Abstract: Laser alignment methods and apparatus are disclosed whereby pipe and similar materials may be aligned. The methods and apparatus are adapted to be utilized on the end of pipe or other material and thereby using as a reference point that pipe or other material with the reference beam generated by the laser providing a center reference point from the pipe on which the laser is mounted. In a preferred embodiment, the laser apparatus mounting is threaded so as to be used in mating relationship with the ends of complementarily threaded pipes. A preferred embodiment has a mounting adaptor for the laser that either has tapered steps or is shaped like a tapered cone so that a single adaptor can be friction fitted into pipes of different diameters.

Abstract: An exposure apparatus for exposing a substrate to a pattern. The apparatus includes a stage configured to hold the substrate and to move, a driving unit configured to drive the stage, a plurality of cameras, each of the plurality of cameras being configured to sense an image of a mark for alignment of the substrate, the plurality of cameras including at least two cameras of which specifications are different from each other, a camera controller configured to supply a sync signal common to the plurality of cameras, to cause the plurality of cameras to execute image sensing based on the common sync signal, and to measure position of the mark based on the sensed image, and a drive controller configured to control the driving unit based on information provided by the camera controller. The common sync signal includes a common horizontal sync signal having a first horizontal period.

Abstract: An exposure apparatus for projecting a pattern of a reticle onto an object to be exposed with first light having a wavelength of 20 nm or smaller, said exposure apparatus comprising a projection optical system for projecting the pattern onto the object, and a position detecting system for detecting a positional information of a mark by receiving a second light having a wavelength different from that of the first light via the projection optical system.

Abstract: System and methodology for setting, and compensating detected errors between intended and realized Angle-of-Incidence (AOI) and Plane-Of-Incidence (POI) settings in ellipsometer and the like systems during analysis of sample characterizing data.

Abstract: In a method of measurement according to one embodiment of the invention, a relative position of a temporary alignment mark on one side of a substrate and an alignment mark on the other side of the substrate is determined, and the temporary alignment mark is removed. Before removal of the temporary alignment mark, a relative position of that mark and another mark on the same side of the substrate may be determined. The temporary alignment mark may be formed in, e.g., an oxide layer.

Abstract: A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is to be transferred, adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on one of the substrates (a reference substrate) and alignment marks formed on other two of the substrates are aligned with each other, and transferring the object to be transferred from the first substrate to the second substrate, the transferring step including irradiating the object to be transferred from the first substrate with light transmitted through the mask substrate.

Abstract: At least two identical combined transmitter/receivers are used to perform a measurement task to be carried out. Each combined transmitter/receiver utilizes a combined exit/entrance window. The identical configuration of the transmitter/receiver yields major cost advantages in the production of these articles.

Abstract: In one configuration of an arrangement according to an embodiment of the invention, a first grating patch on one module is aligned with a first grating patch on another module. In a different configuration of the arrangement, a second grating patch on the one module is aligned with a second grating patch on the other module. The two configurations are not aligned at the same time.

Abstract: A method and arrangement for aligning an optical component (14) on a printed wiring board (1) by using a reflector (8) below a surface mount technology camera to determine the offset (?) between the printed wiring board electrical layout and the light beam in the printed wiring board optical layer.

Abstract: A lithographic projection apparatus is disclosed. The apparatus includes an illumination system for providing a beam of radiation used to irradiate a patterning device, and a first support that supports the patterning device. The patterning device capable of patterning the beam of radiation. The apparatus also includes a second support that supports a substrate, a projection system for projecting the patterned beam of radiation onto a target portion of the substrate, and a projection system positioning module that controls at least one of a position and an orientation of the projection system based on at least one of a velocity and an acceleration of the projection system.

Abstract: The invention pertains to a measurement system for measuring displacement of a moveable object relative to a base in at least a first direction of measurement, the moveable object having at least one reference part that is moveable in a plane of movement relative to the base, the actual movements of the reference part being within an area of said plane of movement that is bounded by a closed contour having a shape. The measurement system comprises a sensor head that operatively communicates with a planar element. The sensor head is mounted onto the base and the planar element being mounted onto the reference part of the moveable object or the other way around, wherein the planar element has a shape that is essentially identical to the shape of the closed contour.

Abstract: A lithographic production process according to one embodiment comprises an input section, pre-imaging processes, measurement of a substrate, exposure of the substrate, post-imaging processes, and output. A controller controls the time spent processing in the scanner based on an input of the rate at which substrates arrive from the pre-imaging processes. This control allows the scanner to optimize the accuracy of devices produced by selectively varying the duration of processes in the scanner.

