Stripline Patents (Class 333/128)
  • Patent number: 7663455
    Abstract: A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: February 16, 2010
    Assignee: TDK Corporation
    Inventors: Tomoyuki Goi, Hideaki Fujioka, Masami Itakura, Hideya Matsubara
  • Publication number: 20090295500
    Abstract: A radio frequency power splitter/combiner employs a multilayer printed circuit board (PCB). A first power splitter/combiner section is formed on a first layer of the multilayer PCB and has signal propagation traces coupling a first major port to a first pair of minor ports. A second power splitter/combiner section is formed on a second layer of the multilayer PCB and has signal propagation traces coupling a second major port to a second pair of minor ports. At least one signal ground is formed on one or more layers of the multilayer PCB intermediate the first layer and the second layer. The at least one signal ground isolates the first power splitter/combiner section from the second power splitter/combiner section.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 3, 2009
    Inventor: Fred H. Ives
  • Patent number: 7626473
    Abstract: Provided is a signal transmission line for a millimeter-wave band. The signal transmission line includes: a dielectric substrate; an input line formed on the dielectric substrate; a pair of serial transmission lines formed on the dielectric substrate, the serial transmission lines being branched at, separated from, and electromagnetically connected in series with one end of the input line; a pair of parallel transmission lines respectively formed on the dielectric substrate at both sides of the input line and the serial transmission lines, and having both ends separated from and electromagnetically connected in parallel with one end of each of the input line and the serial transmission lines; and a pair of wires electrically connected between the other ends of the parallel transmission lines and a connection pad of a monolithic microwave integrated circuit (MMIC). An electrical signal of about 57 to 63 GHz generated from a monolithic microwave integrated circuit (MMIC) can be efficiently transferred.
    Type: Grant
    Filed: October 14, 2007
    Date of Patent: December 1, 2009
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Ho Young Kim, Hae Cheon Kim, Hyun Kyu Yu, Young Jun Chong
  • Patent number: 7605672
    Abstract: The present invention is directed to a balun that includes a first coupler structure having a first port of a balanced port pair and an unbalanced port. A second coupler structure includes a second port of the balanced port pair. The second coupler port structure being connected to the first coupler structure such that the second port of the balanced port pair is DC isolated from the first port of the balanced port pair without decoupling components.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: October 20, 2009
    Assignee: Anaren, Inc.
    Inventor: Niels H. Kirkeby
  • Publication number: 20090243753
    Abstract: Methods and systems for processing signals via power splitters embedded in an integrated circuit package may include generating via a power splitter, one or more RF signals proportional to one or more received RF signals. The power splitter may be integrated in a multi-layer package. The generated RF signals may be processed via an integrated circuit, which may be electrically coupled to the multi-layer package. The power splitters may include quarter wavelength transmission lines. The transmission lines may include a microstrip structure or a coplanar structure. The power splitters may be bonded to one or more capacitors in the integrated circuit. The capacitors may include CMOS devices in the integrated circuit. The power splitters may include lumped devices which may include surface mount devices coupled to the multi-layer package or devices within the integrated circuit, which may be flip-chip bonded to the multi-layer package.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 1, 2009
    Inventor: Ahmadreza Rofougaran
  • Patent number: 7579929
    Abstract: A small-sized, high-performance transmission circuit is provided which avoids degradation in transmission line characteristics caused by coupling, due to a transmission line and a leader electrode to an external electrode which are oppositely facing, of the electromagnetic field induced by the transmission line and the electromagnetic field induced by the leader electrode. In order to attain the aforementioned object, the present invention comprises a first shield layer which is a first ground electrode, a second shield layer which is a second ground electrode, and a spiral-shaped transmission line facing the first shield layer and the second shield layer which is disposed between the first shield layer and the second shield layer. The spiral portion of the transmission line, when viewed from the top face or the bottom face of the transmission line, is disposed on the inside of the first shield layer and the second shield layer.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: August 25, 2009
    Assignee: Hitachi Media Electronics Co., Ltd.
