By Diaphragm Patents (Class 361/283.4)
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Patent number: 8272272Abstract: A pressure measuring module for recording an absolute pressure or a relative pressure. Pressure measuring module includes a housing produced preferably as a premold, in which a pressure measuring chip is accommodated. The latter is contacted electrically either to a lead frame or to at least one printed circuit trace, at least one electronic component being provided, which is connected to a section of the lead frame or of the at least one printed circuit trace, exiting laterally from the housing that is produced as a premold, and is covered by a partition of a cover.Type: GrantFiled: November 26, 2008Date of Patent: September 25, 2012Assignee: Robert Bosch GmbHInventors: Jan Gebauer, Masoud Habibi
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Patent number: 8256299Abstract: A micromechanical pressure sensor includes a first diaphragm and a second diaphragm accommodated in a shared semiconductor substrate. The two diaphragms facilitate independent pressure sensing of one or more media, by the fact that a respective pressure variable is sensed by way of the deflection of the respective diaphragm. A cap above the first diaphragm defines a hollow space that is connected to the hollow space below the second diaphragm.Type: GrantFiled: November 9, 2009Date of Patent: September 4, 2012Assignee: Robert Bosch GmbHInventors: Michaela Mitschke, Hubert Benzel
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Patent number: 8250925Abstract: A workpiece composite includes a preform part and a gel accommodated in a recess in the preform, the recess being enclosed by at least one edge which serves as a creep barrier to prevent the gel from spreading. The at least one edge of the recess defines a termination point of at least one surface which is provided with a coating made of an oleophobic material in an area adjacent to the at least one edge.Type: GrantFiled: September 3, 2009Date of Patent: August 28, 2012Assignee: Robert Bosch GmbHInventors: Hubert Benzel, Lutz Mueller, Roman Sellin
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Patent number: 8240217Abstract: Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.Type: GrantFiled: October 15, 2007Date of Patent: August 14, 2012Assignee: Kavlico CorporationInventors: Robert Guziak, Enrique Gandaria
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Patent number: 8234926Abstract: A pressure sensor has a substrate with conductor tracks for contact-connecting electrical components. The pressure sensor has a measuring element for converting a mechanical measurement variable into an electrical signal and a signal converter for processing the electrical signals from the measuring element further. Furthermore, the pressure sensor has a first diaphragm which, together with the substrate, forms a first closed cavity which contains an inert filling medium. At least one side of the measuring element of the pressure sensor, which comprises an active surface, has direct contact with the filling medium in the first cavity. The signal converter is arranged on the substrate in the form of an unhoused integrated circuit.Type: GrantFiled: October 14, 2010Date of Patent: August 7, 2012Assignee: EPCOS AGInventors: Christian Wohlgemuth, Peter Thiele
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Patent number: 8215176Abstract: MEMS pressure sensing elements, the fabrication methods of the sensing elements, and the packaging methods using the new sensing elements are introduced to provide a way for a harsh media absolute pressure sensing and eliminating the negative effects caused by the gel used in the prior art. The invention uses vertical conductive vias to electrically connect the enclosed circuit to the outside, and uses a fusion bond method to attach a cap with the embedded conductive vias over a device die having a circuit for example a piezoresistive Wheatstone bridge to sense pressure. New packaging methods comprise a) a two-pocket housing structure and using a surface mounting method to attach a new sensing element into one pocket by a ball grid array (BGA), and b) a single pocket structure and using conventional die attach and wire bonding. Both methods can be used for harsh media pressure sensing but without the negative effects caused by the gel in prior art.Type: GrantFiled: May 27, 2009Date of Patent: July 10, 2012Assignee: Continental Automotive Systems, Inc.Inventors: Xiaoyi Ding, Jeffrey J. Frye, Jen-Huang Albert Chiou
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Patent number: 8156817Abstract: Provided is a pressure detection device capable of easy installation and removal of a sensor in/from a diaphragm, measurement of a pressure in a wide rage, and manufacture at a low cost while reducing a size. A sensor part (A) has: a magnet (12) being applied with a load produced by pressing of a diaphragm (8); and a magnet cap (11) covering the magnet (12). The diaphragm (8) has an intra-diaphragm magnetic body (9) buried therein. The intra-diaphragm magnetic body (9) has a protrusion part protruding from the diaphragm (8) so as to be in contact with the magnet (12). The magnet cap (11) has an opening part enabling the protrusion part of the intra-diaphragm magnetic body (9) and the magnet (12) to be joined together.Type: GrantFiled: March 29, 2006Date of Patent: April 17, 2012Assignee: JMS Co., LtdInventors: Mitsuru Kaneko, Aki Kitani
