Stripline Patents (Class 333/128)
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Patent number: 6690249Abstract: A high power amplifier has a first balun propagating a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal; first and second power amplifier circuits connected to the first and second opposite-phase output terminals of the first balun and having the same characteristics; a third power amplifier circuit connected to the in-phase output terminal of the first balun and having output power substantially twice as much as the output power of the first or second power amplifier circuit; and a second balun having first and second opposite-phase input terminals for receiving the outputs of the first and second power amplifier circuits, having an in-phase input terminal for receiving the output of the third power amplifier circuit, combining the outputs of tType: GrantFiled: March 22, 2002Date of Patent: February 10, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kaoru Ishida, Masayuki Miyaji, Hiroaki Kosugi, Shin'ichi Kugou
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Publication number: 20040021527Abstract: Switchable path length coupler/dividers. Coupler/divider operation over multiple frequency bands is provided by using switchable path lengths. In one implementation, a Wilkinson-style device with switches to select different path lengths and therefore operating frequencies. In a rat-race style device, switches select races of different lengths, and therefore operating frequencies.Type: ApplicationFiled: July 31, 2002Publication date: February 5, 2004Inventor: Brian W. Carlson
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Patent number: 6686810Abstract: A device having a capacitor for changing the impedance of a section of a coplanar waveguide is provided, the capacitance of the capacitor being changeable, the signal line of the section of the waveguide being interrupted for a predefined length, a first connection connecting the ground lines of the waveguide, and the second connection connecting both parts of the interrupted signal line.Type: GrantFiled: July 17, 2002Date of Patent: February 3, 2004Assignee: Robert Bosch GmbHInventors: Roland Mueller-Fiedler, Thomas Walter, Markus Ulm
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Publication number: 20030227352Abstract: The invention relates to a power management arrangement which comprises, formed as a multilayer structure (100), several insulating layers (130, 132, 134, 136); several conductive layers (124, 126, 128) functioning as reference planes; a first port (101), a second port (102) and a third port (104); a first transmission line (106) from the first port (101) to the second port (102), a second transmission line (108) from the first port (101) to the third port (104); means (110, 112, 114, 122) for connecting the transmission lines (106, 108) to the ports (101, 102, 104); and at least one passive element (116) between the second and the third port (102, 104). In the presented power management arrangement, the first transmission line (106) is in an insulating layer (130, 132, 134, 136) other than the one where the second transmission line (108) is.Type: ApplicationFiled: March 18, 2003Publication date: December 11, 2003Inventors: Jari Kolehmainen, Ilpo Kokkonen
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Patent number: 6642819Abstract: A dielectric transmission line bend structure includes an electrically conductive strip that forms a bend (e.g., a right angle bend). The inner edge of the bend includes a plurality of curved and/or straight line segments that result in the inner edge extending along a circuitous path in order to thereby reduce transmission line loss. A T-type junction includes a first or left side inner edge bending to the left and a second or right side inner edge bending to the right, with both inner edges including segments that result in greater inner edge lengths in order to increase current path lengths along the inner edges and thereby help reduce transmission line loss. A method of designing a transmission line bend structure includes the step of providing a preliminary bend structure design having an electrically conductive strip with at least one inner edge extending along a circuitous path between first and second inner edge end points on the strip.Type: GrantFiled: February 21, 2002Date of Patent: November 4, 2003Assignee: Anokiwave, Inc.Inventors: Nitin Jain, Nenad Djapic
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Publication number: 20030194985Abstract: A reception frequency band is selected at 11.7 GHz-12.2 GHz, the local oscillating frequencies of local oscillators are determined at 10.75 GHz and 13.85 GHz, respectively, and each intermediate frequency band is selected at 950 MHz-1450 MHz and 1650 MHz-2150 MHz, respectively, so that the harmonic component of the frequency difference between local oscillation signals output from each local oscillator is not present in the frequency band of each intermediate frequency signal output from each mixer and in the reception band of polarization signals applied to input terminals.Type: ApplicationFiled: April 15, 2003Publication date: October 16, 2003Inventor: Makio Nakamura
