Abstract: In order to reduce the parts required for matching of an SAW filter module, the SAW filter module 10 obtains matching for coupling SAW filters 10A to 10D with RF-IC 20 using impedance matching circuits 11A to 11D. The real part of output impedance Z saw of the SAW filter is closely matched with the real part of input impedance Zic of an RF-IC. The impedance matching circuit modifies the imaginary part of the output impedance Zm of the SAW filter module according to the imaginary part of the input impedance Zic of the RF-IC 20. The impedance matching circuit composed of one piece of inductance or capacitor, or a plurality of inductors or capacitors in parallel connection, ans formed as a print pattern on a module substrate, in which the real part R saw and the real part Ric are in a relation nearly of 0.8 Ric<R saw<1.2 Ric.

Abstract: A component includes a filter having a first structure and a second structure. The component also includes a substrate on which the first and second structures are arranged. The first structure has an approximately uniform layer thickness and an approximately uniform composition. The second structure has an approximately uniform layer thickness and an approximately uniform composition. At least one of the layer thickness or composition of the first structure differs from the layer thickness or composition of the second structure.

Abstract: A SAW duplexer includes a first SAW filter having a passband with a relatively low frequency, and a second SAW filter having a passband with a relatively high frequency. The first and second SAW filters each have a ladder-shaped circuit configuration. A bridging inductor is connected in parallel to at least one serial arm resonator in the second SAW filter. The bridging inductor includes a coiled portion provided on a multilayer package substrate. The coiled portion is defined by connecting first to third wires provided on first to third layers by via-hole conductors. First, third, and fifth via-hole conductors that define a coil return wire portion are disposed inside the coiled portion.

Abstract: An acoustic wave device includes a piezoelectric substrate, a resonator having comb electrodes that are provided above the piezoelectric substrate and excite an acoustic wave, and a capacitor that is provided above the piezoelectric substrate and is connected in series or parallel with the resonator, the capacitor including electrodes that horizontally face each other above the piezoelectric substrate. The electrodes of the capacitor are further from the piezoelectric substrate than the comb electrodes of the resonator.

Abstract: A duplexer includes two surface acoustic wave (SAW) filters having different center frequencies; a phase matching circuit that matches phases of the two SAW filters; a package in which the SAW filters and the phase matching circuit are housed, the package being composed of multiple layers; and a line pattern provided between at least one of the SAW filters and at least one of a transmit terminal and a receive terminal of the duplexer. The line pattern runs on at least two of the multiple layers within a range defined by peripheral ground patterns provided in the package.

Abstract: An acoustic wave filter device having a greatly reduced size includes a balance-unbalance conversion function and an input/output impedance ratio of about 1. The acoustic wave filter device includes a second IDT of a first acoustic wave filter portion that is connected to an unbalanced terminal. The second IDT includes first and second divided IDT portions which are divided in an overlap width direction and connected in series with each other between the unbalanced terminal and a ground potential. A fifth IDT of a second acoustic wave filter portion connected to the first acoustic wave filter portion includes first and second divided IDT portions which are divided in an acoustic wave propagating direction. The first and second divided IDT portions of the fifth IDT are connected to first and second balanced terminals, respectively.

Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.

Abstract: A surface acoustic wave resonator has a piezoelectric substrate (11), an IDT (13) formed of a plurality of electrode fingers (12) disposed on piezoelectric substrate (11), and reflectors (14) disposed near the opposite ends of IDT (13). The IDT (13) has a gradation region where the electrode finger pitch of the plurality of electrode fingers (12) at the opposite ends is different from the electrode finger pitch near the center of the IDT (13). In this gradation region, the electrode finger pitches are sequentially varied in the range from the electrode finger at the farthest end that is one end of the gradation region to the electrode finger lying at the other end of the gradation region. The electrode finger pitch of the electrode fingers at the farthest end that is one end of the gradation region is set to be 1 through 5% smaller than the electrode finger pitch near the center of the IDT (13).

Abstract: A multi-channel surface acoustic wave (SAW) filter includes a voltage controlled velocity tunable piezoelectric substrate, an input transducer fabricated on the substrate, and an output transducer fabricated on the substrate. The input transducer further includes multiple input sub-transducers that are electrically and physically connected in parallel. The output transducer further includes multiple output sub-transducers that are electrically and physically connected in parallel. Corresponding pairs of input sub-transducers and output sub-transducers form multiple parallel channels for SAW propagation. The input transducer produces a voltage controlled tunable COMB frequency response that is combined with a voltage controlled tunable COMB frequency response produced by the output transducer to produce a SAW filter voltage controlled tunable frequency response.