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Patent number: 8146437Abstract: A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.Type: GrantFiled: December 3, 2009Date of Patent: April 3, 2012Assignee: Panasonic CorporationInventors: Yuichi Miyoshi, Yusuke Takeuchi, Tohru Yamaoka, Hiroshi Ogura
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Patent number: 8141429Abstract: Disclosed are capacitive pressure probes or sensors for high temperature applications. The capacitive pressure sensors of the present invention include, inter alia, a sapphire diaphragm which is disposed within an interior sensing chamber of the probe housing and has a first electrode formed on a central portion thereof. The central portion of the diaphragm and the first electrode are adapted and configured to deflect in response to pressure variations encountered within an interior sensing chamber and by the pressure sensor. A sapphire substrate which has a second electrode formed thereon is fused to the sapphire diaphragm about its periphery to form a sapphire stack and to define a reference chamber therebetween. Prior to fusing the sapphire diaphragm to the sapphire substrate, all contact surfaces are chemically treated and prepared using plasma activation, so as to create a bonding layer and to reduce the temperature required for the fusion.Type: GrantFiled: July 30, 2010Date of Patent: March 27, 2012Assignee: Rosemount Aerospace Inc.Inventor: Shuwen Guo
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Patent number: 8141430Abstract: A monolithic manometer and method of sensing pressure changes may include sensing a change in parasitic capacitive coupling between multiple parasitic capacitive coupled conductive elements in response to a diaphragm disturbing the parasitic capacitive coupling between the conductive elements. A signal representative of the sensed change in parasitic capacitive coupling may be output.Type: GrantFiled: June 30, 2010Date of Patent: March 27, 2012Assignee: Brooks Instrument, LLCInventors: Michael W. Fortner, Joseph Sipka, Christopher Reed
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Patent number: 8132465Abstract: Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.Type: GrantFiled: July 31, 2008Date of Patent: March 13, 2012Assignee: Silicon Microstructures, Inc.Inventors: Michael B. Doelle, Joachim Bergmann
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Patent number: 8096189Abstract: A physical quantity sensor includes two substrates and a movable electrode that is disposed between the two substrates and is bonded to the two substrates. In the physical quantity sensor, the movable electrode has an elastically deformable diaphragm and one of the two substrates is an electrode substrate having a detection electrode on a detection surface opposite to the diaphragm to detect capacitance between the diaphragm and the detection electrode. In the physical quantity sensor, in a range between a room temperature and a bonding temperature when the two substrates and the movable electrode are bonded, coefficients of thermal expansion of the two substrates are smaller than that of the movable electrode and in a temperature range where the physical quantity sensor is used, a coefficient of thermal expansion of the movable electrode is between a first and second substrates.Type: GrantFiled: April 7, 2009Date of Patent: January 17, 2012Assignee: Nagano Keiki Co., Ltd.Inventors: Daiji Uehara, Yoichi Kobayashi
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Patent number: 8079269Abstract: A pressure sensor comprises a first pressure chamber containing fill fluid at a first pressure, a second pressure chamber containing fill fluid at a second pressure, a porous dielectric diaphragm having first and second major surfaces exposed to the first and second pressure chambers, and first and second electrodes positioned with respect to the first and second major surfaces. A method for sensing pressure is also disclosed, comprising applying first and second pressures to fill fluid in first and second pressure chambers of a pressure sensor having a porous dielectric diaphragm, and producing an output representative of a pressure differential between the pressures, as a function of surface charges on first and second major surfaces of the porous dielectric diaphragm.Type: GrantFiled: May 16, 2007Date of Patent: December 20, 2011Assignee: Rosemount Inc.Inventor: Swapan Chakraborty