Abstract: A probe alignment adjuster (10) for adjusting an angle of a probe (22) for measuring a configuration of a workpiece has an angle adjuster (21) capable of adjusting the angle of the probe so that the angle aligns with a reference axis line. Since the angle of the probe and a hole angle can be accurately coincided in measurement by coinciding the angle of the probe (22) and the reference axis line, interference with a sidewall caused in inserting into a deep hole can be avoided, thereby preventing damage on the probe.

Abstract: An apparatus for aligning a mask having an image and at least one complimentary alignment mark to a substrate having a first surface and a substantially opposing second surface. The substrate further has at least one alignment mark on the second surface. A mask support supports the mask in proximity to the first surface of the substrate. A substrate support supports the substrate with the first surface in proximity to the mask. An alignment means aligns the at least one alignment mark on the second surface of the substrate to the at least one complimentary alignment mark on the mask. An exposure source projects the image of the mask onto the first surface of the substrate, and a controller controls the mask support, substrate support, alignment means, and exposure source.

Abstract: For determining the alignment of a substrate with respect to a mask, a substrate alignment mark, having a periodic structure, and an additional alignment mark, having a periodic structure and provided in a resist layer on top of the substrate, are used. Upon illumination of these two marks, having a period which is considerably smaller than that of a reference mark, an interference pattern is generated, which has a period corresponding to that of the reference mark. By measuring the movement of the interference pattern with respect to the refernce mark, the much smaller mutual movement of the fine alignment marks can be measured. In this way, the resolution and accuracy of a conventional alignment device can be increased considerably.

Abstract: When actual measurement data of a wavefront aberration of a projection optical system is input, a main controller calculates a targeted image forming characteristic of the projection optical system based on the data and a Zernike sensitivity table of the image forming characteristic that is made prior to the input. By using the Zernike sensitivity table, the targeted image forming characteristic can be calculated with only one measurement of wavefront aberration. Moreover, parameters that denote a relation between an adjustment of an adjustable specific optical element and a change in the image forming characteristics of the projection optical system is obtained in advance, and are stored in advance in a storage unit.

Abstract: A method of inspecting a phase shift mask is disclosed. The method includes receiving a mask having an alternating phase shift pattern. The method also includes forming the alternating phase shift pattern on a wafer. The method further includes analyzing the alternating phase shift pattern on the wafer to determine the phase difference of the alternating phase shift pattern.

Abstract: To inspect the polarization state of light flux for exposure of an exposure apparatus, a mask for inspection is held at the photomask position. This mask for inspection comprises a polarizing element which is disposed in a light path of light flux forming an image of a light source and which can selectively transmit light flux with a plurality of polarization directions.

Abstract: An apparatus for aligning a wafer is provided, which normally senses a flat zone of the wafer by sensors regardless of an external light so that the wafer is aligned in a set mode, in order to increase or maximize production yield. A body has all kinds of drivers. An orient chuck is provided to protrude to an upper portion of the body for rotating the wafer; a guide plate ascending and descending to slide a circumference surface of the wafer so that a center of the wafer is located on the orient chuck. A plurality of sensors sense a flat zone of the wafer being rotated on the orient chuck. A wafer carrier cassette is formed at an upper portion of the orient chuck in order to load the wafer aligned in one direction by the sensors and the orient chuck, and is supported by a plurality of frames formed at respective corners of the body.

Abstract: A semiconductor substrate is mounted on a semiconductor alignment apparatus. A chip alignment step is performed to center a central chip on the semiconductor substrate with respect to the semiconductor alignment apparatus, and to store the coordinates thereof. A semiconductor substrate alignment is performed to virtually align the semiconductor substrate with the semiconductor alignment apparatus. At this time, coordinates of a chip adjacent to the central chip and of a number of chips in a peripheral region of the semiconductor substrate are stored in the alignment apparatus. In addition, at least two templates are located in the central chip, and images and coordinates of the templates are stored in the semiconductor alignment apparatus during the semiconductor substrate alignment.

Abstract: The present invention provides for a method for adjusting an alignment microscope. In the method of the present invention an alignment mask is used in which the one side comprises at least one alignment mark and the other side is reflective. For the adjustment, the microscope is first focused to the alignment mark and then refocused to the mirror image of the alignment mark generated by the reflective side. The microscope is then adjusted by comparing the positions of the alignment mark and the generated mirror image of the alignment mark until the alignment mark overlaps its mirror image. Moreover, a device for adjusting an alignment microscope in accordance with the method of the present invention.

