Abstract: When using a scatterometer different portions of a target area may be at different focal depths. When the whole area is measured this results in part of it being out of focus. To compensate for this an array of lenses is placed in the back focal plane of the high numerical aperture lens.

Abstract: The present invention provides an indexed support substrate. The support substrate comprises at least one set of indexing features that are distinguishable from one another and from the surrounding substrate. The support substrate also comprises a set of useful domains. The indexing features are positioned on the substrate in such a way as to correspond to the useful domains in an identifying fashion.

Abstract: A methodology to improve the through-process model calibration accuracy of a semiconductor manufacturing process using lithographic methods by setting the correct defocus and image plane position in a patterning process model build. Separations of the optical model and the photoresist model are employed by separating out the adverse effects of the exposure tool from the effects of the photoresist. The exposure tool is adjusted to compensate for the errors. The methodology includes a determination of where the simulator best focus location is in comparison to the empirically derived best focus location.

Abstract: The present invention enables the user to measure process line shortening (PLS) on an overlay tool. In an example embodiment (900), to obtain the PLS, the user applies a method to determine the misalignment (MA) of a composite image on a substrate (940a), from the composite image the user may determine the total line (940b) shortening (TLS) and the equipment line (940c) shortening (ELS). The process line shortening (PLS) is determined (940d) as a function of TLS and ELS.

Abstract: The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

Abstract: A chassis having an alignment form is disclosed. The alignment form has dimples that permit a carrier to be aligned with the chassis sidewall. When a component is inserted in the computer system, the component contacts the dimples and aligns in the chassis sidewall.

Abstract: Exposure position marks are reliably recognized and the displacement of an exposure position is correctly and efficiently detected based on measurement results produced by recognizing the marks. The exposure position marks are constructed of a first pattern made up of an inner quadrangular pattern and an outer quadrangular pattern and a second pattern shaped as a rectangular frame whose inner edge and outer edge are formed as quadrangular patterns. The first pattern and the second pattern are formed with an intention of making center positions of the first pattern and the second pattern match and of having the second pattern disposed inside a region between an inner quadrangular pattern and an outer quadrangular pattern of the first pattern.

Abstract: In wafer positioning by moving a center point (0) of a wafer (21) to a given position and orienting a notch part (21a) of the wafer in a given direction, wafer seat drive means (2,3,8, or 9) positions a rotation axis (B) of a wafer seat (16) on a straight line which passes through a center part of a line sensor (4) and extends in the extending direction thereof, and rotates the wafer seat on which the wafer lies around the rotation axis; calculation means (24) finds a wafer notch part position and a maximum or minimum eccentric radius of the wafer based on a rotation angle of the wafer seat and detection results of an outer periphery edge of the wafer lying on the wafer seat by the line sensor, and, from the obtained results, geometrically calculates a rotation axis position and a rotation angle of the wafer when the wafer center point is at the given position and the wafer notch part is oriented in the given direction; and the wafer seat drive means (2, 3, 8, or 9) moves, rotates, and stops the wafer seat (1

Abstract: An embodiment of the present invention is a technique to monitor carbon nanotubes (CNTs). A carbon nanotube (CNT) is manipulated in a fluid by a laser beam. An illuminating light from a light source is aligned along axis of the CNT to produce an optical response from the CNT. The CNT is monitored using an optical sensor according to the optical response.

Abstract: An optical alignment detection system for detecting the alignment of a first object relative to a second object is provided. One or more light sources and one or more light detectors, either or both of which are secured relative to the second object, are used to detect the position of one or more light scattering elements on the first object.

Abstract: A method and apparatus for measuring the relative positions of first and second components, comprising: mounting first and second measurement units on respective housings forming part of each component and which are rotatably arranged and infinitely adjustable thereon in respective brackets for defining first and second adjustably selected rotational axes, respectively; measuring the relative positions of the components in first and second states of operation by detecting the relative positions of those selected axes in each state of operation and producing measurement values determinative of those relative positions.