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Patent number: 6622370Abstract: A method for fabricating a suspended transmission line includes supporting a first conductive trace on a first side of a dielectric support layer. A second conductive trace is supported on a second side of the support layer. The first and second conductive traces are connected at spaced intervals. A first spacer is formed outwardly of the first side of the support layer A second spacer is formed outwardly of the second side of the support layer. A first plate is disposed outwardly of the first spacer and includes a first ground plane displaced from the first conductive trace. A second plate is disposed outwardly of the second spacer and includes a second ground plane displaced from the second conductive trace.Type: GrantFiled: April 13, 2000Date of Patent: September 23, 2003Assignee: Raytheon CompanyInventors: James R. Sherman, Ray B. Jones, Barry B. Pruett
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Patent number: 6614325Abstract: A Printed Circuit Board (PCB) (30, 70, 102) and method of manufacturing same. The PCB (30, 70, 102) includes an embedded shielded conductor structure comprising a dielectric layer (42) disposed over a first conductor (40, 80, 84), and a second conductor (38, 78, 82) proximate and coupled to said first conductor (40, 80, 84) being disposed over said dielectric layer (42). The first (40, 80, 84) and second (38, 78, 82) conductors are juxtaposed to form a broadside coupled stripline. A first low noise ground layer (54, 94) is disposed under said first conductor (40, 80, 84), and a second low noise ground layer (52, 92) is disposed over said second conductor (38, 78, 82), these low noise ground layers typically being coupled to chassis ground. RF (32, 72) and digital (34, 74) portions of the PCB (30, 70, 102) are separated and isolated by a vertical ground shield (36, 76). The use of heavy, bulky RF connectors and cables may be eliminated or reduced.Type: GrantFiled: August 31, 2000Date of Patent: September 2, 2003Assignee: Northrop Grumman CorporationInventor: Michael J. Kocin
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Patent number: 6608535Abstract: A suspended transmission line with an embedded signal channeling device includes a support layer and a conductor supported by the support layer between first and second plates each having a ground plane. The conductor includes a combined signal line and a plurality of discrete signal lines extending from the combined signal line. The discrete signal lines each transmit a portion of a signal transmitted on the combined signal line. A propagation structure is disposed between the first and second plates to substantially contain an electromagnetic field generated by the propagating signal.Type: GrantFiled: July 26, 2002Date of Patent: August 19, 2003Assignee: Raytheon CompanyInventors: James R. Sherman, Elvin C. Chou
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Patent number: 6570466Abstract: An ultra broadband traveling wave divider/combiner (TWD/C) with a two section power splitter with an isolation resistor connected in series with a capacitor across the outputs of each set of transmission lines in the first and second sections. The TWD/C may be formed on a GaAs substrate in MMIC realization. The transmission lines may be formed using microstrip lines on a dielectric. A capacitor may be used with an input impedance step down unit to increase the bandwidth of the TWD/C.Type: GrantFiled: September 1, 2000Date of Patent: May 27, 2003Assignee: Tyco Electronics Logistics AGInventor: Inder J. Bahl
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Patent number: 6549090Abstract: A coplanar coupler for use with microstrip input and output ports includes a printed circuit substrate in which first and second metal input ports are formed on a top surface and cooperate with a metal layer on the bottom surface as microstrip lines, and first and second metal output ports formed on the top surface which cooperate with the metal layer on the bottom surface as microstrip lines. The metal layer on the bottom surface functions as a ground plane for the input ports and the output ports, the metal layer being removed in a coupler region underlying at least portions of the metal input and output ports and extending therebetween. First and second metal lines are formed on the bottom surface in the coupler region and function as a coplanar coupler for the input and output ports. Electrical vias in the substrate interconnect the ports and the coplanar coupler.Type: GrantFiled: July 19, 2001Date of Patent: April 15, 2003Assignee: Cree Microwave, Inc.Inventor: Emil James Crescenzi, Jr.
