Abstract: The inspection apparatus includes: a linear polarizer and a wave plate generating polarized light from light emitted from a light source; a polarization camera imaging the polarized light generated by the linear polarizer and the wave plate and transmitted through a molding product; and a determination unit determining a state of the molding product using an image captured by the polarization camera.

Abstract: A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (Xi,Yi,Zi). By using a formula “ D = ? i = 1 N - 1 ? ( X i + 1 - X i ) 2 + ( Y i + 1 - Y i ) 2 + ( Z i + 1 - Z i ) 2 ” , a first measurement length D is calculated. By using a formula “F=(D?S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: A system for controlling the non-product wafer includes the following: a monitoring module, configured to monitor the state of the non-product wafer; a statistics module, configured to obtain usage information of the non-product wafer; and a control module, configured to receive a production instruction and control the non-product wafer according to the state and the usage information of the non-product wafer. The disclosure implements the purpose of automatic control and management of the non-product wafer.

Abstract: One pixel unit including at least one light receiving element of a light receiving element array (photodiode array) and a light source have a one-to-one correspondence, and only when the light source emits light, the light beam is detected by at least one light receiving element (one pixel unit) corresponding to the light source. An illumination optical system includes a light guiding means for guiding to an inspection object by reducing an interval between optical axes of light beams emitted from a plurality of light sources in an arrangement direction of a plurality of the light sources.

Abstract: In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of secondary electrons emitted from the scanned part of the plurality of patterns is obtained. One or more of the plurality of patterns that show an intensity of the secondary electrons different from others of the plurality of patterns are searched.

Abstract: A continuous flow manufacturing system includes a tool, configured to hold a part. The system also includes a machine-readable identifier, associated with the tool and encoded with a tool-identification. The system further includes a plurality of workstations. Each one of the plurality of workstations includes a production machine, configured to perform a manufacturing operation on a part, and a reader, configured to read the machine-readable identifier. The system also includes a computing device, configured to retrieve process-data, associated with the tool-identification and a corresponding one of the plurality of workstations, and configured to update the process-data, subsequent to performing the manufacturing operation associated with the corresponding one of the plurality of workstations.

Abstract: Provided are methods and apparatuses for controlling a position of a target point on a processing result relative to a focus point of a focusing sensor system for determining properties of the processing result. The method includes the steps of determining an initial focus point of the focusing sensor system, controlling rotation of the cartridge and disc, checking whether the initial focus point of the focusing sensor system corresponds to the target point on the processing result, comparing (x, y) target positions in captured images with the initial focus point of the focusing sensor system, adjusting rotation of the cartridge and disc such that the focus point of the focusing sensor system corresponds to the target point on the processing result, and detecting and examining signals received from the focusing sensor system for determining properties of the processing result.

Abstract: Motion isolation apparatus, methods, and systems are disclosed. One example is a motion isolation apparatus comprising a floating frame that maintains an alignment between a 3D printhead and a 3D print surface, the floating frame having a floating frame stiffness; and a structural frame that supports the floating frame and has a structural frame stiffness, the floating frame stiffness being greater than the structural frame stiffness so that the structural frame elastically deflects to dampen oscillating forces applied to the floating frame by the 3D printhead during printing without disrupting the alignment. Related apparatus, methods, and systems also are disclosed.

Abstract: The present invention is related to a method, a computer program, and apparatus for adapting an estimator for use in a microscope for estimating a position of an emitter in a sample based on a method, in which the sample is illuminated with light at one or more sets of probe positions and fluorescence photons are acquired for the sets of probe positions. The invention is further related to a microscope, which makes use of such a method or apparatus. The sample is illuminated with light at one or more sets of probe positions and fluorescence photons are acquired for the sets of probe positions. Photon counts of the acquired photons are then added to vectors of photon counts or sums of photon counts are determined for the sets of probe positions. A value representative of background noise is determined and used for adapting the estimator in real-time.

