Abstract: A patterning device support for controlling a temperature of a patterning device can include a movable component. The movable component can include a gas inlet for supplying a gas flow across a surface of the patterning device and a gas outlet for extracting the gas flow. The patterning device support can also include a gas flow generator coupled to a duct, for recirculating the gas flow from the gas outlet to the gas inlet.

Abstract: A backlight system for a display device which comprises a light emitting diode comprising an encapsulating lens and an aspheric lens interposed between the light emitting diode and the display device. The backlight system provides a luminance of substantially 100K nits at a cone angle of substantially 12° and is of particular utility in conjunction with laser-based range and speed measurement instruments.

Abstract: One pair each of a Y linear motor (a total of four) on the +X side and the ?X side that drive a reticle stage include one pair each of a stator section (a total of four) and three each of a mover section (a total of six) on the +X side and the ?X side. In this case, the three each of the mover sections on the +X side and the ?X side configure one each of a mover. The mover section located in the center in the Z-axis direction of each of the movers is used in common by each pair of the Y linear motors. Therefore, the weight of the mover section (reticle stage) of the reticle stage device is reduced, which allows a higher acceleration. Further, the mover section located in the center in the Z-axis direction of each of the movers coincides with a neutral plane of the reticle stage.

Abstract: A multi-layer laser diode mount is configured with a submount made from thermo- and electro-conductive material. One of the opposite surfaces of the submount supports a laser diode. The other surface of the submount faces and is spaced from a heatsink. The submount and heatsink are configured with respective thermal expansion coefficients (“TEC”) which are different from one another. The opposite surfaces of the submount are electroplated with respective metal layers one of which is bonded to a soft solder layer. In one aspect of the disclosure, the mount is further configured with a spacer having the same TEC as that of the submount and bonded to the soft solder layer. A layer of hard solder bonds the spacer and heatsink to one another. In a further aspect of the disclosure, the electroplated metal layer in contact with the other surface of the submount is hundred- or more micron thick. The soft solder is directly bonded to the heatsink.

Abstract: An industrial CT scanning test system. The test system includes a test base, a multi-axis motion swivel table supported on the test base, a ray generator, an image acquisition device, and a fluid pressure loading device, and further includes a control device. The fluid pressure loading device includes at least one loading cylinder, and in case of performing a scanning experiment, the at least one loading cylinder is placed on a sample stage of the multi-axis motion swivel table together with a sample, and real-time loading of loads in different directions on the sample is performed according to test requirements.

Abstract: Metrology methods and respective software and module are provided, which identify and remove measurement inaccuracy which results from process variation leading to target asymmetries. The methods comprise identifying an inaccuracy contribution of process variation source(s) to a measured scatterometry signal (e.g., overlay) by measuring the signal across a range of measurement parameter(s) (e.g., wavelength, angle) and targets, and extracting a measurement variability over the range which is indicative of the inaccuracy contribution. The method may further assume certain functional dependencies of the resulting inaccuracy on the target asymmetry, estimate relative donations of different process variation sources and apply external calibration to further enhance the measurement accuracy.

Abstract: A purge cover is equipped whose upper end is connected to an illumination unit and the lower end has a pair of plate sections facing an upper surface of a reticle stage and a reticle via a predetermined clearance. Therefore, gaseous circulation can be substantially blocked via the clearance between the reticle stage and the plate sections. This allows a space which is almost airtight surrounded by the purge cover, the reticle stage and/or the reticle to be formed on the optical path of the illumination light that reaches the projection optical system from the illumination unit. Further, the space above which is almost airtight serves as a purge space that is purged with clean dry air and the like.

Abstract: Methods and systems for minimizing of algorithmic inaccuracy in scatterometry overlay (SCOL) metrology are provided. SCOL targets are designed to limit the number of oscillation frequencies in a functional dependency of a resulting SCOL signal on the offset and to reduce the effect of higher mode oscillation frequencies. The targets are segmented in a way that prevents constructive interference of high modes with significant amplitudes, and thus avoids the inaccuracy introduced by such terms into the SCOL signal. Computational methods remove residual errors in a semi-empirical iterative process of compensating for the residual errors algorithmically or through changes in target design.

Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.

Abstract: Methods and metrology modules and tools are provided, which minimize an estimated overlay variation measure at misalignment vector values obtained from a derived functional form of an overlay linear response to non-periodic effects. Provided methods further quantifying target noise due to the non-periodic effects using multiple repeated overlay measurements of the target cells, calculating an ensemble of overlay measurements between the cells over the multiple measurement repeats and expressing the target noise as a statistical derivative of the calculated overlay measurements. Sub-ensembles may be selected to further characterize the target noise. Various outputs include optimized scanning patterns, target noise metrics and recipe and target optimization.

