Abstract: An improved method and system of aligning an optical fiber or optical fiber array to an optical circuit device couples an optical signal source and an optical measuring device to the optical fiber array, the other side of which array is coupled to the same side of the optical circuit device, thereby forming an initial U-shaped optical path from the optical signal source to the optical fiber array to the optical circuit device to the optical fiber array and to the optical measuring device. The optical path is adjusted until the optical measuring device finds a characteristic of the optical signal to be satisfactory. At that time, the final alignment may be fixed or made permanent. The characteristic of the optical signal may include, for example, the intensity of the optical signal, which is preferably at a maximum or the insertion loss which is preferably at a minimum.

Abstract: An exposure apparatus includes a measurement device for measuring a distortion of an image of a reticle formed on a substrate by scanning exposure, a calculation device for calculating a position compensation parameter for each distortion, by separating the measured distortion into a symmetrical component and an asymmetrical component, and a control device for controlling scanning of either the reticle or the substrate based on the position compensation parameter calculated by the calculation device.

Abstract: A method involves aligning each of two optical components to be joined relative to a common standard, removing the common standard, and joining each of two optical components to each other in alignment.

Abstract: A method and an apparatus for precisely exposing a predetermined width of a peripheral area of a wafer coated with a layer of photoresist material with light from a light source, wherein the wafer is moved when the light is radiated onto the wafer to expose the photoresist layer at the peripheral area of the wafer, an inspection section inspecting whether the light is radiated onto a precise position of the peripheral area of the wafer, whereby by adjusting the position of the light source if the light is not radiated at the precise position of the peripheral area of the wafer requiring exposure while inspecting the light radiated onto the peripheral area of the wafer, the predetermined width of the peripheral area of the wafer is precisely exposed.

Abstract: Provided is an optical alignment apparatus and method that can enhance the efficiency of optical alignment by using a light source for generating light of a visible wavelength range and lensed fiber and perform optical alignment quickly, precisely and economically. The optical alignment apparatus of the present research includes: a first light source for providing light of a visible wavelength range to perform optical alignment; a second light source providing light of an infrared wavelength range; a micrometer stage for aligning the light outputted from the first light source or the second light source with an active area of a detector; lensed fiber for inputting light into the active area of the detector; an optical alignment confirming means for visually confirming whether the light outputted from the lensed fiber is aligned with the active area of the detector; an image information acquiring means for acquiring image information; and a control means for operating the micrometer stage.

Abstract: Various techniques are disclosed to align an optical fiber with a light source or a photo-detector using a low-force contact.

Abstract: A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xk is defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xm relative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=xm+xk.

Abstract: A stage system is disclosed for supporting and positioning a semiconductor wafer for inspection in an optical metrology device. A chuck for supporting a wafer is mounted to the stage system. The stage system can move the chuck along two linear orthogonal axes. A rotational stage is also provided for rotating the chuck. A mechanism is provided for adjusting the vertical position of a chuck to allow for focusing of the probe beam of the metrology device. The vertical adjustment mechanism is designed so that it does impede the rotational positioning of the chuck.

Abstract: Improved methods and systems for routing and aligning beams and optical elements in an optical device include a multiplexing device and/or a demultiplexing device, which includes an optical alignment element (OAE). The OAE can be configured to substantially compensate for the cumulative alignment errors in the beam path. The OAE allows the optical elements in a device, other than the OAE, to be placed and fixed in place without substantially compensating for optical alignment errors. The OAE is inserted into the beam path and adjusted. This greatly increases the ease in the manufacturing of optical devices, especially for devices with numerous optical elements, and lowers the cost of manufacturing. The multiplexing and/or demultiplexing device can reside within a standard small form factor, such as a GBIC. The devices fold the paths of the traversing beams with a geometry which allows a small package.

Abstract: In a method and an apparatus for measuring process errors capable of reducing the process errors, and a method and an apparatus for measuring an overlay, at least two regions are assigned on an object to be measured, which has been passed through a predetermined unit process. Process error values of each region are detected. Error correcting values of each region are calculated based on the process error values. The calculated error correcting values are fed back to a device performing the predetermined unit process. The process error values are merged and outputted as one file. The error correcting values of each region formed on the object are reflected in the device performing the unit process, so the process failure generated in each region of the object can be reduced when the unit process is performed.