Abstract: A method and system for nanoscale precision programmable profiling on substrates. Profiling material is dispensed on a substrate or a superstrate. The superstrate is brought in contact with the substrate. The profiling material is then cured after bringing the superstrate in contact with the substrate. The superstrate is separated from the substrate after curing. An optical metrology of points on the substrate corresponding to the final substrate profile is then performed.

Abstract: Integrated circuitry comprising an opaque material layer, such an interconnect metallization layer is first patterned with a maskless lithography to reveal an alignment feature, and is then patterned with masked lithography that aligns to the alignment feature. In some examples, the maskless lithography employs an I-line digital light processing (DLP) lithography system. In some examples the I-line DLP lithography system performs an alignment with IR illumination through a backside of a wafer. The maskless pattern may include dimensionally large windows within a frame around circuitry regions. A first etch of the opaque material layer may expose the alignment feature within the window, and a second etch of the opaque material may form IC features, such as interconnect metallization features.

Abstract: There is provided a surface abnormality detection device, and a system, capable of detecting an abnormal portion having a displacement below the distance measurement accuracy when detecting the abnormal portion on the surface of a structure. A surface abnormality detection device includes a classification means for classifying an object under measurement into one or more clusters having the same structure, based on position information at a plurality of points on a surface of the object under measurement; a determination means for determining a reflection brightness normal value of the cluster based on a distribution of reflection brightness values at a plurality of points on a surface of the cluster; and an identification means for identifying an abnormal portion on the surface of the cluster based on a difference between the reflection brightness normal value and the reflection brightness value at each of the plurality of points.

Abstract: A surface characteristics evaluation method for evaluating a surface characteristic of a painted surface including a glittering material, including: a multi-angle condition image acquisition step S101 for acquiring a multi-angle condition image including multi-angle conditions in a continuous manner by performing an image-capturing process to capture how a reflection condition of the painted surface changes when rotating an illumination device 2 emitting light onto the painted surface, the image-capturing process being performed by the line scan camera 4 while a sample P having the painted surface is moved in a certain direction; an in-plane chromaticity distribution acquisition step S102 for acquiring an in-plane chromaticity distribution of the painted surface from the multi-angle condition image acquired; and a surface characteristics evaluation step S107 for calculating particle characteristics S as surface characteristics evaluation values of the multi-angle conditions, on the basis of the in-plane chrom

Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.

Abstract: Apparatus and methods for coherent diffraction imaging. This is accomplished by acquiring data in a CDI setup with a CMOS or similar detector. The object is illuminated with coherent light such as EUV light which may be pulsed. This generates diffraction patterns which are collected by the detector, either in frames or continuously (by recording the scan position during collection). Pixels in the CDI data are thresholded and set to zero photons if the pixel is below the threshold level. Pixels above the threshold may be set to a value indicating one photon, or multiple thresholds may be used to set pixels values to one photon, two photons, etc. In addition, multiple threshold values may be used to detect different photon energies for illumination at multiple wavelengths.

Abstract: The invention relates to a floor cleaning appliance which comprises at least one cleaning assembly for cleaning a floor surface and an optical detection device with which a floor type is determinable. In order to provide a floor cleaning appliance with which a reliable determination of the floor type is possible, it is proposed in accordance with the invention that the detection device is configured as or comprises a spectroscopic device with which the floor type is determinable on the basis of a spectrum of the floor surface recorded by reflection measurement. The invention also relates to a method for floor cleaning.

Abstract: A method of qualifying semiconductor wafer processing includes: illuminating a semiconductor wafer simultaneously with source light having wavelengths in a plurality of wavebands, including at least a first waveband and a second waveband, the second waveband being different from the first waveband; separating light reflected from the semiconductor wafer as a result of said illuminating, the separating dividing the reflected light according to waveband; generating a first image of the semiconductor wafer based on reflected light separated into the first waveband; and, generating a second image of the semiconductor wafer base on reflected light separated into the second waveband.

Abstract: A dynamic concentrator system having a concentrator lens, a tracker platform and a receiver. In an embodiment, the concentrator lens is configured to receive an incoming light at an entrance angle ? and concentrate the light beam on a focus spot. The tracker platform has a detector optical aperture and one or more actuators. The detector optical aperture can be configured to receive the concentrated light beam. The actuators can move the detector optical aperture in a spatial plane to a location of the focus spot. The receiver has a detector optically coupled to the detector optical aperture to receive the concentrated light beam from the detector optical aperture.