Abstract: A system, apparatus and method for alignment of a marine engine in a water vessel with either an existing or a design propeller shaft line of a propeller shaft of the vessel. The invention is also useful in positioning and aligning propeller shaft supports to the design shaft line before being secured to the hull of the vessel under construction. A laser gun for projecting a laser beam, a plurality of laser targets positionable into the propeller shaft support members, and a unique laser beam splitter temporarily connected to the engine output shaft cooperate to provide opposing colinear laser output beams viewably emitting from the laser beam splitter only when the marine engine is properly oriented coaxially of the engine crankshaft centerline with respect to the shaft line.

Abstract: An apparatus for radiographic image acquisition has a radiation source with an associated laser device for representation of a linear light marking on the examination subject to align the subject relative to the radiation source for a subsequent image acquisition. The laser of the laser device is operated pulsed with a pulse-pause ratio of 1:n, with n>1.

Abstract: The present invention is a pre-aligner capable of determining the center of a wafer by casting light onto a wafer that is positioned above a charge-coupled device (CCD). The pre-aligner performs this operation by directing light emitted from a single LED simultaneously onto the wafer and the CCD. The light emitted from the LED is directed through a light guide in order to direct the light onto the wafer and CCD. A lens collimates the light exiting the light guide such that the light, as it passes the wafer's edge, is substantially perpendicular to the wafer's edge. The light guide may be removably secured to the pre-aligner housing for easy installation removal. The pre-aligner is capable of self-calibrate the LED.

Abstract: The present invention refers to a system and a device (10) for alignment of at least one alignable plane with reference to at least one reference plane. The device includes a main part (11), a light source (18) and a number of contact points (21a, 21b, 21c), and the light source (18) is provided to emit a light beam (25) with a scattering angle in one plane.

Abstract: A semiconductor wafer has an alignment mark for use in aligning the wafer with exposure equipment during the manufacturing of a semiconductor device. The wafer is made by forming a chemical mechanical polishing target layer over an alignment mark layer, chemically-mechanically polishing the target layer to planarize the same, and prior to forming the chemical mechanical polishing target layer over the alignment mark layer, forming a dense pattern of lands or trenches in the alignment layer of dimensions and an inter-spacing preselected to inhibit a dishing phenomenon from occurring in the target layer as the result of its being chemically-mechanically polished. The lands or trenches may be disposed in at least a 2×2 array of rows and columns.

Abstract: A sensor system featuring a field angle compression telescope optical system for measuring atmospheric trace gases is provided. According to an embodiment of the present invention, the telescope optical system condenses the field angle of received light with respect to a cross track plane, while leaving the field angle with respect to an along-track plane uncompressed. Such an anamorphic telescope design provides a wide field of view, while allowing information regarding the altitude or height distribution of a gas to be obtained. According to another embodiment of the present invention, the field angle of received light is compressed by magnifying the received light by a value less than 1.0 in all directions.

Abstract: A method and an apparatus for aligning the longitudinal direction of grooves of a diffraction grating to a predetermined direction. The method and apparatus detect a diffracted light pattern sent from the diffraction grating, and displace the diffraction grating such that the direction of an arranging direction obtained from the diffracted light pattern is aligned in the predetermined direction.

Abstract: An exposure apparatus for exposing a substrate to a pattern due to an original includes a substrate stage which holds and moves the substrate, and a first measurement unit which is arranged on the substrate stage, and measures a position of a mark formed on the original by projecting and receiving light.

Abstract: A polarization conditioner for aligning a collimator to provide a polarized light signal. The apparatus includes input and output collimators. An adjustment mechanism can be used to adjust a position of the output collimator in order to align it for receiving one of the polarized light signals from the beam splitter through free space.

Abstract: Apparatus for aligning an optical measuring system to a desired direction comprises two housings (42,48) attachable to two relatively movable parts of a machine. The housings (42,48) have engagement means (53) such that when they are engaged together the optics inside (44,50) are aligned. The first housing (42) may be provided with attachment means, such as a ball (46), which may be located in a mount (54) on the machine table (56). The position of this ball (46) is determined and the machine spindle housing (48) to be attached to the spindle (60) when the two housings (42,48) are joined and such that the apparatus is aligned with the desired direction. The engagement means (53) between the two housings (42,48) may be compliant along an axis of the apparatus.

Abstract: An automated monitoring and alignment system to position the mechanical and optical components of a flow cytometer to enhance the consistency, performance, and efficiency of particle sorting and analysis applications.