Abstract: Device for determining the straightness of hollow cylindrical surfaces and partial surfaces thereof, and the three-dimensional orientation of several hollow cylindrical surfaces or partial surfaces with reference to at least one of axial parallel offset and angular offset relative to one another. A transmitting/receiving device and a reflector/receiving device are provided which are swingable essentially without play over a respective hollow cylindrical surface or partial hollow cylindrical surface. The transmitting/receiving device has at least one transmitter for emitting light beams and at least one receiver for receiving and for measuring an incidence position of the light beams. The reflector/receiving device has at least one partially-reflective optical element for partial reflection of light beams and at least one receiver for receiving and for measuring an incidence position of a portion of the light beams.

Abstract: Apparatus for monitoring the alignment of marking lasers in a room for diagnosis and/or treatment in the radiation therapy, characterized by a housing, which is provided with holding means for the installation in the room and which has the following a linearly extending photosensor and an analyzing unit, which compares the position of the light generated by the laser on the photosensor with a reference position, and generates a corresponding signal upon a deviation of the measured position from the reference position.

Abstract: A system comprises the step for applying a mark in advance in a reference position in which attachment of a lens holder is anticipated on a convex lens surface of a reference lens; the step for attaching the lens holder to the convex lens surface of the reference lens by using a holder attachment apparatus; and the step for comparing a position in which the lens holder is actually attached and a reference position in which the mark is applied on the lens. A cavity-shaped hole is formed in the holder so that a position of the mark on the reference lens can be observed when the lens holder is attached to the lens. In the comparison step, a toolmaker's microscope is used to observe the mark through the hole in the lens holder from a direction of the convex lens surface of the lens, an actual attachment position of the holder is compared to the reference position of the reference lens, and an attachment accuracy of the holder is verified.

Abstract: In a lithographic apparatus, a measurement of the position of an object in an ambient space by an object position measuring system which is influenced by pressure variations in the ambient space, is corrected by an accurate measurement of the pressure in the ambient space. A pressure difference is measured between a pressure in a reference pressure volume and an ambient pressure in an ambient space. An absolute pressure in the reference pressure volume is added to the pressure difference to determine a change of pressure in the ambient space. Alternatively, the pressure difference is integrated over time and a determined change of pressure in the reference pressure volume is added to the pressure difference to determine a change of pressure in the ambient space.

Abstract: A sensing mechanism for crystal orientation indication mark of semiconductor wafer is provided. The semiconductor wafer includes: a device region formed on a surface of the semiconductor wafer, plural devices are formed or are to be formed on the surface; a circular peripheral extra region formed around the device region; a chamfered portion formed at a peripheral edge portion of the peripheral extra region; a flat surface as a mark indicating a crystal orientation of the semiconductor wafer. The mark is positioned within a region of the chamfered portion and is perpendicular to a surface direction of the semiconductor wafer. The sensing mechanism includes: an optical sensor having an optical axis parallel to the surface direction of the semiconductor wafer; and a rotatable holding table for holding the semiconductor wafer. The flat surface is sensed by the sensing mechanism.

Abstract: A method and apparatus for aligning the left and right image channels a two-image stereoscopic three-dimensional display is disclosed. A left and right alignment pattern may be shown on the left-eye and right-eye image screens, respectively, pre-computed for any given input imaging geometry. The operator (or alignment processor) then adjust the displays to converge the superimposed left-eye and right-eye test patterns by moving the display elements using display positioning equipment and/or software. This ensures that the stereoscopic three-dimensional display geometry matches the three-dimensional camera imaging geometry in order to produce a minimally-distorted visual depth perception of objects in space. Such precision alignment can be essential for efficient and safe telerobotic operation applications, as in the case of remote aerial refueling operations, for example.

Abstract: In an apparatus which determines characteristics of a thin film according to the present invention, a temporal change in a refractive index n and an extinction coefficient k of a thin film in a period from start of a change in the thin film as a processing target (e.g., melting) to end of the change (e.g., solidification) can be obtained with a high time resolution of pico-seconds. Based on this, it is possible to know a progress of a change in state of the thin film (e.g., crystallization) or a transition of growth of crystal grains in units of pico-seconds.

