Abstract: A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being Ni, the internal electrode layers being alternately exposed to two end faces of the multilayer chip opposite to each other, and external electrodes, each of which is provided on each of the two end faces. Each of the external electrodes includes a base layer contacting the internal electrode layers, a main component of the base layer being Cu. The base layer includes Ni of 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers that are laminated and a pair of external electrodes electrically connected to the internal electrode layers. The multilayer body includes an effective portion, a principal surface-side outer layer between both principal surfaces and outermost surfaces of the effective portions on both principal surface sides, and an end surface-side outer layer between both end surfaces and outermost surfaces of the effective portions on both end surface sides. The principal surface-side outer layer includes a glass layer facing the effective portion. The glass layer overlaps tips of the external electrodes on a portion of both principal surfaces and a portion of both side surfaces, and the glass layer is not exposed from the effective portion at both end surfaces.

Abstract: A coil component includes a support substrate, a coil portion disposed on the support substrate, and a body in which the support substrate and the coil portion are disposed. The coil portion includes a coil pattern portion, a lower pattern portion connected to the coil pattern portion and disposed on one surface of the support substrate, a dummy pattern portion disposed to overlap the lower pattern portion on another surface of the support substrate opposite to the one surface, and a through-via penetrating through the support substrate and connecting the lower pattern portion and the dummy pattern portion to each other. The lower pattern portion and the dummy pattern portion are externally exposed through one surface of the body. The through-via has one surface externally exposed through the one surface of the body.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.

Abstract: An electronic component with a metal terminal includes a plurality of electronic components each including an element body and a pair of external electrodes provided on each of a pair of end surfaces facing each other in an X direction in the element body, and disposed in a Y direction, and a pair of plate-shaped metal terminals each including a plurality of joint portions to which external electrodes of the plurality of electronic components are joined, and a leg portion provided to protrude further than the electronic component in a Z direction, wherein a portion of the metal terminal that extends in the Y direction to straddle the plurality of joint portions is an easily deformable portion made of a second metal material having a Young's modulus smaller than that of a first metal material constituting the other portion.

Abstract: A novel method of depositing grit particles onto a fan blade tip coating is provided. The method enhances grit capture by presenting a softened coating surface for the impinging particles. The softened surface is achieved without high substrate temperatures that could degrade the base metal properties in the fan blade. An auxiliary heat source is used to establish a locally heated and softened surface where the grit deposition takes place. The softened surface greatly increases the probability of grit capture.

Abstract: A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.

Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.

Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip facing each other, and a pair of external electrodes respectively formed on the two edge faces so as to be connected to the internal electrode layers exposed on the respective edge faces, each external electrode extending to at least one side face of the multilayer chip, wherein in the multilayer chip, oxides including Zn and Ni are present around the internal electrode layer in a vicinity of a connection part connecting the internal electrode layer to the external electrode.

Abstract: A capacitor structure implemented using a semiconductor process. The capacitor structure includes a plurality of interdigitated positive and negative electrode fingers separated by a dielectric material, and a plurality of patterned metallization layers separated by the dielectric material. Each interdigitated electrode finger comprises a lateral part formed on one of at least two essentially parallel first metallization layers and a vertical part includes a plurality of superimposed slabs or bars disposed on a plurality of second metallization layers between said first metallization layers and electrically connected to each other and to the lateral part with a plurality of electrically conducting vias traversing through dielectric material separating adjacent metallization layers. Vertical distance between each pair of at least partially superimposed lateral parts of two adjacent electrode fingers is substantially equal to lateral distance between two adjacent vertical parts.

Abstract: Certain aspects of the present disclosure generally relate to an integrated circuit package having a land-side capacitor electrically coupled to an embedded capacitor. One example integrated circuit package generally includes a package substrate having a first capacitor embedded therein, a semiconductor die disposed above the package substrate, and a second capacitor disposed below the package substrate and electrically coupled to the first capacitor.

Abstract: An electronic component device includes: an electronic component having: a base body having a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces; and a pair of outer electrodes disposed on respective sides of the pair of end surfaces; metal terminals respectively electrically connected to the pair of outer electrodes; and joint portions joining and electrically connecting the outer electrodes to the metal terminals respectively, wherein the electronic component has a metal portion disposed on at least one surface of the four side surfaces, and the metal portion has a baked metal layer.

Abstract: A parallel plate capacitor structure in an integrated circuit has a first plate and a second plate separated by an insulator, such as a dielectric. Both plates are connected to an interconnect structure at a plurality of connection points. The area of the first plate that overlaps with the second plate is identified. This overlap region does not include any connection points on the first plate. For this overlap region, the lumped element model for the first plate includes nodes on the edge of the overlap region (edge nodes), and lumped resistances between the edge nodes and the node connected to the lumped capacitance. In one embodiment, the lumped element model also includes a common node, all of the edge nodes are connected to the common node by lumped resistances, and the common node is connected by a negative resistance to the lumped capacitance.

Abstract: A coil component according to one embodiment of the present invention includes a magnetic base body, a first external electrode, a second external electrode, a coil conductor extending around a coil axis, a first insulator, and a second insulator. The first insulator is provided between a first flange portion of the first external electrode and a first coil pattern of the coil conductor, and the second insulator is provided between a second flange portion of the second external electrode and a second coil pattern of the coil conductor.

Abstract: An inductor component comprises a core including a substantially column-shaped shaft and a support formed on an end portion of the shaft, and a terminal electrode formed on the support. The terminal electrode includes a side electrode section on a side face of the support and an end electrode section on an end face of the support. An end portion of the end electrode section adjacent to the side face is higher than an end portion of the side electrode section adjacent to the end face.

Abstract: An inductor component includes a core including a substantially column-shaped shaft and a support formed on an end portion of the shaft, a terminal electrode formed on the support, and a cover member that covers at least an upper face of the shaft. A width dimension of the inductor component including the core and the terminal electrode is greater than a width dimension of the cover member.

Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Abstract: An inductor component includes a core including a substantially column-shaped shaft and a support formed on an end portion of the shaft, a terminal electrode formed on the support, and a wire wound around the shaft and including an end portion connected to the terminal electrode. The support includes a first ridge that is rounded at a boundary between an inner face and a bottom face of the support, and a second ridge that is rounded at a boundary between the bottom face and an end face of the support. A radius of curvature of the first ridge is greater than a radius of curvature of the second ridge.

Abstract: A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit laminates to electrically connect the respective connection electrodes of the unit laminates above and below the pad portions to each other.

Abstract: Disclosed is a ceramic electronic component having external electrodes on each of opposed end portions of a rectangular parallelepiped component body. A first direction dimension, a second direction dimension and a third direction dimension of the component body satisfy a condition of second direction dimension>first direction dimension>third direction dimension. The external electrodes are of a five-face type having a first face portion, a second face portion, a third face portion, a fourth face portion and a fifth face portion. At least one edge of the fourth face portion and the fifth face portion of the external electrode has a recess portion recessed from the edge toward the first face portion. Both side portions in the third direction of the recess portion are covering portions which cover ridge portions of the two faces in the second direction of the component body.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors consecutively disposed in a horizontal direction, first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes, respectively. The first and second metal frames respectively include first and second horizontal bonding portions bonded to upper portions of first and second band portions, first and second horizontal mounting portions disposed to oppose the first and second horizontal bonding portions in a vertical direction, and first and second vertical portions connecting the first and second horizontal bonding portions and the first and second horizontal mounting portions and having at least one first and second cutout portions in a horizontal direction, respectively. The first and second horizontal mounting portions are spaced apart from the plurality of multilayer capacitors.

Abstract: A coil component according to one embodiment of the present invention includes a magnetic base body, a first external electrode, a second external electrode, a coil conductor extending around a coil axis, a first insulator, and a second insulator. The first insulator is provided between a first flange portion of the first external electrode and a first coil pattern of the coil conductor, and the second insulator is provided between a second flange portion of the second external electrode and a second coil pattern of the coil conductor.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: In an embodiment, a coil component includes: a core 10; a coil conductor 40 having a spiral part 42 placed inside the core 10, and a lead part 48 which is led out from the spiral part 42 to the principal outer surface, constituting the bottom face 28, of the core 10, and which includes an end part 46 that serves as an external terminal 49; an insulated terminal 60 electrically insulated from the coil conductor 40, which is fitted onto and bonded to the core 10, and which has a bottom part 64 positioned on the bottom face 28, a top part 62 positioned on the top face 26, and a side part 66 coupling the bottom part 64 and the top part 62, where the top part 62 and side part 66 have an opening 68 in which an adhesive 82 is filled.

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

Abstract: A roll-up type capacitor that includes a plurality of cylindrical parts arranged parallel to one another and which each are a rolled-up laminate; a first external electrode on respective first ends of the plurality of cylindrical parts; and a second external electrode on respective second ends of the plurality of cylindrical parts. When, prior to being rolled-up, a dimension of the laminate parallel to a rolling-up direction is a length L, and a dimension of the laminate perpendicular to laminating direction and the rolling-up direction is a width W, the roll-up type capacitor has two or more cylindrical parts when a ratio L/W is 4 or more; has three or more cylindrical parts when L/W is 3 to less than 4; has four or more cylindrical parts when L/W is 2 to less than 3; and has eight or more cylindrical parts when L/W is 1 to less than 2.

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.

Abstract: A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein the external electrode includes a base conductive layer that includes glass of less than 7 weight % and is mainly composed of a transition metal other than an iron group or a noble metal, and a first plated film that covers the base conductive layer, has a thickness that is half of a thickness of the base conductive layer or more and is mainly composed of a transition metal other than an iron group.

Abstract: An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 ?m or less.

Abstract: The present disclosure discloses the laminated ceramic chimp component including an element part having a ceramic main body and an internal electrode placed in the ceramic main body; an external electrode part having a first external electrode and a second external electrode, the first and second external electrodes being provided with side electrodes covering both side surfaces of the ceramic main body, respectively, upper electrodes covering portions of both sides of an upper surface of the ceramic main body, respectively, and lower electrodes covering portions of both sides of a lower surface of the ceramic main body, respectively; and a nano thin film layer formed of electric insulation material and applied to a region including the upper electrodes, the method for manufacturing the same and the atomic layer deposition apparatus for the same.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has a first external electrode 12 and a second external electrode 13 that each contain metal grains MP and dielectric grains DP, where an oxide of the same metal element constituting the metal grain MP, or MO, is present at the interface between the metal grain MP and the dielectric grain DP. The multilayer ceramic capacitor can prevent the hardness of its external electrodes from dropping, even when the external electrodes contain metal grains and dielectric grains.

Abstract: A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.

Abstract: An electronic component includes an inductor including an inductor body and first and second external electrodes, the first and second external electrodes including first and second body portions and first and second band portions extended from the first and second body portions to portions of an upper surface of the inductor body in a thickness direction, respectively; and first and second metal frames including first and second upper horizontal portions bonded to the first and second band portions, respectively, first and second lower horizontal portions disposed below the inductor body to be spaced apart from each other, and first and second vertical portions connecting end portions of the first and second upper horizontal portions and end portions of the first and second lower horizontal portions to each other and disposed to be spaced apart from the first and second body portions, respectively.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic; and a pair of external electrodes that are formed on the two edge faces; wherein: the pair of external electrode have a structure in which a plated layer is formed on a ground layer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and the ground layer includes Mo.

Abstract: A multilayer ceramic electronic component includes an electronic component body including a laminate and an external electrode, and a pair of metal terminals that are joined by a joining material. The pair of metal terminals includes a terminal joint portion, an extended portion and a mounting portion. The external electrode is provided only on both end surfaces of the laminate, and includes first and second external electrodes. The first external electrode and the second external electrode each include a saddle portion with a thickness larger than the thickness of a center portion of each end surface in the periphery of the first end surface and the second end surface of the laminate, respectively.

Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.

Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer includes a glass component. A formula (1) of 0.25<?/?<1 is satisfied, where ? denotes a thermal expansion coefficient of the insulating layer, and ? denotes a thermal expansion coefficient of one of the internal electrode layer and the dielectric layer that is larger than a thermal expansion coefficient of the other layer.

Abstract: A multilayer ceramic electronic component may include first and second metal frames connected to different external electrodes of a multilayer ceramic capacitor, respectively, and disposed to be spaced apart from a mounting surface of the multilayer ceramic capacitor; and an insulating layer disposed on a surface of the multilayer ceramic capacitor opposing the mounting surface thereof.

Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer integrally has an insulating layer extension portion covering part of the end surfaces facing each other in the second axis direction. W1/W0 is 1/30 to less than ?, where W0 denotes a width along the first axis, and W1 denotes a width along the first axis of the insulating layer extension portion. The external electrode covers at least part of the insulating layer extension portion.

Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. A main component of the insulating layer is constituted by glass containing Si at 25 wt % or more. The external electrode includes glass containing at least Si. The external electrode covers an end portion in the second axial direction of the insulating layer. A diffusing layer is partially present at least at a bonding portion of the insulating layer with the external electrode in the side surface.

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract: A chip-component structure includes an interposer and a multilayer capacitor mounted thereon. The interposer includes a substrate, a component connecting electrode, an external connection electrode, and a side electrode. The component connecting electrode and the external connection electrode are electrically connected by the side electrode. The component connecting electrode is joined to an external electrode of the multilayer capacitor. The substrate includes a communication hole that communicates between opposite spaces opening in both principal surfaces of the substrate.

Abstract: A multilayer ceramic capacitor includes a multilayer ceramic sintering body and one or two or more internal electrode units formed to be placed inside the multilayer ceramic sintering body. Each internal electrode unit includes first internal electrodes formed in the multilayer ceramic sintering body in such a way to be spaced apart from each other, one or more of both ends of one side of each of the first internal electrodes being formed to be exposed to the top or bottom surface of the multilayer ceramic sintering body, and second internal electrodes placed between the first internal electrodes, respectively, and formed in the multilayer ceramic sintering body in such a way to be spaced apart from each other, one or more of both ends of the other side of each of the second internal electrodes being formed to be exposed to the top or bottom surface of the sintering body.

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract: A multilayer ceramic capacitor may include: a ceramic body in which dielectric layers having first via holes are stacked in a thickness direction; first internal electrodes having second via holes disposed in positions corresponding to those of the first via holes and exposed to at least one side surface of the ceramic body; second internal electrodes having third via holes disposed in positions corresponding to those of the first and second via holes; a via electrode passing through the first to third via holes to thereby be exposed to upper and lower surfaces of the ceramic body, and connected to the third via holes; and a first external electrode disposed on the at least one side surface of the ceramic body to be connected to a portion of the first internal electrode exposed to the exterior of the ceramic body.

Abstract: A low pass filter having an attenuation pole includes at least inductors disposed on a series arm which connects an input terminal and an output terminal. The inductors are wound inductors mounted on a first surface of a multilayer body. A winding axis of one of the wound inductors is perpendicular or substantially perpendicular to a winding axis of the other one of the wound inductors.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces opposing each other and third and fourth end surfaces connecting the first and second side surfaces, first and second internal electrodes formed in the ceramic body and having one ends exposed to the first and second side surfaces and the third end surface or exposed to the first and second side surfaces and the fourth end surface, first and second external electrodes formed on an outer side of the ceramic body and electrically connected to the first and second internal electrodes, and a plating layer partially formed on certain regions of the first and second external electrodes, wherein a polymer layer is additionally formed on the ceramic body on regions of upper portions of the first and second external electrodes on which the plating layer is not formed.