Abstract: According to various embodiments of the present invention, an optical capture system is provided. In one embodiment, a micro-scale optical capturing system is provided with low divergence (approximately 1°) of the incident light and low acceptance angle (<8°) of the captured light. According to embodiments, a micro-scale optical capturing system is provided with a large number of collimated high-power white LEDs as light sources, between 60 and 100 units, for example, and may be positioned at distances of about 650 mm from the sample. In one embodiment, a digital camera using 50 mm focal objective with a 25 mm length extension tube captures images of the sample. This provides a working distance of approximately 100 mm and at the same time maintains ×0.5 magnification for microscale captures, with an image size of 4×4 microns per pixel.

Abstract: The easy and quick detection of a contour shape of an object from three dimensional point group data, and control a robotic arm and a tool using it. An information processing method comprising: a step of acquiring three-dimensional point group data by a sensor from an object, a step of specifying a contour point group data that constitutes a contour of the object from the three-dimensional point group data, a step of acquiring tool control information including tool position information and tool posture information for specifying a tool trajectory of the tool connected to the arm of the working robot from the contour point group data, and a step of controlling the tool based on the tool control information.

Abstract: A system is disclosed, in accordance with one or more embodiment of the present disclosure. The system may include a controller including one or more processors configured to execute a set of program instructions. The set of program instructions may be configured to cause the processors to: receive images of a sample from a characterization sub-system; identify target clips from patch clips; prepare processed clips based on the target clips; generate encoded images by transforming the processed clips; sort the encoded images into a set of clusters; display sorted images from the set of clusters; receive labels for the displayed sorted images; determine whether the received labels are sufficient to train a deep learning classifier; and upon determining the received labels are sufficient to train the deep learning classifier, train the deep learning classifier via the displayed sorted images and the received labels.

Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images are captured with a tilt angle from the semiconductor wafer according to graphic data system (GDS) information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the plurality of raw images, by a determining circuitry, to obtain a defect image in the plurality of raw images. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of an image difference in the defect image, by the determining circuitry. The number of the plurality of raw images is greater than 2.

Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

Abstract: A semiconductor wafer processing system for processing a semiconductor wafer includes a semiconductor wafer processing station for processing the semiconductor wafer and a semiconductor wafer imaging system that images the semiconductor wafer after the semiconductor wafer processing station processes the semiconductor wafer. The semiconductor wafer imaging system includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

Abstract: A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (Xi,Yi,Zi). By using a formula “D=?i=1N?1?{square root over ((Xi+1?Xi)2+(Yi+1?Yi)2+(Zi+1?Zi)2)}”, a first measurement length D is calculated. By using a formula “F=(D?S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

Abstract: An inspection probe is configured by inserting a cylindrical hollow glass pipe configured by quartz glass into a cylindrical exterior member configured by stainless steel or the like. The glass pipe transmits a laser beam from a laser light emission device as irradiation light to a leading end part through a hollow region. In the inspection probe, the irradiation light is transmitted to the leading end part through the hollow region of the glass pipe and is reflected by a reflection mirror provided at the leading end part, whereby the inner face of an inspection target is irradiated by the irradiation light, and reflected light reflected from the inner face of the inspection target is reflected by the reflection mirror and transmitted to a photoelectric conversion unit via a region other than the hollow region of the glass pipe.

Abstract: The present invention provides a detection device and a detection method. The detection device uses the signal light formed by the interference of the first and the second echo lights reflected on the surface of the component to be detected to obtain the first light intensity distribution information of the signal light corresponding to the sampling position on the component to be detected by the first detection device to obtain the phase distribution of the signal light according to the intensity distribution to obtain the defect distribution data of the component to be detected. Among them, the first detection apparatus includes more than two polarization detectors, or a non-polarization detector and at least one polarization detector.