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Patent number: 8042401Abstract: A process fluid pressure transmitter includes a pressure sensor, transmitter electronics, and an isolation system. The pressure sensor has an electrical characteristic that changes with pressure. The transmitter electronics are coupled to the pressure sensor to sense the electrical characteristic and calculate a pressure output. The isolation system includes a base member, and isolation diaphragm, and a fill-fluid. The isolation diaphragm is mounted to the base member and interposed between the pressure sensor and a process fluid. The fill-fluid is disposed between the isolation diaphragm and the pressure sensor. The base member and the isolation diaphragm are constructed from different materials such that the coefficient of thermal expansion of the isolation diaphragm is larger than the coefficient of thermal expansion of the base member.Type: GrantFiled: June 12, 2008Date of Patent: October 25, 2011Assignee: Rosemount, Inc.Inventor: David A. Broden
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Patent number: 8012360Abstract: A pressure sensor for measuring an external pressure fabricated upon a ceramic substrate penetrated by a via extending from the top to the bottom of the ceramic substrate is disclosed. A sacrificial layer is deposited on a portion of the top of the ceramic substrate in communication with a via. A diaphragm material is then deposited on the sacrificial layer, thereby creating a diaphragm surface. A sensor element for transducing a mechanical deflection into an electrical signal is applied to the diaphragm surface. When the sacrificial layer is removed, the diaphragm is able to deflect in response to the external pressure, which is sensed by the sensor element in order to measure the external pressure.Type: GrantFiled: June 11, 2008Date of Patent: September 6, 2011Inventor: Clayton B. Sippola
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Publication number: 20110150261Abstract: A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.Type: ApplicationFiled: December 21, 2009Publication date: June 23, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tzong-Che HO, Lung-Tai Chen, Yao-Jung Lee, Chao-Ta Huang, Li-Chi Pan, Yu-Sheng Hsieh
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Patent number: 7942062Abstract: A pressure sensor includes: a housing; an attachment having a pressure input orifice communicating with an interior of the housing; a first diaphragm that seals an opening of the pressure input orifice of the attachment, an external surface of the first diaphragm being a pressure receiving surface; a force transmitting member having an end which is coupled approximately perpendicular to a main surface of the first diaphragm, the main surface being opposite from the pressure receiving surface; a swing arm which is joined to the force transmitting member and is held to a retainer at a pivoting point as a fulcrum; and a pressure sensing element having a first end coupled to the retainer and a second end coupled to the swing arm, so that a displacement direction of the force transmitting member is the same direction as a line joining the first end and the second end.Type: GrantFiled: March 24, 2009Date of Patent: May 17, 2011Assignee: Epson Toyocom CorporationInventor: Hisao Motoyama
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Patent number: 7900518Abstract: A variable capacitor, a microfabricated implantable pressure sensor including a variable capacitor and an inductor, and related pressure measurement and implantation methods. The inductor may have a fixed or variable inductance. A variable capacitor and pressure sensors include a flexible member that is disposed on a substrate and defines a chamber. Capacitor elements extend indirectly from the flexible member. Sufficient fluidic pressure applied to an exterior surface of the flexible member causes the flexible member to move or deform, thus causing the capacitance and/or inductance to change. Resulting changes in resonant frequency or impedance can be detected to determine pressure, e.g., intraocular pressure.Type: GrantFiled: August 29, 2007Date of Patent: March 8, 2011Inventors: Yu-Chong Tai, Po-Jui Chen, Damien C. Rodger, Mark S. Humayun
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Patent number: 7864503Abstract: A capacitive type touch panel includes: a transparent substrate; an array of first conductors formed on a surface of the transparent substrate; an array of second conductors formed on the surface of the transparent substrate; a plurality of conductive first bridging lines, each of which interconnects two adjacent ones of the first conductors; a plurality of conductive second bridging lines, each of which interconnects two adjacent ones of the second conductors and each of which intersects insulatively a respective one of the first bridging lines; and a plurality of spaced apart insulators, each of which is disposed at an intersection of a respective one of the first bridging lines and a respective one of the second bridging lines to separate the respective first and second bridging lines.Type: GrantFiled: April 23, 2008Date of Patent: January 4, 2011Assignee: Sense Pad Tech Co., LtdInventor: Yu-Huei Chang