Abstract: An acoustic wave filter device includes a plurality of acoustic wave filters disposed on the same piezoelectric substrate, and achieves enlargement of out-of-passband attenuation without a large increase in its size. For at least the first acoustic wave filter, ends of second IDTs and of third IDTs connected to first and second balanced terminals, the ends being connected to a ground potential, are connected to a common connection line, the common connection line is connected to a ground terminal by a ground line, and a distance between a connection point, at which the ground line is connected to the common connection line, and the first balanced terminal, and a distance between the connection point and the second balanced terminal, is the same or substantially the same.

Abstract: An acoustic wave device includes: a piezoelectric substrate; at least five IDTs (InterDigital Transducers) arranged on the substrate in directions of SAW (Surface Acoustic Wave) propagation; and two balanced terminals connected to two first IDTs that are two out of the at least five IDTs and are 180 degrees out of phase. One of a pair of comb electrodes of one of the two first IDTs is connected to one of the two balanced terminals, and one of a pair of comb electrodes of the other one of the two first IDTs being connected to the other one of the two balanced terminals. The other comb electrodes of the two first IDTs are connected in series, and one of a pair of comb electrodes that form an IDT that is included in the at least five IDTs and is not connected to the two first IDTs is grounded.

Abstract: A SAW filter comprises an IDT disposed on a piezo-electric substrate, wherein the IDT includes comb-shaped electrodes having a plurality of interdigital electrodes arranged in a propagation direction of surface acoustic waves and bus bars for connecting these interdigital electrodes, arranged in opposition, and the interdigital electrodes are crossed with one another. The IDT comprises one or more branch electrodes branched from the interdigital electrode and positioned in a non-overlap zone between an overlap zone at which the interdigital electrodes overlap and the bus bar, and the branch electrode includes a branch electrode body extending in a direction substantially orthogonal to the propagation direction of surface acoustic wave. The SAW filter can be applied to any of a longitudinally coupled multi-mode filter, a ladder type filter, a resonator, a filter having a resonator connected in series to a longitudinally coupled multi-mode filter, and the like.

Abstract: An acousto-optic modulator includes an acousto-optic bulk medium. A transducer is attached to the acousto-optic bulk medium and formed as a linear array of electrodes. A transducer driver is connected to each electrode and comprises a plurality of amplifiers connected to the electrodes such that each electrode is driven by a respective amplifier as a means to provide a low cost alternative to the use of higher power hybrid amplifiers in conventional AO device applications.

Abstract: An electric filter has a band-pass filter that includes a track with acoustically coupled electroacoustic transducers. The filter includes a band-stop filter with at least one electroacoustic series element and at least one electroacoustic parallel element. The series element of the band-stop filter is connected in series to at least one of the transducers of the band-pass filter. The parallel element of the band-stop filter is arranged in a shunt arm that is electrically connected to at least one of the transducers of the band-pass filter. In at least one of the electroacoustic elements of the band-stop filter, the resonance frequency and the anti-resonance frequency lie outside the passband of the band-pass filter.

Abstract: An apparatus in one example comprises a piezoelectric layer, an input transducer, an output transducer, and at least one electrode set. The input transducer is configured to convert an input signal from an input source to a surface acoustic wave and send the surface acoustic wave from an input portion of the piezoelectric layer to an output portion of the piezoelectric layer. The input transducer comprises a set of input passbands. The output transducer is configured to receive the surface acoustic wave from the output portion of the piezoelectric layer. The output transducer comprises a set of output passbands. The at least one electrode set is configured to apply at least one voltage bias to at least one portion of the piezoelectric layer to create an electric field that controls an acoustic velocity of the surface acoustic wave through the at least one portion of the piezoelectric layer.

Abstract: The invention relates to a piezoelectric component and a manufacturing method thereof, that includes: a first piezoelectric element composed of a piezoelectric substrate, comb-shaped electrodes formed on a principal surface of the piezoelectric substrate, and wiring electrodes having element wiring disposed adjacent to the comb-shaped electrodes; terminal electrodes formed on the piezoelectric substrate; and a plurality of second piezoelectric elements on the principal surfaces of which are formed solder electrodes which contact the terminal electrodes, and comb-shaped electrodes and wiring electrodes.

Abstract: A surface acoustic wave (SAW) expander based transmitter and correlator based receiver comprises SAW devices that perform expander or correlator functions based on the types of signals inputted to the SAW devices. The SAW devices incorporate chirp with adaptive interference and programmable coding capabilities. The SAW devices and method of operating the devices allow the implementation of very low power radios that overcome problems with temperature drift, lithography constraints and interference and jamming suffered by prior art implementations.

Abstract: A Q-factor of a resonator at a high frequency is improved. An insertion loss of a filter using such a resonator and steepness of the filter are improved. A plurality of surface acoustic wave resonators including an interdigital transducer and reflecting electrodes provided on both sides thereof are connected in parallel on a piezoelectric substrate. Resonance frequencies of the surface acoustic wave resonators are rendered equal among all the resonators connected in parallel. In this way, the Q-factor of the resonance can be improved. A surface acoustic wave filter using such surface acoustic wave resonators is formed in order to improve the insertion loss and the steepness.

Abstract: The invention refers to a method for the fabrication of a thin film acoustic reflector stack with alternating layers of a first and a second material having different acoustic characteristic impedances, wherein the layers are deposited alternately by a reactive pulsed dc magnetron sputtering process. The invention further comprises an acoustic reflector stack fabricated thereby and an arrangement for performing the method.

Abstract: A multi-band filter module and a method of fabricating the same are provided. The multi-band filter module includes a piezoelectric substrate, a first filter provided on the piezoelectric substrate, and a second filter provided adjacent to the first filter on the piezoelectric substrate, and operating in a frequency band that is lower than that of the first filter.

Abstract: To provide a transversal type filter having weighted finger electrodes of at least either of an input IDT and an output IDT provided on a piezoelectric substrate, in which a diffraction of elastic wave output from an end face of the weighted IDT electrode is suppressed, a band width is wide, and a high flatness and a high selectivity are realized. In at least either of an input IDT and an output IDT, an apodized region in which a weighting is performed by using an apodizing method with which an aperture of finger electrodes is continuously changed is formed on a center portion of the electrode with respect to a propagation direction of an elastic wave, and dog-leg regions in which a weighting is performed by using a dog-leg method with which the aperture is made into 1/n by floating electrodes to form n tracks are formed on both sides of the apodized region. Subsequently, finger electrodes in each track of the dog-leg region are further weighted by using the apodizing method.

Abstract: In order to reduce the parts required for matching of an SAW filter module, the SAW filter module 10 obtains matching for coupling SAW filters 10A to 10D with RF-IC 20 using impedance matching circuits 11A to 11D. The real part of output impedance Z saw of the SAW filter is closely matched with the real part of input impedance Zic of an RF-IC. The impedance matching circuit modifies the imaginary part of the output impedance Zm of the SAW filter module according to the imaginary part of the input impedance Zic of the RF-IC 20. The impedance matching circuit composed of one piece of inductance or capacitor, or a plurality of inductors or capacitors in parallel connection, ans formed as a print pattern on a module substrate, in which the real part R saw and the real part Ric are in a relation nearly of 0.8 Ric<R saw<1.2 Ric.

Abstract: A filter includes: a first acoustic wave filter having acoustic wave filters cascaded, an input stage of the acoustic wave filters including a first multimode filter; a second acoustic wave filter having acoustic wave filters cascaded, an input stage of these acoustic wave filters including a second multimode filter having an aperture length different from that of the first multimode filter, the second acoustic wave filter receiving an unbalanced in signal applied to the first acoustic wave filter, and having a pass band that does not overlap with that of the first acoustic wave filter.

Abstract: A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of the piezoelectric substrate from the one principal surface of the piezoelectric substrate, thereby forming a recessed portion including the bottom surface in which the IDT electrodes are embedded, and a step of bonding a cover member to the piezoelectric substrate.