Abstract: In an alignment or overlay measurement of patterns on a semiconductor wafer an error that occurs during the measurement in one of a predefined number of alignment structures in an exposure field of a corresponding predefined set of exposure fields can be handled by selecting an alignment structure in a substitute exposure field. The latter exposure field need not be part of the predefined set of exposure fields, that is, an inter-field change may be effected. The number of alignment measurements on a wafer remains constant and the quality is increased. Alternatively, when using another alignment structure in the same exposure field—by effecting an intra-field change—the method becomes particularly advantageous when different minimum structure sizes are considered for the substitute targets. Due to the different selectivity in, say, a previous CMP process, such targets might not erode and do not cause an error in a measurement, thus providing an increased alignment or overlay quality.

Abstract: The present invention includes a method of determining a relative position of a substrate and a template spaced-apart therefrom, the substrate having substrate alignment marks disposed thereon and the template having template alignment marks disposed thereon, the method including, impinging first and second fluxes of light upon the substrate and template alignment marks, with the substrate and template alignment marks being responsive to the first flux of light defining a first response, and being responsive to the second flux of light defining a second response differing from the first response; and processing the first and second responses to form a focused image of the substrate and template alignment marks on a common plane, with the focused image indicating the relative position of the substrate and the template.

Abstract: A photomask or reticle including a unique set of alignment attributes at separate and distinguishable field points is put in the reticle plane of a photolithographic projection system. The reticle pattern is exposed onto a resist coated wafer or substrate and processed through the final few steps of the photolithographic process. The resulting array of alignment attributes are then measured using a standard optical overlay metrology tool. The overlay tool is driven by a set of software instructions. By comparing the resulting overlay data to the placement error encoded on the reticle it can determined if the data has been read or displayed in the correct order.

Abstract: A component transfer apparatus is provided. The component transfer apparatus comprises a pick and place machine having a component feed source and a movable pick head having access to the component feed source. A component alignment detector is directed toward the component feed source and a controller is coupled to the component alignment detector. The controller contains instructions which, when executed by the controller, cause the controller to compare the detected component alignment with a known component alignment.

Abstract: A system for aligning a plurality of cylindrical rollers is disclosed. The system comprising a light emitter unit having a horizontal planar light source for generating a horizontal planar light signal and a vertical planar light source for generating a vertical planar light signal. The system further comprising a reflector unit having a reflective surface for receiving the vertical light signal from the light emitter unit and returning a reflected vertical light signal. A horizontal lineal indicator is provided on the exterior surface of the reflector unit and a vertical lineal indicator is provided on the exterior surface of the light emitter unit. By aligning the horizontal planar light signal with the horizontal lineal indicator and by aligning the reflected vertical light signal with the vertical lineal indicator, the cylindrical rollers are aligned in a common plane and are substantially parallel to each other.

Abstract: Methods and apparatus for aligning a lens with respect to an axis of beam propagation are disclosed. A position of the lens is adjusted with respect to the axis along one or more directions that lie substantially parallel to a surface of a bulkhead connector. The surface of the bulkhead connector is substantially not parallel to the axis of beam propagation. A position of the lens is adjusted along a direction substantially parallel to the axis of beam propagation. After adjustment, the position of the lens is fixed with respect to the surface. An example of a lens aligning apparatus includes a lens mount configured to receive the lens, a bulkhead connector having a surface, wherein the axis of beam propagation intersects a plane of the surface, means for fixing a position of the lens mount with respect to the surface; and means for fixing a position of the lens with respect to the lens mount.

Abstract: In order to perform a measurement operation of a pattern and a processing operation in parallel while the positions of two substrate stages are accurately measured and wire/hose units are prevented from becoming tangled, a substrate processing apparatus includes an alignment system for measuring the pattern arrangements of the substrates, a processing system disposed separately from the alignment system and used for processing the substrates, substrate stages which are able to support the substrates and move in an xy plane, and position measurement systems which measure the positions of the substrate stages. Four position measurement systems are arranged for the measurement in the x direction, and three position measurement systems are arranged for the measurement in the y direction. One of the position measurement systems for the measurement in the y direction is disposed at a side opposite to the remaining positioning measurement systems across the substrate stages.