    Inventors: Osamu Hikino, Masashi Ohki, Hideaki Sunayama
  • Patent number: 7541892
    Abstract: According to one exemplary embodiment, a three-way splitter includes a printed element and a resistive network comprising discrete resistors. A first printed branch, second printed branch, and third printed branch distribute a received communication signal to respective outputs having substantially the same phase, frequency, and impedance. Each printed branch includes a number of substantially ninety-degree angles. In one embodiment, the printed branches are quarter wavelength transmission lines in a frequency range of 1.5 GHz. In one embodiment, the three-way splitter consumes less than one square inch of surface area on a printed circuit board, and can be used in a satellite receiving system, for example. In this embodiment, the three-way splitter is utilized for frequencies in the range of approximately 900 MHz to 2.2 GHz.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 2, 2009
    Assignee: Broadcom Corporation
    Inventor: Jose Ignacio Gorostegui
  • Patent number: 7528675
    Abstract: Disclosed are a microstrip-type BALUN (BALance to UNbalance transformer), broadcast receiving apparatus using the same, and a method for forming the same. The BALUN includes a board and a microstrip line formed on the board for transforming an input unbalanced signal into a balanced signal. Since the microstrip-type BALUN is realized by a microstrip line which is a distributed constant line, the microstrip-type BALUN has an excellent performance even for high-frequency signals. Similarly, a broadcast receiving apparatus to which a microstrip-type BALUN is applied also has an excellent performance for high-frequency broadcasting signals.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: May 5, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Bum-youl Bae
  • Patent number: 7483606
    Abstract: The present invention provides a splitter. The splitter includes a substrate and a layer formed on the substrate. The layer is patterned such that a signal applied to at least one input port is provided to a plurality of output ports. The relative power of the signal provided at each of the plurality of output ports is determined by at least one property of the substrate and at least one property of the layer.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: January 27, 2009
    Assignee: Alcatel-Lucent USA Inc.
    Inventor: Norbert Carsten Metz
  • Publication number: 20090009261
    Abstract: A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip transmission line and has upper opening parts corresponding in position to the branch lines. A lower ground layer is disposed under the strip transmission line and has lower opening parts corresponding in position to the branch lines. The upper and lower opening parts are symmetric about the branch lines of the strip transmission line.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 8, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Ki-Jae Song
  • Publication number: 20080315977
    Abstract: A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: Tessera, Inc.
    Inventors: Ronald Green, Belgacem Haba, David William Wallis, Nicholas J. Colella
  • Patent number: 7456704
    Abstract: A power combiner comprising an LC lattice structure is shown, together with a method for generating a planar wave front. The LC structure can comprise constant or voltage dependent capacitors. Either the delay or the characteristic impedance of the two-dimensional transmission line formed by the LC lattice structure are kept constant. A planar wave propagating along one direction of the transmission line gradually experiences higher impedances at the edges, creating a lower resistance path for the current in the middle. This funnels more power to the center as the wave propagates.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 25, 2008
    Assignee: California Institute of Technology
    Inventors: Ehsan Afshari, Harish Bhat, Seyed Ali Hajimi{grave over (r)}i
  • Publication number: 20080218294
    Abstract: According to one exemplary embodiment, a three-way splitter includes a printed element and a resistive network comprising discrete resistors. A first printed branch, second printed branch, and third printed branch distribute a received communication signal to respective outputs having substantially the same phase, frequency, and impedance. Each printed branch includes a number of substantially ninety-degree angles. In one embodiment, the printed branches are quarter wavelength transmission lines in a frequency range of 1.5 GHz. In one embodiment, the three-way splitter consumes less than one square inch of surface area on a printed circuit board, and can be used in a satellite receiving system, for example. In this embodiment, the three-way splitter is utilized for frequencies in the range of approximately 900 MHz to 2.2 GHz.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 11, 2008
    Inventor: Jose Ignacio Gorostegui
  • Patent number: 7400215
    Abstract: A power combining array and method of increasing performance in a power combining array includes a waveguide enclosure having a plurality of slotline modules disposed therein. The slotline modules include input and output antennas that have varying physical characteristics to overcome differences in field intensity across the slotline module configuration and to account for phase changes. The varying physical characteristics include differences in longitudinal position, thickness, dielectric constant, and circuit element configurations. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or the meaning of the claims.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: July 15, 2008
    Assignee: Wavestream Corporation
    Inventors: Blythe Chadwick Deckman, James Jordan Rosenberg, Chun-Tung Cheung, Michael Peter DeLisio, Jr.