Abstract: A method for actively aligning the components of an optoelectronic device. The optoelectronic device includes a first portion containing a laser and a second portion containing an optical element. In one embodiment, the optoelectronic device is a laser package having a header structure containing a laser and a header can containing a lens. The method includes transmitting an optical signal from the laser through the optical element and comparing the position of the optical signal relative to a reference in order to determine whether the optical coupling of the laser with the optical element is within a desired tolerance range.

Abstract: A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.

Abstract: The X, Y and Rx positions of a mask stage are measured using two optical encoder-reading heads measuring displacements of respective grid gratings mounted on the mask stage. The grid gratings are preferably provided on cut-away portions of the mask table so as to be coplanar with the pattern on the mask itself. Measurements of the table position in the other degrees of freedom can be measured with capacitative or optical height sensors.

Abstract: A system for aligning an object with a target is disclosed. The system allows an operator to monitor the alignment of the object, either while the object is stationary or while the object is moving through a trajectory, without requiring that the operator directly view the target. The system preferably comprises a positioning unit for attaching to the object, such as a golfing putter, and a target unit for positioning at, near or over a target location, such as a hole. The positioning unit and the target unit are in two-way communication to detect and to indicate alignment of the object with the target. Preferably, the positioning unit emits light that is preferably laser light or infrared light, and the target unit detects that light when the units are aligned. When the positioning unit and the target unit are aligned, the target unit emits an alignment signal that is preferably a radio signal. The radio signal initiates a display element for indicating that the object and target are aligned.

Abstract: The invention relates to a method of adjusting a monitor having a radar and a camera and correcting the positions and orientations of their detection areas based on intensity of reflected light from a target object. A single target having a specified pattern of bright and dark areas in placed in front of the monitor in the detection areas of the radar and the camera. The detection area of the radar is adjusted first based on measurements taken of the target by the radar and thereafter axial displacement of the detection area of the camera is determined a coordinate conversion parameter is obtained based on an image of the target taken by the camera.

Abstract: In a method of measuring, in a lithographic manufacturing process using a lithographic projection apparatus, overlay between a resist layer, in which a mask pattern is to be imaged, and a substrate, use is made of an alignment-measuring device forming part of the apparatus and of specific overlay marks in the substrate and resist layer. These marks have periodic structures with periods which cannot be resolved by the alignment device, but generate an interference pattern having a period corresponding to the period of a reference mark of the alignment device.

Abstract: An optical package includes one or more MEMS mirrors to provide alignment between internal optical components and the signal port(s) on the package (where one or more ports may include optical fiber attachments). Once the components are placed in the package, an electrical signal is used to adjust the deflection profile of the appropriately positioned MEMS mirror(s) until maximum coupling between the internal components and the fibers/ports is obtained. Advantageously, if later signal degradation occurs due to, for example, subsequent physical misalignment of the internal components, corrective electrical signal can be sent to the MEMS mirror(s) to provide correction and re-alignment without having to open the package and physically move the components.

Abstract: An alignment device and method for delivering a light beam to an optical application, such as an optical trap having a pair of lenses with overlapping focal regions for trapping a particle therein. The alignment device includes a light source for generating a beam of light, a support member, an optical fiber, a collimating lens, and actuators. The optical fiber includes an input end for receiving the beam of light, and a generally rigid portion extending from the support member and terminating in a delivery end for emitting the beam of light. The collimating lens collimates the emitted beam of light. The actuators exert forces on the generally rigid portion such that it pivots about a pivot point of the optical fiber at the support member. The collimated beam of light pivots about an optical pivot point as the optical fiber pivots about the pivot point.

Abstract: Described are systems and methods for orienting a semiconductor wafer during semiconductor fabrication with the aid of an optical alignment system, the semiconductor wafer having an alignment mark with regular structures, on the basis of which the position of the semiconductor wafer can be determined.

