Abstract: A device for fault detecting passive routing substrates. Thermal behavior differences before and after a passive routing substrate is damaged are used. A batch of passive routing substrates is fault detected without running a functional test. In addition, the passive routing substrates are not contacted and are not damaged on detection. The device provides superior and precise detection before stacking the passive routing substrates.

Abstract: An inspection apparatus 1 for solar cells 100 includes: a visible light source 11 adapted to irradiate visible light; a CCD camera 15 adapted to measure a reflection image based on the visible light reflected by an antireflective film of a solar cell 100; an infrared light source 13 adapted to irradiate the solar cell 100 with infrared light; and a CCD camera 16 adapted to measure a transmission image based on the infrared light transmitting through the solar cell 100. In the inspection apparatus 1, as a result of comparing the reflection image and the transmission image with each other, of areas respectively appearing as bright spots in the reflection image, an area appearing as a dark spot in the transmission image is determined as an area including a particle, whereas of the areas respectively appearing as the bright spots in the reflection image, an area other than the area determined as the area including the particle is determined as an area including a pinhole.

Abstract: A device and a method for detecting scattered light signals is specified. A light source exposes a scattered light area in which particles may be present to light. With the objective of reducing costs and improving detection accuracy, the device comprises a plurality of optical sensors for detecting scattered light and an evaluation unit for evaluating the signals detected by the optical sensors, wherein the sensors are each arranged at a sensor angle relative to the incident axis of the incident light so as to detect scattered light from the scattered light area, wherein one of the plurality of optical sensors is a reference sensor, and wherein the evaluation unit is designed to relate the signal profiles of the other optical sensors to the signal profile of the reference sensor, wherein the signal profiles of the optical sensors serve in classifying any particles which may be present in the scattered light area.

Abstract: A computer creates a recipe for a manufacturing tool based on design data. The computer obtains the design data, which includes basic elements and hierarchical levels corresponding to the basic elements. The computer selects one or more basic elements of interest and generates one or more sets of simple array cells corresponding to a level of interest. The computer uses the sets of simple array cells to identify periodical areas in level-of-interest coordinates to enable automated recipe creation. The periodical areas are identified with respect to one or more basic elements.

Abstract: A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection.

Abstract: A defect inspection apparatus is disclosed that includes a stage, a photosensitive element, and a controller. The stage can support a semiconductor element that has a plurality of complete dies and partial dies surrounding the complete dies. The photosensitive element is located above the stage. The controller is electrically connected to the photosensitive element to drive the photosensitive element to inspect the defects of the complete dies and the partial dies.

Abstract: When a size of a block on a wafer is equal to or smaller than an optical resolution of imaging optics, room for improvement in a signal-to-noise ratio has not been sufficiently considered in a conventional technique. One feature of the defect determination of the present invention is to include a filter processing for setting a predetermined partial area serving as a predetermined matrix for a first difference image, scanning the first difference image in the partial area, and outputting a second difference image, and a first threshold processing using a first threshold value for the second difference image. As a result, highly sensitive defect detection can be achieved.

Abstract: An imaging device includes multiple sensor pixels that are arranged in a predetermined direction, each sensor pixel having multiple sensor pixel borders defining an outer edge part of the sensor pixel, among which at least one of a pair of sensor pixel borders that are opposed in the arrangement direction is oblique to a passage direction of a defect image that is vertical to the predetermined direction. This can provide an inspection tool enabling high sensitivity inspection and/or having improved detection reproducibility of a defect.

Abstract: Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.

Abstract: The present invention is intended to provide a contour extraction method and a contour extraction device with an objective of either suppression of unnecessary contouring processings or selective contouring of necessary portions. To attain the objective, provided are a contour extraction method, and a device, with which contours of pattern edges on an image formed based on charged particles emitted from a sample are extracted and, when contouring of a pattern located in an overlapping region provided in connecting images of plural image-capturing regions to form a synthesized image is performed, either areas of the pattern in the plurality of image-capturing regions, or a pre-set measurement portion is found, and selective contour extraction of the pattern with respect to an image of an image-capturing region is carried out either on a side where the area is large, or on a side where a measurement portion regarding the pattern is located.

Abstract: A method and a device are described that implement electroluminescence inspection, photoluminescence inspection or both of an object capable of luminescence. During the inspection, the object is excited by the application of a voltage, by the irradiation of light or both so as to transmit electromagnetic radiation. The electromagnetic radiation is registered by an optical recording device and is outputted as an image. The image undergoes an evaluation, and possible faults of the object are determined in the image evaluation. Provision is made for the registration of the electromagnetic radiation by the recording device to be undertaken in at least two images in different spectral ranges.

