Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.

Abstract: A non-contact type displacement sensor includes a light source that emits measurement light; a liquid lens apparatus in which a refractive index periodically changes in response to an input drive signal; an objective lens emitting, at a measurable object, the measurement light that is emitted from the light source and has passed through the liquid lens apparatus; a photodetector receiving the measurement light that is reflected by the measurable object and outputs a photodetection signal; and a signal processor (controller) that calculates focus timing with which the measurement light is in focus on a surface of the measurable object based on the photodetection signal output from the photodetector, and that obtains a position of the measurable object based on a phase of the focus timing with respect to a cycle of the drive signal.

Abstract: A method for testing optical fibers includes using an optical testing instrument to measure a characteristic, such as clad non-circularity, of an optical fiber at a multiple angles of rotation of an optical fiber around its optical axis. From the measurements data points indicative of measured values of the characteristic at the respective angles of rotation are generated. A model is created of the optical fiber having the characteristic as a variable parameter, and from the model a functional relationship between an expected measured value of the characteristic and the angle of rotation and the variable parameter is generated. By varying the parameter a fit of the functional relationship to the data points is made according to one or more predetermined criteria, such as least-squares fit. The value of the characteristic can be found based on the fit. Instrumental parameters, such as fiber misalignment and cleave angle, can also be ascertained by the method.

Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface and a second surface opposite the first surface. In an embodiment, the sensor wafer further comprises a first conductive pad with a first surface area, wherein the first conductive pad has a surface that is substantially coplanar with the first surface of the substrate. In an embodiment, the sensor wafer further comprises a second conductive pad with a second surface area that is smaller than the first surface area, wherein the second conductive pad has a surface that is substantially coplanar with the first surface of the substrate.

Abstract: A fiber alignment device includes: a fixation block; an alignment element having a first end portion fixed in the fixation block and a second end portion formed with a protrudent platform, an alignment groove being formed in the alignment element and extending to an end of the protrudent platform in a central axis of the alignment element; an alignment sleeve having a first end portion fitted on the second end portion of the alignment element; and a spring element having a first end extending into the alignment sleeve and pressed against the alignment groove in the protrudent platform. The front end of the ferrule assembly is inserted into the alignment sleeve and when the fiber is inserted into the alignment groove of the alignment element, the position accuracy of the fiber in the fiber bore of the ferrule assembly is calibrated to reach position accuracy of the fiber in the alignment groove of the alignment element. A high precision fiber optic connector may be manufactured with a low precision ferrule.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

Abstract: The system and method provide for identification of dynamic objects in an enclosed space and the presence of a component in a primary location. The system uses an active electro-optical 3D sensor, such as a three-dimensional time of flight camera, to identify the presence or absence of a reflected pulse, to determine, for example, proper placement of a seat belt, or a change in characteristics of a reflected pulse to determine a change in location, and thus possible movement, of a living creature in a vehicle, for example.

Abstract: An image compensated multi-beam system includes a beam splitter configured to receive an input light beam and split the input light beam into a plurality of processing light beams, beam scanning optics configured to receive the plurality of processing light beams and to scan the beams at a target, and an image compensation subsystem configured to selectively adjust the rotation of an image of the plurality of processing light beams at the target. A method for compensating a multi-beam image includes splitting an input light beam into a plurality of processing light beams with a beam splitter, scanning the plurality of processing light beams across a target with beam scanning optics, and selectively adjusting the rotation of an image of the plurality of processing light beams at the target.

Abstract: An optical system of a laser scanner comprising: a light projecting system for projecting a distance measuring light, a scanning mirror for rotatably irradiating the distance measuring light from the light projecting system around a single axis and for making a reflected distance measuring light from an object to be measured enter a light receiving system, a transmission window for accommodating the scanning mirror and through which the distance measuring light and the reflected distance measuring light are transmitted, and a correction optical component for offsetting an optical action of the transmission window, which is provided at least in a middle of an irradiating optical path of the distance measuring light.