Abstract: A long wave infrared imaging polarimeter (LWIP) is disclosed including a pixilated polarizing array (PPA) in close proximity to a microbolometer focal plane array (MFPA), along with an alignment engine for aligning and bonding the PPA and MFPA and method for assembly.

Abstract: The present invention provides a method for manufacturing a liquid crystal display device, which hardly causes display unevenness in joining parts in which mutually neighboring exposure regions are overlapped upon carrying out a photo-alignment treatment for forming a horizontal alignment film.

Abstract: Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a single patterned target and a multiple patterned target are measured, the collected data fit to a combined measurement model, and the value of a structural parameter indicative of a geometric error induced by the multiple patterning process is determined based on the fit. In some other examples, light having a diffraction order different from zero is collected and analyzed to determine the value of a structural parameter that is indicative of a geometric error induced by a multiple patterning process. In some embodiments, a single diffraction order different from zero is collected. In some examples, a metrology target is designed to enhance light diffracted at an order different from zero.

Abstract: When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge intersecting points are acquired in a first wafer coordinate system, and a reference edge intersecting point set composed of two adjacent edge intersecting points is created from the four edge intersecting points. Between the two remaining edge intersecting points which do not constitute the reference edge intersecting point set, an edge intersecting point present within an area surrounded by two circles defined based on the two edge intersecting points constituting the reference edge intersecting point set is selected as an effective edge intersecting point, and a central position of a circle passing through the reference edge intersecting points and the effective edge intersecting point is acquired as a central position of the wafer.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

Abstract: Devices and methods are provided for positioning and/or rotating a substrate without solid contact, such as by floating the wafer on a thin layer of gas. Since there is no solid contact with components of a processing chamber, features on the wafer are used to determine wafer position and rotational speed. Closed loop control systems are provided with capacitive sensors to monitor the position of the edge of the wafer in a horizontal plane. Control systems may also monitor the position of a wafer feature as it rotates, such as a notch in the edge of the wafer. Because the presence of a notch can disrupt sensors facing the edge of the wafer, methods and devices to reduce or eliminate this disruption are also provided.

Abstract: An exposure method includes loading a first substrate on a loading portion , the first substrate having a photo alignment agent which is coated on the first substrate, irradiating the first substrate by moving the first substrate in a first speed in a first direction to a working portion while loading a second substrate on the loading portion, the working portion having an ultra violet light source generating ultra violet ray to harden a photo alignment agent, simultaneously irradiating the first substrate and the second substrate by moving the first substrate and the second substrate in the first direction in the working portion, and unloading the first substrate from an unloading portion while irradiating the second substrate by moving the second substrate in the first direction in the working portion.

Abstract: Implementations disclosed herein provide a method comprising emitting light at a plurality of locations across a surface of a recording head, detecting light output from a diffraction grating axis with a detector, and determining a target position for mounting a light source on the surface of the recording head by analyzing the detected light output corresponding to one or more of the plurality of locations.

Abstract: An overlay target for use in imaging based metrology is disclosed. The overlay target includes a plurality of target structures including three or more target structures, each target structure including a set of two or more pattern elements, wherein the target structures are configured to provide metrology information pertaining to different pitches, different coverage ratios, and linearity. Pattern elements may be separated from adjacent pattern elements by non-uniform distance; pattern elements may have non-uniform width; or pattern elements may be designed to demonstrate a specific offset as compared to pattern elements in a different layer.

Abstract: The present invention provides a method for manufacturing a liquid crystal display device, which hardly causes display unevenness in joining parts in which mutually neighboring exposure regions are overlapped upon carrying out a photo-alignment treatment for forming a horizontal alignment film.

Abstract: A system for displaying a plurality of registered images is disclosed. A first viewport unit displays a representation of a first image dataset in a first viewport. A second viewport unit displays a representation of a second image dataset in a second viewport. A position indication unit enables a user to indicate a position in the first dataset displayed in the first viewport, to obtain a user-indicated position. A corresponding position determining unit determines a position in the second image dataset corresponding to the user-indicated position, to obtain a corresponding position in the second image dataset, based on correspondence information mapping positions in the first image dataset to corresponding positions in the second image dataset. The second viewport unit displays an indication of the corresponding position in the second viewport.