Abstract: A visual inspection apparatus 10 performing a visual inspection of an electronic component 13 including opposing sides 11, 11a and opposing sides 12, 12a, the apparatus 10 including an optical-path adjusting means 30 changing a traveling direction of a light and setting an appearance of the side 11a of the electronic component 13 temporarily stopped at a first inspection point in an image of the side 11 of the electronic component 13 captured by a first imaging means 31, and an optical-path adjusting means 34 setting an appearance of the side 12a of the electronic component 13 temporarily stopped at a second inspection point in an image of the side 12 of the electronic component 13 captured by a second imaging means 35, thereby performing a visual inspection of the sides 11, 11a, 12, 12a.

Abstract: Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.

Abstract: A defect inspection method comprising: picking up an image of a subject under inspection to thereby acquire an inspection image; extracting multiple templates corresponding to multiple regions, respectively from design data of the subject under inspection; finding a first misregistration amount between the inspection image and the design data using a first template as any one template selected from among the plural templates; finding a second misregistration amount between the inspection image and the design data using a second template other than the first template, the second template being selected from among the plural templates, and the first misregistration-amount; and converting the design data, misregistration thereof being corrected using the first misregistration-amount, and the second misregistration-amount, into a design data image, and comparing the design data image with the inspection image to thereby detect a defect of the subject under inspection.

Abstract: An electronic device handling apparatus, which handles an electronic device under test having a first main surface provided thereon with first device terminals and a second main surface provided thereon with second device terminals, includes: a contact arm having a holding-side contact arm to which a first socket is attached and a suction pad which holds the electronic device under test; an alignment apparatus which positions the first socket and the electronic device under test; and the alignment apparatus which positions, with respect to a second socket, the electronic device under test being held by the suction pad and contacting the first socket, wherein the contact arm presses the second device terminals of the electronic device under test to the second socket.

Abstract: Inspection apparatus includes an imaging module, which is configured to capture images of defects at different, respective locations on a sample. A processor is coupled to process the images so as to automatically assign respective classifications to the defects, and to autonomously control the imaging module to continue capturing the images responsively to the assigned classifications.

Abstract: A system for detecting stress in rails includes a railcar, having a rail temperature detector, and a rail imaging device oriented to produce images of rail joints and rail anchors. The imaging device and temperature detector are connected to a computer controller, which is programmed to provide an output signal indicative of estimated axial stress in the rail based upon rail temperature and the images of at least one of the rail joints and rail anchors.

Abstract: One of the objects of the present invention is to provide a semiconductor measurement apparatus capable of obtaining a measurement result that appropriately reflects the deformation of a pattern even if plural causes for the deformation of the pattern exist together. In order to attain the above object, the semiconductor measurement apparatus is proposed in the following way. The semiconductor measurement apparatus is capable of measuring the dimensions between plural measurement points of different positions of the edge of a reference pattern and plural corresponding points of the circuit pattern of an electronic device, in which the corresponding points correspond to the plural measurement points.

Abstract: The invention relates to apparatus monitoring test media used in or applicable to magnetic testing, said apparatus comprising a test element fitted with an artificial defect and a test medium feed and a test return as well as a magnetic field generator, further a magnetic field adjustment unit to adjust the magnetic field strength acting on the test element and/or the artificial defect, being adjustable at different magnetic field intensities to check the test medium, and to a corresponding method.

Abstract: According to one embodiment, a pattern inspection method includes acquiring a first image using a first condition by irradiating an electron beam onto a pattern to be inspected, acquiring a second image using a second condition by irradiating the electron beam onto the pattern, the second condition being different from the first condition, and judging the existence/absence of defects of the pattern by comparing the first image and the second image. A pattern inspection apparatus includes an electron source, a converging part, a stage, an image acquisition part, a controller and a judgment part. The controller is configured to perform a control to acquire a first image using a first condition and acquire a second image using a second condition different from the first condition. The judgment part is configured to judge the existence/absence of defects of the pattern by comparing the first and the second image.

Abstract: A method for 3-dimensional vision inspection of objects, such as microelectronic components, which have protrusions as features to be inspected, such as input/output contact balls, is disclosed. The method comprises the steps of determining interior and exterior parameters of a stereo camera system, forming a rectified stereo camera system with a rectified camera coordinate system from the parameters of the stereo cameras determined above. A pair of images of the object having a plurality of co-planar protrusions on one surface is captured by the stereo cameras system and is transformed into the rectified coordinate system to form a pair of rectified images. Conjugate points of each protrusion are then determined in the rectified images for the measurement of its location, co-planarity and height. Various configurations of the apparatus for capturing the images and processing the image data are also disclosed.

