Abstract: An RF assembly (20) operating at a predetermined wavelength of &lgr; and having a ground-plane interface (26) between first and second components (22, 24) is presented. A bond wire (48) couples the components (22, 24) along a bond-wire directrix (54). The components (22, 24) have grounding members (30, 32) establishing substantially coplanar ground planes (42, 44). The grounding members (30, 32) are coupled together so as to create a semi-cylindrical slot (28) having an opening (60) substantially coincident with the ground planes (42, 32). The slot 28 has an axis (66) proximate the bond-wire directrix (54), and a radius (68) substantially equal to &lgr;/2. The slot axis (66) and the bond-wire directrix (54) are located within a plane (56) substantially perpendicular to the ground planes (42, 32).

Abstract: A high-frequency semiconductor device includes a microwave monolithic integrated circuit having first and second passive element sections each having at least one passive element as well as an FET. The FET has a gate connected to the first passive element section and a drain connected to the second passive element section. A bed configured as a plate of a conductive member is provided for mounting thereon the microwave monolithic integrated circuit. The bed has at least one opening or hole formed therethrough. The hole of the bed is provided at a specified position of the bed so as to underlie either one the first or second passive element section. With such an arrangement, it becomes possible to obtain enhanced performance.

Abstract: A housing for an electronic component is described, in particular a Gunn element for generating radar waves, including a bottom part, a wall part made of a plastic that can be processed by injection molding in particular and a cover part enclosing the electronic component in the installed state. The cover part has a contact spring for establishing an electric connection to a terminal of the component. In addition, the wall part is connected to the cover part by at least one connecting structure.

Abstract: An electronic module, comprising: a dielectric base plate having first and second opposing surfaces on which respective electrodes are disposed such that respective areas at the first and second surfaces are free of electrode material and aligned relative to one another to form a dielectric resonator; a first electronic component coupled to the base plate; and a first circuit sheet having first and second opposing surfaces, at least one aperture between the surfaces, and a conductor pattern disposed on the first surface, the first circuit sheet being disposed on the base plate such that: (i) the first electronic component is at least partially received within the aperture; and (ii) at least part of the conductor pattern is coupled to the dielectric resonator.

Abstract: A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

Abstract: A data processing system including but not limited to a section of a first printed-circuit-board conductive element, the section of the first printed-circuit-board conductive element formed to follow at least one bent segment of a first printed-circuit-board path; a section of a second printed-circuit-board conductive element, the section of the second printed-circuit-board conductive element having at least a first part formed to follow at least one bent segment of a second printed-circuit-board path, where the at least one bent segment of the second printed-circuit-board path is substantially proximate to and has a length less than a length of the at least one bent segment of the first printed-circuit-board path; and the section of the second printed-circuit-board conductive element having at least a second part formed to follow a conductive-section-equalization feature which deviates from the second printed-circuit-board path, the at least a second part situated substantially proximate to the at least one

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: In a semiconductor chip are arranged power pads, ground pads and signal pads. A ground line is provided which is formed as one in the vicinity of the chip and branches off at some distance from the chip. Signal lines and power lines are each formed over one of the branched ground lines. The signal lines and the power lines are extended radially together with the underlying ground lines. Each of the signal lines and the power lines are extended together with the corresponding ground line to form a stacked pair line.

Abstract: A radio-frequency composite element 10 is formed by an element substrate carrying a high-efficiency amplifier 14, a transmission line 16 and an isolator 12, the amplifier 14 being made of a semiconductor element mounted on a multilayer substrate and enveloped by a cover, and the transmission line 16 furnished on the element substrate 18 connecting an output terminal of the high-efficiency amplifier with an input terminal of the isolator, so that the components make up an integrally formed composite element.

Abstract: An RF circuit module comprising a first RF semiconductor device 19 mounted within a cavity 4 surrounded by a wall 3 of a first dielectric circuit board 1, and a second RF semiconductor device 29 mounted to a second dielectric circuit board 2 placed on the wall 3. A metal base 11 is disposed on the first circuit board 1 and a number of embedded conductors 13 such as via holes are embedded within the wall 3 and arranged to surround the cavity 4 so that each having one end electrically connected to the metal base 11 and the other end exposed and arranged to surround the cavity 4. A metal cover 12 is sealingly attached to the first circuit board 1 to cover the second circuit board 2 and the second RF semiconductor device 29 and electrically connected at the upper surface of the wall 3. Therefore, the first and second RF semiconductor devices are electrically shielded and hermetically sealed, providing an RF circuit module of small-sized and high-performance.