Abstract: A measurement apparatus includes: an imaging unit positioned with fixing with respect to a first member; a first detector configured to detect a position of a stage with reference to a second member; a second detector configured to detect fluctuation of a position of the first member with reference to the second member; and a control unit configured to obtain the position of the mark from an image of the mark sensed by the imaging unit while controlling a relative position of the stage relative to the second member so as to reduce fluctuation of a relative position of the mark relative to the imaging unit due to the fluctuation of the position of the first member based on detection results of the first and second detectors.

Abstract: The present invention provides an overlay target. The overlay target includes a plurality of first pattern blocks and a plurality of second pattern blocks. The first pattern blocks and the second patterns blocks are arranged in array by being separated by at least one first gaps stretching along a first direction and at least one second gaps stretching along a second direction. Each first pattern block is composed of a plurality of first stripe patterns stretching along a third direction, and each second pattern block is composed of a plurality of second stripe patterns stretching along a fourth direction. The first direction is orthogonal to the second direction, the third direction and the fourth direction are 45 degrees relative to the first direction.

Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a first wafer and a second wafer. The light source is configured to provide a first light directed to the first wafer and a second light directed to the second wafer. The light detection device is configured to detect reflected light intensity from the first wafer to find a position of at least one wafer alignment mark of the first wafer and to detect reflected light intensity from the second wafer to find a position of at least one wafer alignment mark of the second wafer.

Abstract: The present invention provides devices and systems for use at the point of care. The methods devices of the invention are directed toward automatic detection of analytes in a bodily fluid. The components of the device are modular to allow for flexibility and robustness of use with the disclosed methods for a variety of medical applications.

Abstract: The present invention provides devices and systems for use at the point of care. The methods devices of the invention are directed toward automatic detection of analytes in a bodily fluid. The components of the device are modular to allow for flexibility and robustness of use with the disclosed methods for a variety of medical applications.

Abstract: An overlay mark for determining the alignment between two separately generated patterns formed along with two successive layers above a substrate is provided in the present invention, wherein both the substrate and the overlay mark include at least two pattern zones having periodic structures with different orientations, and the periodic structures of the overlay mark are orthogonally overlapped with the periodic structures of the substrate.

Abstract: Embodiments of the disclosure provide methods and system for correcting lithographic film stress/strain variations on a semiconductor substrate using laser energy treatment process. In one embodiment, a method for correcting film stress/strain variations on a substrate includes performing a measurement process in a metrology tool on a substrate to obtain a substrate distortion or an overlay error map, determining dose of laser energy in a computing system to correct film stress/strain variations or substrate distortion based on the overlay error map, and providing a laser energy treatment recipe to a laser energy apparatus based on the dose of laser energy determined to correct substrate distortion or film stress/strain variations.

Abstract: Metrology targets, design files, and design and production methods thereof are provided. The metrology targets are hybrid in that they comprise at least one imaging target structure configured to be measurable by imaging and at least one scatterometry target structure configured to be measurable by scatterometry. Thus, the hybrid targets may be measured by imaging and scatterometry simultaneously or alternatingly and/or the measurement techniques may be optimized with respect to wafer regions and other spatial parameters, as well as with respect to temporal process parameters. The hybrid targets may be used to monitor process parameters, for example via comparative overlay measurements and/or high resolution measurements.

Abstract: According to one embodiment, a deflection measuring device that irradiates an effective region of a pattern transfer plate on which a pattern is formed, with parallel lights from at least two directions, and detects interference fringes of the parallel lights reflected from the effective region.

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.

Abstract: The following relates to assessing the quality of an optical component. The optical component comprises an arrangement of a first and a second optically transmissive component grating having a component relative orientation angle, and the quality is assessed in terms of a deviation of the component relative orientation angle from a desired relative orientation angle. A master component comprises a substantially matching arrangement of a first and a second optically transmissive master grating having the desired relative orientation angle. The components are supported with the first and second component gratings in the vicinity of the first and second master gratings, and first and second fringe patterns formed by the first gratings and second gratings respectively are used to output a quality assessment, which is based on the fringe spacing of the second fringe pattern when the fringe spacing of the first fringe pattern is substantially maximal.