Abstract: An apparatus includes an overlay mark. The overlay mark includes a first portion including a first pattern and a second portion including a second pattern. The first pattern includes a plurality of first features and a first center feature each separated by a gap along a first direction. At least two gaps are the same but are different from the other gaps, and the first centers are symmetric with respect to the first center feature. The second pattern includes a plurality of second features and a second center feature each separated by a gap along the first direction. At least two gaps are the same but are different from the other gaps, and the second features are symmetric with respect to the second center feature. The first center feature of the first pattern is aligned with the second center feature of the second pattern along a second direction.

Abstract: One illustrative example of an overlay mark disclosed herein includes four quadrants (I-IV). Each quadrant of the mark contains an inner periodic structure and an outer periodic structure. Each of the outer periodic structures includes a plurality of outer features. Each of the inner periodic structures includes a plurality of first inner groups, each of the first inner groups having a plurality of first inner features, each first inner group being oriented such that there is an end-to-end spacing relationship between each first inner group and a selected one of the outer features.

Abstract: An apparatus for determining an orientation of a die mounted on a tape includes an imaging device, a light source and a conveying mechanism. The die is at least partially translucent and includes at least one orientation feature indicative of the orientation of the die. In use, the conveying mechanism conveys the tape to position the die at an inspection position between the imaging device and the light source. The light source projects light to the imaging device and the imaging device captures an image. The projected light from the light source passing through the die is obstructed by the at least one orientation feature of the die to cause the captured image to include an image of the at least one orientation feature, whereby the orientation of the die may be determined.

Abstract: The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the a least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).

Abstract: An apparatus for detecting a mark on a substrate is provided. The mark has a first stripe group and a second stripe group disposed in parallel to each other. The apparatus includes a detection module operative to move over a surface of the substrate. The detection module includes a detection unit for obtaining data from the mark and operative to perform repeated acquisition operations on the first stripe group and the second stripe group of the mark. Each of the acquisition operations acquires data associated with the first stripe group or the second stripe group of the mark. The detection module also includes a positioning unit for aligning the detection unit with the mark.

Abstract: To provide a lightweight and highly rigid stage device that can move in X and Y directions and a Z direction, and a charged particle beam device including the stage device. A stage device includes a chuck that is loaded with a sample, an XY stage that moves in X and Y directions, and a Z stage that moves in a Z direction. The Z stage includes: an inclined part that is fixed to the XY stage and includes an inclined surface inclined with respect to an XY plane; a movement part that moves on the inclined surface; and a table that is fixed to the movement part and is provided with the a plane parallel to the XY plane.

Abstract: The present invention provides devices and systems for use at the point of care. The methods devices of the invention are directed toward automatic detection of analytes in a bodily fluid. The components of the device are modular to allow for flexibility and robustness of use with the disclosed methods for a variety of medical applications.

Abstract: A system for moving first and second fuselage structures into assembly alignment, the system including a first transmitter indexed to a first seat track of the first fuselage structure, a first reflector target indexed to a first seat track of the second fuselage structure, a second transmitter indexed to a second seat track of the first fuselage structure, a second reflector target indexed to a second seat track of the second fuselage structure, wherein the first and second transmitters and the first and second reflector targets cooperate to provide first and second measurements indicative of position of the first fuselage structure relative to the second fuselage structure, and a manipulator system including at least one assembly actuator coupled to the first fuselage structure to move the first fuselage structure into assembly alignment with the second fuselage structure based upon the first and second measurements.

Abstract: Decrease in a measurable distance that occurs when a distance measuring light is obliquely incident on an object is suppressed. A distance measuring device 100 includes an emitting unit 103, a detecting unit 104, a frequency-modulated component separating unit 105, a selecting unit 107, and a distance calculating unit 108. The emitting unit 103 emits distance measuring light to an object to be measured. The distance measuring light is modulated by multiple modulation frequencies. The detecting unit 104 receives and detects light of the distance measuring light that is reflected from the object. The separating unit 105 separates components of the received reflected light into multiple frequency-modulated components. The selecting unit 107 selects a frequency-modulated component that has a received-light intensity exceeding a threshold value from among the separated multiple modulation frequencies.