Abstract: A method for determining an improved alignment to couple a beam having a high power level into a waveguide. The power of the beam is reduced to a minimum test power level. The reduced-power beam is aligned in a test alignment such that it forms a beam spot on the coupling surface of the waveguide. The coupled power level of the coupled portion of the beam is measured. The power level of the reduced-power beam is increased in steps to a maximum test power level. Corresponding coupled power levels for each power level are measured. If the coupled power level does not saturate and the corresponding coupling efficiency is greater than or equal to the desired coupling efficiency, the current test alignment is determined to be the improved alignment. Otherwise, the test alignment is changed and the new test alignment is tested to see whether it meets the desired standards.

Abstract: A level sensor for a lithographic projection apparatus includes a light source configured to direct light onto a substrate to be measured, a detector configured to detect light reflected from the substrate, and a processor configured to calculate a difference between measurements made with the filter in the first configuration and in the second configuration. The sensor is adjustable between a first configuration, in which the light is given a first property, and a second configuration, in which the light is given a second property. The sensor may include a polarizing filter, such that the first and second properties are different polarization states.

Abstract: The invention relates to a method for inspection of periodic structures on lithography masks using a microscope with adjustable illumination and an operating element for movement of a mechanical stage with the lithography mask attached to it in order to record images of the lithography mask at a computer-controlled location on the lithography mask. The position, the size and the pitch specification of the lithography mask are stored.

Abstract: An apparatus and method for manufacturing and using a calibrated registration reference wafer in a semiconductor manufacturing facility where an archive media includes etched alignment attributes. Exposing a pattern of complementary alignment attributes onto the archive media such that the pattern of complementary alignment attributes overlay and interlock with the etched alignment attributes thereby forming completed alignment attributes. Then, measuring offsets in the completed alignment attributes and constructing a calibration file for the archive media based upon the offset measurements and other characteristic data of the exposure tool.

Abstract: Techniques for automatically adjusting and/or optimizing the color and/or intensity of the illuminating light used in a vision system is presented. The intensity of each of a plurality of illuminating light colors is allowed to be independently adjusted to adapt the illumination light based on the color of a part feature against the part feature background of a part being viewed by the vision system to produce high contrast between the part feature and background. Automated contrast optimization may be achieved by stepping through all available color combinations and evaluating the contrast between the part feature and background to select a color combination having a “best” or acceptable contrast level.

Abstract: Embodiments of the invention provide methods and apparatuses for efficient and cost-effective imaging of alignment marks. For one embodiment, alignment mark imaging is accomplished separately from, and independent of product imaging through use of a relatively low cost, low resolution, imaging tool. For one embodiment a wafer is exposed to low-resolution light source through a reticle having a number of alignment patterns corresponding to desired alignment marks. For one embodiment, global alignment marks are imaged on a backside of a wafer. Various embodiments of the invention obviate the need for a highly accurate stage and a high-resolution imaging device, and therefore reduce processing costs and processing time.

Abstract: A method of manufacturing a semiconductor device and an apparatus of automatically adjusting a semiconductor pattern can precisely correct a difference in the shape or position of a pattern exposed or formed in two exposure steps. A pattern measuring unit measures an offset between the first pattern and the second pattern in a pattern measuring step. Based on the information on the offset thus detected, the first pattern is adjusted in a first patterning step with a high degree of freedom in the next manufacturing step cycle of a semiconductor device to precisely align the shape or position of the first pattern with the second pattern in a second patterning step with a low degree of freedom.

Abstract: A device for quantitative assessment of the orientation of two machines relative to one another has auxiliary devices in the form of extenders or holding devices (40, 50) on which displacement and/or mounting of light transmitting or receiving devices (44, 52) are mountable in a manner that makes the use of a precision pivot bearing unnecessary.