Abstract: An acoustic wave element includes an IDT electrode in contact with a piezoelectric material and including a plurality of electrode fingers, which include first and second electrode fingers that adjoin each other in an acoustic wave propagation direction and that connect to different potentials and a first dummy electrode finger facing the first electrode finger via a gap located on an outer side in an electrode finger length direction of the first electrode finger. At an area near the gap, first protrusions are provided in at least one of the first electrode finger and the first dummy electrode finger, the first protrusion protruding in the acoustic wave propagation direction from at least one of side edges of the at least one of the first electrode finger and the first dummy electrode finger. The acoustic wave element has greatly improved resonance characteristics of a resonance frequency and prevents short-circuit failure between electrode fingers and degradation in insulation properties.

Abstract: A surface acoustic wave sensor or tag having multiple transducer/antenna pairs each having a different center frequency. The bandwidth of each transducer/antenna pair is inversely proportional to the number of transducer/antennas pairs used and the bandwidth is the sum of the bandwidth of the transducer/antenna pairs. Implementing a SAW sensor or tag with multiple transducer/antenna pairs significantly reduces device losses and improves the performance of the device since the individual transducer/antenna pair's fractional bandwidth is reduced by the ratio of the system bandwidth to the number of transducer antenna pairs used in the sensor.

Abstract: A boundary acoustic wave filter device capable of increasing an out-of-band attenuation includes a dielectric film formed on a piezoelectric substrate, at least one longitudinally coupled resonator boundary acoustic wave filter having a plurality of IDTs disposed along a boundary between the piezoelectric substrate and the dielectric film, and at least two one-terminal-pair boundary acoustic wave resonators. At least one boundary acoustic wave resonator is connected in series to the longitudinally coupled resonator boundary acoustic wave filter, and at least remaining one boundary acoustic wave resonator is connected in parallel to the longitudinally coupled resonator boundary acoustic wave filter.

Abstract: Disclosed is a spread spectrum clock generator which includes: a first delay control type oscillator that variably controls an oscillation period at a control period interval according to a control signal; a control circuit; a maximum modulation value determination circuit that determines a maximum modulation value from a predetermined value, a frequency control signal, and a given modulation degree setting signal; a modulation signal generation circuit that receives the maximum modulation value from the maximum modulation value determination circuit and generates a modulation control signal within the maximum modulation value; and a second delay control type oscillator that receives a value obtained by adding the modulation control signal from the modulation signal generation circuit to the frequency control signal as a control signal and variably controls the oscillation period of an output clock signal at the control period interval according to the control signal.

Abstract: An elastic wave duplexer includes a transmission filter chip and a reception filter chip each defined by an elastic wave filter chip and flip-chip bonded to a laminated board. A coil-shaped line including coil-shaped line patterns is provided inside the laminated board. The coil-shaped line defines an impedance matching circuit. In plan view, the transmission filter chip is disposed on one side of a center line passing through the approximate center of the laminated board and extending between a first edge and a second edge, and the reception filter chip is disposed on the other side of the center line. The coil-shaped line is disposed on the side on which the reception filter chip is disposed.

Abstract: A composite filter downsized without degrading its characteristics is disclosed. The filter includes a surface acoustic wave filter and a LC filter coupled to the surface acoustic wave filter. The LC filter is formed by combining a ?-shaped LC filter formed of two capacitors and an inductor coupled together in a ?-shape with a capacitor coupled in parallel to the inductor. The two capacitors of the ?-shaped LC filter are placed on a piezoelectric substrate with their comb-shaped electrodes opposed to each other. This opposing direction differs from an opposing direction of comb-shaped electrodes of a surface acoustic wave resonator.

Abstract: An acoustic wave filter apparatus includes first and second acoustic wave filter sections on one piezoelectric substrate, first balance terminals of the first and second acoustic wave filter sections are commonly coupled to each other, and second balance terminals thereof are commonly coupled to each other.

Abstract: A MEMS acoustic filter has a MEMS resonator and at least two acoustic I/O ports to alter an input acoustic signal to an output acoustic signal. The first I/O port is adapted for interfacing with a medium, and the second I/O port for passing an acoustic signal to an acoustic transducer. Multiple MEMS resonators may be stacked to form a high order acoustic filter. An array of MEMS acoustic filters may be designed to function as an acoustic lens. The MEMS acoustic filter is particularly useful with an ultrasonic transducer, such as PZT and MUT. Fabrication methods to make the same are also disclosed.

Abstract: An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.