Abstract: A lithographic technique that involves obtaining values of parameters of a substrate deformation model, wherein the values are based on positional data obtained from an alignment system for a lithographic apparatus; modifying the values using a mapping operation, wherein the mapping operation is based on a correlation found between the parameters and overlay data for a previous set of substrates; and generating, based on the modified values, electronic data adapted to configure the lithographic apparatus.

Abstract: A sample identification system for an automated sampling device is described. A system embodiment includes, but is not limited to, a sample holder having a plurality of apertures configured to receive a plurality of sample vessels therein, the sample holder having one or more corresponding sample holder identifiers positioned proximate to the sample holder; and an identifier capture device configured to detect the one or more sample holder identifiers positioned proximate to the sample holder and generate a data signal in response thereto, the data signal corresponding to at least an orientation of the sample holder relative to a surface on which the sample holder is positioned.

Abstract: The method includes a step of executing a rotation treatment in a rotation treatment apparatus; a step of imaging a substrate on which the rotation treatment has been executed, in an inspection apparatus; a step of acquiring change amount information stored in advance, being information on an amount of change in orientation of the substrate while the substrate is moved from the rotation treatment apparatus to the inspection apparatus; a step of acquiring, as an execution result information, information on an execution result of the rotation treatment along a circumferential direction of the substrate, based on an imaging result in the inspection apparatus; and a step of correcting a position of the substrate at a time of the rotation treatment, based on the change amount information and the execution result information.

Abstract: A component mounting machine moves a mounting head from a supply position P1 to each of mounting positions P3 and P4 of a circuit board CB via an imaging position P2. Further, the component mounting machine performs control such that the mounting head moves in a direction of movement at the time of imaging that is either of an X-axis direction or a Y-axis direction when passing through the imaging position P2. The component mounting machine determines the direction of movement at the time of imaging, according to a first X-axis distance Lx and a first Y-axis distance Ly from the imaging position P2 to each of the mounting positions P3 and P4.

Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.

Abstract: In an exemplary method, a first layer is formed on a substrate. First overlay marks are formed in a first zone of the first layer. A non-transparent layer is formed on top of the first layer. At least a portion of the non-transparent layer is removed from an area above the first zone of the first layer. This provides optical access to the first overlay marks. A second layer is formed on top of the non-transparent layer. Second overlay marks are formed in a second zone of the second layer. Position information is obtained from each of the first overlay marks and the second overlay marks.

Abstract: According to embodiments, a method for manufacturing a semiconductor device includes forming a mask comprising a pattern of inert structures on a side of a first main surface of a semiconductor substrate. A semiconductor layer is formed over the first main surface, and the semiconductor substrate is thinned from a second main surface opposite to the first main surface. Thereafter, a semiconductor region laterally adjoining the inert structures is anisotropically etched.

Abstract: In some examples, an unmanned aerial vehicle (UAV) may include a stereo camera including two cameras. To maintain proper alignment of the stereo camera as the UAV moves about, a management device may access calibration information for the stereo camera and receive sensing information indicating movement of the two cameras relative to each other. Based at least in part on the calibration information and the sensing information, the management device may instruct an actuator to move one of the two cameras to the proper alignment or may rectify frames captured by the two cameras to return to the proper alignment.

Abstract: Devices and methods are provided for positioning and/or rotating a substrate without solid contact, such as by floating the wafer on a thin layer of gas. Since there is no solid contact with components of a processing chamber, features on the wafer are used to determine wafer position and rotational speed. Closed loop control systems are provided with capacitive sensors to monitor the position of the edge of the wafer in a horizontal plane. Control systems may also monitor the position of a wafer feature as it rotates, such as a notch in the edge of the wafer. Because the presence of a notch can disrupt sensors facing the edge of the wafer, methods and devices to reduce or eliminate this disruption are also provided.

Abstract: A lithographic apparatus having a substrate table, a projection system, an encoder system, a measurement frame and a measurement system. The substrate table has a holding surface for holding a substrate. The projection system is for projecting an image on the substrate. The encoder system is for providing a signal representative of a position of the substrate table. The measurement system is for measuring a property of the lithographic apparatus. The holding surface is along a plane. The projection system is at a first side of the plane. The measurement frame is arranged to support at least part of the encoder system and at least part of the measurement system at a second side of the plane different from the first side.