Abstract: An alignment device with one or two optoelectronic transmitting and/or receiving units and an evaluation unit. At least one optoelectronic transmitting and/or receiving unit contains an inclinometer. Furthermore, the transmitting and/or receiving unit is connected to a vibration sensor which can be the inclinometer. Both the result of the alignment process and also the result of the vibration measurement are communicated to the user as an easily understandable characteristic on a display of the evaluation unit. For vibration measurement at a non-rotating part of a machine, an accelerometer/inclinometer sensor may be used for measuring acceleration forces resulting from machine vibrations to be measured and for measuring gravity and an electronic evaluation unit determining the orientation of the sensor with regard to gravity from a stationary component of the sensor output and determining sensor orientation from evaluation of non-stationary components of sensor output.

Abstract: The present invention provides devices and systems for use at the point of care. The methods devices of the invention are directed toward automatic detection of analytes in a bodily fluid. The components of the device are modular to allow for flexibility and robustness of use with the disclosed methods for a variety of medical applications.

Abstract: In a method to control a printer or copier, a color measurement unit is provided for determining a measurement value of a print marking in a measurement region of color measurement unit. The print marking is printed on the printing substrate web. In addition a positioning marking is also printed on the printing substrate web in a predetermined position relative to the print marking in order to determine a relative position between the print marking and the measurement region of the color measurement unit. The positioning marking comprises at least two partial regions printed in different colors, the partial regions being formed such that a determined color value of the positioning marking changes given a movement of the measurement region of the color measurement unit transverse to a movement direction of the printing substrate web. A real color value is determined with the color measurement unit if the measurement region of the color measurement unit is arranged in a region of the positioning marking.

Abstract: A transfer device includes: a transfer unit configured to transfer a substrate from a transfer original position to a corrected transfer destination position; a plurality of position detecting units installed between the transfer original position and the corrected transfer destination position and configured to detect a position of the substrate which is being transferred by the transfer unit; and a control unit configured to calculate the corrected transfer destination position by correcting an initial transfer destination position set at the start of the transfer of the substrate, based on the position of the substrate detected by the position detecting units, before the substrate is transferred to the initial transfer destination position, and configured to control the transfer unit to transfer the substrate to the corrected transfer destination position along a transfer path produced by modifying an initial transfer path.

Abstract: Systems and methods for acquiring information for a construction site are provided. One system includes a base unit positioned within a construction site by a user. A computer subsystem of the base unit determines a position of the base unit with respect to the construction site. The system also includes a measurement unit moved within the construction site by a user. The measurement unit includes one or more elements configured to interact with light in a known manner. An optical subsystem of the base unit directs light to the element(s) and detects the light after interacting with the element(s). The computer subsystem is configured to determine a position and pose of the measurement unit with respect to the base unit based on the detected light. The measurement unit includes a measurement device used by the measurement unit or the base unit to determine information for the construction site.

Abstract: A method and system for overly measurement is disclosed. The overlay measurement is performed based on moiré effect observed between structured illumination grids and overlay targets. A structured illumination is used to illuminate a first overlay target and a second overlay target. Upon obtaining an image of the first overlay target illuminated by the structured illumination and an image of the second overlay target illuminated by the structured illumination, relative displacement between the first overlay target and the structured illumination and relative displacement between the second overlay target and the structured illumination are measured. The overlay between the first overlay target and the second overlay target is then measured based on their relative displacements with respect to the structured illumination.

Abstract: Film grain simulation within a receiver occurs by first obtaining at least one block of pre-computed transformed coefficients. The block of pre-computed transformed coefficients undergoes filtering responsive to a frequency range that characterizes a desired pattern of the film grain. In practice, the frequency range lies within a set of cut frequencies fHL, fVL, fHH and fVH of a filter in two dimensions that characterizes a desired film grain pattern. Thereafter, the filtered set of coefficients undergoes an inverse transform to yield the film grain pattern.

Abstract: The present invention relates to the field of alignment of an ordered stack of images from a sliced specimen. According to the present method and apparatus, the ordered stack of images is aligned by successively determining, for at least two already aligned images of the ordered stack, the respective misalignments with an unaligned image which is to be aligned next, selecting from the at least two aligned images as a reference image that aligned image with which the unaligned image has the smallest amount of misalignment, and aligning the unaligned image with the selected reference image. This is intended to provide a robust and computationally cheap aligning method and apparatus.

Abstract: In a shadow mask-substrate alignment method, a substrate is provided that includes a grate having a plurality of spaced bars and a shadow mask is provided that includes a grate having a plurality of spaced bars. Also provided is a light source-light receiver pair that defines a path of light therebetween. The grate of the substrate and the grate of the shadow mask are caused to be positioned in the path of the light. Thereafter, the orientation of the substrate, the shadow mask, or both are caused to be adjusted to position the grate of the substrate, the grate of the shadow mask, or both until a predetermined amount of light or a predetermined range of an amount of light on the path passing through the grates is received by the light receiver.