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Patent number: 6542048Abstract: A suspended transmission line with an embedded signal channeling device includes a support layer and a conductor supported by the support layer between first and second plates each having a ground plane. The conductor includes a combined signal line and a plurality of discrete signal lines extending from the combined signal line. The discrete signal lines each transmit a portion of a signal transmitted on the combined signal line. A propagation structure is disposed between the first and second plates to substantially contain an electromagnetic field generated by the propagating signal.Type: GrantFiled: April 13, 2000Date of Patent: April 1, 2003Assignee: Raytheon CompanyInventors: James R. Sherman, Elvin C. Chou
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Patent number: 6538528Abstract: The present invention relates to a T-circuit produced using microstrip technology with two branches (2, 3) of identical length L2 comprising a phase-shifting element (6) producing a given phase shift &PHgr; by extending one of the branches, the T-circuit operating in broadband, the circuit comprises at least one elbow (4) extending the branch (3) without the phase-shifting element and the length L2 is equal to a multiple of &lgr;g/2 where &lgr;g is the guided wavelength.Type: GrantFiled: June 28, 2001Date of Patent: March 25, 2003Assignee: Thomson Licensing S.A.Inventors: Ali Louzir, Philippe Minard, Jean-François Pintos
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Publication number: 20030042992Abstract: A component that includes a first structure that is integrated with a second structure. The first structure is a lumped balanced to unbalanced circuit (balun) and the second structure is a resonator-based filter. The function of the balun is to move a signal from a differential form to a single ended form or from a single ended form to a differential form. The component has an area that is comparable to the area needed to implement the balun alone. However, the component now provides a filter function. Preferably, the substrate of the first structure also acts as a substrate for the second structure.Type: ApplicationFiled: August 30, 2001Publication date: March 6, 2003Inventor: Michael L. Frank
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Patent number: 6525623Abstract: A multi-layer circuit comprises first and second transmission lines. The first transmission line includes vertically stacked bottom and middle dielectric layers. A conductive pattern is disposed between the bottom and middle dielectric layers. A bottom ground layer is in contact with a bottom surface of the bottom dielectric layer. The second transmission line is vertically stacked above the first transmission line and includes a top dielectric layer and a conductive pattern in contact with a top surface of the top dielectric layer and at least one ground layer separating a bottom surface of the top dielectric layer from the middle dielectric layer. At least one plated through hole electrically connects the first and second transmission lines. All of the dielectric layers comprise a ceramic-filled substrate with woven glass reinforcement.Type: GrantFiled: June 8, 2001Date of Patent: February 25, 2003Assignee: Synergy Microwave CorporationInventors: Mahadevan Sridharan, Vasanth Munikoti
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Patent number: 6525631Abstract: A microstrip termination is provided with a thin film resistor connecting a transmission line to a tapered edge ground, enabling high frequency performance, such as for optical modulators. The tapered edge ground is formed with metal deposited on a substrate edge between a top surface of a substrate containing the transmission line with thin film resistor, and a bottom surface with a metal coating forming a ground plane. The tapered edge is cut at an angle in the range of 30 degrees with respect to the top surface. The microstrip termination provides a wider bandwidth of impedance matching than a standard microstrip termination.Type: GrantFiled: September 21, 2001Date of Patent: February 25, 2003Assignee: Anritsu CompanyInventor: William W. Oldfield
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Patent number: 6515557Abstract: A signal divider/combiner (11) and method combines first and second frequency signals received by microstrip patch antennas (58, 48). A first transmission line stub (28) blocks the second frequency signals on the first signal receiving path, and a second transmission line stub (20) blocks the first frequency signals on the second signal receiving path providing increased signal levels at a receiver input (10). In one embodiment, the transmission line stubs are open-circuit stubs and are positioned a quarter-wavelength from a combining junction (12) formed from stripline transmission lines (14, 32, 50). The transmission line stubs (28, 20) also reduce radiation of the first frequency signal by the second antenna as well as radiation of the second frequency signal by the first antenna. In one embodiment, the first and second frequency signals are the L1 and L2 signals provided by the Global Positioning System.Type: GrantFiled: August 13, 2001Date of Patent: February 4, 2003Assignee: Raytheon CompanyInventors: Chad M. Wangsvick, Gary M. Salvail, Mark E. Kusbel
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Publication number: 20020180557Abstract: A suspended transmission line with an embedded signal channeling device includes a support layer and a conductor supported by the support layer between first and second plates each having a ground plane. The conductor includes a combined signal line and a plurality of discrete signal lines extending from the combined signal line. The discrete signal lines each transmit a portion of a signal transmitted on the combined signal line. A propagation structure is disposed between the first and second plates to substantially contain an electromagnetic field generated by the propagating signal.Type: ApplicationFiled: July 26, 2002Publication date: December 5, 2002Applicant: Raytheon Company, a Delaware CorporationInventors: James R. Sherman, Elvin C. Chou