  • Patent number: 7324060
    Abstract: An RF power divider circuit unequally divides an input signal into first and second signal components of unequal power. The circuit includes a single input port, first and second output ports, and a combination of a plurality of quarter wave transformers and a plurality of resistors coupled between the input port and the first and second output ports.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: January 29, 2008
    Assignee: Raytheon Company
    Inventors: Clifton Quan, Stephen M. Schiller, Yanmin Zhang
  • Patent number: 7301422
    Abstract: A variable differential phase shifter including an isolation element providing good isolation between output ports, good return loss and reduced reflections. In one embodiment a Wilkinson divider is incorporated in the wiper arm of a wiper type variable differential phase shifter. In another embodiment a linear phase shifter incorporates a Wilkinson divider. Multistage embodiments are also disclosed. The variable differential phase shifter may be used in combination with a hybrid coupler to provide an isolated variable power divider. The variable differential phase shifter may be utilized in a variety of feed networks and antenna arrays to vary beam tilt, beam azimuth and beam width. Antennas incorporating the phase shifter exhibit low variation of half power beam width with frequency and reduced side lobes.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: November 27, 2007
    Assignee: Andrew Corporation
    Inventors: Martin L. Zimmerman, Jonathon C. Veihl
  • Publication number: 20070229188
    Abstract: There is disclosed a microstrip transmission line device according to an embodiment of the invention which includes a substrate, a resistor layer, and a metal conductive layer. The substrate is made of an insulating or dielectric material and has a back face where a metal layer to be grounded is provided. The resistor layer is provided at a region on the substrate which requires a resistor. The metal conductive layer is provided on the substrate and connected to the resistor layer.
    Type: Application
    Filed: February 1, 2007
    Publication date: October 4, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kazutaka TAKAGI
  • Publication number: 20070216494
    Abstract: A monolithic thin film variable power divider is disclosed for variable power level distribution. The thin film power divider includes a substrate having a main surface, a first stage and a second stage, each formed as thin film networks on the main surface of the substrate. The first stage includes a plurality of transmission lines, at least one of the transmission lines having a variable dielectric deposition layer providing variable power level distribution. The variable dielectric deposition is a paraelectric, such as Barium-Strontium-Titanate. The second stage includes a hybrid combiner. The thin film power divider is capable of operating at frequencies extending into the millimeter wave spectrum. The thin film power divider provides a cost effective device that varies the balance of power through a multiport RF distribution network while simultaneously maintaining little, or low, frequency dispersion during the dynamic dissemination process.
    Type: Application
    Filed: June 20, 2006
    Publication date: September 20, 2007
    Inventors: William S. McKinley, Jeffery A. Dean
  • Patent number: 7215220
    Abstract: A broadband power combining device includes an input port, an input waveguide section, a center waveguide section formed by stacked wedge-shaped trays, an output waveguide section, and an output port. Each tray is formed of a wedge-shaped metal carrier, an input antipodal finline structure, one or more active elements, an output antipodal finline structure, and attendant biasing circuitry. The wedge-shaped metal carriers have a predetermined wedge angle and predetermined cavities. The inside and outside surfaces of the metal carriers and surfaces of the cavity all have cylindrical curvatures. When the trays are assembled together, a cylinder is formed defining a coaxial waveguide opening inside. The antipodal finline structures form input and output arrays.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: May 8, 2007
    Assignee: Cap Wireless, Inc.