Abstract: One embodiment relates to an apparatus for alignment measurement. A laser source generates an incident laser beam which is directed to a two-dimensional target grating on a target substrate such that multiple diffracted beams are created. A beam splitter transmits a first plurality of the multiple diffracted beams onto a first optical path and directs a second plurality of the multiple diffracted beams onto a second optical path. Each of the two optical paths includes a reference grating and a detector. Another embodiment relates to a method of measuring alignment of a target substrate. Other embodiments, aspects and features are also disclosed.

Abstract: An optical imaging system is to be aligned with its optical axis in relation to a given alignment axis. For this, a radiation beam is emitted from one side of the imaging system along the alignment axis. In the direction of beam propagation, there is located behind the imaging system a pair of diaphragm elements, whose apertures are each covered by a piece of material transparent to the radiation, carrying a plurality of sensor elements arranged in a matrix. The sensor elements furnish information about the measured radiation intensity to a signal processing unit, which can graphically illustrate the current alignment status of the imaging system on a monitor and/or produce an automatic adjustment of the imaging system.

Abstract: An exclusion region of interest imaging overlay target includes a self-symmetric target structure including two or more pattern elements, and an additional target structure including two or more pattern elements, wherein each of pattern elements of the additional target structure is contained within a boundary defined by one of the pattern elements of the self-symmetric target structure, wherein the self-symmetric target structure is characterized by a composite exterior region of interest, wherein the composite exterior region of interest is formed by removing two or more exclusion zones corresponding with the pattern elements of the additional target structure from an exterior region of interest encompassing the self-symmetric target structure, wherein each of the pattern elements of the additional target structure is characterized by an interior region of interest, wherein the self-symmetric target structure and the additional target structure are configured to have a common center of symmetry upon alignme

Abstract: A drive system drives a movable body, based on measurement results of a first measurement system which measures the position of the movable body in an XY plane by irradiating a measurement beam from an arm member on a grating placed on a surface parallel to the XY plane of the movable body. In this case, because a configuration in which the arm member irradiates a measurement beam on the grating is employed, there is no adverse effect due to the drive of the moving body, unlike the case when an encoder system is arranged on a stage surface plate. Accordingly, it becomes possible to drive the movable body with good precision.

Abstract: A double-sided maskless exposure system and method consists of light sources which includes two light wavelength segments, maskless optical engines in which a 2D spatial light modulation (spatial light modulator) device, such as DMD, is generating a plurality of pixel array of the pattern, vision system, moving substrate and computer control system. The double-sided maskless exposure system at least includes two maskless optical engines with auto-calibration function which can correct any alignment error in-line. Each optical engine is for each side of the substrate. The optical engines are aligned each other in pairs and are simultaneously patterning on each side of the moving substrate. The system also includes a manipulator for moving, stepping or scanning the optical engines, relative to the substrate so that it can create a contiguous whole image on the both sides of the subject.

Abstract: In a measuring probe (40) according to the present invention, measuring light is split into a two or more through a split optical system (12), and, when each split light is received by a light-receiving sensor (13B, 13B, 15B) through an interference filter (13A, 14A, 15A) serving as a color filter, the split light is introduced into the interference filter (13A, 14A, 15A) through a collecting lens group (123C, 14C, 15C) formed as a substantially bilateral telecentric system. The interference filter (13A, 14A, 15A) is formed to obtain a transmittance characteristic corresponding to a measurement parameter, depending on a condition of an intensity distribution with respect to incidents angles of light incident on the interference filter (13A, 14A, 15A). Thus, the measuring probe (40) according to the present invention can reduce an influence of a deviation in the transmittance characteristic due to incident angles, even using the interference filter (13A, 14A, 15A).

Abstract: The present invention provides a method and device for acquiring real-time video images of a terminal, sad method comprising: acquiring light intensity of an existing environment when the terminal acquires the real-time video images; comparing the light intensity of the existing environment with a light intensity threshold value set by the terminal system; acquiring images preset by the terminal and sending the preset images to an existing receiver which is communicating with the terminal if the light intensity of the existing environment is lower than the light intensity threshold value set by the terminal system. The present invention can ensure the quality of video conversation when the light intensity is weak, save power energy, improve the user experience, and is beneficial to promote the video communication terminal.

Abstract: A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation.