Abstract: A method for positioning a viewing center of a parallax barrier mainly includes: disposing multiple alignment markers respectively at appropriate places of the parallax barrier and a flat panel display, and performing position measurement and alignment of the multiple alignment markers, so as to achieve a purpose of setting a viewing center at a specific and appropriate position.

Abstract: An apparatus comprising a charging pin in a recharging inlet of an electric powered vehicle (EPV) recharging inlet, a ground pin in the recharging inlet and substantially parallel to the charging pin, a safety pin in the recharging inlet and substantially parallel to the charging pin and the ground pin, an electric power source coupled to the safety pin, and a control circuit coupled to the electric power source and the safety pin, wherein the length of the safety pin extended in the recharging inlet is substantially shorter than the length of the ground pin and longer than the length of the charging pin.

Abstract: A method for correcting a position error of a lithography apparatus comprises inputting position data of exposure pattern, irradiating laser light onto a position reference mask from a position measurement laser system, calculating actual position data of the laser light irradiated onto the position reference mask, and comparing the position data of the exposure pattern with the actual position data of the laser light irradiated onto the position reference mask. With this method, circuit patterns can be accurately formed at predetermined positions on a photomask, and the circuit patterns on the photomask can be accurately formed at predetermined positions on a wafer.

Abstract: A method and system to measure misalignment error between two overlying or interlaced periodic structures are proposed. The overlying or interlaced periodic structures are illuminated by incident radiation, and the diffracted radiation of the incident radiation by the overlying or interlaced periodic structures are detected to provide an output signal. The misalignment between the overlying or interlaced periodic structures may then be determined from the output signal.

Abstract: A method and optical device measures the rotation of an object, including a light source emitting a collimated incident light beam, and a reflecting plane optical interface to be fastened to the object and forming a first reflected beam. The device includes a corner reflector fastened to the object, and having reflecting plane faces forming a second reflected beam, and a detection system capable of measuring the displacement ?1 of the first reflected beam, and the displacement ?2 of the second reflected beam. A processing system calculates, as a function of ?1 and of the distance D1 between the detection system and the reflecting plane optical interface, and of the measurement of ?2 and of the distance D2 between the detection system and the corner reflector, a measurement of the rotation ? of the object between an initial position and a measurement position.

Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: An alignment device for conducting single axis alignment of a workpiece is provided. The alignment device has a holder positioned on a worktable. The holder is rotatable about an axis and holds the workpiece. The alignment device also has a light source that emits a beam of light toward the workpiece. Optics positioned at an emitting end of the light source and a slit portion provided between the light source and the optics cooperate to shape the light beam emitted from the light source to be elongated in a direction orthogonal to the worktable. A photodetector is disposed in the vicinity of the light source and in the orthogonal plane with respect to an optical axis of the light source. A circuit portion determines when a workpiece is aligned with the work table based on the photodetector detecting the reflected beam of light and outputs a signal confirming alignment to a user.

Abstract: A substrate positioning device includes: a supporting unit for supporting a substrate in place; a light emitting unit and a light receiving unit respectively arranged at major surface sides of the substrate to face each other; a light emission control unit configured to control a light emission quantity of the light emitting unit pursuant to a control value; and a detecting unit for detecting a light reception quantity received by the light receiving unit. The substrate positioning device further includes an adjusting unit for controlling the control value pursuant to the light reception quantity while the substrate is not supported by the supporting unit.

Abstract: An apparatus may be provided for determining a signature from an article in a reading volume of the apparatus. The apparatus can comprise a source operable to generate a coherent beam and a beam directing member operable to direct the coherent beam into the reading volume. The apparatus may also comprise a detector arrangement for collecting signals created by scatter of the coherent beam within the reading volume, wherein different ones of the signals relate to scatter from different parts of the reading volume, the detector arrangement having a numerical aperture greater than a predetermined minimum and a processor operable to determine a signature for an article in the reading volume from the collected signals. Use of such apparatus can be repeated whenever required to test authenticity of the article.

Abstract: An overlay measurement apparatus includes a stage on which a wafer comprising first and second overlay measurement keys, which are separated from each other, is placed. A nonlinear medium receives a reference beam and first and second diffracted beams respectively generated by the first and second overlay measurement keys. A detector detects a synthesized beam emitted from the nonlinear medium.

Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders.