Abstract: A second substrate 21 composed of a material having a lower dielectric constant than that of a piezoelectric substrate 2 having a transmission-side filter region 12 and a receiving-side filter region 13 formed therein is joined to the other main surface of the piezoelectric substrate 2, and a conductor layer 22 is formed throughout the other main surface of the second substrate 21. The effective dielectric constant of the substrate is reduced, thereby making it possible to reduce a parasitic capacitance formed between an input electrode section 5 in the transmission-side filter region 12 and an output electrode section 6 in the receiving-side filter region 13 and to improve isolation characteristics.

Abstract: Channel quality can be detected accurately in a wireless transmission system such as an HSDPA method. In the case of estimating a channel quality of a signal transmitted by a Code Division Multiple Access method and of estimating the channel quality in a system having a synchronization channel not orthogonal to a channel receiving data, a noise component of a desired channel is estimated; degree of a noise component caused by the synchronization channel is estimated with respect to the estimated noise; and a channel quality of a receiving channel is detected based on the estimated degree of the noise component.

Abstract: An acoustic wave filter device includes plural filter circuits between an input terminal and an output terminal. Plural inductors are connected in series in a series arm that connects the input terminal and the output terminal, and plural first acoustic wave resonators are connected between the series arm and a ground potential. Each of the filter circuits includes at least one of the inductors and one of the first acoustic wave resonators. A second acoustic wave resonator in the series arm connects adjacent filter circuits. The acoustic wave filter device has a pass band lower than a trap band, steep attenuation characteristics in a range from the pass band to the trap band, and is capable of providing a large amount of attenuation in the trap band.

Abstract: A filter device includes a circuit board having a pattern electrode; a substrate having a filter to which a signal line for inputting or outputting a signal and a reference potential line having a reference potential are connected, and a pad electrode connected to the filter, the substrate being mounted on the circuit board such that the pad electrode and the pattern electrode face each other; and a connection part formed of the pad electrode, the pattern electrode, and a conductive member formed between the pattern electrode and the pad electrode to electrically connect the pattern electrode to the pad electrode, wherein the connection part is arranged to connect the signal line to the reference potential line.

Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.

Abstract: An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.

Abstract: A surface acoustic wave device which uses a Rayleigh wave as a surface acoustic wave includes an IDT electrode provided on a piezoelectric substrate composed of quartz having Euler angles of (0°±5°, 0° to 140°, 0°±40°), a piezoelectric film composed of c-axis oriented ZnO arranged so as to cover the IDT electrode, and the piezoelectric film has a convex portion provided on a surface thereof corresponding to the thickness of the ID electrode. The IDT electrode is composed of a metal material primarily including Al, Au, Ta, W, Pt, Cu, Ni, or Mo, and when the wavelength of the surface acoustic wave is represented by ?, the primary metal of the IDT electrode, a normalized thickness of the IDT electrode normalized by the wavelength of the surface acoustic wave, and a normalized thickness of the piezoelectric film normalized by the wavelength of the surface acoustic wave are preferably set within the ranges of each combination shown in Table 1.

Abstract: A frequency hopping communications system is disclosed. A server is adapted to have one or more radio head interface modules and a call processing software module. The call processing software module performs modulation and demodulation of voice and data streams using one or more air interface standards. A radio head unit is coupled to the radio head interface module over one or more transport mediums and communicates with one or more subscriber units using the one or more air interface standards. The one or more radio head interface modules, are adapted to receive frequency channel hopping information, including a channel and a time to hop trigger, from the call processing software module for one or more of a plurality of communication channels.

Abstract: An electronic part includes a substrate, a comb-shaped electrode having a plurality of electrode fingers arranged parallel to one another on the upper surface of the substrate, and a protective film formed on the upper surface of the substrate so as to cover the comb-shaped electrode. The protective film has convex portions and concave portions. The convex portions are upwardly convex at the positions corresponding to the electrode fingers, and the concave portions are downwardly concave between the convex portions. The cross section of the protective film in the direction orthogonal to the extending direction of the electrode fingers has a downward convex curve between apex portions of the convex portions.

Abstract: An acoustic wave filter includes a piezoelectric substrate, an IDT (interdigital transducer) formed on the piezoelectric substrate, and reflectors located at both sides of the IDT and composed of electrode fingers, at least one of the electrode fingers of at least one of the reflectors including at least one gap within a propagation path of an acoustic wave.