Abstract: Some embodiments of the invention may include an electro-optical distance measurement method having at least one emission of a light signal, in particular of laser light, from at least one light source onto a target object, detection of a fraction of the light signal returning from the target object using a detector and a signal processing electronics system connected downstream from the detector, and/or determination of a distance to the target object. In some embodiments, the emitted light signal comprises in this case a sequence of sequential elements of, in each case at least one light pulse and one light signal train. In some embodiments, the light pulses each have a higher intensity amplitude than the light signal trains. Some embodiments may also an electro-optical distance meter having the features analogous to The distance measurement method according to the invention.

Abstract: A method for assessing the relative alignment of a first and second diffractive element. The method includes illuminating the first diffractive element to form a first diffraction pattern in the far field and illuminating the second diffractive element to form a second diffraction pattern in the far field. The method further comprises determining a positional and/or rotational relationship between the first diffraction pattern and the second diffraction pattern in the far field.

Abstract: A conveyance control device according to one aspect of the present invention is configured to control operation of one or more carriages each configured to convey a FOUP. The conveyance control device includes: a basic processing unit that generates basic command data based on basic input data 32a containing a request to convey the FOUP; an optimization processing unit that generates optimization command data based on optimization input data containing the request to convey the FOUP; an output unit that outputs the basic command data or the optimization command data to each of the carriages; and a switching unit that controls operation of at least one of the basic processing unit, the optimization processing unit, and the output unit such that either one of the basic command data and the optimization command data is output by the output unit.

Abstract: An optical coordinate measuring system (OCMS) for manufactured components having build variations that require splices for accurate integration of the components. The OCMS includes manufacturing the components that include integral three dimensional optical reticle image arrays affixed to predetermined surfaces of the components, such that those surfaces can be optically captured in three dimensional composite measurements associated with various 3-D scanned poses. Each pose includes an orthogonal pair of grid lines, and each pose involves a single field of view. A plurality of poses can then be collated to form composite measurements that extend out-of-range of any single pose. The three dimensional optical reticle image arrays can be concave or convex, ideally formed as an integral part of each as-manufactured component. The three dimensional aspect enhances scanning clarity of each scanned pose, thus assuring greater accuracies of composite measurements that result from any plurality of collated poses.

Abstract: A method including: determining recipe consistencies between one substrate measurement recipe of a plurality of substrate measurement recipes and each other substrate measurement recipe of the plurality of substrate measurement recipes; calculating a function of the recipe consistencies; eliminating the one substrate measurement recipe from the plurality of substrate measurement recipes if the function meets a criterion; and reiterating the determining, calculating and eliminating until a termination condition is met. Also disclosed herein is a substrate measurement apparatus, including a storage configured to store a plurality of substrate measurement recipes, and a processor configured to select one or more substrate measurement recipes from the plurality of substrate measurement recipes based on recipe consistencies among the plurality of substrate measurement recipes.

Abstract: In systems and methods for adjusting the position of a headset element (e.g., a display and/or other optical element), coherent light (e.g., a laser beam) is transmitted through a display of a headset to produce a diffraction pattern on a detector, which detects the diffraction pattern. The orientation of the headset element is determined based in part on the detected diffraction pattern. Based on the determined orientation and a target orientation, an adjustment to the orientation of the headset element is determined. The position of the headset element is adjusted based on the determined adjustment. This method may be repeated until the headset element is determined to be correctly oriented.

Abstract: A white light interferometric metrology device operates in the image plane and objective pupil plane. The interferometric metrology device extracts the electric field with complex parameters and that is a function of azimuth angle, angle of incidence and wavelength from interferometric data obtained from the pupil plane. Characteristics of the sample are determined using the electric field based on an electric field model of the azimuth angle, the angle of incidence and the wavelength that is specific for a zero diffraction order. A center of the pupil in the pupil plane may be determined based on a Fourier transform of the interferometric data at each new measurement and used to convert each pixel from the camera imaging the objective pupil plane into a unique set of angle of incidence and azimuth angle of light incident on the sample.