Abstract: A ribbon and a bonding wire are connected respectively to a high-frequency input and output of a microwave circuit, the width of the ribbon and/or the thickness of the bonding wire being varied continuously or discontinuously at a portion other than a portion used for bonding. By applying the ribbon and bonding wire to a microwave circuit package including a metallic substrate and sealing therein an MMIC mounted to the metallic substrate, desired high-frequency characteristics of the MMIC can be obtained.

Abstract: A radio frequency amplifier includes a waveguide filter positioned between a first and a second amplifier circuit, which reduces the distortion between the amplifier circuits. The waveguide includes a main body having a cavity.

Abstract: A microstrip line includes a ground conductor layer, a dielectric layer formed on the ground conductor layer, and a linear conductor layer formed on the dielectric layer to have a linear configuration. The linear conductor layer has a wider portion in the upper part of a cross section thereof taken in a direction perpendicular to the direction in which the linear conductor layer extends and a narrower portion in the lower part of the cross section. The narrower portion is smaller in width than the wider portion.

Abstract: A millimeter wave module includes a silicon substrate with first and second cavityes formed by anisotropic etching on the silicon substrate, and a glass substrate having a microstrip filter pattern and microbumps for connecting the glass substrate to the silicon substrate. A filter is provided using an air layer as a dielectric disposed in the first cavity. An MMIC is mounted by the flip chip method over the second air layer. A coplanar waveguide is on the silicon substrate for connecting the filter and MMIC. The filter having low loss is achieved because it has the microstrip structure using air as an insulating layer. Also change in characteristics of the MMIC during mounting is eliminated because the MMIC is protected by contacting air. Accordingly, the millimeter wave module has excellent characteristics and is made using a simple method.

Abstract: A first electrode layer having a first electrodeless portion is formed on the upper surface of a dielectric plate, a second electrode layer having a second electrodeless portion opposing the first electrodeless portion is formed on the lower surface of a second dielectric plate, and electric lines are formed by an intermediate electrode layer formed between the first and second electrode layers.

Abstract: Disclosed herein is a printed circuit board comprising a ground layer and a signal layer in which the characteristic impedance of a specific source line is made to be not less than three times as large as the impedance at an upper limit frequency at which the electromagnetic wave radiation of a specific capacitor may occur. In this printed circuit board, variation of a power source voltage and unnecessary electromagnetic wave radiation can be suppressed.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.

Abstract: A millimeter wave module includes a silicon substrate with first and second cavityes formed by anisotropic etching on the silicon substrate, and a glass substrate having a microstrip filter pattern and microbumps for connecting the glass substrate to the silicon substrate. A filter is provided using an air layer as a dielectric disposed in the first cavity. An MMIC is mounted by the flip chip method over the second air layer. A coplanar waveguide is on the silicon substrate for connecting the filter and MMIC. The filter having low loss is achieved because it has the microstrip structure using air as an insulating layer. Also change in characteristics of the MMIC during mounting is eliminated because the MMIC is protected by contacting air. Accordingly, the millimeter wave module has excellent characteristics and is made using a simple method.

Abstract: A drain electrode and a source electrode are provided for an intrinsic device section on a GaAs substrate with a gate electrode placed therebetween. Almost all or substantial parts of the GaAs substrate is covered by an extending source electrode extending from the source electrode. A belt-shaped extending drain electrode is provided on the extending source electrode with a dielectric layer placed therebetween, and thereby an output-side microstripline is formed. A belt-shaped extending gate electrode is also provided on the extending source electrode with a dielectric layer placed therebetween, and thereby an input-side microstripline is formed.

Abstract: A means of connecting a plurality of essentially identical active devices is presented for the purpose of multifunction and multiple function operation. These devices, mounted on a chip, are flip-mounted onto a circuit formed on a base substrate and having large passive elements. Push-pull amplifiers are presented as examples in which the multiple function operation is the combining of amplifiers whose active devices are on a single chip. Electromagnetic coupling, impedance matching and signal transmission are variously provided by the use of strip lines, slotlines, coplanar waveguides, and a slotline converted into a coplanar waveguide.

Abstract: A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and have a pattern of metalization to perform varying electronic tasks. These tasks include electrical interconnection, RF signal transmission, DC current routing and DC signal routing.

Abstract: A high-frequency package comprising a dielectric substrate, a high-frequency element that operates in a high-frequency region and is mounted in a cavity formed on said dielectric substrate, and a microstrip line formed on the surface or in an inner portion of said dielectric substrate and electrically connected to said high-frequency element, wherein a signal transmission passage of a waveguide is connected to a linear conducting passage or to a ground layer constituting the microstrip line. In the junction portion of the waveguide, for example, an end of the linear conducting passage is electromagnetically opened, so that the end portion works as a monopole antenna inside the waveguide that is connected. The high-frequency package makes it possible to connect the waveguide without adversely affecting the sealing of the high-frequency element and to transmit high-frequency signals with a low loss.

Abstract: A millimeter wave module includes a silicon substrate with first and second cavityes formed by anisotropic etching on the silicon substrate, and a glass substrate having a microstrip filter pattern and microbumps for connecting the glass substrate to the silicon substrate. A filter is provided using an air layer as a dielectric disposed in the first cavity. An MMIC is mounted by the flip chip method over the second air layer. A coplanar waveguide is on the silicon substrate for connecting the filter and MMIC. The filter having low loss is achieved because it has the microstrip structure using air as an insulating layer. Also change in characteristics of the MMIC during mounting is eliminated because the MMIC is protected by contacting air. Accordingly, the millimeter wave module has excellent characteristics and is made using a simple method.

Abstract: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.

Abstract: A MMIC package comprises a trace pattern of a coplanar wave guide which matches impedances at all transitions to enhance signal transmission and avoid reflection. The invention employs metalization on a dielectric substrate material wherein this metalization is patterned in order to provide gaps and signal carrying conductors which enhance the signal propagation and reduce impedance mismatches in order to provide a package capable of handling high frequency microwave signals.

Abstract: A printed circuit board (PCB) for mounting a dielectric radio frequency (RF) band pass filter (BPF) thereon, and a method of making the same, is provided. The filter has an input terminal, an output terminal, and a ground terminal including a first, a second, and a third terminal. The PCB includes a first terminal for mounting the input terminal of the RF BPF thereon. A second terminal of the PCB is for mounting the output terminal of the RF BPF thereon. The second terminal is disposed horizontally apart from said first terminal by a predetermined distance. A third terminal of the PCB is for mounting the first terminal of the ground terminal of the RF BPF thereon. The third terminal is disposed between said first and said second terminals. A fourth terminal of the PCB is for mounting the second terminal of the ground terminal of the RF BPF thereon. The fourth terminal is disposed vertically apart from said first terminal by a predetermined distance.

Abstract: A hermetically sealed package assembly for microwave circuits in the high microwave frequencies having a dielectric gap defined in the substrate. The package assembly comprises a substrate for carrying the circuit on a top surface, a seal ring wall carried on the top surface, a via structure provided through the substrate for transmitting high-frequency signals into and out of the package, and a conducive lead carried on the bottom surface of the substrate and passes under the seal ring wall. A dielectric gap is provided in the substrate between the seal ring wall and the lead to reduce the capacitive coupling between the lead and the wall. The gap may be a sealed cavity provided inside the substrate, or a cutout area in the substrate so that the lead is suspended in air at the location where it passes under the seal ring wall.

Abstract: An improved frequency response for a bond wire (1) at high frequency operation is realized by using a matching element (13) including a meander line (9) structure. The frequency response is improved at an operating frequency by design.

Abstract: A circuit arrangement for interconnecting electronic components such as integrated circuit devices, chip packages and/or circuit boards includes signal, first fixed potential (e.g., power) and second fixed potential (e.g., ground) interconnects arranged into an interconnection layout pattern that offers greater flexibility, performance and cost effectiveness than conventional patterns. In some implementations, the interconnection layout pattern incorporates one or more tiles of interconnects, with each tile defining a plurality of interconnect positions arranged into at least three rows and at least four columns. For each tile, a signal interconnect is disposed at each of the three interconnect positions in each of the first and fourth columns, and one each of a signal interconnect, a first fixed potential interconnect and a second fixed potential interconnect are disposed in each of the second and third columns.

Abstract: An antenna-integral high frequency circuit includes: a first grounding conductor surrounding a microstrip antenna; a first via hole connecting the first grounding conductor and a second grounding conductor; and a second via hole connecting the second grounding conductor and a third grounding conductor such that the distance from the second grounding conductor to a fourth grounding conductor is less than a predetermined value.

Abstract: A plurality of integrated circuits, such as microwave monolithic integrated circuits (MMICs), is supported upon a common carrier substrate having transmission lines for interconnection of signals between terminals of any one of the MMICs and among terminals of the plurality of MMICs. Circuit terminals at the front sides of the respective MMICs are connected electrically by vias to the back sides of the respective MMICs to be adjacent conductive components of the transmission lines. Electrically conductive bumps of metal or epoxy serve to connect the vias to the conductive components of the transmission lines, and to connect also metallized regions of the MMICs to metallized regions of the substrate.

Abstract: First to fourth power wiring conductors and first to fourth ground wiring conductors are arranged on first to fourth insulating layers, respectively, and a first signal wiring conductor is arranged on the first or second insulating layer and a second signal wiring conductor is arranged on the third or fourth insulating layer.

Abstract: A printed wiring board device used for electronic equipment, such as the information equipment, etc. A printed wiring board (10) has a power source layer (11) and a ground layer (12) and is mounted with active elements (3 and 4), such as digital ICs, etc. A first capacitor (1) which conductively couples the layers (11 and 12) with each other at a high frequency is provided in the peripheral section of one end side or the other end side of the section of the board (10) where the layers (11 and 12) are faced to each other. Second capacitors (2) which respectively supply transient currents to the active elements (3 and 4) are provided between the power supply pins (3V and 4V) of the elements (3 and 4) and the ground layer (12) near the elements (3 and 4). Therefore, the electromagnetic radiation caused by the power source layer (11) and the ground layer (12) of the printed wiring board (10) can be suppressed easily and remarkably.

Abstract: A voltage-controlled resonator is fabricated by laminating, one on top of the other, a first dielectric which has a resonant circuit and on the upper surface of which a variable-capacitance element is mounted, and a second dielectric which has a through-hole formed in a position thereof corresponding to the position of the variable-capacitance element and which has a dual function of shielding and resonant frequency tuning. With this structure, the height of the resonator can be further reduced compared with the prior art while retaining the shielding effect, and moreover, further precise resonant frequency tuning can be accomplished as compared with the prior art.

Abstract: A wireless MMIC chip packaging scheme where the MMIC chip (38) is maintained right side up. The MMIC chip (38) is positioned within a cavity (40) of a fixture (42), where a backside metal layer (44) of the chip (38) is mounted to the fixture (42) by a conductive epoxy layer (48). RF and DC via feedthroughs (62, 64) are strategically provided through the chip (38), and are electrically connected to isolated islands (70) in the backside metal layer (44). Substrates (52, 56) are provided that carry microstrips (54) and electrical traces (56), and that extend below the chip (38) so that ends of the microstrips (54) and traces (56) make an electrical connection with the isolated islands (70). In an alternate design, the substrate (80) extends completely across the backside of the chip (38), and ground vias (84) extend through the substrate (80) to connect the backside metal layer (44) to the fixture (42).

Abstract: Silicon conductive vias and pedestals are disclosed for use in microwave integrated circuits. The pedestals are isolated from a ground plane on the bottom surface by glass, while the vias are used to make electrical contact to ground. Electrical circuit elements in the top surface of the integrated circuit are selectively grounded or isolated by the choice of connection to a via or pedestal, respectively.

Abstract: An intrinsic device section is provided by laminating a drain area, an intermediate area, and a source area above a GaAs substrate and by forming a channel area at one oblique surface thereof. A drain electrode ohmic connected to the drain area extends toward the output side, a source electrode ohmic connected to the source area extends above the drain electrode with a dielectric layer placed therebetween, and thereby an output micro-wave transmission line is formed. A gate electrode Schottky connected to the channel area extends toward the input side, the source electrode extends above the drain electrode with the dielectric layer placed therebetween, and thereby an input micro-wave transmission line formed.

Abstract: A high frequency circuit structure including a base substrate having a planar face, a first base slotline mounted on the base substrate face and consisting of first and second, spaced-apart coplanar base conductors, and a circuit chip flip-mounted on the base substrate. The circuit chip include a chip substrate having a planar face facing the planar face of the base substrate. A slotline resident on the chip is flip mounted onto the base slotline. Input and output connections made according to the invention can be used to provide connections to an intermediate circuit resident on either the chip or the base substrate. A second chip slotline may be electrically in series or parallel with the first chip slotline.

Abstract: A laminated multi-layer printed board having at least a power source circuit layer, at least a ground layer and at least a signal layer includes a hole which extends through the board to the power source circuit layer. An inductor is provided in the hole.

Abstract: An electronic module, comprising: a dielectric base plate having first and second opposing surfaces on which respective electrodes are disposed such that respective areas at the first and second surfaces are free of electrode material and aligned relative to one another to form a dielectric resonator; a first electronic component coupled to the base plate; and a first circuit sheet having first and second opposing surfaces, at least one aperture between the surfaces, and a conductor pattern disposed on the first surface, the first circuit sheet being disposed on the base plate such that: (i) the first electronic component is at least partially received within the aperture; and (ii) at least part of the conductor pattern is coupled to the dielectric resonator.