Abstract: A method and system for alignment of a tool to a workpiece in a continuous or discontinuous material flow are disclosed. The workpiece may be a portion of a web of material. An imaging system captures first and second images of the workpiece at first and second occasions respectively. Microscopic native features of the workpiece are selected, detected, tracked and/or compared in the first and second images. Based on the correspondence between, tracking or relative displacement of features as captured in the first and second images, an alignment to the workpiece is controlled. In embodiments, the workpiece and a tool, a projected image or a pattern to be imparted to the workpiece by a lithography or photolithography apparatus are aligned based upon positioning information determined from an analysis of correlated features or texture in the images. Positioning information may include a positioning error or a distortion indication.

Abstract: An optical reader for interrogating an optical analyte sensor includes a housing, comprising in its interior: at least one light source, a detector, and a programmable logic device. The housing has a registration feature configured to align the optical reader with an optical analyte sensor. Methods for confirming alignment of such optical readers are also disclosed.

Abstract: To perform high-speed and highly accurate measurement by setting desired measuring conditions for each measuring object. In an alignment sensor of exposure apparatus, in the case of performing position measurement for a plurality of sample shots, measurement is performed by changing the measuring conditions, in response to a measuring axis direction, a mark or a layer whereupon a mark to be measured exists. At that time, for the measuring objects to be measured under the same measuring conditions, for example, a position in a Y axis direction and a position in an X axis direction, measurement is continuously performed. When the measuring condition is changed, a baseline value is remeasured. The changeable measuring conditions are wavelength of measuring light, use and selection of a retarder, NA and ? of an optical system, a light quantity of measuring light, illumination shape, signal processing algorithm, etc.

Abstract: A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation.

Abstract: An optical apparatus comprising a first mirror (12), a second mirror (14), and at least one support (30) for holding the second mirror in substantially a predetermined position relative to said first mirror (12), wherein said at least one support (30) comprises at least one actuator (32) arranged to adjust the position of the second mirror (14), and said optical apparatus further comprises at least one light source (40a-40-c) rigidly fixed to the first mirror (12) in a predetermined orientation for providing a beam of light (42a-42c) directed at said second mirror (14), at least one corresponding alignment sensor (46a-46c) for detecting the beam of light (44a-44c) reflected from said second mirror (14), and arranged to provide an output signal indicative of the position of the incident reflected beam, and a controller (50) arranged to receive said output signal, and to thereby control said actuator (32) to adjust the position of the second mirror (14).

Abstract: Analysis methods and apparatus are provided for inspecting a channel, such as a capillary electrophoresis channel, in a device. Configuration and alignment systems are provided, together with optical systems and temperature control.

Abstract: An apparatus, system, or method for positioning a wafer on a support of a rotatable chuck may improve the accuracy and precision of various wafer edge cuts and wafer profiling at a variety of stages of wafer manufacturing. The apparatus, system, or and/or method may employ one or more of a wafer position calculator to calculate a desired wafer position and to provide desired wafer position information to a wafer arm controller; and a wafer arm controller in communication with the wafer position calculator to provide instructions to adjust a wafer arm to position the wafer on the support according to the desired wafer position. Various sensor detectors and sensor lights or other mechanisms for sensing the position of a wafer may also be used.

Abstract: A laser beam is periodically deflected before being directed into a sample volume. The beam is deflected at a frequency such that the beam makes one or more passes through the sample volume while data are collected from the sample volume. The amplitude of motion of the beam, the dwell time of the beam at any given point, and the Gaussian intensity profile of the beam cooperate to produce an effective flat topped illumination profile for the light that is incident on specimens in the sample volume. The total photon exposure at any given point in the sample volume is a function of both the beam intensity and the dwell time at that location. Therefore, a longer dwell time and lower intensity at the edge of the profile are in balance with a shorter dwell time and higher intensity at the center of the profile.

Abstract: In an exposure apparatus, exposure light from a lamp (continuous light source) (9) is applied at an exposure station (exposure section) (2) to a substrate (4), which is being transferred at a fixed speed in a fixed direction by a substrate transfer section (5), through a mask (11) arranged on an optical axis (optical path) (S) of an exposure optical system (3). At the time of exposing an image of an opening section (11a) of the mask (11) on the substrate (4), the front edge and the side edge (pattern edge) of a pixel (reference pattern) (18) previously formed on the substrate (4) are photographed by a linear CCD (20) of an imaging section (6), and a reference position in the transfer direction and a direction vertical to such direction on the substrate (4) is detected.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: A method of inspecting a substrate with first and second layers thereon is disclosed. The method includes directing a beam of electromagnetic radiation at an acute angle towards an edge of the layers, detecting scattered and/or reflected electromagnetic radiation, and establishing, from results of the detecting, whether an edge of the second layer overlaps an edge of the first layer.

Abstract: A sample investigation system (ES) in functional combination with an alignment system (AS), and methodology of enabling calibration and very fast, (eg. seconds), sample height, angle-of-incidence and plane-of-incidence adjustments, with application in mapping ellipsometer or the like systems.

Abstract: The invention relates to a method for orienting an optical element (e. g. a parallax barrier screen or lenticular screen) on a screen comprising pixels x(i, j) in a raster composed of lines (i) and columns (j) in order to produce a screen for three-dimensional representation. In said method, especially a test pattern is presented which consists of various views A(k), wherein k=1, . . . , n, and n>1. The test pattern comprises at least two first straight lines that are located in different horizontal positions in the n>1 views A(k) as well as at least two second straight lines which each extend parallel to one of the first straight lines and are located in at least the same horizontal positions in the n>1 views A(k). The method according to the invention can be carried out quickly and with high accuracy and is therefore suitable for industrial use to produce screens for three-dimensional representation.

Abstract: A system and method for computer automated optimal lateral alignment of a spectrophotometer over a region of consistent color on a moving media or web for maintaining consistent color and or tonal qualities of a color application production process. The system consisting of a computer operated lateral traverse mechanism affixed to the press or color application equipment that is able to move the sensor laterally in small increments across the band of the color patches on the moving web or media, marking the lateral position each time it makes a light measurement, and therefrom calculating the optimal lateral alignment or position of the sensor for maintaining consistent color or density control during the color application process.

Abstract: Pulley alignment apparatus for aligning pulleys when the operating position of a variable sheave pulley of a pulley system has changed is provided. The pulley alignment apparatus has an adjustable laser light unit that can be adjusted to compensate for the resulting displacement of the centerline of the variable sheave pulley when the operating position is changed. The pulley alignment apparatus also has a set of gauges for determining the operating position of a variable sheave pulley and determining if a belt is adequate for the variable sheave pulley at the operating position.

Abstract: Methods, apparatuses and systems for monitoring a stage alignment in a processing system are disclosed. A method for monitoring a stage alignment in a processing system may include providing a calibration target on a surface of the stage; measuring an angle of incident of a light beam to the calibration target; and monitoring the stage alignment based on the determined angle of incidence.

Abstract: The disclosure relates to a system and a method for light beam interrogation of an optical biosensor and for monitoring a biological event on the biosensor for use, for example, in microplate image analysis. The system and method correct pointing-errors that can be encountered, for example, in scanning label-independent-detection biosensor applications.

Abstract: A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

Abstract: A semiconductor wafer may include a dummy field configured to enable overlay measurements. The enhanced dummy field may include a plurality of encoding blocs that enable OVL measurements to be made throughout the enhanced dummy field.

Abstract: An exposure method comprises: a first detection step of detecting a position of a first mark by a first scope; a second detection step of detecting a position of a second mark by a second scope having a magnification higher than the first scope; a first calculation step of calculating a first correction value based on the detection results obtained in the first and second detection steps; a third detection step of detecting a position of a third mark by the second scope after the substrate is aligned based on the first correction value calculated in the first calculation step; a second calculation step of calculating a second correction value based on the detection results obtained in the second and third detection steps; and an exposure step of exposing the substrate after the substrate is aligned based on the second correction value calculated in the second calculation step.

Abstract: A maskless exposure apparatus which precisely and rapidly measures positions of spot beams of a plurality of optical systems by calculating positions of respective BMSs using a plurality of FMs engraved on an FBA on a movable table. The centers of the respective BMSs are aligned with the centers of random FMs of the plurality of FMs. Thereafter, positions of spot beams irradiated from the plurality of optical systems are quickly and precisely measured using the positions of the respective BMSs and the positions of the FMs measured by the BMSs, thereby more quickly generating mask data to execute maskless exposures.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: A lithographic apparatus, includes a support structure configured to hold a patterning device, the patterning device configured to impart a beam of radiation with a pattern in its cross-section; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate table; a sensor configured to measure an exposure parameter using a measuring beam projected through the liquid; and a correction system configured to determine an offset based on a change of a physical property impacting a measurement made using the measuring beam to at least partly correct the measured exposure parameter.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: A drive system drives a movable body, based on measurement results of a first measurement system which measures the position of the movable body in an XY plane by irradiating a measurement beam from an arm member on a grating placed on a surface parallel to the XY plane of the movable body. In this case, because a configuration in which the arm member irradiates a measurement beam on the grating is employed, there is no adverse effect due to the drive of the moving body, unlike the case when an encoder system is arranged on a stage surface plate. Accordingly, it becomes possible to drive the movable body with good precision.