Abstract: A medical X-ray photographing apparatus includes a support configured to hold the X-ray generator and the X-ray detector in a facing state, a base body (support holder) configured to rotatably hold the support on a side opposite to a position where the X-ray generator and the X-ray detector are provided, and a turning driver configured to drive and turn the support about a turning axis. The medical X-ray photographing apparatus also includes a center-direction setting part configured to set a center direction passing through a center of a swing angle of the support in X-ray photography and a turning controller configured to control the turning driver such that the support turns with a swing angle around the center direction set by the center-direction setting part.

Abstract: A package includes a device die, a molding material molding the device die therein, a through-via penetrating through the molding material, and an alignment mark penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via.

Abstract: The present application provides an LTPS multilayered structure, which includes: a first stack layer having a reference pattern structure formed thereon and provided with uniformly distributed first references; and a second stack layer disposed on the first stack layer and having an alignment pattern structure formed thereon and provided with uniformly distributed second references each selectively aligning with one of the first references so that misalignment between the first stack layer and the second stack layer is precisely calculated by markings attached to each of the first references. The present further provides a method for measuring misalignment between a plurality of stack layers in the LTPS multilayered structure.

Abstract: A method of measuring a parameter of a lithographic process, the method including: illuminating a diffraction measurement target on a substrate with radiation, the measurement target including at least a first sub-target, at least a second sub-target and at least third sub-target, wherein the first, second and third sub-targets each include a periodic structure and wherein the first sub-target, second sub-target and third sub-target each have a different design and wherein at least two of the sub-targets are respectively designed for determination of a different lithographic process parameter; and detecting radiation scattered by the at least two sub-targets to obtain for that target a measurement representing the different parameters of the lithographic process.

Abstract: The problem of picking tightly-pack generally uniformed products such as rubber bales in a bin is solved by sequentially selecting each one of the products based on the products depths in the bin, using a robot with a tool to grip each selected product, and moving on an output station each gripped product considering its position relative to the gripping tool. A first sensor system is used to determine the product depths in the bin. The sensor system can be mounted on the robot tool or be positioned above the bin. The position of each gripped product in the gripping tool is achieved by analyzing an image of the gripped product in the gripping tool.

Abstract: The present invention provides a position-detecting and chip-separating device applied to a semiconductor structure that includes a base layer and a plurality of light emitting chips disposed on the base layer. The position-detecting and chip-separating device includes a position detecting module and a chip separating module. The position detecting module includes an emitting element and a receiving element, and the chip separating module corresponds to the position detecting module. The position detecting module provides a position data of a contact interface between the base layer and the light emitting chip by pairing of the emitting element and the receiving element. A projection light source generated by the chip separating module is projected onto the contact interface between the base layer and the light emitting chip according to the position data so as to easily separate the light emitting chip from the base layer.

Abstract: A pre-alignment measurement device includes, disposed in a direction of propagation of light, a laser, a first cylindrical lens, a first imaging lens, an illumination diaphragm, a second imaging lens, a second cylindrical lens and a CCD detector. The laser, an object under measurement and the CCD detector are arranged at respective apexes of a triangle formed by the measurement device for pre-alignment. A light beam is emanated by the laser and is transformed into a line beam. The line beam is reflected by the object under measurement and then passes through the second cylindrical lens to form a CCD image which has different horizontal and vertical magnifications, allowing horizontal and vertical resolutions to be matched with horizontal and vertical measuring ranges, respectively. The CCD image contains information of a position and a height of a step defined by the object under measurement and the wafer stage.

Abstract: A detection apparatus includes an image pickup unit and a processor which detects a position of a mark using a two-dimensional image of the mark. The processor generates a one-dimensional signal having a plurality of peaks by accumulating images included in a detection region, detects peaks in which differences between values of the peaks and a reference value are equal to or larger than a threshold value and peaks in which differences between values of the peaks and the reference value are smaller than the threshold value from among the plurality of generated peaks and obtains a failure region in the mark, resets the detection region such that the differences between the values of the detected peaks and the reference value become smaller than the threshold value, generates a one-dimensional signal by accumulating images included in the reset detection region, and detects a position of the mark.