Abstract: A router module is arranged in a housing of a smart television. The router module is externally connected to a modem for surfing the Internet. The router module is electrically connected to a micro processing unit of the smart television. Therefore, the smart television is connected to the Internet through the router module. A wireless transmission chip of the router module is configured to process Internet signals. An antenna module is configured to wirelessly transmit the Internet signals, so that wireless network is shared to outside.

Abstract: An apparatus for identifying a defect in an electronic circuit having periodic features, the apparatus including at least a camera for obtaining an image of the electronic circuit and an image processing system. The image processing system receives the image of the electronic circuit from the camera, performs a diagonal shift of the received image of the electronic circuit by at least a diagonal size of the periodic features of the electronic circuit to produce a shifted image of the electronic circuit, identifies a candidate defect using the image of the electronic circuit and the shifted image of the electronic circuit, computes one or more local defect-free reference (golden) images of the electronic circuit using at least one selected area in the closest proximity of the identified candidate defect and determines the defect in the electronic circuit using one or more computed local golden images of the electronic circuit, the image of the electronic circuit.

Abstract: In semiconductor fabrication processes, one or more wafers are often exposed to processes such as chemical vapor deposition to form semiconductor components thereupon. Often, some of the wafers exhibit flaws due to contamination or processing errors occurring before, during, or after component formation. Inspection of the wafers is often performed by direct visual inspection of humans, which is prone to errors due to flaws that are too small to view directly; to particles naturally arising in the human eye; and to fatigue caused by inspection of large numbers of wafers. Presented herein are inspection techniques involving positioning the wafer in a dark chamber exposing the surface of the wafer to a light source at a first angle, and capturing with a camera an image of the light source reflected from the surface of the wafer at a second angle. Wafers identified as exhibiting flaws are removed from the wafer set.

Abstract: An imaging apparatus includes an optical system, an imaging device that captures an image imaged via the optical system to generate image data, a detecting unit that detects a shake of the imaging apparatus in a rotating direction, a cutting-out unit that cuts out data in a predetermined cutting-out region in a region of the image data generated by the imaging device, and a recording unit that records the cut image data in a recording medium. The cutting-out unit determines a rotating center position according to a predetermined condition (for example, the focal length of the optical system or move amount of the imaging apparatus), rotates the cutting-out region around the rotating center position to reduce an effect of the shake in the rotating direction detected by the detecting unit on the image imaged on the imaging device, and cuts out the image data from the rotated cutting-out region.

Abstract: An inspection apparatus comprising, an optical system emitting light having a predetermined wavelength, illuminating a sample while the light is converted into light having a polarization plane not in the range of ?5 degrees to 5 degrees and 85 degrees to 95 degrees with respect to a direction of a repetitive pattern on the sample, an optical system for acquiring an image and forming said image on an image sensor using a lens, a half-wave plate, a first image sensor, a second image sensor, an inspection analyzer, wherein these differ in a transmission axis direction, a processor that obtains an average gray level and a standard deviation in each predetermined unit region of the image, and a defect detector, wherein a resolution limit defined by a wavelength of the light source and a numerical aperture of the lens is a value in which the pattern is not resolved.

Abstract: With an optical inspection tool, images of a plurality of patches of a plurality of dies of a reticle are obtained. The patch images are obtained so that each patch image is positioned relative to a same reference position within its respective die as another die-equivalent one of the patch images in each the other ones of the dies. For each patch image, an integrated value is determined for an image characteristic of sub-portions of such patch image. For each patch image, a reference value is determined based on the integrated values of the patch image's corresponding die-equivalent patch images. For each patch image, a difference between that patch image's integrated value and an average or median value of its die-equivalent patch images is determined whereby a significant difference indicates a variance in a pattern characteristic of a patch and an average or median pattern characteristic of its die-equivalent patches.

Abstract: To inspect a board, first, a measurement area is set on the board and a reference data of the measurement area is obtained. Then, a measurement data of the measurement area is obtained per colors, and a lighting condition is set using the reference data of the measurement area and the measurement data obtained per colors. Next, a feature object in the measurement area is set, and a distortion quantity between the reference data and the measurement data is obtained by comparing the reference data corresponding to the feature object and the measurement data corresponding to the feature object obtained under the lighting condition. Then, an inspection area is set by compensating the distortion quantity. Therefore, it is possible to compensate the distortion and set precisely the inspection area.

Abstract: A solder printing inspection apparatus for inspection of solder printed on a circuit board has a multiplicity of lands for mounting of electronic components. The apparatus includes an irradiation unit for irradiating a light on the circuit board, an imaging unit for imaging the circuit board irradiated by the light, a solder bridge detection unit for detecting a solder bridge connecting two of the lands based on an image data imaged by the imaging unit, a distance calculation unit for calculating a bridge distance as distance between two lands contacting the solder bridge or solder bridging regions or solder detection frames corresponding to the two lands contacting the solder bridge, and a distance determination unit for determination of whether or not the bridge distance is within a permissible range.

Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

Abstract: A first output value evaluation device obtains an average value of output values of optical image data for each of unit regions and creates a distribution map of an average value in an inspected region. A first defect history management device creates a distribution map related with the shape of the pattern from the distribution map of the average value and holds the created distribution map. A second output value evaluation device obtains at least one of a variation value and deviation of the output value of each pixel in the unit region. A defect determination device compares the obtained value with a threshold value. A second defect history management device holds information of the output value determined as a defect in the defect determination device. A defect/defect history analysis device analyzes, and checks the information from the first defect history management device and the second defect history management device.

Abstract: One embodiment relates to a method of automatically inspecting multiple array regions (102) simultaneously using an imaging apparatus (302). The method includes selecting (211 or 212) an optimal pixel size such that each array region in the multiple array regions has a grouped cell which is an integer number of pixels in size, and adjusting a pixel size of the imaging apparatus to be the selected optimal pixel size. Optimal pixel sizes within an available range of pixel sizes may be determined by finding (202) a largest common divider of cell sizes of the multiple array regions when the cell sizes are expressed in integers. Pre-set criteria may be applied to determine (208) which, if any, of the optimal pixel sizes are acceptable based on pre-set criteria. If none of the optimal pixel sizes are acceptable, then one of the array regions may be marked for digital interpolation (see 216). Other embodiments, aspects, and features are also disclosed.

Abstract: An imaging system (40), safety system (58) or combined imaging and safety system (FIG. 1) for an industrial machine (20), including a light transmitter (26) and a corresponding receiver (28). In an imaging application, image data relating to a machine tool (22) and/or work piece (32) is derived from said at least one receiver and processed by an image processing means to determine information regarding said tool and/or tool position and/or extent of work carried out on said work piece. A screen (34, 46), such as a shadow screen, can be used to form an image of a profile of the tool tip and end of the workpiece. Took tip position and extent of work on the workpiece can be derived from the image, e.g., via a camera viewing an image formed on the screen. Multiple cameras may be used. A safety system application (FIGS.

Abstract: Disclosed is an automatic optical inspection device. The automatic optical inspection device comprises a substrate support platform, a sensor fixed platform, an image sensor, and a backlight source. The automatic optical inspection device of the present invention is capable of inspecting defects in an interior of a substrate for solving the technical problem that the conventional automatic optical inspection device fails to inspect the defects in the interior of the substrate.

Abstract: A method of inspecting a substrate is disclosed. The method is performed by a substrate-inspecting apparatus having at least one projecting module projecting a patterned light onto a substrate fixed on a stage and an inspecting module with a camera capturing an image, and inspecting a plurality of inspection regions of the substrate step by step. The method comprises, setting an inspection order of the inspecting regions according to a lengthwise direction of the substrate, estimating height displacement of a target inspection region by using a tendency information regarding at least one previous inspection region that is already inspected, adjusting height of the inspecting module by using the estimated height displacement of the target inspection region, and inspecting the target inspection region by using the inspecting module of which height is adjusted. Therefore, inspection time is reduced.

Abstract: An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. At least one of the localized circuits can control a clock associated with the TDI sensor. At least one light pipe can be used to distribute a source illumination to the plurality of TDI sensor modules. The plurality of TDI sensor modules can be positioned capture a same inspection region or different inspection regions. The plurality of TDI sensor modules can be identical or provide for different integration stages. Spacing of the modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.

Abstract: In order to highly sensitively detect fatal defects present in the vicinity of a direct peripheral circuit section in a chip formed on a semiconductor wafer, in the defect inspection device, which is provided with an illumination optical system that illuminates an inspection subject at predetermined optical conditions and a detection optical system that acquires image data by detecting scattered light from the inspection subject at predetermined detection conditions, a plurality of different defect determinations are performed for each region from a plurality of image data that differ in image data acquisition conditions or optical conditions and that are acquired by the detection optical system, and defect candidates are detected by consolidating the results.

Abstract: A substrate storage condition inspecting apparatus includes an illumination device, an imaging device, and a substrate storage condition determining unit. The illumination device includes, on the front side of an opening of a transport container located at an inspecting position, a first illumination portion and a second illumination portion that are spaced apart in the width direction of the opening. The substrate storage condition determining unit detects a pair of high-luminance portions on an inspection image captured by the imaging device, the pair of high-luminance portions being generated in locations circumferentially spaced apart in the peripheral edge portion of the semiconductor substrate by light applied by the first illumination portion and the second illumination portion, and determines whether or not the storage orientation of the semiconductor substrate is abnormal on the basis of the positional correspondence in the vertical direction for the pair of high-luminance portions.

Abstract: A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.

Abstract: A pulsed thermography defect detection apparatus including active and passive infrared (IR) thermography for non-destructive testing (NDT) of powdermetallic (P/M) components for on-line and off-line inspection.

Abstract: A thermal imaging device includes an optical module gathering infrared radiation of a circuit board and correspondingly providing infrared light, a photo sensor converting the infrared light into a first electrical signal, a processor, and a thermal imaging control system having one or more programs stored in a storage and executed by the processor. The system includes an image processing unit converting the first electrical signal into a thermal image signal, a comparing unit comparing the thermal image signal with circuit diagram of the circuit board to determine at least one abnormal temperature element, and a display control unit controlling a screen to display a thermal image of the circuit board together with a label comprising at least one name of the at least one abnormal temperature element on the screen.

Abstract: In accordance to an embodiment, there is provided an apparatus for inspecting at least one through-hole solder connection on a PCB. The device includes a light source and a light sensor on opposite sides of the PCB. If light is sensed, the solder connection is defective.

Abstract: The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

Abstract: According to one embodiment, a defect inspection apparatus comprises an illumination optical system, an image formation optical system, a image data conversion unit, a singular part detecting circuit, an optical path length adjusting mechanism, and a defect determining unit. The image formation optical system forms an optical image derived from light passing through first and second optical paths. The image data conversion unit converts, to image data, each of the optical images. The singular part detecting circuit detects a singular part in each of the image data. The optical path length adjusting mechanism equalizes the optical path lengths of the first and second optical paths. The defect determining unit determines a defect on the basis of singular part detection.

Abstract: Disclosed is a chip defect inspection apparatus including a linear array image acquisition module, an illumination control module, a chip defect detection module connected to the LIA module, and an operations and management module connected to the LIA module, the illumination control module and the chip defect detection module.

Abstract: An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.

Abstract: The invention provides an image processing device and an image processing method which can efficiently make use of memory resources, and can also edit and simulate a registered image or the like so as to reflect the registered image or the like after editing in a normal operation without stopping the normal operation, and further to enhance production efficiency. When data for image processing edited in a second processing section is to be reflected in image processing (normal operation) that is continuously executed in a first processing section, the edited data for image processing is transmitted from a third data storage area to a second data storage area, and the edited data for image processing is read from the second data storage area when image processing is executed by use of the edited data for image processing in the first processing section.

Abstract: Provided are a lens apparatus and a machine vision system including the lens apparatus. The lens apparatus includes: a first lens group and a second lens group which are designed to use a wavelength of light of a first single color as a reference wavelength and disposed on opposite sides of an aperture; and a converter lens group which is disposed at an object side of the first lens group, wherein the converter lens group performs selectively at least one of a first conversion for converting a magnification, and a second conversion for converting the reference wavelength.

Abstract: A vibrating body which is formed of a piezoelectric material and has a convex portion in an end surface is accommodated in a vibrating body case, the convex portion of the vibrating body is pressed against an object along with the vibrating body case, and the vibrating body vibrates to drive the object. An end surface of a front-side pressure spring which presses the vibrating body case against a slide portion of a base is fitted into the vibrating body case such that the vibrating body case does not escape due to a reaction force during driving.

Abstract: A camera system and associated method for aligning a component with a footprint on a PCB including: a housing having a first side and a second side opposite to the first side; a first image sensor positioned on the first side of the housing and pointing to a first direction away from the housing to capture an image of the component and generating a first image signal, wherein the first image sensor includes a first lens assembly without a prism; a second image sensor positioned on the second side of the housing and aligned with the first image sensor pointing to a second direction opposite to the first direction to capture an image of the footprint on the PCB and generating a second image signal, wherein the second image sensor includes a second lens assembly without a prism; a mixing circuit for mixing the first image signal with the second image signal and generating a mixed image signal; and a processor for processing the mixed image signal and displaying a superimposed image of the component and the footp