Abstract: The invention relates to a substrate for use in a lithography system, said substrate being provided with an at least partially reflective position mark comprising an array of structures, the array extending along a longitudinal direction of the mark, characterized in that said structures are arranged for varying a reflection coefficient of the mark along the longitudinal direction, wherein said reflection coefficient is determined for a predetermined wavelength. In an embodiment a specular reflection coefficient varies along the substrate, wherein high order diffractions are substantially absorbed by the substrate. A position of a beam on a substrate can thus be determined based on the intensity of its reflection in the substrate. The invention further relates to a positioning device and lithography system for cooperation with the substrate, and a method of manufacture of the substrate.

Abstract: A method of measuring focus of a lithographic projection apparatus includes exposure of a photoresist covered test substrate with a plurality of verification fields. Each of the verification fields includes a plurality of verification markers, and the verification fields are exposed using a predetermined focus offset FO. After developing, an alignment offset for each of the verification markers is measured and translated into defocus data using a transposed focal curve. The method according to an embodiment of the invention may result in a focus-versus alignment shift sensitivity up to 50 times higher (typically dX,Y/dZ=20) than conventional approaches.

Abstract: A table saw includes a workpiece support surface and a laser apparatus. The workpiece support surface defines a blade opening through which a cutting blade is configured to extend. The laser apparatus is configured to emit a laser light away from the workpiece support surface.

Abstract: An alignment system for optical lithography uses cameras fixed to a movable stage and to a lithography unit to view unique microscopic non-uniformities that are inherent to the surface of a work piece, e.g., metal or ceramic microcrystalline grains, for position referencing. Stage cameras image two sites on the work piece through windows in the stage to establish original position templates. After the work piece has been repositioned, e.g., reversed topside-down, the same two sites are again viewed and template matching establishes the transformed coordinates of the work piece, e.g. by a lithography unit camera under which the stage moves to approximate site locations. Two corner cameras can serve as a coarse positioning mechanism. The alignment system is particular useful for backside alignment in printed circuit board lithography.

Abstract: The invention relates to alignment of an interferometer module for use in an exposure tool. An alignment method is provided for aligning an interferometer to the tool while outside of the too. Furthermore, the invention provides a dual interferometer module, an alignment frame use in the alignment method, and an exposure tool provided with first mounting surfaces for cooperative engagement with second mounting surfaces of an interferometer module.

Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).

Abstract: Disclosed is a system for aligning a collimator tube with an alignment ring used to hold a film or sensor aligned with the collimator tube. The disclosed alignment system includes a light source, a light detector, and a reflective surface, where, when the collimator and alignment ring are aligned, light emitted from the light source reflects off the reflective surface and is received by the light detector.

Abstract: In an embodiment, a stage system calibration method includes moving the stage relative to an encoder grid in response to a setpoint signal and measuring a position of the stage by a sensor head cooperating with the encoder grid. The position of the stage is controlled by a stage controller. A signal representative of a difference between the setpoint signal and the position of the stage as measured by the sensor head is registered. The stage system is calibrated from the registered signal representative of the difference.

Abstract: A method of determining the location of a lithographic substrate relative to an imprint template is disclosed.

Abstract: A substrate stage for an immersion type lithographic apparatus is arranged to project a patterned radiation beam from a patterning device onto a substrate, the substrate stage being constructed to hold the substrate and including at least a sensor for sensing the patterned radiation beam, the sensor including an at least partially transmissive layer having a front side facing the incoming radiation beam and a back side opposite the front side, wherein the back side is provided with at least a sensor mark to be subjected to the radiation beam transmitted through the layer.

Abstract: A semiconductor wafer may include a dummy field configured to enable overlay measurements. The enhanced dummy field may include a plurality of encoding blocs that enable OVL measurements to be made throughout the enhanced dummy field.

Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on acceleration of the substrate holders. Whether there is the possibility of misalignment may be judged based on acceleration of a transporting section that transports the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of the substrate holders.

Abstract: An alignment method for controlling a mirror (100) makes it possible to orient an optical compensation digital hologram (3) relative to a mirror control tool. The control tool is designed to light up, one by one, confined portions (S10) of a reflecting surface (S100) of the mirror, and the entire surface is controlled while moving a lighting and image capture assembly (20), between a series of views, over the mirror. The control tool can then be of small size, even when the mirror has a very low curvature and a large size.

Abstract: Methods and apparatuses are provided for positioning a substrate having a target that may be located on either the front-side or the backside of the substrate. The optical detector that views the target contains a signal-generating material that is substantially identical to the substrate material.