    Inventor: Pengcheng Jia
  • Patent number: 7205865
    Abstract: Disclosed is a high frequency omni-directional 2-way power divider which includes one input terminal and two output terminals so that a signal inputted through the input terminal is uniformly distributed to the two output terminals.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: April 17, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-II Kang, Kyung-Hun Jang, Hyo-Sun Hwang, Jun-Seok Park
  • Patent number: 7200365
    Abstract: The invention provides a composite high frequency component constituting a part of a microwave circuit having plural signal paths corresponding to their respective frequencies, comprising: a diplexer for coupling transmitting signals from the plural signal paths for transmission and distributing receiving signals into said plural signal paths for reception; plural high frequency switches for separating the plural signal paths into a transmission section and a reception section, respectively; plural filters introduced in the signal paths; said diplexer, said high frequency switch, and said filters being integrated into a ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. According to the above described composite high frequency component, the diplexer, the high frequency switches, and the filters which constitute the composite high frequency component are integrated into the ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: April 3, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Watanabe, Koji Tanaka, Koji Furutani, Hideki Muto, Takanori Uejima, Norio Nakajima
  • Patent number: 7164903
    Abstract: An integrated N-way Wilkinson power divider is described. In one embodiment, the N-way Wilkinson power divider uses a conductor layer with a cross-over (or cross-under) resistor insulated from the conducting layer by an insulating bridge. In one embodiment, the width of the transmission line underneath a cross-over resistor is adjusted to improve performance In one embodiment, a three-way Wilkinson power divider is formed using microstrip transmission lines on a single-layer substrate that supports the microstrip transmission lines, dielectric insulators, and resistors.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: January 16, 2007
    Assignee: Smiths Interconnect Microwave Components, Inc.
    Inventors: Richard Cliff, Michael J. Kettner, Robert J. Wright, Andrew J. Kettner, Patrick A. Biebersmith, Juan G. Ayala
  • Patent number: 7151423
    Abstract: A demultiplexer receives a multiplexed signal, in which a plurality of electrical signals with mutually different frequencies are multiplexed together, and divides the multiplexed signal into the electrical signals. The demultiplexer includes at least one line for propagating the multiplexed signal and a plurality of resonators arranged along the line. The dispersion characteristic of the line has a nonlinear portion, caused by electromagnetic coupling between the line and the resonators, and the phase velocities of the electrical signals which propagate through the line change according to their frequencies.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: December 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Ushio Sangawa, Hiroshi Kanno, Kazuyuki Sakiyama, Tomoyasu Fujishima
  • Patent number: 7151421
    Abstract: The present invention provides a coupler having a high degree of coupling. The coupler comprises first and second dielectric substrates each having first and second surfaces which are parallel to each other. A ground conductor is formed on the first surface of the first dielectric substrate, and two coupling line conductors and are formed on the second surface of the second dielectric substrate close to each other so as to be electromagnetically coupled to each other. Via conductors and are filled in through holes passing through the second dielectric substrate, and are placed and connected to the two coupling line conductors so as to enhance the degree of electromagnetic coupling, thereby increasing the opposing areas between the coupling line conductors to increase the capacitance.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: December 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Munehiro Shinabe, Yasushi Ono
  • Patent number: 7123884
    Abstract: A radio frequency (RF) switch which is used in an RF unit of a communication apparatus and which has less of an insertion loss during a transmission. A strip line disposed in the RF switch is formed by combining first and second strip lines having different values of characteristic impedance from each other.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: October 17, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd
    Inventors: Hideaki Nakakubo, Tomoyuki Iwasaki
  • Patent number: 7030715
    Abstract: There is provided a high-frequency GaAs power FET element with high performance, capable of suppressing an abnormal oscillation. Thin film resistors are provided so as to be connected electrically between incoming distributed constant lines connected electrically to FET chips, and thin film resistors are provided so as to be connected electrically between outgoing distributed constant lines electrically connected to FET chips. An unnecessary roundabout power is consumed by the thin film transistors in the incoming distributed constant lines and the outgoing distributed constant lines.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: April 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Maeda, Shigeru Morimoto
  • Patent number: 7026889
    Abstract: A device for feeding signals between a common line and two or more ports. The device including a branched network of feedlines coupling the common line with the ports. The feedlines have transformer portions of varying width for reducing reflection of signals passing through the network. A dielectric member is mounted adjacent to the network and can be moved to synchronously adjust the phase relationship between the common line and one or more of the ports. The dielectric member also has transformer portions for reducing reflection of signals passing through the network. At least one of the junctions of the network does not overlap with the dielectric member, or overlaps a region of reduced permittivity.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: April 11, 2006
    Assignee: Andrew Corporation
    Inventor: Victor Aleksandrovich Sledkov
  • Patent number: 7023295
    Abstract: A photonic band gap coplanar waveguide transmission line and a method for fabricating a power divider using the same capable of increasing a characteristic impedance, increasing a signal line width of the transmission line and providing high power, includes: a ground conductive layer formed on a substrate; linear grooves formed on the ground conductive layer; a signal line formed between linear grooves; rectangular grooves formed close to the signal line, and formed on the ground conductive layer; and slots formed at the rectangular grooves respectively, and connecting the rectangular groove and the linear groove.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: April 4, 2006
    Assignee: LG Electronics Inc.