Abstract: Disclosed are a piezoelectric substrate and a surface acoustic wave (SAW) filter. A piezoelectric substrate 10a includes a base member 11 including an oxide layer 12 with a plurality of grooves 12a on one surface of the base member 11; a buffer member 13 being formed on the oxide layer 12 to expose one end and another end of the oxide layer 12; an insulating member 14 being formed on another surface of the base member 11; and a piezoelectric member 15 being formed on the buffer member 13. A SAW filter using the piezoelectric substrate 10a, includes the base member 11 including the oxide layer 12 with the plurality of grooves 12a on one surface; the buffer member 13; the insulating member 14; the piezoelectric member 15; and a plurality of interdigital transducer (IDT) electrodes 17 and 17 being formed on the piezoelectric member 15 to receive an electrical signal, filter the electrical signal, and output the filtered electrical signal.

Abstract: An acoustic wave filter device having a balanced-to-unbalanced conversion function, in which the signal balance between a pair of balanced terminals is improved, has, on a piezoelectric substrate, one end of at least of one longitudinally coupled resonator type acoustic wave filter and one end of at least one acoustic wave filter among the rest of acoustic wave filters are commonly connected and connected to an unbalanced terminal, and the other ends of the longitudinally coupled resonator type acoustic wave filters are electrically connected to first and second balanced terminals, respectively, in which a signal input from the unbalanced terminal is configured such that the phase difference of a signal output from the first balanced terminal and a signal output from the second balanced terminal is approximately 180 degrees, and in which a propagation direction of an acoustic wave in the longitudinally coupled resonator type acoustic wave filter and a propagation direction of an acoustic wave in the second lo

Abstract: A code division multiple access (CDMA) communication system using spread spectrum signaling over a communication bandwidth uses two different signal spectra generated using two different respective spreading code formats, such as NRZ code formatting and staggered Manchester code formatting, for respectively providing nonsplit spectra having a center peak and split spectra having a center null. The spectra are combined during transmission as a CDMA communication signal having a composite spectrum. The use of different code formats produces the composite spectrum of respective center peak and center null spectra that enables increased channel capacity.

Abstract: An apparatus and method for channel estimation and CP reconstruction in an OFDM-STBC mobile communication system are provided. An ISI canceller cancels ISI signal components from first and second received symbol sequences. A cyclicity restorer cancels ICI signal components from the ISI-cancelled first received symbol sequence and the ISI-cancelled second received symbol sequence. A recoverer acquires the recovered sequence estimates of the ICI-cancelled first received symbol sequence and the ICI-cancelled second received symbol sequence by decoding. The ICI cancellation of the ISI-cancelled first and second received symbol sequences and the ISI cancellation of the second received symbol sequence are iterated a predetermined number of times.

Abstract: A piezoelectric device includes a piezoelectric substrate having a connection pad, a package having an electrode pad, and a connection member to connect the electrode pad to the connection pad, the connection member being a metal member having a plurality of spherical metal particles connected to each other by sintering.

Abstract: In a method for producing a boundary acoustic wave device that includes a first medium, a second medium, and a third medium laminated in that order, and electrodes disposed at the interface between the first medium and the second medium, the method includes the steps of preparing a laminate including the first medium, the second medium, and the electrodes disposed at the interface between the first medium and the second medium, adjusting the thickness of the second medium after the step of preparing the laminate to regulate a frequency or the acoustic velocity of a surface acoustic wave, a pseudo-boundary acoustic wave, or a boundary acoustic wave, after the adjusting step, forming the third medium different from the second medium in terms of the acoustic velocity with which the boundary acoustic wave propagates therethrough and/or in terms of material.

Abstract: A piezoelectric substrate is joined to a cover with a support layer disposed therebetween and with a space maintained therebetween. A transmission surface acoustic wave filter and a reception surface acoustic wave filter are disposed on a major surface of the piezoelectric substrate adjacent to the cover and inside the support layer. External electrodes are provided on the side of the cover opposite to the side facing the piezoelectric substrate. The external electrodes include an antenna terminal electrically connected to the transmission surface acoustic wave filter and the reception surface acoustic wave filter, a transmission input terminal electrically connected to the transmission surface acoustic wave filter, and a reception output terminal electrically connected to the reception surface acoustic wave filter. A portion of an interconnection line that electrically connects the reception surface acoustic wave filter to the antenna terminal is disposed on the cover.