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Patent number: 7841238Abstract: The invention provides for a pressure sensor with compensation for temperature variations. The sensor has CMOS layers deposited on a substrate, a conductive layer connected to the CMOS and a passivation layer deposited on the CMOS layers. The arrangement also includes a conductive active membrane spaced from the conductive layer to form an active chamber, and a conductive reference membrane spaced from the conductive layer to form a sealed reference chamber. Further included is a cap which covers the membranes, said cap exposing the active membrane to an outside fluid pressure. The active membrane further defines a foot which is located between the substrate and cap with a leg extending away from the substrate and terminating in a substantially planar deflectable portion, which deflects due to differential pressure stresses so that an active capacitance is developed between the active membrane and the conductive layer depending on the electrical permittivity e of the fluid.Type: GrantFiled: August 5, 2009Date of Patent: November 30, 2010Assignee: Silverbrook Research Pty LtdInventors: Kia Silverbrook, Samuel George Mallinson
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Patent number: 7798007Abstract: A hydraulic pressure intermediary includes: a platform, which has a bowl-shaped surface having an annular, platform-surface edge region, a platform-surface central region depressed relative to the platform-surface edge region and surrounded by the platform-surface edge region, and an annular platform-surface transition region, which borders, on its inner side, the platform-surface central region and, on its outer side, the platform-surface edge region; a bowl-shaped, separating membrane having a flat, annular, separating-membrane edge region, a separating-membrane central region depressed relative to the separating-membrane edge region and an annular separating-membrane transition region, which borders, on its inner side, the separating-membrane central region and, on its outer side, the separating-membrane edge region. The separating membrane is connected with the platform-surface edge region within the separating-membrane edge region along a surrounding joint.Type: GrantFiled: May 10, 2006Date of Patent: September 21, 2010Assignee: Endress + Hauser GmbH + Co. KGInventors: Wolfgang Dannhauer, Ralf Nürnberger, Anh Tuan Tham
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Patent number: 7775118Abstract: Described herein is the sense element assembly for a capacitive pressure sensor and method for creating same that has increased sensitivity without additional size. The sense element assembly and method includes fabricating an off-centered elliptically shaped center electrode, at least one elliptical annular-like electrode around the center electrode, a ground electrode and a method for fusing the layers together to optimize sensitivity.Type: GrantFiled: April 24, 2008Date of Patent: August 17, 2010Assignee: Custom Sensors & Technologies, Inc.Inventors: Gary L. Casey, Marcos Nassar, Nhan Nguyen
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Patent number: 7762140Abstract: A combined fluid pressure transducer and temperature sensor (10) has a housing (12) containing a variable capacitor (14) having a rigid substrate (14a) and attached flexible diaphragm (14b) in sealed, spaced apart relation. The capacitor is mounted in the housing so that the outer face surface of the diaphragm is exposed to a fluid pressure chamber (12k). A temperature responsive sensor element (28) is disposed on the outer face surface of the diaphragm and covered by a thin protective layer. A fluid flow diffuser (30) is disposed in the fluid pressure port (12b) for directing fluid flow across the temperature sensor.Type: GrantFiled: December 11, 2008Date of Patent: July 27, 2010Assignee: Sensata Technologies, Inc.Inventors: Jared E. Girroir, Nicholas Moelders
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Publication number: 20100117994Abstract: A variable capacitor of a position indicator includes a dielectric, an electrode, a conductive member and a conductive portion. The dielectric has an upper surface and a lower surface opposite the upper surface. The electrode is provided on the upper surface of the dielectric. The conductive member is arranged so as to face the lower surface of the dielectric. The conductive portion is provided on the lower surface of the dielectric and is arranged so as to be electrically connectable to the conductive member. The conductive member is adapted to be elastically deformed when pressed against the lower surface by an external force, such that the capacitance of the variable capacitor changes according to a change of the external force.Type: ApplicationFiled: October 26, 2009Publication date: May 13, 2010Applicant: WACOM CO., LTD.Inventors: Yasuyuki Fukushima, Hiroyuki Fujitsuka
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Patent number: 7681457Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.Type: GrantFiled: January 16, 2008Date of Patent: March 23, 2010Assignee: Infineon Technologies Sensonor ASInventor: Henrik Jakobsen