Abstract: A tool is employed in conjunction with alignment, depth, and level detectors. The tool can use all or some of these detectors. The alignment detector provides an orthogonal laser line grid on an incident surface when the detector has a predefined relationship with the surface. The depth detector emits two sets of parallel laser planes that converge with each other. When the laser planes impact on an incident surface two sets of lines are formed. The laser lines from one laser plane set move closer to the lines from the other laser plane set as the depth detector moves closer to the surface—showing changes in depth or distance. The level detector employs two converging laser planes. An operator positions the level detector above an incident surface, so the laser planes' line of intersection appears on the surface if the surface is level. If the surface is not level, lines separate from each laser plane appear on the surface—signaling the need for a level adjustment.

Abstract: A calibration jig for a component recognition device and a component recognition calibration method using the jig which can stabilize the mounting accuracy of a component to a to-be-mounted object and improve amount quality. An opening is formed at a to-be-picked up face of the calibration jig. A predetermined position of the calibration jig is recognized on the basis of the contrast between the picked-up face and the opening. The position of the calibration jig can be recognized with higher accuracy, so that a resolution of the component recognition device, etc. can be obtained with a higher degree of accuracy. Mount accuracy of the component to the object is thus stabilized and mount quality is improved.

Abstract: A lens apparatus for detecting inaccuracy of machining of a finished workpiece is disclosed. After finishing the workpiece on a machine table in a machining process, remove a tool from a shaft, mount the lens apparatus under the shaft, couple a display to the machine, machine a left side of the workpiece by moving the table to align the left side of the workpiece with a reference point of a lens for determining alignment of the workpiece, initialize data shown on the display if the workpiece has been aligned, adjust the table to align a right side of the workpiece with the reference point for determining the alignment of the workpiece, determine whether there is an inaccuracy of machining of the workpiece by watching updated data on the display, remove the lens apparatus, and replace the tool with a second tool for correcting the machining process if an inaccuracy occurs.

Abstract: In a lithographic apparatus having a movable object table in vacuum, an interferometer-based alignment system for detecting the position of that object table has a passive part in vacuum and an active part outside the vacuum chamber. The active part contains the beam generator, e.g. a laser, and the electronic detectors whilst the passive part contains the illumination and imaging optics. The two parts are coupled by optical fibers. The interferometer may make use of different diffraction orders from measurement and reference gratings and the order separation may be included in the passive part.

Abstract: A device for detecting the relative position of a generally horizontal reference plane of light includes a plurality of photodetector elements, a weighting circuit, and an output circuit. The photodetector elements are positioned on the device in a generally vertically oriented row. The weighting circuit provides a portion of the electrical output of each photodetector element as a first reference signal related to the spacing of the photodetector element from a first end of said row, and a portion of the electrical output of each photodetector element as a second reference signal related to the spacing of the photodetector element from the second end of said row. The output circuit is responsive to the weighting circuit for determining the relative levels of the first and second reference signals and the position of said reference plane of light with respect to the detector device.

Abstract: A scanning exposure apparatus is provided that is capable of increasing the overlay accuracy. Every time a reticle is exchanged, a direction overlay correction table is updated. A control device for the exposure apparatus corrects the target positions (target locus) of a wafer stage on the basis of the direction overlay correction table.

Abstract: A monitoring method, includes: delineating a monitor resist pattern on an underlying film, the monitor resist pattern having a tilted sidewall slanted to a surface of the underlying film at least at one edge of the monitor resist pattern; measuring a width of the monitor resist pattern in an orthogonal direction to a cross line of the tilted sidewall intersecting with the underlying film; delineating a monitor underlying film pattern by selectively etching the underlying film using the monitor resist pattern as a mask; measuring a width of the monitor underlying film pattern in the orthogonal direction; and obtaining a shift width in the monitor underlying film pattern from a difference between the width of the monitor resist pattern and the width of the monitor underlying film pattern.