    Inventors: Young-Joon Ko, Jae-Yeong Park
  • Patent number: 7015772
    Abstract: A tunable amplitude unbalance stripline combiner for RF signals in which the amplitude unbalance can be adjusted in order to minimize the amplitude unbalance. The combiner has an upper printed circuit board mounted over a lower printed circuit board. The lower printed circuit board has a pair of printed circuit lines that are connected between an output port and a pair of input ports. The upper printed circuit board has a metallized area covering the top surface. Several non-metallized cavities are located in the metallized area above the circuit lines. The number of cavities can be adjusted to change the amplitude unbalance.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: March 21, 2006
    Assignee: Scientific Components Corporation
    Inventor: Daxiong Ji
  • Patent number: 7005726
    Abstract: A semiconductor device with integrated circuits includes superimposed layers provided at different levels on a substrate, and including a metal strip (3) formed in a reference layer and through which an electric current passes, a metal ground plane (4) formed in a layer situated at a level lower than the reference layer and having a slit (5) which lies below the strip while running alongside it, an electrostatic shield (6) formed in a layer located at a level lower than the ground plane and comprising a multiplicity of spaced out bands (7), made of an electrically-conducting material, that extends across the slit, and conducting junctions (4a, 4b) making it possible to electrically connect the ends of each band to the parts of the ground plane situated on either side of its slit.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: February 28, 2006
    Assignee: STMicroelectronics SA
    Inventor: Jean-Francois Carpentier
  • Patent number: 6980066
    Abstract: It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: December 27, 2005
    Assignee: TDK Corporation
    Inventors: Shinya Nakai, Yoshinari Yamashita, Hideaki Ninomiya
  • Patent number: 6922116
    Abstract: Disclosed are systems and methods which apply design criteria to beam forming network parameters to arrive at a passive beam forming network design. Preferably a beam forming network approach is implemented in two primary stages. Operation of the aforementioned first primary stage may provide a branching configuration which determines how the weights of a desired radiation pattern weight set are allocated in the beam forming network. Preferably, branching nodes are configured to substantially equally distribute power splitting/combining the branches of a node. The aforementioned second primary stage operates to determine the actual physical layout of the various components. Preferably, each branching node is analyzed to determine an optimal physical layout configuration with respect thereto.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: July 26, 2005
    Assignee: Kathrein-Werke KG
    Inventors: Scot D. Gordon, Mitch S. Kaplan
  • Patent number: 6903625
    Abstract: A microwave signal combiner having a dielectric board with a main line on one surface and a plurality of cascaded input lines on a second, and opposite surface. The second surface includes a ground plane while the first surface is devoid of any ground plane. The combiner may be mounted at right angles to another circuit board with the provision of L-shaped mounting brackets secured at first and second ends of the dielectric board.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 7, 2005
    Assignee: Northrop Grumman Corporation
    Inventor: Paul M. Esker
  • Patent number: 6861923
    Abstract: The invention relates to a power management arrangement which comprises, formed as a multilayer structure (100), several insulating layers (130, 132, 134, 136); several conductive layers (124, 126, 128) functioning as reference planes; a first port (101), a second port (102) and a third port (104); a first transmission line (106) from the first port (101) to the second port (102), a second transmission line (108) from the first port (101) to the third port (104); means (110, 112, 114, 122) for connecting the transmission lines (106, 108) to the ports (101, 102, 104); and at least one passive element (116) between the second and the third port (102, 104). In the presented power management arrangement, the first transmission line (106) is in an insulating layer (130, 132, 134, 136) other than the one where the second transmission line (108) is.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: March 1, 2005
    Assignee: Nokia Corporation
    Inventors: Jari Kolehmainen, Ilpo Kokkonen
  • Patent number: 6847813
    Abstract: A radio frequency connector that protrudes through a printed circuit board is comprised of threaded leads. A center conductor is shielded when a shielding connector cap, having a threaded inner portion, screws onto the threaded leads.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: January 25, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Timothy Harold Ashley, Mitchell Johnson
  • Patent number: 6838955
    Abstract: The invention relates to methods and structures for connecting circuits and circuit elements processing electrical signals having very fast transition times, including sub-nanosecond transition times. It includes a connecting structure for connecting a multiplicity of signal lines at a common point to reduce unwanted reflections thereat; a single or multi-conductor female connector for receiving thin elements such as ribbon cable ends, printed circuit (PC) board edges, and the like; a structure for connecting together a multiplicity of ribbon cables terminating in such multi-conductor female connectors, and a further structure for connecting together a multiplicity of such multi-cable connectors to obtain maximum packing thereof, and minimum conductor lengths thereto, to obtain processing rates up to twenty-fold over what is available with present connecting methods and structures.