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Patent number: 6489859Abstract: The prior art has a problem in which an isolation between output terminals is deteriorated when a thin film resistor is used as an isolation resistor. Such being the case, in a power divider/combiner comprising an input terminal, two output terminals, two branch lines each connecting the input terminal and one of the output terminals and having a line length that is ¼ of a set wavelength or a multiple of integer of half a wavelength and ¼ of the set wavelength, and an isolation resistor connected to between the output terminals, there is provided an improved power divider/combiner further comprising a transmission line interposed between each of the output terminals and the branch lines. Consequently, even when using the isolation resistor having a length that can not be ignored as compared with a wavelength of a high-frequency signal in use, the isolation between the output terminals can be ensured.Type: GrantFiled: February 11, 2000Date of Patent: December 3, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yukihiro Tahara, Hideyuki Oh-Hashi, Moriyasu Miyazaki
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Patent number: 6477060Abstract: A printed circuit board utilizes asymmetric striplines to accommodate a large number of transmission lines on a six-layer board. The asymmetric striplines are formed from two signal layers that are sandwiched between two reference planes such that the traces in each signal layer form asymmetric striplines with the two reference planes. Two additional signal layers are arranged on the outside of the reference planes so as to form microstrips with the reference planes.Type: GrantFiled: June 30, 2000Date of Patent: November 5, 2002Assignee: Intel CorporationInventors: Erik W. Peter, Jeffrey M. Shuey, Ronald Martin
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Publication number: 20020158706Abstract: An antenna element comprises a housing (2) having a base (4) adapted for attachment to a vehicle windscreen. Antenna elements are provided on printed circuit boards (7a, 7b) and form a dipole, the elements defining an included angle (A) of approximately 140°. When mounted on the inside surface of a vehicle windscreen, an improved radiation pattern is exhibited compared with a planar antenna. A coaxial cable (13) having inner and outer conductors coupled to the boards (7a, 7b) at their apex is routed in spaced relation to the element (7a) connected to the inner conductor. In such a manner that currents tending to be induced in the outer conductor of the coaxial cable are cancelled as a result of the proximity of the cable (13) to the element (7a). This enables the coaxial cable to be matched to the impedance of the antenna without the need for a balun.Type: ApplicationFiled: December 31, 2001Publication date: October 31, 2002Inventors: David John Edwards, Alan Peter Jenkins, Yit Aun Lim
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Patent number: 6441696Abstract: The present invention relates to a balun circuit that includes means for transforming a balanced input signal to an unbalanced signal and impedance changing means. The means for transforming the balun input signal to an unbalanced output signal is a &lgr;/2-waveguide (30). A first side of the &lgr;/2-waveguide (30) is connected to a second port (P2) of the balun circuit, while a second side of said &lgr;/2-waveguide (30) is connected to a third port (P3) of the balun circuit. The impedance changing means is a &lgr;/4-waveguide (40) of which a first side is connected to a second side of the &lgr;/2-waveguide (30) and a second side is connected to the first port (P1) of the balun circuit.Type: GrantFiled: July 7, 2000Date of Patent: August 27, 2002Assignee: Telefonaktiebolaget L M Ericsson (publ)Inventor: David Westberg
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Publication number: 20020024405Abstract: The present invention relates to a T-circuit produced using microstrip technology with two branches (2, 3) of identical length L2 comprising a phase-shifting element (6) producing a given phase shift &PHgr; by extending one of the branches, the T-circuit operating in broadband, the circuit comprises at least one elbow (4) extending the branch (3) without the phase-shifting element and the length L2 is equal to a multiple of &lgr;g/2 where &lgr;g is the guided wavelength.Type: ApplicationFiled: June 28, 2001Publication date: February 28, 2002Inventors: Ali Louzir, Philippe Minard, Jean-Francois Pintos
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Publication number: 20020008599Abstract: A circuit and method of making a multi-layer circuit including a microstrip and stripline.Type: ApplicationFiled: June 8, 2001Publication date: January 24, 2002Inventors: Mahadevan Sridharan, Vasanth Munikoti
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Patent number: 6335662Abstract: The invention discloses the utilization of various transmission lines that entail a ferroelectric material as dielectric substrate to introduce an impedance shift by means of an externally applied d.c. bias, which alters the effective length between the input and output signals of the transmission lines of microwave couplers.Type: GrantFiled: September 21, 1999Date of Patent: January 1, 2002Assignee: The United States of America as represented by the Secretary of the ArmyInventors: Romeo D. Del Rosario, Jr., Steven C. Tidrow
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Patent number: 6335664Abstract: A circuit assembly having a thin and large-area dielectric substrate and improved grounding. To make the assembly, a circuit board comprising the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the substrate. A bath of conductive bonding material (e.g., a low melting point solder) is made inside a tray-like metal chassis of the assembly. The circuit board is floated on the bath and excessive portion of the conductive material is absorbed. A branch circuit for branching a first path into at least two second paths is provided by mainly using impedance transformers but by using fewest possible stub(s). Also, the elements are arranged in symmetry around the axis through the first path. This yields a wide operating frequency band. A waveguide-microstrip line transition that is easy to work and low in transition loss is provided by shaping the wider walls of the ridge waveguide so as to spread out toward the end.Type: GrantFiled: April 13, 1999Date of Patent: January 1, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ushio Sangawa, Suguru Fujita