Abstract: An image of an inspection surface of a product shot with a first imaging unit is divided into partial area images. For each partial area, a narrow-angle partial area image shot with a second imaging unit is acquired under shooting conditions in a pre-learning table in which the conditions and IDs are set. For each partial area, the narrow-angle partial area image suitable for inspection is selected, an inspection image is generated, and an anomaly of the inspection surface is detected based on the inspection image. For each partial area, whether each condition is effective is determined based on a frequency of the ID included by the inspection image. For each partial area, whether a predetermined condition is established is determined, and, with respect to the partial area in which the predetermined condition is established, a post-learning table is established in which only the condition determined to be effective is set.

Abstract: A semiconductor wafer imaging system for imaging a semiconductor wafer includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

Abstract: A detection apparatus includes a light source device, including a plurality of light-emitting elements, configured to irradiate light onto a detection target by dividing an illuminance area into a plurality of illuminance regions; and circuitry configured to switch an illuminance level at each of the plurality of illuminance regions with a plurality of illuminance levels; detect a plurality of detection data of the detection target at the plurality of illuminance regions by switching the illuminance level at each of the plurality of illuminance regions with the plurality of illuminance levels when irradiating the light onto the detection target; and synthesize the plurality of detection data of the detection target.

Abstract: A method of manufacturing a prepreg composition includes disposing a plurality of core/shell quantum dots on or in a resin matrix of the prepreg composition. The quantum dots may include an inner core that when excited by light of a first wavelength emits a detectable luminescent signal, and an outer shell that blocks light of the first wavelength from reaching the inner core when the outer shell is intact. A method of determining the suitability of a pre-impregnated composite fiber material for incorporation into a composite structure and a method of detecting damage to a prepreg composition due to ultraviolet radiation exposure utilizing the core/shell quantum dots are provided.

Abstract: The embodiments disclose a method for in-situ inspection and processing of an object including providing a pulsed laser source during the in-situ inspection of a surface of the object for modifying at least one of an optical, mechanical, or chemical property of a first region of the surface, directing the laser source through an optics path to shape, position and focus a pulsed laser beam at the first region, directing a probe illumination light beam to the optics path to produce a combined and collinear optical light path of the probe illumination light beam and the pulsed laser beam to focus and deliver the combined and collinear optical light path at a same region on the surface, superimposing a first focus spot of the probe illumination light beam over a second focus spot of the pulsed laser beam on an illuminated region of the surface.

Abstract: The disclosure provides a wafer inspection method and wafer inspection apparatus. The method includes: receive scanning information of at least one wafer, wherein the scanning information includes a plurality of haze values; the scanning information is divided into a plurality of information blocks according to the unit block, and the feature value of each of the plurality of information blocks is calculated according to the plurality of haze values included in each of the plurality of information blocks; and converting the feature value into a color value according to the haze upper threshold and the haze lower threshold, generating the color value corresponding to the at least one wafer according to the converted color value according to the feature value, whereby the color graph displays the texture content of the at least one wafer.

Abstract: Systems and methods for evaluating the physical and/or cosmetic condition of electronic devices using machine learning techniques are disclosed. In one example aspect, an example system includes a kiosk that comprises an inspection plate configured to hold an electronic device, one or more light sources arranged above the inspection plate configured to direct one or more light beams towards the electronic device, and one or more cameras configured to capture at least one image of a first side of the electronic device. The system also includes one or more processors in communication with the one or more cameras configured to extract a set of features of the electronic device and determine, via a first neural network, a condition of the electronic device based on the set of features.

Abstract: A method of automatically setting optical parameters, using Automatic Optical Inspection (AOI) System, the method includes the following steps. Firstly, a recommended object image is obtained when the AOI system is set under a first recommended optical parameter set. Then, a computation is performed on an object standard picture and a recommended object image to obtain a recommended error value between the object standard picture and the recommended object image according to an optimized error function. Then, whether the recommended error value converges is determined. Then, when the recommended error value does not converge, a computation is performed to obtain a second recommended optical parameter set according to the recommended error value and the first recommended optical parameter set. Then when the recommended error value converges, the first recommended optical parameter set is decided as an optimal optical parameter set of the AOI system.

