytheon Company
    Inventors: Clifton Quan, Stephen M. Schiller, Yanmin Zhang
  • Patent number: 7301422
    Abstract: A variable differential phase shifter including an isolation element providing good isolation between output ports, good return loss and reduced reflections. In one embodiment a Wilkinson divider is incorporated in the wiper arm of a wiper type variable differential phase shifter. In another embodiment a linear phase shifter incorporates a Wilkinson divider. Multistage embodiments are also disclosed. The variable differential phase shifter may be used in combination with a hybrid coupler to provide an isolated variable power divider. The variable differential phase shifter may be utilized in a variety of feed networks and antenna arrays to vary beam tilt, beam azimuth and beam width. Antennas incorporating the phase shifter exhibit low variation of half power beam width with frequency and reduced side lobes.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: November 27, 2007
    Assignee: Andrew Corporation
    Inventors: Martin L. Zimmerman, Jonathon C. Veihl
  • Publication number: 20070229188
    Abstract: There is disclosed a microstrip transmission line device according to an embodiment of the invention which includes a substrate, a resistor layer, and a metal conductive layer. The substrate is made of an insulating or dielectric material and has a back face where a metal layer to be grounded is provided. The resistor layer is provided at a region on the substrate which requires a resistor. The metal conductive layer is provided on the substrate and connected to the resistor layer.
    Type: Application
    Filed: February 1, 2007
    Publication date: October 4, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kazutaka TAKAGI
  • Publication number: 20070216494
    Abstract: A monolithic thin film variable power divider is disclosed for variable power level distribution. The thin film power divider includes a substrate having a main surface, a first stage and a second stage, each formed as thin film networks on the main surface of the substrate. The first stage includes a plurality of transmission lines, at least one of the transmission lines having a variable dielectric deposition layer providing variable power level distribution. The variable dielectric deposition is a paraelectric, such as Barium-Strontium-Titanate. The second stage includes a hybrid combiner. The thin film power divider is capable of operating at frequencies extending into the millimeter wave spectrum. The thin film power divider provides a cost effective device that varies the balance of power through a multiport RF distribution network while simultaneously maintaining little, or low, frequency dispersion during the dynamic dissemination process.
    Type: Application
    Filed: June 20, 2006
    Publication date: September 20, 2007
    Inventors: William S. McKinley, Jeffery A. Dean