Abstract: A method of determining aberration of a projection system of a lithographic includes projecting a reference test pattern, projecting a second test pattern, measuring relative displacements between items in the resulting images of said reference test pattern and said second test pattern, and using said measurements to determine information on the aberration of the projection system, wherein a filter is used when imaging the second test pattern to select particular radiation paths though the projection system, and wherein the measuring is performed for a plurality of images of the second test pattern obtained at planes displaced along the optical axis relative to each other.

Abstract: A scanning transmission electron microscope which enhances correction accuracy of a de-scanning coil for canceling a transmitted-electron-beam position change on an electron detector. Here, this transmitted-electron-beam position change appears in accompaniment with a primary-electron-beam position change on a specimen caused by a scanning coil. First, control over the scanning coil is digitized. Moreover, while being synchronized with a digital control signal resulting from this digitization, values in a de-scanning table registered in a FM(2) are outputted to the de-scanning coil. Here, the de-scanning table is created as follows: Diffraction images before and after activating the scanning coil and the de-scanning coil are photographed using a camera. Then, based on a result acquired by analyzing a resultant displacement quantity of the diffraction images by the image processing, the de-scanning table is created.

Abstract: A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker that structurally alters a physical appearance of the components. The system may also comprise a nest having a nest surface that defines a recess shaped to receive any one of the plurality of components only when the component is oriented such that the component's fiducial marker is received by a corresponding asymmetric portion of the nest surface. In addition, the system may comprise a component feed assembly for feeding the plurality of components to the nest, a component alignment detector, and a pick and place machine having a movable pick head. The movable pick head may have access to the component feed assembly and the recess of the nest.

Abstract: In a working system for circuit boards such as, typically, as an electronic component mounting apparatus, an image pickup camera mainly for detecting the position of a reference mark on a circuit board or/and for detecting the misalignment of an electronic component from the axis a mounting head holding the electronic component is also utilized for detecting a peculiar portion formed on one of board lifting plates for lifting a circuit board to be clamped at a working position on a circuit board transfer conveyer. The peculiar portion comprises a plurality of grooves formed on one board lifting plate made of stainless steel for being detected as a plurality of dark regions appearing on the stainless steel board lifting plate. When the circuit board is transferred to the working position on the circuit board transfer conveyer, one of the dark regions to be detected is hidden by the circuit board from the image pickup camera, so that the presence of the circuit board on the board transfer device can be judged.

Abstract: An optical alignment system for aligning a light beam with a core flow in a flow stream. The flow stream may have a sheath fluid and a core flow, where the core flow has a current position within the flow stream. A light source may be used to produce a light beam, and an optical element may be used to direct the light beam at the core flow. In some illustrative embodiments, an actuator is provided for moving the optical element, light source and/or flow stream such that the light directed by the optical element is aligned with the current position of the core flow.

Abstract: A system for actively aligning an optoelectronic device including a frame, a mounting and alignment assembly, and a camera. The mounting and alignment assembly can be movably connected to the frame and is configured to mount separate portions of an optoelectronic device such that the portions can be moved in relation to each other. An optical signal from a laser in the first portion is transmitted through an optical element in the second portion and captured by the camera to determine the positioning of the first and second portions of the optoelectronic device. The portions can then be aligned accordingly.

Abstract: A scan exposure apparatus according to this invention determines a scan velocity and a focus measurement position from process conditions and the like and determines a threshold ? of the focus measurement position on the basis of the scan velocity. The scan exposure apparatus executes focus measurement if a stage position falls within the range of the threshold ?.

Abstract: A lens blocking device is disclosed that includes a frame, a light source mounted on the frame, a carriage having a first end and a second end mounted on the frame for sliding movement between first and second positions, a first mirror mounted on the carriage first end and a lens block holder mounted on the carriage second end and shiftable between third and fourth positions with respect to the carriage, a stage disposed between the light source and the carriage, and including an opening, for supporting an object, an at least partially translucent screen generating a display image operably connected to the support frame, at least one second mirror arranged to reflect an image of an object on the stage from the first mirror, when the carriage is in the first position, onto the screen, and an actuator operably connected to the carriage.