Abstract: An image of an integrated circuit chip and optical kerf and their mirror image are formed within a single optical field. When a substrate pattern using this process is flipped over or reversed, the processed pattern appears the same as on the first side, equal to its own mirror image. Prior to the backside lithography, a portion of the second side is removed to allow detection of alignment marks on the first side from the second side of the substrate. Once the alignment marks are detected, the lithography continues as though the substrate was not flipped over at all.

Abstract: A diffractive optical element having a design wavelength ?, includes a diffractive surface for diffracting predetermined light corresponding to the design wavelength, and a mark shaped so that, with regard to the predetermined light, a phase difference corresponding to a multiple, by an integer, of the design wavelength ? is produced between (i) a light ray, of the predetermined light, as transmitted through or reflected by the mark and (ii) a light ray, of the predetermined light, as transmitted through or reflected by a portion adjacent to the mark, and that, with regard to second light of a second wavelength ?? different from the design wavelength ?, no phase difference corresponding to a multiple, by an integer, of the second wavelength ? is produced between (a) a light ray, of the second light, as transmitted through or reflected by the mark and (b) a light ray, of the second light, as transmitted through or reflected by a portion adjacent to the mark.

Abstract: A reference mark is formed on an under-surface of a reference mark member that is disposed on a mask stage. The mask stage can be part of a projection exposure apparatus in which a substrate and a mask are moved in respective scanning directions during scanning exposure. The projection exposure apparatus also may include a projection system disposed under the mask stage, with the mask and substrate being provided on opposite sides of projection system. The mask stage may be moved into the image field of the projection system, and the reference mark is detected.

Abstract: Improved methods and systems for routing and aligning beams and optical elements in an optical device include a multiplexing device and/or a demultiplexing device, which includes an optical alignment element (OAE). The OAE can be configured to substantially compensate for the cumulative alignment errors in the beam path. The OAE allows the optical elements in a device, other than the OAE, to be placed and fixed in place without substantially compensating for optical alignment errors. The OAE is inserted into the beam path and adjusted. This greatly increases the ease in the manufacturing of optical devices, especially for devices with numerous optical elements, and lowers the cost of manufacturing. The multiplexing and/or demultiplexing device can reside within a standard small form factor, such as a GBIC. The devices fold the paths of the traversing beams with a geometry which allows a small package.

Abstract: A system is provided for processing a semiconductor wafer. The wafer is pre-aligned at a first workstation. The pre-alignment may be accomplished by an edge sensor. Alignment mark portions of the wafer are exposed at the same workstation. A fiber optic bundle may be used to expose the alignment mark portions. A high degree of accuracy is not needed to expose the alignment mark portions. The accuracy achieved by the pre-alignment mechanism and the fiber optic bundle is sufficient. The invention saves processing time at a subsequent stepper or scanner exposure workstation.

Abstract: Improved methods and systems for routing and aligning beams and optical elements in an optical device include a multiplexing device and/or a demultiplexing device, which includes an optical alignment element (OAE). The OAE can be configured to substantially compensate for the cumulative alignment errors in the beam path. The OAE allows the optical elements in a device, other than the OAE, to be placed and fixed in place without substantially compensating for optical alignment errors. The OAE is inserted into the beam path and adjusted. This greatly increases the ease in the manufacturing of optical devices, especially for devices with numerous optical elements, and lowers the cost of manufacturing. The multiplexing and/or demultiplexing device can reside within a standard small form factor, such as a GBIC. The devices fold the paths of the traversing beams with a geometry which allows a small package.

Abstract: A device manufacturing method capable of imaging structures on both sides of a substrate, is presented herein. One embodiment of the present invention comprises a device manufacturing method that etches reversed alignment markers on a first side of a substrate to a depth of 10 ?m, the substrate is flipped over, and bonded to a carrier wafer and then lapped or ground to a thickness of 10 ?m to reveal the reversed alignment markers as normal alignment markers. The reversed alignment markers may comprise normal alignment patterns overlaid with mirror imaged alignment patterns.

Abstract: An alignment system includes a first module having a plurality of emitters and a first receiver configuration located on the face of the first module. A second module has a second plurality of emitters and a second receiver configuration located on the face of the second module. First and second trigger signal generators fire the first and second plurality of the emitters. The generated signals are sensed by at least some of the receivers. A converter arrangement obtain and convert the received signals into digital data representative of the readings received by selected receivers. A processing system computes at least one of an absolute six degree offset or a relative six degree offset between the faces. The offset information is then used to achieve a desired alignment between the face of the first module and the face of the second module.