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Patent number: 6333682Abstract: A conductive element (FIG. 1, 220) incorporates a wide end portion (230) which is subdivided into a set of low impedance coupling paths (235) separated by one of the planar grooves (250). Each of the low impedance coupling paths (235) is suitable for coupling to a corresponding solid-state amplifier device (210). Power from each solid-state amplifier device (210) is combined at a narrow end portion (240) and conveyed to a transmission line (260). The high frequency low loss power combiner requires minimal integrated circuit chip area and can be designed and fabricated using existing microstrip analysis and design tools. Additionally, the substantially fully metallic structure provides additional excess heat dissipation through increased surface area over that of the Wilkenson power combiner. Further, due the broad conductive path formed by the conductive element, resistive losses are also minimized, thus increasing overall device efficiency.Type: GrantFiled: January 13, 2000Date of Patent: December 25, 2001Assignee: Motorola, Inc.Inventors: Warren Leroy Seely, Jay Chae Pyon
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Patent number: 6331807Abstract: A balanced and active coplanar microwave coupler for an MMIC, comprising FETs provided with metal grid, source, and drain electrodes integrated with coplanar plane metal elements combined to constitute the inlet and outlet accesses of the coupler. All of the access are constituted by an association comprising one or more CPSes and one or more CPWs.Type: GrantFiled: October 4, 1999Date of Patent: December 18, 2001Assignee: AlcatelInventors: Didier Prieto, Eric Rogeaux, Jean-Francois Villemazet, Thierry Parra
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Patent number: 6326863Abstract: The present matching circuit chip has an integrated shape comprising a first transmission line, a second transmission line and a third transmission line, wherein one end of the first transmission line, one end of the second transmission line and one end of the third transmission line are connected to one another, a first filter connection terminal is connected to the other end of the first transmission line, an antenna terminal is connected to the other end of the second transmission line, and a second filter connection terminal is connected to the other end of the third transmission line, whereby the second transmission line converts the characteristic impedances of the first and third transmission lines so that the impedance matching between the antenna terminal and the first filter connection terminal can be attained, and so that the impedance matching between the antenna terminal and the second filter connection terminal can be attained.Type: GrantFiled: December 18, 1998Date of Patent: December 4, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Kushitani, Toru Yamada, Naoki Yuda, Toshio Ishizaki, Hideaki Nakakubo, Makoto Fujikawa
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Patent number: 6259335Abstract: An umbrella-shaped matching network (10, 14, 16) for matching phase and impedance in a power amplifier (2). The matching network (10, 14, 16) employs rounded corners (22). The rounded corners (22) reduce microwave signal scattering losses, because they are less prone to signal radiation than square corner power combining networks. The matching network (10, 14, 16) includes slits (24) defining separated arms (26). The slits (24) are positioned in such a way that they provide phase and amplitude balance for the signal presented to the amplifiers (2). The slits (24) also prevent current from traveling transversely.Type: GrantFiled: August 10, 1999Date of Patent: July 10, 2001Assignee: TRW Inc.Inventors: Daisy L. Ingram, Huan-Chun Yen, Yaochung Chen
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Patent number: 6259337Abstract: A coplanar waveguide structure for use in constructing a monolithic microwave integrated circuit high power amplifier. The coplanar waveguide structure is a coplanar transmission line segment having more than two ground plane electrodes and a plurality of signal/dc current carrying electrodes. The current carrying electrodes are each separated from an adjacent ground plane electrode by a gap. The coplanar waveguide structure forms a shunt inductor for the monolithic microwave integrated circuit high power amplifier. The electrodes are shorted at one end to form the shunt inductor. A center ground plane electrode is preferably at least twice the width of the signal carrying electrode. The gaps between the signal carrying electrode and the ground electrodes are preferably at least one half the width of the signal carrying electrode to minimize current crowding.Type: GrantFiled: August 19, 1999Date of Patent: July 10, 2001Assignee: Raytheon CompanyInventor: Cheng P. Wen
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Patent number: 6130585Abstract: A stripline cross-over architecture includes a first stripline layer extending on a first side of a dielectric layer between a first signal input port and a plurality of first signal output ports. A second stripline layer extends on a second side of the dielectric layer between a second signal input port and a plurality of second signal output ports, crossing over the first stripline layer at a plurality of cross-overs of mutual overlap therebetween. The electrical lengths of the stripline layers are defined and the cross-overs are located such that electrical distances between the cross-overs and signal combination locations cause cross-coupled signals to cancel one another, when non cross-coupled signals are combined in phase.Type: GrantFiled: January 22, 1998Date of Patent: October 10, 2000Assignee: Harris CorporationInventors: Walter M. Whybrew, Jeffery C. May, Douglas E. Heckaman