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Patent number: 7614308Abstract: A diaphragm pressure measuring cell arrangement has a housing body at least partly made of sapphire material and a planar sapphire diaphragm with a peripheral edge joined by a first edge seal to the housing body to form a reference vacuum chamber. An outer surface of the diaphragm is exposed to a medium to be measured. A ceramic supporting body is attached to the back side of the housing body by sealing glass and includes a surface area overhanging that surrounds the housing body to form a first sealing surface. A tubular sensor casing incorporates the measuring cell for mounted the ceramic support body, the casing including an inside second surrounding sealing surface corresponding to the first sealing surface. A metal ring seal is between the sealing surfaces and a pressing member presses sealing surfaces together.Type: GrantFiled: December 4, 2008Date of Patent: November 10, 2009Assignee: Inficon GmbHInventors: Walter Christian Berner, Jarkko Antila, Gaétan Duplain, Per Björkman, Tove Manselin, Oskar Untermarzoner
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Patent number: 7607355Abstract: A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip.Type: GrantFiled: February 11, 2008Date of Patent: October 27, 2009Assignee: Yamaha CorporationInventors: Kenichi Shirasaka, Yukitoshi Suzuki
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Patent number: 7581447Abstract: The invention provides for a temperature compensating pressure sensing arrangement. The arrangement includes a substrate having sealed channels on which is deposited a CMOS layer, with a conductive layer and a passivation layer deposited on the CMOS layer. The arrangement also includes a conductive active membrane spaced from the conductive layer to form an active chamber, and a conductive reference membrane spaced from the conductive layer to form a sealed reference chamber. Further included is a cap which covers the membranes, said cap exposing the active membrane to an outside fluid pressure. The active membrane further defines a foot which is located between the substrate and cap with a leg extending away from the substrate and terminating in a substantially planar deflectable portion, which deflects due to differential pressure stresses so that an active capacitance is developed between the active membrane and the conductive layer depending on the electrical permittivity e of the fluid.Type: GrantFiled: November 18, 2008Date of Patent: September 1, 2009Assignee: Silverbrook Research Pty LtdInventors: Kia Silverbrook, Samuel George Mallinson
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Patent number: 7571650Abstract: Various embodiments and methods relating to a pressure sensor having a flexure supported piezo resistive sensing element are disclosed.Type: GrantFiled: July 30, 2007Date of Patent: August 11, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: James C. McKinnell, Eric L. Nikkel, Jennifer L. Wu, Adel B. Jilani
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Patent number: 7568394Abstract: An enhanced pressure sensing system and method use an external diaphragm to address issues involved with accurate and prolonged measurement of fluid pressure, such as of blood flowing in a vascular structure. Some external diaphragms include a metallized layer or other highly impermeable layer to furnish a high degree of seal at least near to hermetic grade. As temperature of the intermediary fluid changes, the external diaphragm is able to move in a direction that minimizes differential pressure across the external diaphragm over an operational temperature range thereby reducing pressure change of the intermediary fluid due to change in temperature of the intermediary fluid. Relatively smooth hydrodynamic surfaces can be used as well as a bi-layer construction.Type: GrantFiled: April 24, 2008Date of Patent: August 4, 2009Assignee: Cardiometrix, Inc.Inventors: George W. Keilman, Timothy Johnson
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Patent number: 7559247Abstract: A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.Type: GrantFiled: July 12, 2007Date of Patent: July 14, 2009Assignee: DENSO CORPORATIONInventors: Kiyoshi Otsuka, Osamu Itoh, Hiroshi Uchigashima, Kazuhiro Yoshino, Keiji Horiba, Tetsuya Ogawa
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Patent number: 7495302Abstract: A micromechanical component having a diaphragm is provided, the structure of which effectively prevents the penetration of dirt particles into the cavity. A method for manufacturing such a component is also provided. The structure of the component is implemented in a layer structure which includes at least one first sacrificial layer and a layer system over the first sacrificial layer. A cavity is formed in the first sacrificial layer underneath the diaphragm. In the region of the diaphragm between the upper layer and the lower layer of the layer system situated directly above the first sacrificial layer, at least one access channel to the cavity is formed which has at least one opening in the upper layer and at least one opening in the lower layer, the opening in the upper layer and the opening in the lower layer being offset with respect to each other.Type: GrantFiled: March 3, 2005Date of Patent: February 24, 2009Assignee: Robert Bosch GmbHInventors: Frank Fischer, Hans Artmann, Lars Metzger, Arnim Hoechst, Julian Gonska