Abstract: The X, Y and Rx positions of a mask stage are measured using two optical encoder-reading heads measuring displacements of respective grid gratings mounted on the mask stage. The grid gratings are preferably provided on cut-away portions of the mask table so as to be coplanar with the pattern on the mask itself. Measurements of the table position in the other degrees of freedom can be measured with capacitative or optical height sensors.

Abstract: A method and arrangement for aligning an optical component (14) on a printed wiring board (1) by using a reflector (8) below a surface mount technology camera to determine the offset (&Dgr;) between the printed wiring board electrical layout and the light beam in the printed wiring board optical layer.

Abstract: An apparatus and method to align an invisible light beam sensor, such as an IR sensor, utilizing a visible light beam such as a visible LED or HeNe laser, and provide the ability to visually monitor when the sensor needs adjustment in real time and avoid off line adjustments. Various embodiments synchronize and position both the invisible light beam and the visible light beam to travel the same path to a common desired location.

Abstract: An exposure apparatus for exposing a substrate to a pattern due to an original includes a substrate stage which holds and moves the substrate, and a first measurement unit which is arranged on the substrate stage, and measures a position of a mark formed on the original by projecting and receiving light.

Abstract: A system, apparatus and method for alignment of a marine engine in a water vessel with either an existing or a design propeller shaft line of a propeller shaft of the vessel. The invention is also useful in positioning and aligning propeller shaft supports to the design shaft line before being secured to the hull of the vessel under construction. A laser gun for projecting a laser beam, a plurality of laser targets positionable into the propeller shaft support members, and a unique laser beam splitter temporarily connected to the engine output shaft cooperate to provide opposing colinear laser output beams viewably emitting from the laser beam splitter only when the marine engine is properly oriented coaxially of the engine crankshaft centerline with respect to the shaft line.

Abstract: The present invention provides for a method for adjusting an alignment microscope. In the method of the present invention an alignment mask is used in which the one side comprises at least one alignment mark and the other side is reflective. For the adjustment, the microscope is first focused to the alignment mark and then refocused to the mirror image of the alignment mark generated by the reflective side. The microscope is then adjusted by comparing the positions of the alignment mark and the generated mirror image of the alignment mark until the alignment mark overlaps its mirror image. Moreover, a device for adjusting an alignment microscope in accordance with the method of the present invention.

Abstract: In a method and apparatus for compensating for static and dynamic inaccuracies in an optical scanner used in a typical surface inspection system, the scanner may have a scanning axis and a cross-scanning axis. A surface of an inspection article is scanned along a scanning axis and a scanning axis signal is output at predetermined distances along this axis. The scanning axis signal may be used to determine a speed of relative movement between the scanner and the inspection article. A jitter signal may be output whenever the scanner deviates from the scanning axis, and this signal may be used to calculate the amount of deviation. Information, such as the speed of relative movement, scan line resolution, and a scanning axis static position error may be used to generate a scan line. A generated scan line may be shifted to compensate for a cross-scanning axis error.

Abstract: An exposure apparatus includes an illumination optical system for illuminating a pattern formed on an object with light from a light source, a projection optical system for projecting, onto a plate, an image of a pattern illuminated by the illumination optical system, the projection optical system including a mirror, and a detection system for detecting a positional offset of the image of the pattern.

Abstract: An exposure apparatus and method to expose an object with an illumination beam irradiated on a mask from a light source disposes an optical unit between the light source and an optical integrator of an illumination optical system to illuminate the mask with an illumination beam, of which an intensity distribution on a Fourier transform plane with respect to a pattern on the mask has an increased intensity portion apart from the optical axis relative to a portion of the intensity distribution on the optical axis.

Abstract: In a projection system for EUV, the positions of mirrors are measured and controlled relative to each other, rather than to a reference frame. Relative position measurements may be made by interferometers or capacitive sensors mounted on rigid extensions of the mirrors.