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Patent number: 6121853Abstract: A broadband coupled-line N-way power combiner is presented for combining N RF signals into a common load. This combiner includes N.gtoreq.2 input ports, a common output port, and N identical at least two-conductor coupled transmission lines, and N isolating resistors. Each of these two-conductor coupled transmission line has at one end one conductor connected to one of the input port of the power combiner, and another conductor connected to the common output port. At another end two conductors of each two-conductor coupled transmission line are terminated to one of the N isolating resistors. The opposite ends of these resistors are connected to each other in a ring. This power combiner also can operate in reverse as N-way power divider.Type: GrantFiled: October 28, 1998Date of Patent: September 19, 2000Assignee: Apti, Inc.Inventor: Simon Y. London
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Patent number: 6121854Abstract: A power divider includes an input port, a first output port, a second output port, a first transformer coupled between the input port and the first output port, and a second transformer coupled between the input port and the second output port. The first and second transformers each incorporates a low pass filter. The power divider further includes a ground plate disposed adjacent to the first and second transformers. The ground plate is capacitively coupled to the low pass filters of the first and second transformers for enhancing the low pass filtering characteristics of the power divider. The power divider provides low pass filtering capability while achieving a significant size reduction over conventional power dividers.Type: GrantFiled: April 19, 1999Date of Patent: September 19, 2000Assignee: Digital Microwave CorporationInventors: Robert K. Griffith, Roland Matian
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Patent number: 6118353Abstract: A power divider/combiner for dividing received powers at 4 input ports, transmitting the divided powers to each of 4 output ports and combining the transmitted powers at each of the output ports. The power divider combiner has through transmission lines flanked on either side by secondary through transmission lines that interconnect corresponding input and output ports. The through transmission lines are likewise interconnected at a center node by a plurality of branch transmission lines. A method for making a power divider/combiner includes merging two 0 dB couplers by joining the center points of each of the branch transmission lines.Type: GrantFiled: February 17, 1999Date of Patent: September 12, 2000Assignee: Hughes Electronics CorporationInventor: James P. McKay
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Patent number: 6097267Abstract: The invention is a device that provides a phase-tunable antenna feed network that allows beam-steering and beam-width variation with simple actuation, at low cost, and with high rf performance. The device provides a series-feed where signal power splitters and phase-shifters are alternately disposed in series. Each phase-shifter consists of reflection-mode phase-shifter elements that operate in conjunction with an isolation device. This avoids the critical resonance condition between periodically aligned phase-shifters over the entire tuning range, since the isolation devices can easily be matched and/or aligned with non-resonant spacing. The main feed-line interconnections have the same impedance, thereby enabling the utilization of the same phase-shifter design for the entire network. Moreover, a common driving mechanism can be used for the phase-shifters to steer the antenna beam.Type: GrantFiled: September 4, 1998Date of Patent: August 1, 2000Assignee: Lucent Technologies Inc.Inventor: Karl Georg Hampel
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Patent number: 6097260Abstract: A distributed ground pad-based isolation arrangement for a multilayer stripline architecture is configured to effectively inhibit the mutual coupling of signals between overlapping regions of adjacent stripline networks of dielectrically separated transmission networks, without substantially increasing either the mass of the laminate structure or the lossiness of the stripline. At regions of mutual overlap, the stripline layers are spatially oriented at right angles to one another, and a limited area ground pad is interleaved between the stripline layers. To maintain the desired characteristic line impedance of a stripline layer as it passes over a ground pad, the width of the stripline layer is reduced in the overlap region. Each ground pad is connected to an external ground reference by plated vias, that extend through the dielectric layers and intersect outer grounded shielding layers of the laminate.Type: GrantFiled: January 22, 1998Date of Patent: August 1, 2000Assignee: Harris CorporationInventors: Walter M. Whybrew, Jeffery C. May, Douglas E. Heckaman
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Patent number: 6081565Abstract: A digital automatic gain control circuit for a receiver includes an averaging block and an adjustment block. The averaging block receives a length of a digital sample stream that represents an incoming analog signal and produces an absolute average signal. The adjustment block receives the absolute average signal and a reference signal and outputs an adjustment signal for controlling gain. The adjustment signal is based on a difference between the absolute average signal and the reference signal. In an alternative embodiment, a method of controlling gain according to the invention includes the steps of calculating an absolute average of an incoming signal, and comparing the absolute average to a reference to produce an adjustment signal based on a difference between the absolute average and the reference.Type: GrantFiled: February 5, 1998Date of Patent: June 27, 2000Assignee: Lucent Technologies Inc.Inventors: Vahid Marandi, Mohammad Shafiul Mobin, Kalyan Mondal, Akkas T. Sufi