Abstract: A conductive ground layer provides a low cost method of reducing, controlling, or tailoring printed circuit board (PCB), for example, a motherboard, trace impedance and/or size, cross-talk, and EMI without having to add additional layers. A thin layer of conductive epoxy is applied over a solder mask high speed signal trace area of the PCB. The conductive epoxy is connected to or coupled to a ground plane or layer of the PCB. The inclusion of a higher number of traces on the PCB is made possible by tailoring the characteristic impedance of the traces, which allows the trace size to be reduced.

Abstract: An MCM including a resonator made using conventional MCM fabrication techniques. The MCM's resonator is constructed with overlapping first and second spiral-shaped regions of metallic material separated by a layer of dielectric material. A via disposed in the layer of dielectric material, couples the spiral-shaped regions of metallic material together, thereby utilizing self winding and internal capacitance to gain resonance at frequencies between 500 MHz to 3GHz. The internal capacitance is increased by controlling the overlap between the first and second spiral-shaped regions of metallic material. On a high-resistivity substrate, the monolithic resonator achieves a Q of at least 19 at approximately 900MHz and at least 24 at approximately 2GHz.

Abstract: A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

Abstract: A duplexer includes a high-frequency switch, an LC filter serving as a low-pass filter, and an SAW filter serving as a band-pass filter. The high-frequency switch includes diodes, capacitors, and transmission lines. The LC filter includes capacitors and transmission lines. The high-frequency switch and LC filter are built into a multi-layer ceramic substrate, while the diodes of the high-frequency switch and the SAW filter are mounted on the substrate. The substrate is made of a low-temperature-baked ceramic material.

Abstract: A device for processing electromagnetic waves in the microwave range, with a body provided with a circuit element which is electrically connected to a strip-type transmission line which comprises conductor tracks, said body being mechanically connected to an insulating substrate via contact bodies. The transmission line is formed by conductor tracks which lie on mutually facing surfaces of the body and the insulating substrate, respectively. The transmission line in the device is present between the body and the insulating substrate, the contact bodies providing a separation between the conductor tracks. Thus, it is not necessary then to use a second side of the body remote from the insulating substrate for the manufacture of transmission lines.

Abstract: Disclosed is a printed circuit board that includes selectable structures for attenuating EMI/RFI of replaceable components. In one preferred embodiment, the printed circuit board has a power plane that is subdivided into a plurality of power islands, a ground plane, a plurality of bypass capacitors, and a connector mounted on the printed circuit board for receiving electrical components. Each bypass capacitor is connected between the ground plane and an associated one of the power islands. The connector is connected to at least two selected power island, and the selected power islands are arranged such that when a first electrical component is inserted into the connector, a first one of the selected power islands is automatically connected to a power supply pin of the first electrical component to facilitate attenuation of electromagnetic interference generated by the first electrical component in a first frequency band.

Abstract: A semiconductor module, includes a circuit including a plurality of semiconductor devices connected together as a package, wherein the plurality of semiconductor devices have a same device structure. Further, an amplifier includes a cascade-connection of a plurality of semiconductor device packages, wherein the plurality of semiconductor devices have a same device structure. Preferably, the devices include field-effect transistors (FETs), and an external input lead of a semiconductor package is connected to an input stage of the amplifier, an interstage circuit is connected between an intermediate output lead and an intermediate input lead, and an external output lead is connected to an output stage of the amplifier.

Abstract: An RF-driven semiconductor chip is die-bonded to the top face of a metal plate. The semiconductor chip and the metal plate are molded together with outer leads in a plastic package in the form of a rectangular parallelepiped. The metal plate is exposed at the back face of the plastic package. The metal plate is not protruding from the front and rear side faces of the plastic package. The front and rear side faces of the metal plate are flush with the front and rear side faces of the plastic package and partially exposed at the front and rear side faces of the plastic package. The front and rear portions of the plastic package are centrally formed with respective cutaway portions each in the form of a rectangular parallelepiped. The top face of the metal plate is exposed in the cutaway portions formed centrally in the front and rear portions of the plastic package to form solder portions.

Abstract: The present invention provides a detector comprising a microstrip line having one end being grounded and another end connected to a main transmission line, a detection diode connected to the microstrip line, and a smoothing circuit for smoothing a signal detected by the detection diode.

Abstract: A printed circuit board including a terminating structure wherein impedance matching can be established with certainty also for a long wiring line without using a discrete part as a terminating resistor. In the terminating structure, an internal wiring line connected to a signal output terminal of a semiconductor unit is formed with a resistance value which satisfies an impedance matching condition of a printed circuit board wiring line connected to the signal output terminal. The terminating structure is applied to any application wherein impedance matching of a wiring line is established on a printed circuit board on which a semiconductor unit having an internal wiring line having a resistance higher than that of a wiring line on the printed circuit board is mounted.