Abstract: An aspect of the present invention provides simulation that includes dividing a surface of a substrate onto which light that is focused at an aperture angle by a projection lens is shone into a first region onto which all of the light strikes and a second region onto which a portion of the light strikes, calculating an intensity of the light shone onto the first region, and calculating an intensity of the light shone onto the second region.

Abstract: A device for exposing several rows of mask patterns on a strip-shaped workpiece without the device becoming larger and the rolls having to be replaced is achieved as follows: A strip-shaped workpiece is transported. When a first exposure area of the first row reaches a projection site on a workpiece carrier (3), the strip-shaped workpiece (Wb) is held by vacuum. A mask (M) is positioned relative to the strip-shaped workpiece and the first exposure area is exposed. Then, the strip-shaped workpiece is held by the workpiece suction devices (8, 8′). The movement devices (9) are driven and the strip-shaped workpiece is moved in the direction which orthogonally intersects the transport direction so that a second exposure area of the second row reaches the projection site on the workpiece carrier. The mask is positioned to the strip-shaped workpiece and exposes the second exposure area.

Abstract: The X, Y and Rx positions of a mask stage are measured using two optical encoder-reading heads measuring displacements of respective grid gratings mounted on the mask stage. The grid gratings are preferably provided on cut-away portions of the mask table so as to be co-planar with the pattern on the mask itself. Measurements of the table position in the other degrees of freedom can be measured with capacitative or optical height sensors.

Abstract: An interferometric measurement system capable of measuring tilt of a reflecting surface with respect to a vertical axis. The system preferably includes four laser beams spaced at predetermined distances to measure distances between the measurement system and four locations on the reflecting surface. A controller is also provided for receiving inputs from the measuring laser beams to mathematically determine a tilt of the location being measured.

Abstract: A projection exposure apparatus includes a diaphragm controlling unit controlling one or more of an diaphragm, an iris diaphragm, and a relay lens system. In addition, the projection exposure apparatus also includes a line width calculator which calculates a bias, which is a difference between a line width in a dense part and a line width in an isolated part, based on information regarding a mask pattern, the wavefront aberration of a lens, the effective light source of an illumination optical system, the half-width of a laser, the temperature change in a projection optical system due to exposure, etc. When the bias is out of a tolerance range, the line width calculator calculates a correction value for the diaphragm of the projection optical system or a correction value for the effective light source of the illumination optical system in accordance with the bias which is to be corrected. Then, the diaphragm controlling unit is driven in accordance with the calculation results.

Abstract: A substrate attracting and holding method includes steps of supporting a substrate by use of a protrusion provided on a holding table for holding the substrate and reducing pressure between the holding table and the substrate to attract and hold the substrate. The protrusion is disposed to be placed in a predetermined positional relation, with respect to a direction along the surface of the substrate, with (i) a position of an alignment mark to be used for processing the substrate or (ii) a position to with respect to which an alignment mark is to be produced. The method also includes attracting and holding the substrate.

Abstract: A device (1) for generating and projecting light marks (MP, ML) in which projection optics (P) have a cylindrical lens (Z). The cylindrical lens (Z) can be irradiated by a light beam bundle (L2) such that a central beam bundle (L2Z) radiates completely through a cylinder portion area (A) and at least one marginal beam bundle (L2R) travels directly past the edge of the outer surface of the cylinder portion area (ZA). A light mark (ML) in the shape of a line is projected by the central beam bundle (L2Z), while a light mark (MP) in the shape of a point is projected through the marginal beam bundle (L2R).

Abstract: A method of optically aligning a permanent energy emitter with a first target includes steps to fix the attitude of the emitter retainer portion of an adjustable and selectively fixable emitter bracket as follows. An adjustable emitter bracket facilitative of the method includes (i) a base, (ii) an emitter retainer for selectively retaining an energy emitter and (ii) at least one set of adjustable and selectively fixable linkage members interconnecting the base and the emitter retainer. A temporary emitter is retained by the emitter retainer and caused to emit a detectable beam of electromagnetic energy. The bracket is manipulated and secured in a position in which the emitting beam impinges upon a target positioned such that, when the temporary emitter is replaced by the permanent emitter, energy emitting from the permanent emitter will impinge upon the first target. The temporary emitter is then replaced with the permanent emitter.