    Type: Grant
    Filed: August 23, 1996
    Date of Patent: January 4, 2005
    Assignee: Hub Technologies, Inc.
    Inventor: Peter M. Compton
  • Publication number: 20040239444
    Abstract: A device for feeding signals between a common line and two or more ports. The device including a branched network of feedlines coupling the common line with the ports. The feedlines have transformer portions of varying width for reducing reflection of signals passing through the network. A dielectric member is mounted adjacent to the network and can be moved to synchronously adjust the phase relationship between the common line and one or more of the ports. The dielectric member also has transformer portions for reducing reflection of signals passing through the network. At least one of the junctions of the network does not overlap with the dielectric member, or overlaps a region of reduced permittivity.
    Type: Application
    Filed: February 19, 2004
    Publication date: December 2, 2004
    Inventor: Victor Aleksandrovich Sledkov
  • Publication number: 20040233024
    Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.
    Type: Application
    Filed: May 22, 2003
    Publication date: November 25, 2004
    Inventors: Antonio Almeida, Shankar Joshi, Meta Rohde, Mahadevan Sridharan
  • Patent number: 6822531
    Abstract: Switchable path length coupler/dividers. Coupler/divider operation over multiple frequency bands is provided by using switchable path lengths. In one implementation, a Wilkinson-style device with switches to select different path lengths and therefore operating frequencies. In a rat-race style device, switches select races of different lengths, and therefore operating frequencies.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: November 23, 2004
    Assignee: Agilent Technologies, Inc.
    Inventor: Brian W. Carlson
  • Patent number: 6819202
    Abstract: A power splitter that has a small package size and low cross-talk noise. The power splitter includes a low temperature co-fired ceramic (LTTC) substrate with several layers. Electrical components such as transmission lines and resistors are integrated onto and within the LTCC substrate. The power splitter provides impedance matching and dividing functions. The LTCC substrate has counter rotating spiral shaped circuit lines and electrically conductive vias extending therethrough. The vias are used to connect the power splitter to an external printed circuit board. The vias are also used to make electrical connections between the layers of the LTCC substrate. The counter rotating circuit lines allow the power splitter to have a small package size and low cross-talk noise.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: November 16, 2004
    Assignee: Scientific Components
    Inventor: Loren Ralph
  • Patent number: 6803837
    Abstract: A balun design incorporating the functions of a splitter (combiner) which can be employed in a high power amplifier circuit configuration. The balun is formed of a dielectric multilayer board with conductor patterns on each conductor pattern layer. The balun includes the propagation of a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal. The balun provides the output signals at the first and second opposite-phase output terminals 180° out of phase employing through holes in the main line and coupling lines for promoting electromagnetic coupling therebetween.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: October 12, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaoru Ishida, Masayuki Miyaji, Hiroaki Kosugi, Shin'ichi Kugou
  • Publication number: 20040174231
    Abstract: There is provided a high-frequency GaAs power FET element with high performance, capable of suppressing an abnormal oscillation. Thin film resistors are provided so as to be connected electrically between incoming distributed constant lines connected electrically to FET chips, and thin film resistors are provided so as to be connected electrically between outgoing distributed constant lines electrically connected to FET chips. An unnecessary roundabout power is consumed by the thin film transistors in the incoming distributed constant lines and the outgoing distributed constant lines.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 9, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Maeda, Shigeru Morimoto
  • Patent number: 6784758
    Abstract: A wave device for supporting electromagnetic waves, the device including a first pair of inputs for setting up a first standing wave therebetween a second pair of inputs for setting up a second standing wave therebetween and positioned such that the input signal of each of the first and second pairs of inputs is unaffected by the other of the first and second pairs of inputs and an output positioned so as to receive power from both the first and second standing waves.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: August 31, 2004