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Publication number: 20080253058Abstract: Pressure and mechanical sensors include a sensing component formed of a titanium and tantalum alloy having an elastic (Young's) modulus of less than about 80 GPa and a tensile strength of greater than about 1,000 MPa. The high strength and low elastic modulus, together with very low temperature dependence of the elastic modulus and very low linear thermal expansion, result in high resolution and precise measurement over a large temperature range.Type: ApplicationFiled: April 13, 2007Publication date: October 16, 2008Applicant: Rosemount Inc.Inventors: Swapan Chakraborty, David A. Broden
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Patent number: 7434472Abstract: The present invention pertains to differential pressure transducers. In an embodiment of the invention, a differential pressure transducer includes a transducer housing, a diaphragm, a bellows, and a sensing assembly. The transducer housing, diaphragm, and bellows are coupled to form a pressure chamber. The pressure chamber is separated into two portions by the diaphragm, with each portion arranged to be filled with a process fluid. A pressure differential across the diaphragm causes displacement of the diaphragm. Such displacement is measured by the sensing assembly and used to calculate the pressure differential between the two process fluids.Type: GrantFiled: February 22, 2007Date of Patent: October 14, 2008Inventors: Travis W. Leitko, Richard L. Lopushansky, Larry A. Jeffers, John W. Berthold
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Patent number: 7418871Abstract: A pressure measuring device for detecting a pressure to be measured of a medium, having a pressure housing; a converter situated in the pressure housing for converting a mechanical force produced by the pressure to be measured into an electrical signal; an output unit for outputting the electrical signal; a separator for separating the medium from the converter; and a transmission device for transmitting the force produced by the pressure to be measured to the converter.Type: GrantFiled: October 2, 2006Date of Patent: September 2, 2008Assignee: Robert Bosch GmbHInventors: Thomas Moelkner, Holger Scholzen, Joerg Engelhardt, Christian Roesser, Hans-Peter Didra, Markus Ledermann
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Publication number: 20080184787Abstract: Methods for making and systems employing pressure and temperature sensors are described. Embodiments include a capacitive element including a first conductor plate and a second conductor plate. Each plate includes a conductor layer formed on a substrate. In a pressure sensor embodiment, seal is positioned at or near the edges of the conductor plates, and a gas retained in a gap defined between the plates. In a temperature sensor embodiment, the gap defined between the plates is in fluid communication with the external environment.Type: ApplicationFiled: February 6, 2008Publication date: August 7, 2008Applicant: Chevron U.S.A., Inc.Inventor: Don M. COATES
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Patent number: 7395719Abstract: A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.Type: GrantFiled: October 23, 2006Date of Patent: July 8, 2008Assignee: Custom Sensors & Technologies, Inc.Inventors: Marcos Nassar, Scott McDaniel
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Patent number: 7356913Abstract: A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect thermal sensor. The sensor includes a deformable element attached, at opposite ends, to the substrate so that there is a natural deflection without stress with respect to a surface of the substrate opposite it, this natural deflection determining the first state of functioning, the second state of functioning being caused by the thermal sensor which, under the influence of temperature variation, induces a deformation of the deformable element which diminishes the deflection by subjecting it to a compressive force which shifts it in a direction opposite to its natural deflection by buckling.Type: GrantFiled: September 24, 2004Date of Patent: April 15, 2008Assignee: Commissariat A l'Energie AtomiqueInventor: Yves Fouillet