Abstract: In order to perform a measurement operation of a pattern and a processing operation in parallel while the positions of two substrate stages are accurately measured and wire/hose units are prevented from becoming tangled, a substrate processing apparatus includes an alignment system for measuring the pattern arrangements of the substrates, a processing system disposed separately from the alignment system and used for processing the substrates, substrate stages which are able to support the substrates and move in an xy plane, and position measurement systems which measure the positions of the substrate stages. Four position measurement systems are arranged for the measurement in the x direction, and three position measurement systems are arranged for the measurement in the y direction. One of the position measurement systems for the measurement in the y direction is disposed at a side opposite to the remaining positioning measurement systems across the substrate stages.

Abstract: An overlay target with gratings thereon is illuminated and radiation scattered by the target is imaged onto detectors. A phase difference is then detected between the outputs of the detectors to find the mis-alignment error. In another aspect, an overlay target with gratings or box-in-box structures is illuminated and radiation scattered by the target is imaged onto detectors located away from the specular reflection direction of the illumination in a dark field detection scheme. Medium numerical aperture optics may be employed for collecting the radiation from the overlay target in a bright or dark field configuration so that the system has a larger depth of focus and so that the two structures of the target at different elevations can be measured accurately at the same time. Analytical functions are constructed for the grating type targets. By finding the phase difference between the two gratings at different elevations, misalignment errors can be detected.

Abstract: The present invention generally relates to a method and system for determining the position and alignment of a plane in relation to an intersecting axis and using that known position and alignment to allow for corrections to be made when using the plane as a reference plane. More particularly, the invention relates to a method and system for determining the angle of tilt of a planar surface in relation to a laser beam, and using the determined angle of tilt to calculate a correction factor to be applied to the laser beam. Briefly stated, the method and system ultimately calculates a correction factor, z-offset, that is applied when using the laser beam in a procedure.

Abstract: A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.

Abstract: A projection exposure apparatus includes a projection optical system for projecting a pattern on a substrate, a holding portion for holding an optical element which propagates light toward the projection optical system, a mask which is arranged on or near a plane of an image of the optical element formed by the projection optical system and has a transmission portion, an actuator for driving the optical element along one of focal planes of the projection optical system, and a measurement device for measuring an intensity of light which emerges from the optical element, and passes through the projection optical system and the transmission portion of the mask, while the optical element is driven. The measurement device is disposed at a point in a plane conjugate to a pupil plane of the projection optical system or a point in a plane spaced apart from the mask enough to separately detect respective rays emerging from plural points of the plane.

Abstract: An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the “spacing” in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.

Abstract: An omni-positional camera mount for the photographing of small objects (24). The mount has a support (4) to hold an object to be photographed. A first frame (9) is pivotally mounted to the support such that the first frame can pivot on a first pivot axis (12). A second frame (15) is mounted to the first frame (9) such that the second frame can pivot on a second pivot axis (18) which is at right angles to and passing through the first pivot axis. A camera stage is on the second frame. The support (4) can include a turntable and a mounting post. The turntable (4) rotates on a axis which passes through the meeting point (20) of the first and second axes.

Abstract: A scan exposure apparatus includes a stage which moves while mounting a substrate thereon, a projection optical system which projects a pattern on the stage, a horizontal position measurement unit which measures a horizontal position of the stage, and a measurement unit which measures a plane position of the substrate. A controller controls the stage so as to make an image plane of the projection optical system and a plane of the substrate coincide with each other on the basis of a measurement result by the measurement unit if a deviation of the horizontal position of the stage measured by the horizontal position measurement unit during scan exposure from a predetermined position falls within a tolerance. The tolerance is determined on the basis of a scan velocity of the stage.

Abstract: To provide an anti-thief security sensor assembly in which the angle of an optical unit can be adjusted over a wide range without increasing the size thereof and in which an optical axis can easily be adjusted, the security sensor assembly includes an optical unit (14) mounted at its lateral sides on a support member (9) of a device body (4) for rotation about a horizontal pivot axis (24) for projecting or receiving a detecting wave. A drive gear (29) is rotatably mounted on the support member (9) and positioned laterally of the optical unit (14) and adapted to be manually turned. A driven gear (39) is mounted on a lateral side of the optical unit (14) and is drivingly meshed with the drive gear (29). The driven gear (39) is rotatable together with the optical unit (14) about a horizontal pivot axis (11).