Abstract: A pattern formed on a substrate includes first and second sub-patterns positioned adjacent one another and having respective first and second periodicities. The pattern is observed to obtain a combined signal which includes a beat component having a third periodicity at a frequency lower than that of the first and second periodicities. A measurement of performance of the lithographic process is determined by reference to a phase of the beat component. Depending how the sub-patterns are formed, the performance parameter might be critical dimension (CD) or overlay, for example. For CD measurement, one of the sub-patterns may comprise marks each having of a portion sub-divided by product-like features. The measurement can be made using an existing alignment sensor of a lithographic apparatus. Sensitivity and accuracy of the measurement can be adjusted by selection of the first and second periodicities, and hence the third periodicity.

Abstract: An imaging system includes a primary imager and plurality of 3A-control sensors. The primary imager has a first field of view and includes a primary image sensor and a primary imaging lens with a first optical axis. The primary image sensor has a primary pixel array and control circuitry communicatively coupled thereto. The plurality of 3A-control sensors includes at least one of a peripheral imager and a 3A-control sensor. The peripheral imager, if included, has a second field of view including (i) at least part of the first field of view and (ii) a phase-difference auto-focus (PDAF) sensor and a peripheral imaging lens, the PDAF sensor being separate from the primary image sensor. The 3A-control sensor, if included, is separate from the primary pixel array and communicatively connected to the control circuitry to provide one of auto-white balance and exposure control for the primary pixel array.

Abstract: A pulse wave measurement device includes a storage unit and a subtracter. When a light emitting element alternately switches between a lighting state in which the light emitting element emits light into a body and a non-lighting state in which the light emitting element does not emit light, the storage unit stores a value of a first digital signal representing an output state of a light receiving element that receives light transmitted through or reflected by the body at timing of the lighting state, and a value of a second digital signal representing an output state of the light receiving element at timing of the non-lighting state. The subtracter subtracts the second digital signal value stored in the storage unit from the first digital signal value stored in the storage unit.

Abstract: A system for checking the axial position of a bearing (30) inside an hole (31) of an E-block (29), preferably during the assembly of an HSA, comprises a reference system (3) that locates the E-block, a coupling element (17) that comes into contact with the bearing, a floating element (8) that, being connected to the coupling element, assumes the attitude of the bearing, two or more detection devices, for example optoelectronic, that cooperate with the floating element and detect at the same time, at checking areas are spaced apart from each other, quantities indicative of the position and, in case, of the attitude of the bearing with respect to the E-block, and a processing unit (50) for receiving and processing the detected quantities.

Abstract: A substrate has three or more overlay gratings formed thereon by a lithographic process. Each overlay grating has a known overlay bias. The values of overlay bias include for example two values in a region centered on zero and two values in a region centered on P/2, where P is the pitch of the gratings. Overlay is calculated from asymmetry measurements for the gratings using knowledge of the different overlay bias values and an assumed non-linear relationship between overlay and target asymmetry, thereby to correct for feature asymmetry. The periodic relationship in the region of zero bias and P/2 has gradients of opposite sign. The calculation allows said gradients to have different magnitudes as well as opposite sign. The calculation also provides information on feature asymmetry and other processing effects. This information is used to improve subsequent performance of the measurement process, and/or the lithographic process.

Abstract: A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.

Abstract: A semiconductor method is disclosed. The semiconductor method is performed upon semiconductor wafers, wherein each of the semiconductor wafers includes a first exposure field and a second exposure field, and each of the first exposure field and the second exposure field includes a first alignment mark and a second alignment mark. The method includes: determining a first alignment pattern for a first wafer by selecting one of the alignment marks of the first exposure field, and selecting one of the alignment marks of the second exposure field; performing the aligning operation upon the first semiconductor wafer by using the first alignment pattern; determining a second alignment pattern for a second wafer by selecting one of the alignment marks of the first exposure field, and selecting one of the alignment marks of the second exposure field, wherein the first alignment pattern is different from the second alignment pattern.