Abstract: A system is disclosed for verification of the installation of a component such as a side curtain air bag into a vehicle passenger compartment where energy absorbing quarter-turn fasteners attached to the air bag are employed to affix hanger brackets to structural base plates in the vehicle. The system includes an image capturing camera, stored data in a machine readable form of an acceptable installation, a central processing unit to compare the captured images to the stored machine readable data and an output generator to create an output signal based on the results of the comparison.

Abstract: An inspection station for manufactured components includes a framework and a plurality of cameras. The framework has of a plurality of vertically stacked and spaced apart plates. Each plate defines a central orifice. The central orifices of each plate are aligned along an axis. The manufactured components are configured to freefall through the central orifices defined by the plates. The plurality of cameras is secured to the framework. Each camera is focused toward a region within the framework to capture images of the manufactured components. The plurality of cameras is arranged in an array that extends radially about the axis. At least one of the cameras is positioned at an angle above a horizontal plane that is perpendicular to the axis and intersects the region within the framework. At least one of the cameras is positioned at an angle below the horizontal plane.

Abstract: A method of detecting defects in a structure sample comprising a thin film layer and a sacrificial later is disclosed. The method comprises exposing the thin film layer to a vapour phase etchant, obtaining an image of the thin film layer and analysing the image. The vapour phase etchant enhances any defects present in the thin film layer by passing through the defect and etching a cavity within the sacrificial layer. The cavity undercuts the thin film layer resulting in a stress region surrounding the defect. Defects which were not originally detectable may be made detectable after exposure to the vapour phase etchant. A vapour phase etchant has the advantage of being highly mobile such that it can access defects that a liquid phase etchant might not. Furthermore, unlike a liquid phase etchant, a vapour phase etchant can be used to test a sample non-destructively.

Abstract: A dark-field optical system may include a rotational objective lens assembly with a dark-field objective lens to collect light from a sample within a collection numerical aperture, where the dark-field objective lens includes an entrance aperture and an exit aperture at symmetrically-opposed azimuth angles with respect to an optical axis, a rotational bearing to allow rotation of at least a part of the dark-field objective lens including the entrance aperture and the exit aperture around the optical axis, and a rotational driver to control a rotational angle of the entrance aperture. The system may also include a multi-angle illumination sub-system to illuminate the sample with an illumination beam through the entrance aperture at two or more illumination azimuth angles, where an azimuth angle of the illumination beam on the sample is selectable by rotating the objective lens to any of the two or more illumination azimuth angles.

Abstract: An electromagnetic wave detection apparatus 10 includes a separator 16, a first detector 17, a switching unit 18, and a second detector 20. The separator 16 is capable of switching between a separation state and a non-separation state. The separator 16 separates incident electromagnetic waves to travel in a first direction d1 and a second direction d2, in the separation state. The first detector 17 detects electromagnetic waves traveling in the first direction d1. The switching unit 18 includes a plurality of switching elements “se”. Each switching element “se” is capable of switching a traveling direction of electromagnetic waves traveling in the second direction d2 between a third direction d3 and a fourth direction d4. The second detector 20 detects electromagnetic waves traveling in the third direction d3.

Abstract: To shorten a time required for evaluation of a recipe while suppressing an increase in a data amount. A charged particle beam device includes a microscope that scans a charged particle beam on a sample, detects secondary particles emitted from the sample, and outputs a detection signal and a computer system that generates a frame image based on the detection signal and processes an image based on the frame images. The computer system calculates a moment image between a plurality of the frame images, and calculates a feature amount data of the frame image based on a moment.

Abstract: An image-capturing device includes: an illumination light source configured to emit illumination light to illuminate an object; a laser light source configured to emit laser light with a peak wavelength in a range of wavelengths absorbed or reflected by at least one region of the object; an imaging device configured to take an image of the object; a speckle variable device configured to change a speckle pattern in an image acquired by the imaging device over time; and an image processing device configured to process the image acquired by the imaging device, which includes: measuring a change over time in a intensity signal from each pixel constituting the image, and dividing an imaged region of the object into a plurality of portions based on a waveform of the change in the intensity signal over time.

Abstract: A non-destructive testing calibration system includes a first multi-axis robotic device having a first end effector, a second multi-axis robotic device having a second end effector. A calibration assembly includes an emitter arranged on the first end effector and a receiver arranged on the second end effector, where the emitter and the receiver exchange a calibration signal between the first robotic device and the second robotic device. A data processor and a memory storing instructions, which when executed causes the data processor to perform operations comprising: performing a calibration scan, where the calibration scan includes a plurality of measurement points along a scan path of the emitter and the receiver; measuring the deviation between the emitter and the receiver at each measurement point along the scan path; and determining a corrected scan path based on the deviation between the emitter and receiver at each measurement point during the calibration scan.

Abstract: An image processing apparatus performs an inspection on an assembly component with use of one or more images of an assembling work, and includes a work determination unit configured to determine, from the one or more images, one or both of a start frame and an end frame of assembling work captured at a change point of the assembling work, a selection unit configured to select frames to be inspected from the one or more images based on a result of the determination by the work determination unit, and an inspection unit configured to perform an inspection on the frames selected by the selection unit.

Abstract: The present invention relates to a hybrid imaging system for photodiagnosis and phototherapy and, more particularly, to a hybrid imaging system for photodiagnosis and phototherapy, which simultaneously acquires a visible ray image or a near-infrared ray image and a lonq wave infrared ray image by using an optical method. The hybrid imaging system for photodiagnosis and phototherapy according to the present invention includes a light distribution unit, a visible ray/near-infrared ray measurement unit, a long wave infrared ray measurement unit, and a light source unit, thereby simultaneously and quickly extracting a visible ray image, a near-infrared ray image, and a long wave infrared ray image without mutual distortion.

Abstract: [Task] To provide an automatic analysis apparatus including a photomultiplier tube which controls a sensitivity of the photomultiplier tube without adjusting a high voltage value. [Solution] An automatic analysis apparatus according to the present invention includes a photomultiplier tube which detects light from a reaction vessel; a determination unit which determines an output signal of the photomultiplier tube in a case where the photomultiplier tube is irradiated with first light; and a control unit which irradiates the photomultiplier tube with second light to lower a sensitivity of the photomultiplier tube in accordance with a determination result by the determination unit.

Abstract: Various embodiments of the present invention relate to an apparatus and method for measuring the surface of an electronic device, the apparatus comprising: a seating portion on which the electronic device is seated; a first light source for irradiating first light on the surface of the electronic device; a first camera for photographing the surface using the first light; a second light source for irradiating second light on the surface of the electronic device; a second camera for photographing the surface using the second light; and an analyzer electronically connected to the first light source, the first camera, the second light source, and the second camera, wherein the analyzer is setup to analyze the color of the surface acquired using the first light source and the first camera; and the gloss of the surface acquired using the second light source and the second camera, so as to analyze the color and gloss of the surface of the electronic device using quantified and digitized data, thereby enabling qualit

Abstract: There is provided a method of defect detection on a specimen and a system thereof. The method includes: obtaining a runtime image representative of at least a portion of the specimen; processing the runtime image using a supervised model to obtain a first output indicative of the estimated presence of first defects on the runtime image; processing the runtime image using an unsupervised model component to obtain a second output indicative of the estimated presence of second defects on the runtime image; and combining the first output and the second output using one or more optimized parameters to obtain a defect detection result of the specimen.

Abstract: A system and method for specimen examination, the system comprising a processing and memory circuitry (PMC) for: obtaining an image of at least a part of a specimen, the image acquired by an examination tool; receiving one or more characteristics of a defect of interest and a location of interest associated therewith; modifying within the image one or more pixels corresponding to the location of interest, wherein the modification is provided in accordance with a characteristic of the defect of interest, thereby planting the defect of interest into the image; processing the modified image to detect locations of potential defects of the specimen in accordance with a detection recipe; and determining whether the detected locations include the location of interest. Subject to the location of interest not being detected, modifying the detection recipe to enable detecting the planted defect of interest at the location of interest.