    Assignee: ISIS Innovation Limited
    Inventors: David John Edwards, Alan Peter Jenkins, Yit Aun Lim
  • Publication number: 20040160293
    Abstract: A photonic band gap coplanar waveguide transmission line and a method for fabricating a power divider using the same capable of increasing a characteristic impedance, increasing a signal line width of the transmission line and providing high power, includes: a ground conductive layer formed on a substrate; linear grooves formed on the ground conductive layer; a signal line formed between linear grooves; rectangular grooves formed close to the signal line, and formed on the ground conductive layer; and slots formed at the rectangular grooves respectively, and connecting the rectangular groove and the linear groove.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Inventors: Young-Joon Ko, Jae-Yeong Park
  • Patent number: 6778037
    Abstract: The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out1) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips (311) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece (301) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components (321) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: August 17, 2004
    Assignee: Nokia Corporation
    Inventors: Olli Salmela, Esa Kemppinen, Markku Koivisto, Hans Somerma, Pertti Ikäläinen, Petri Savolainen
  • Publication number: 20040145428
    Abstract: A waterproof splitter box includes a hollow casing with threaded sleeves integrally extending out of the hollow casing, plastic inserts each securely received in a corresponding one of the threaded sleeves, rubber plugs each having a top portion, a mediate portion and a bottom portion which is received in a corresponding one of the plastic inserts, connecting blades each extending into a corresponding one of the plastic inserts and out of the rubber plug which is received in the plastic insert and signal wires each extending and connecting to a corresponding one of the connecting blades for transmitting a signal. The engagement between the connecting blade and the rubber plug prevents moisture from entering the hollow casing so that the transmitted signal is steady.
    Type: Application
    Filed: January 2, 2004
    Publication date: July 29, 2004
    Inventor: Jui-Huang Chung
  • Publication number: 20040080380
    Abstract: A device for conditioning a signal includes a hybrid phase shifter and power divider. The power divider circuit includes a transmission line with an input port and two asymmetrical output ports, a first ground plane, a second ground plane, and a first dielectric region. The variable phase shifter includes the transmission line and a dielectric slab disposed to be variably positioned in the first dielectric region. The position of the dielectric slab in relation to the power divider circuit determines the amount of phase shift in the signal. With the above configuration, the invention requires much less space and reduces the number of parts and cable interconnects.
    Type: Application
    Filed: October 29, 2002
    Publication date: April 29, 2004
    Applicant: RADIO FREQUENCY SYSTEMS; INC.
    Inventor: Ronald A. Marino
  • Patent number: 6703909
    Abstract: The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: March 9, 2004
    Assignee: TDK Corporation
    Inventors: Taro Miura, Yoshikazu Fujishiro
  • Patent number: 6690249
    Abstract: A high power amplifier has a first balun propagating a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal; first and second power amplifier circuits connected to the first and second opposite-phase output terminals of the first balun and having the same characteristics; a third power amplifier circuit connected to the in-phase output terminal of the first balun and having output power substantially twice as much as the output power of the first or second power amplifier circuit; and a second balun having first and second opposite-phase input terminals for receiving the outputs of the first and second power amplifier circuits, having an in-phase input terminal for receiving the output of the third power amplifier circuit, combining the outputs of t
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: February 10, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaoru Ishida, Masayuki Miyaji, Hiroaki Kosugi, Shin'ichi Kugou
  • Publication number: 20040021527
    Abstract: Switchable path length coupler/dividers. Coupler/divider operation over multiple frequency bands is provided by using switchable path lengths. In one implementation, a Wilkinson-style device with switches to select different path lengths and therefore operating frequencies. In a rat-race style device, switches select races of different lengths, and therefore operating frequencies.
    Type: Application
    Filed: July 31, 2002
    Publication date: February 5, 2004
    Inventor: Brian W. Carlson