Abstract: A stereoscopic image display apparatus includes: an image display unit 22 for displaying image information corresponding to parallax in a first division and a second division; a divided wave plate filter unit 12 having a frame 41 and disposed adjacent to the first division and the second division of the image display unit, for rotating polarized light of the image information from the first division to a direction different from polarized light of the image information from the second division; and position adjusting means 35R and 35L for acting on the frame of the divided wave plate filter unit and thereby allowing adjustment of a relative position between the image display unit and the divided wave plate filter.

Abstract: A method for diagnosing a lithographic tool. The method includes developing digitalized images of at least one wafer pattern with different exposure doses and assembling the digitized images into a pupilgram. The at least one function is of a known illuminator behavior of the lithographic tool is modeled. The pupilgram is fitted to the modeled function to determine whether a behavior associated with the pupilgram is within predetermined limits of illuminator behavior to diagnosis imperfections in the illuminator behavior. One technique applied to the illuminator analysis consists of evaluating the dose transmitted (by direct calculation) by the lens for a given input pupilgram (or set of pupilgram basis functions), a given pattern size and pitch, and a defined lens NA, is described.

Abstract: A power tool having a work surface and a spindle attached to the power tool and defining an axis of operation of the power tool. In one embodiment, the power tool may include a bracket above the work surface. The bracket may include first and second bracket receptacles and first second holders movably supported in the first and second bracket receptacles. A first laser generator may be mounted in the first holder at a first angle relative to an axis of the first holder, and it may adjustably project a first fan beam. A second laser generator may be mounted in the send holder at a second angle relative to an axis of the second holder, and it may adjustably project a second fan beam. The first and second fan beams may be adjusted to intersect along the axis of operation of the power tool.

Abstract: In a method of measuring, in a lithographic manufacturing process using a lithographic projection apparatus, overlay between a resist layer, in which a mask pattern is to be imaged, and a substrate, use is made of an alignment-measuring device forming part of the apparatus and of specific overlay marks in the substrate and resist layer. These marks have periodic structures with periods which cannot be resolved by the alignment device, but generate an interference pattern having a period corresponding to the period of a reference mark of the alignment device.

Abstract: To calibrate a front-to-backside alignment system a transparent calibration substrate with reference markers on opposite sides is used. A plane plate is inserted to displace the focal position of the alignment system from the top to bottom surface of the calibration substrate.

Abstract: A semiconductor wafer has at least one pre-layer on-wafer alignment mark (pre-layer on-wafer AM) on a top surface of the semiconductor wafer. A baseline check (BCHK) is performed to align a current-layer reticle AM on a current-layer reticle with the pre-layer on-wafer AM. By capturing and comparing signals of the current-layer reticle AM and the pre-layer on-wafer AM, a corresponding coordinate of the current-layer reticle to the semiconductor wafer is calibrated. Finally, a lithography process is performed to transfer the layout of the current-layer reticle AM to the top surface of the semiconductor wafer to form a corresponding current-layer on-wafer AM.

Abstract: For determining the alignment of a substrate with respect to a mask, a substrate alignment mark having a periodic structure, and an additional alignment mark, having a periodic structure and provided in a resist layer (RL) on top of the substrate, are used. Upon illumination of these two marks, having a period which is considerably smaller than that of a reference mark, an interference pattern (Pb) is generated, which has a period corresponding to that of the reference mark. By measuring the movement of the interference pattern with respect to the reference mark, the much smaller mutual movement of the fine alignment marks can be measured. In this way, the resolution and accuracy of a conventional alignment device can be increased considerably.

Abstract: To use a beam splitting optical system smaller than the conventional beam splitters and to set a longer optical path between a concave, reflective mirror and an image plant. A light beam from an object surface travels through a first converging group to enter a beam splitter, and a light beam reflected by the beam splitter is reflected by a concave, reflective mirror to form an image of patterns on the object surface inside the concave, reflective mirror. A light beam from the image of the patterns passes through the beam splitter and thereafter forms an image of the patterns through a third converging group on an image plane.

Abstract: Constant speed drive of a reticle and a wafer in a relative scanning direction and positioning of the reticle and the wafer are simultaneously performed with high precision by a slit scanning exposure scheme. A reticle side scanning stage for scanning a reticle relative to a slit-like illumination area in the relative scanning direction is placed on a reticle side base. A reticle side fine adjustment stage for moving and rotating the reticle within a two-dimensional plane is placed on the reticle side scanning stage. The reticle is placed on the reticle side fine adjustment stage. Constant speed drive and positioning of the reticle and a wafer are performed by independently controlling the reticle side scanning stage and the reticle side fine adjustment stage.