Abstract: Disclosed is a method and apparatus for measuring an optical characteristic of a projection optical system such as wavefront aberration, for example, very precisely. In an embodiment of the present invention, the method includes a first detecting step for causing each of plural light beams from a pattern to pass a predetermined position on a pupil plane of the optical system and subsequently imaging the light beams separately, and for detecting an imaging position of each light beam upon the pupil plane of the optical system, a second detecting step for detecting error information related to a passage position as each light beam passes through the pupil plane, and a third detecting step for detecting wavefront aberration of the optical system on the basis of the imaging position of each light beam upon the pupil plane and of the error information related to the passage position of each light beam on the pupil plane.

Abstract: A processing apparatus for processing an electronic device having a light emitting unit, includes: a light receiving unit for receiving light emitted by the light emitting unit; a position detector for detecting the position of the electronic device; and a processing unit for processing the electronic device based on the position of the electronic device detected by the position detector.

Abstract: An exposure apparatus includes an image sensing section and image sensing control section for measuring the average position of a mark formed on a wafer during a predetermined observation period before a stage completely stops, an interferometer for measuring any deviation of the stage during the observation period, a stage deviation storage section for storing the measurement result by the interferometer in a memory and calculating the average deviation of the stage on the basis of the measurement result, and a shift amount calculation section for calculating the actual position of the mark, while the stage is at rest, on the basis of the average position of the mark and the average deviation of the stage.

Abstract: An optical imaging system and method for the alignment of a light collector with a laser scanline. The optical imaging system includes: an optical assembly for producing a laser beam scanline directed at a scanning platen, the scanning platen including an opening disposed at each of its ends; first and second photodetectors disposed behind the scanning platen, one at each of the openings; a visual indicator coupled to each of the first and second photodetectors to visually indicate detection of the scanline at the openings of the scanning platen; and a light collector assembly for collecting light emitted, reflected or transmitted by a scanned information media, the light collector assembly being pivotable about a centerpoint of the scanning platen and including an adjustment member for pivotably moving the light collector assembly about the centerpoint to align the light collector assembly with the scanline.

Abstract: The apparatus for normalization of a drilling tool to a work surface includes a light source, a beam splitter, and a screen. The beam splitter directs and the screen receives at least a portion of the light reflected off of the work surface. When the received light is located in a predetermined portion of the screen, then the drilling tool is normal to the work surface. The method for normalization of a drilling tool to a work surface includes positioning the drilling tool proximate the work surface, transmitting light toward the work surface, creating an image of the light that has reflected off of the work surface upon a screen, thereby permitting the orientation of the drilling tool to be adjusted until the image of the reflected light is located in a predetermined portion of the screen that is indicative of proper alignment.

Abstract: An apparatus and method for manufacturing and using a calibrated registration reference wafer in a semiconductor manufacturing facility. A reference reticle consisting of a 2-dimensional array of standard alignment attributes is exposed several times onto a photoresist coated semiconductor wafer using a photolithographic exposure tool. After the final steps of the lithographic development process the resist patterned wafer is physically etched using standard techniques to create a permanent record of the alignment attribute exposure pattern. The permanently recorded alignment attributes are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is used to generate a calibration file that contains the positions of the alignment attributes on the reference wafer. The reference wafer and calibration file can be used to determine the wafer stage registration performance for any photolithographic exposure tool.

Abstract: In order to perform a measurement operation of a pattern and a processing operation in parallel while the positions of two substrate stages are accurately measured and wire/hose units are prevented from becoming tangled, a substrate processing apparatus includes an alignment system for measuring the pattern arrangements of the substrates, a processing system disposed separately from the alignment system and used for processing the substrates, substrate stages which are able to support the substrates and move in an xy plane, and position measurement systems which measure the positions of the substrate stages. Four position measurement systems are arranged for the measurement in the x direction, and three position measurement systems are arranged for the measurement in the y direction. One of the position measurement systems for the measurement in the y direction is disposed at a side opposite to the remaining positioning measurement systems across the substrate stages.