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Patent number: 6078965Abstract: A branched transmission line, used for delivering control signals to integrated memory circuits. Memory circuits require control signals, which are delivered on control lines. If multiple memory circuits are involved, multiple control lines are used. If the multiple control lines branch from a common branch point on a supply line, undesirable reflections can occur. The invention reduces the reflections, by distributing the branching, as by starting with three initial branches, each of which branches into three other branches, in order to feed nine memory circuits.Type: GrantFiled: December 8, 1997Date of Patent: June 20, 2000Assignee: Intel CorporationInventors: Richard I. Mellitz, Roy M. Stevens
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Patent number: 6078227Abstract: A dual quadrature branchline in-phase power combiner and power splitter provides a low cost and symmetrical structure for combining power from two signal ports (20, 30, FIG. 1) to an output signal port (10). When used as a power splitter, the structure accepts power from a signal port and divides the power equally and in-phase between the output signal ports (20, 30). The structure can be fabricated using microstrip, stripline, or similar technology such as suspended stripline. The structure is well matched over a large bandwidth and provides high isolation between the splitter output signal ports (20, 30).Type: GrantFiled: August 24, 1998Date of Patent: June 20, 2000Assignee: Motorola, Inc.Inventors: Kenneth Vern Buer, Dean Lawrence Cook
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Patent number: 6054906Abstract: An RF power divider is provided for use in a UHF-band high-power amplifier of a radio transmitter. The RF power divider includes: a single input port; first and second output ports; a first microstrip line coupled to the input port; first and second coils coupled in parallel to an output side of the first microstrip line; a second microstrip line coupled between an output side of the first coil and the first output port; a third microstrip line coupled between an output side of the second coil and the second output port; a first capacitor coupled between a ground and a contact point of the first microstrip line and the first and second coils; a resistor coupled between a contact point of the first coil and the second microstrip line, and a contact point of the second coil and the third microstrip line; and a second capacitor coupled in parallel to the resistor. Accordingly, the present invention provides a Wilkinson power divider implemented in a concentrated integer equivalent circuit, in which .lambda.Type: GrantFiled: March 17, 1998Date of Patent: April 25, 2000Assignee: Samsung Electronics Co., Ltd.Inventor: Wook Kim
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Patent number: 6043722Abstract: A broad band phase shifter of the present invention can be used in a microstrip conductor and includes a power divider disposed along a microstrip conductor. The power divider has first and second outputs. A reference transmission line is disposed on the microstrip conductor and connected to the first output of the power divider. A phase shift filter device is disposed on the microstrip conductor and connected to the second output of the power divider. The phase shift filter device comprises a 180 degree phase shift coupled line structure formed of a first substantially linear 90 degree phase shift parallel line section, and a second substantially linear 90 degree phase shift parallel line section coupled to the first parallel line section. The first and second 90 degree phase shift parallel line sections have parallel lines that are spaced about five mils apart. The first and second 90 degree phase shift parallel line sections also have parallel lines that are offset to each other.Type: GrantFiled: April 9, 1998Date of Patent: March 28, 2000Assignee: Harris CorporationInventors: Roy Vaninetti, Gregory Marquardt, Christopher Gregorean
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Patent number: 6037845Abstract: An RF three-way combiner/splitter is disclosed that can be fabricated in a single signal layer on a PCB and which has better separation of the outputs and improved location of ballast resistors. The combiner/splitter includes seven one-quarter wave-length trace segments joined to form a structure in a general shape of a figure eight. The seven one-quarter wave-length trace segments connect to form six connection ports, wherein a first and second connection port is above and below a central input port and three output ports are disposed on the opposite side of the structure. A first ballast resistor is coupled to the first connection port and a second ballast resistor is coupled to the second connection port. The trace segments may be straight or some of the trace segments may be folded to decrease the physical length of the combiner/splitter.Type: GrantFiled: December 22, 1997Date of Patent: March 14, 2000Assignee: Nokia Telecommunications, OYInventor: Gerry Allen Parker
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Patent number: 6028494Abstract: A stripline isolation cross-over is configured to cancel signals that may be mutually coupled at cross-over points between adjacent stripline networks within a compact multilayer signal distribution architecture, such as one feeding elements of phased array antennas, without a shielding layer between adjacent signal distribution networks. The signal distribution networks includes layers of stripline, patterned on opposite sides of a dielectric layer. Wherever the stripline layers mutually overlap, they are oriented at right angles to one another, and one of the striplines is configured as a pair of power dividers, connected back-to-back via stripline interconnect passing the other stripline layer, to form a signal splitting-recombining stripline pair.Type: GrantFiled: January 22, 1998Date of Patent: February 22, 2000Assignee: Harris CorporationInventors: Jeffery C. May, Walter M. Whybrew, Douglas E. Heckaman