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Patent number: 7319581Abstract: A capacitive pressure sensor includes: a conductive silicon substrate having a diaphragm; an insulating substrate having a fixed electrode, the insulating substrate overlapping the conductive silicon substrate so as to be bonded thereto; and a sealed chamber formed between the diaphragm and the fixed electrode. A conductive silicon member is buried in a part of the insulating substrate, a portion of the conductive silicon member is exposed toward a surface of the insulating substrate facing the sealed chamber so as to form the fixed electrode, and another portion of the conductive silicon member is exposed toward the other surface of the insulating substrate not facing the sealed chamber so as to form a lead electrode of the fixed electrode.Type: GrantFiled: December 2, 2005Date of Patent: January 15, 2008Assignee: ALPS Electric Co., Ltd.Inventors: Toshihide Suto, Shigefumi Sakai, Sasahiro Takahashi
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Patent number: 7316163Abstract: The axial distance between opposing conductors of a capacitance pressure transducer can depend, in part, upon the thickness of a seal that is disposed between a housing and a diaphragm of the capacitance pressure transducer. The present invention utilizes spacer elements and sealing beads to form a seal that is disposed between the housing and the diaphragm of a capacitance pressure transducer. The sealing beads have a melting temperature that is lower than the melting temperature of the spacer elements. The sealing beads are melted so that they flow around and surround the unmelted spacer elements. Upon solidifying, the sealing beads and the spacer elements thus form the seal. The thickness of the seal can be established accurately and uniformly by controlling the height of the spacer elements.Type: GrantFiled: October 5, 2006Date of Patent: January 8, 2008Assignee: MKS InstrumentsInventor: Chris P. Grudzien
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Patent number: 7252011Abstract: The disclosed pressure transducer assembly includes a housing, a pressure sensor disposed within the housing, a coupling establishing a sealed pathway between the housing and an external source of gas or fluid, and a deposition trap disposed in the pathway. The deposition trap provides a plurality of channels, each of the channels being narrower than the pathway.Type: GrantFiled: March 11, 2002Date of Patent: August 7, 2007Assignee: MKS Instruments, Inc.Inventor: Robert Traverso
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Patent number: 7254008Abstract: A microfluidic device and method for capacitive sensing. The device includes a fluid channel including an inlet at a first end and an outlet at a second end, a cavity region coupled to the fluid channel, and a polymer based membrane coupled between the fluid channel and the cavity region. Additionally, the device includes a first capacitor electrode coupled to the membrane, a second capacitor electrode coupled to the cavity region and physically separated from the first capacitor electrode by at least the cavity region, and an electrical power source coupled between the first capacitor electrode and the second capacitor electrode and causing an electric field at least within the cavity region. The polymer based membrane includes a polymer.Type: GrantFiled: March 25, 2005Date of Patent: August 7, 2007Assignee: California Institute of TechnologyInventors: Jun Xie, Jason Shih, Yu-Chong Tai
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Patent number: 7242570Abstract: A vacuum capacitor including an insulating cylinder having first and second ends which are opposite to each other. A stationary-side flange is installed to the first end of the insulating cylinder. A stationary electrode supporting plate is installed to an inner surface side of the stationary-side flange. A movable-side flange is installed to the second end of the insulating cylinder. A movable electrode supporting plate is installed to an inner surface side of the movable-side flange through an electrostatic capacity adjusting screw and movable relative to the stationary electrode supporting plate by turning of the electrostatic capacity adjusting screw. Additionally, a diaphragm is sealingly connected between the movable-side flange and the movable electrode supporting plate, the diaphragm having corrugation and defining a vacuum side and an atmospheric side in the vacuum capacitor.Type: GrantFiled: May 26, 2006Date of Patent: July 10, 2007Assignee: Meidensha CorporationInventor: Eiichi Takahashi
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Patent number: 7176390Abstract: A capacitive load cell includes upper and lower capacitor plates and an intermediate dielectric comprising two or more layers of compressible material with diverse compressibility characteristics. The most easily compressed dielectric layer provides sensitivity to low occupant weight, while the less easily compressed dielectric layer(s) provide sensitivity to medium and high occupant weight.Type: GrantFiled: March 2, 2005Date of Patent: February 13, 2007Assignee: Delphi Technologies, Inc.Inventors: Mark C. Hansen, William W. Fultz