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Patent number: 6005454Abstract: A radio frequency (RF) power divider/combiner circuit prevents an unbalance in current consumption according to a variation of the load, and reduces size of a power amplifier when employed therein. In an exemplary embodiment, the RF power divider/combiner circuit includes an input terminal, first and second output terminals, a first microstrip line connected to the input terminal and a second microstrip line vertically connected to the first microstrip line. A first capacitor is connected between a middle of the second microstrip line and ground. A first inductor has a first end connected to an end of the second microstrip line, a second inductor has an end connected to another end of the second microstrip line, and a second capacitor is connected between a second end of the first inductor and a second end of the second inductor.Type: GrantFiled: August 8, 1997Date of Patent: December 21, 1999Assignee: Samsung Electronics Co., LtdInventor: Cheol-Hoo Kim
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Patent number: 6005442Abstract: A divider/combiner circuit for dividing or combining radio frequency power applicable to communication units utilizing a microwave band or the like. The divider/combiner circuit includes first, second and third nodes with a first transmission line electrically coupled to the first node and to the second node. In addition, the divider/combiner circuit includes a second transmission line electrically coupled to the first node and to the third node. An adjusting circuit is electrically coupled to the second node and to the third node. The adjusting circuit includes a resistance and a phase shifter. The resistance is located between points having substantially equal phases with respect to the second node and to the third node, respectively.Type: GrantFiled: March 24, 1997Date of Patent: December 21, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahiro Maeda, Shigeru Morimoto
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Patent number: 5994976Abstract: A multi-tap is described having two compartments, a microstrip in each compartment for conducting RF signals and AC power from an input at one end of the multi-tap to a first output port at the other end, a cover for each compartment having a circuit thereon that is substituted for the microstrip in a compartment when the cover closes that compartment, a device near the first output port that can be adjusted to direct RF signals and AC power passing through the microstrips to a point other than the first output port and additional microstrips for conducting RF signals and AC power from that point, when the RF signals and AC power are present thereat, to a second output port located near the input port. Grounding shields are provided for shorting the additional microstrips when the device is adjusted to deliver RF signals and AC power to the first output port. When the cover of a compartment is closed, it activates a switches formed in part by ends of the microstrips.Type: GrantFiled: July 31, 1998Date of Patent: November 30, 1999Inventor: Danny Q. Tang
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Patent number: 5986616Abstract: An antenna system for a radio communication device, in particular a hand-portable telephone, having communication circuits and to be operating by circularly-polarized radio waves. In the system (1) there is provided a radiation means, preferably helical elements (2, 3, 4), a feeding network (8) having first coupling means (9) adapted for coupling to said communication circuits and second coupling means coupled to said helical elements (2, 3, 4). The interface means includes a closed resonator means (14), which has at least a first portion associated with said first coupling means (9), and having separated at least second (11), third (12) and fourth (13) portions forming said second coupling means (11, 12, 13).Type: GrantFiled: December 30, 1998Date of Patent: November 16, 1999Assignee: Allgon ABInventor: Olov Edvardsson
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Patent number: 5982192Abstract: A high speed bus circuit system according to the present invention includes a bus having alternately connected resistors and transmission lines, and integrated circuits. Each of the resistors has a predetermined resistance value. The transmission lines are mounted on print circuit boards. The bus is connected in a loop form as a whole. Each of the integrated circuits has a driver and a receiver. The driver and receiver are connected to respective one of the resistors. As a result, DC power dissipation in the terminal resistor of the bus circuit is suppressed. In addition, high speed signal transfer causing less waveform distortion is made possible.Type: GrantFiled: January 30, 1998Date of Patent: November 9, 1999Assignee: Mitsubishi Denki Kabushiki KaishaInventor: Seiichi Saito
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Patent number: 5983089Abstract: First and second slotlines are mounted on an electrically insulating substrate having a planar face with a connection region. Each slotline has first and second, spaced-apart coplanar conductors that extend into the connection region. A fifth, ground conductor, also mounted on the substrate face, is spaced from and coplanar with the first and second slotlines and has a proximal portion in the connection region. A chip circuit includes first and second field-effect transistors (FETs) flip mounted in the connection region to all five conductors. The gates of the FETs are connected to the first slotline for receiving an input signal. The drains are connected to the second slotline for outputting the signal amplified by the transistors. The sources of the FETs are connected to the fifth conductor. This general configuration can be modified for use as an amplifier, oscillator, frequency multiplier or mixer.Type: GrantFiled: October 4, 1996Date of Patent: November 9, 1999Assignee: Endgate CorporationInventors: Clifford A. Mohwinkel, Edward B. Stoneham, Edwin F. Johnson