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Patent number: 7159465Abstract: The present invention provides a highly corrosion-resistant diaphragm pressure sensor capable of obviating the effects of temperature drift that arises when a pressure-travel coefficient changes with temperature of a fluid whose pressure is sensed, and a method of manufacturing the same. A fluororesin thin film diaphragm pressure sensor comprises a pressure sensing element (10, 20) having a pressure receiving part with a deposition electrode formed on each of the opposing faces of sapphire or alumina ceramic diaphragms which are arranged in opposing relation, and a welding portion (10A, 20A) on a part of each of the surfaces of the diaphragms; and a fluororesin base (41, 61) for securing the pressure sensing element at the welding portion of the pressure sensing element. The pressure sensing element is coated with a fluororesin thin film having a cross-linked structure, and the pressure sensing element and the fluororesin base are welded together via the fluororesin thin film having a cross-linked structure.Type: GrantFiled: October 6, 2005Date of Patent: January 9, 2007Assignee: Tem-Tech Lab. Co., Ltd.Inventor: Mitsuyoshi Aizawa
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Patent number: 7140085Abstract: A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at a small distance from the first housing body (1) creating a reference vacuum chamber (25) therebetween. An electrically conductive material (7) coats opposing surfaces of the first housing body (1) and the membrane (2) to form a capacitor. A measurement vacuum chamber (26) is provided between the membrane (2) and the second housing body (4). A port (5) communicates with the second housing body (4) to connect the measurement vacuum chamber (26) of the measuring cell to the medium to be measured. The membrane (2) is made from an Al2O3 slurry that is sintered in a first heating step, cooled, and then reheated to smooth the membrane.Type: GrantFiled: July 11, 2003Date of Patent: November 28, 2006Assignee: Inficon GmbHInventors: Per Bjoerkman, Ray Olsson
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Patent number: 7135749Abstract: A pressure sensor includes a silicon-on-insulator (SOI) substrate, a glass substrate bonded to the SOI substrate by anode bonding, a silicon island formed on a part of a silicon layer of the SOI substrate and surrounded by a groove extending to an insulating layer of the SOI substrate, a through hole formed in the glass substrate, and an output electrode that is made of a conductive material, is disposed inside the through hole, and is electrically connected to an electrode formed on the glass substrate via the silicon island.Type: GrantFiled: January 3, 2005Date of Patent: November 14, 2006Assignee: Alps Electric Co., Ltd.Inventors: Shigefumi Sakai, Munemitsu Abe
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Patent number: 7107855Abstract: A ceramic membrane for a capacitive vacuum measuring cell includes a thin ceramic membrane with a thickness of <250 ?m, in particular less than 120 ?m. The membrane is produced from a ribbon-shaped green body of Al2O3, and is given high planarity by smoothing the membrane after sintering. The green body is sintered at a sintering temperature that is higher than the smoothing temperature applied following sintering.Type: GrantFiled: February 7, 2003Date of Patent: September 19, 2006Assignee: INFICON GmbHInventor: Per Bjoerkman
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Patent number: 6993973Abstract: The disclosed transducer includes a housing, a diaphragm, an inner conductor, an outer conductor, and a first baffle. The housing defines an interior volume. The diaphragm is disposed in the housing and divides the interior volume into a first chamber and a second chamber. The diaphragm flexes in response to pressure differentials in the first and second chambers. The inner conductor is disposed in the first chamber. The outer conductor is disposed in the first chamber around the inner conductor. The first baffle is disposed in the second chamber and defines an inner region, a middle region, and an outer region. The inner region underlies the inner conductor. The middle region underlies the outer conductor. The outer region underlies neither the inner conductor nor the outer conductor. The first baffle defines apertures in at least two of the inner, middle, and outer regions.Type: GrantFiled: May 16, 2003Date of Patent: February 7, 2006Assignee: MKS Instruments, Inc.Inventors: D. Jeffrey Lischer, Robert Traverso
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Patent number: 6992492Abstract: A capacitive sensor is disclosed that includes a variable capacitor transducer that varies its capacitance with changes in an environmental parameter. The present invention is adapted to measure any linear parameter such as pressure, force, or distance. The sensor of the present invention is compact, inexpensive to make, and easily fabricated using commonly available components. Furthermore, it is not susceptible to errors caused by vibration, acceleration, and its orientation to the earth's gravitational field. The output of the capacitive sensor does not substantially drift with changes in temperature.Type: GrantFiled: December 6, 2004Date of Patent: January 31, 2006Assignee: Welch Allyn, Inc.Inventors: Kenneth Burdick, Raymond A. Lia, Robert L. Vivenzio